CN107871809A - The preparation method and a kind of LED component of a kind of chip of white glue all around - Google Patents
The preparation method and a kind of LED component of a kind of chip of white glue all around Download PDFInfo
- Publication number
- CN107871809A CN107871809A CN201610847988.4A CN201610847988A CN107871809A CN 107871809 A CN107871809 A CN 107871809A CN 201610847988 A CN201610847988 A CN 201610847988A CN 107871809 A CN107871809 A CN 107871809A
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- CN
- China
- Prior art keywords
- chip
- tool
- white glue
- around
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000003292 glue Substances 0.000 title claims abstract description 59
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 238000000605 extraction Methods 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 241001025261 Neoraja caerulea Species 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 3
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910017315 Mo—Cu Inorganic materials 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a kind of preparation method of chip of white glue all around and a kind of LED component, wherein, include in the preparation method：Multiple chip-sides are bonded on the first tool by S1 at a certain distance successively；Second tool is bonded in another side surface of chip by S2, and chip is arranged between the first tool and the second tool, and leaves space between the enclosing of the second tool and the first tool；S3 pours into white glue along the space between the first tool and the second tool；The obtained structures of step S3 are put into vacuum tank and vacuumized by S4；S5 is put into air, is filled up in the groove for being squeezed into white glue between each chip using pressure difference；The first tool and the second tool are removed after S6 bakings, obtain the square piece with white glue；The square piece with white glue obtained in S7 cutting steps S6 obtains the chip of single all around white glue, improves illumination while the light extraction efficiency for improving LED chip.
Description
Technical field
The invention belongs to semiconductor applications, and in particular to a kind of preparation method of chip of white glue all around and a kind of LED devices
Part.
Background technology
LED (Light Emitting Diode, light emitting diode) is a kind of can to convert electrical energy into consolidating for visible ray
The semiconductor devices of state.LED, especially white light LEDs, it is widely used as a kind of new lighting source material, it has
Reaction speed is fast, shock resistance is good, long lifespan, energy-conserving and environment-protective the advantages that and it is fast-developing, be widely used at present landscape U.S.
The field such as change and indoor and outdoor lighting.
Scientific research personnel more more at present is directed to the research of LED flip chip, current all commercialized GaN (nitrogen
SiClx) base LED flip chip product all can not directly send white light, if to make the chip for sending white light, it is necessary in chip
Fluorescent material is coated during encapsulation.But the White-light LED chip made is five face light extractions, most of ambient light turns into invalid light,
Have a strong impact on the light extraction efficiency of chip.
In addition, for light emitting diode (LED) chip with vertical structure, though its luminous side is very thin, if the material of support LED chip
It is the materials such as Si (silicon), W-Cu (tungsten-copper), Mo-Cu (molybdenum-copper), the light that LED chip is sent can be absorbed, especially in COB
Light loss caused by (Chip On Board, chip on board) encapsulated type product is more, equally have impact on light extraction efficiency.
The content of the invention
Based on above mentioned problem, it is an object of the invention to provide a kind of preparation method of chip of white glue all around and a kind of LED
Device, effectively improve the light extraction efficiency of chip.
Technical scheme provided by the invention includes：
A kind of preparation method of the chip of white glue all around, comprises the following steps：
Multiple chip-sides are bonded on the first tool by S1 at a certain distance successively, are included around first tool
Highly it is more than the enclosing of chip thickness；
Second tool is bonded in another side surface of chip by S2, by chip be arranged at the first tool and the second tool it
Between, and leave space between the enclosing of the second tool and the first tool；
S3 pours into white glue along the space between the first tool and the second tool；
The obtained structures of step S3 are put into vacuum tank and vacuumized by S4；
S5 is put into air, is filled up in the groove for being squeezed into white glue between each chip using pressure difference；
The first tool and the second tool are removed after S6 bakings, obtain the square piece with white glue；
The square piece with white glue obtained in S7 cutting steps S6 obtains the chip of single all around white glue.
It is further preferred that the chip includes：The blue LED flip chip of five face light extractions and the vertical blue light of silicon substrate
LED core；And/or
First tool is oneType tool.
It is further preferred that the white glue is the mixture of silicones and titanic oxide material, and reflectivity is more than 95%.
It is further preferred that specifically include in step sl：Chip-side is bonded in first by two-sided tape and controlled successively
On tool；
Specifically include in step s 2：Second tool is bonded in another side surface of chip by two-sided tape.
It is further preferred that the two-sided tape is the hot stripping tape of high temperature or the weak sticky adhesive tape of high temperature resistant.
It is further preferred that in step s 4：It is 0.01Mpa~0.1Mpa that pressure range is evacuated in vacuum tank.
Present invention also offers a kind of LED component, the LED component includes preparing all around using above-mentioned preparation method
White glue chip, in addition to a fluorescence film, the fluorescence film are affixed on the light-emitting area of the chip.
The preparation method and LED component of a kind of chip of white glue all around provided by the invention, its advantage are：
Enclose white glue method by provided by the invention, five face light extractions blue LED flip chip and silicon substrate it is vertical
Blue-ray LED core all around goes up the white glue of high reflectance, and so, the light of blue LED flip chip will not be spilt from side, only from hair
Smooth surface comes out；The silicon substrate of the blue light vertical LED chip of silicon substrate will not also absorb the light that LED chip is sent, and improve LED core
Illumination is improved while the light extraction efficiency of piece.
Brief description of the drawings
Fig. 1 is the preparation method schematic flow sheet of all around white glue chip in the present invention；
Fig. 2 is located at the structural representation between the first tool and the second tool in the present invention by chip；
Fig. 3 is that white glue schematic diagram is poured between the first tool and the second tool in the present invention；
Fig. 4 is squeezed into groove schematic diagram between chip for white glue in the present invention；
Fig. 5 is the square piece schematic diagram with white glue in the present invention；
Fig. 6 is the single chip schematic diagram with white glue in the present invention；
Fig. 7 is LED component schematic diagram in the present invention.
Description of reference numerals：
1- chips, the tools of 2- first, the tools of 3- second, 4- two-sided tapes, 5- white glue, 6- fluorescent adhesive layers.
Embodiment
In order that technical problem solved by the invention, technical scheme and beneficial effect are more clearly understood, below in conjunction with
Embodiment, the present invention is described in further detail.
It is the schematic flow sheet of the preparation method of the chip of white glue all around provided by the invention as shown in Figure 1, can from figure
To find out, comprise the following steps in the preparation method：
Multiple chip-sides are bonded on the first tool by S1 at a certain distance successively, and height is included around the first tool
More than the enclosing of chip thickness, specifically, chip here include five face light extractions blue LED flip chip and silicon substrate it is vertical
Blue-ray LED core.In addition, chip-side said herein is the front (exiting surface) or the back side of chip.
Second tool is bonded in another side surface of chip by S2, by chip be arranged at the first tool and the second tool it
Between, and leave space between the enclosing of the second tool and the first tool.Specifically, the front/back of chip is glued respectively to
On the tool of first tool/second, the front/back of chip is protected during white glue is subsequently filled with this.In addition, this
In the first tool enclosing and the second tool between space be enough to make the gap that white glue is flowed between enclosing and chip, and
The white glue poured into is defined by not spilling over enclosing, it is sufficient to the gap filled up between each chip.Further, the height of enclosing is more than chip
Thickness even flushes with the height of the second tool of chip surface.
S3 pours into white glue along the space between the first tool and the second tool.
The obtained structures of step S3 are put into vacuum tank and vacuumized by S4, specifically, pressure are evacuated in the vacuum tank
Strong scope is 0.01Mpa~0.1Mpa (MPa).
S5 is put into air, is filled up in the groove for being squeezed into white glue between each chip using pressure difference, specifically here white
Glue is the mixture of silicones and titanic oxide material, and reflectivity is more than 95%.Here air is put into destroy in vacuum tank
The mode such as vacuum environment, door that can be by opening vacuum tank realize.
The first tool and the second tool are removed after S6 bakings, obtain the square piece with white glue.Specifically, will be white after baking
Glue, the first tool and the second tool are removed with this.
The square piece with white glue obtained in S7 cutting steps S6, cut to obtain single surrounding along the grooved position of chip
Enclose the chip of white glue.
In a specific embodiment, the first tool is oneType tool, chip are the upside-down mounting blue-ray LED core of five face light extractions
Piece.Specifically included in the process that white glue is enclosed to LED blue LED flip chips：
Two-sided tape 4 is affixed in the groove of the first tool 2, chip 1 (light-emitting area) is sequentially arranged in double faced adhesive tape afterwards
On band 4；Then, two-sided tape 4 is affixed on to the side of the second tool 3, and the second tool 3 is posted to the side back-off of two-sided tape
In the back side of chip 1, chip 1 is protected between the first tool and the second tool, forms structure shown in Fig. 2.
Pour into high reflection white glue between the enclosing of the second tool 3 and the first tool 2, glue quantity need to fill up two tools it
Between raceway groove, be defined by not spilling over, as shown in Figure 3.
Structure shown in Fig. 3 is put into vacuum drying chamber, is evacuated to 0.05Mpa, no air stops taking out very after emerging
It is empty.Afterwards, the vacuum that air is destroyed in drying box is put into, with the high reflection white glue that is poured into this previous step by external atmosphere pressure
Squeeze into the groove between chip and chip, until filling up groove, as shown in Figure 4.
Afterwards, the oven for baking 2h (hour) of 150 DEG C (degree Celsius) is put into, is controlled after high reflection latex solidified by second
Tool 3 and the two-sided tape 4 sticked on the tool are removed, while the first tool 2 and the two-sided tape 4 sticked on the tool are moved
Open, form the whole square piece with high reflection white glue, as shown in Figure 5.
Cut along the grooved position of chip, form the single chip with high reflection white glue, such as Fig. 6.
In another specific embodiment, fluorescent glue is pasted in the light-emitting area of the chip with high reflection white glue as described in Figure 7
Piece, obtain white light LED part.
It is described above, it is only the embodiment in the present invention, but protection scope of the present invention is not limited thereto, and is appointed
What be familiar with the people of the technology disclosed herein technical scope in, the conversion that can readily occur in or replace should all cover
Within the protection domain of invention.Therefore, protection scope of the present invention should be defined by the protection domain of claims.
Claims (7)
1. a kind of preparation method of the chip of white glue all around, it is characterised in that comprise the following steps in the preparation method：
Multiple chip-sides are bonded on the first tool by S1 at a certain distance successively, and height is included around first tool
More than the enclosing of chip thickness；
Second tool is bonded in another side surface of chip by S2, and chip is arranged between the first tool and the second tool,
And leave space between the enclosing of the second tool and the first tool；
S3 pours into white glue along the space between the first tool and the second tool；
The obtained structures of step S3 are put into vacuum tank and vacuumized by S4；
S5 is put into air, is filled up in the groove for being squeezed into white glue between each chip using pressure difference；
The first tool and the second tool are removed after S6 bakings, obtain the square piece with white glue；
The square piece with white glue obtained in S7 cutting steps S6 obtains the chip of single all around white glue.
2. the preparation method of white glue chip all around as claimed in claim 1, it is characterised in that the chip includes：Five faces
The blue LED flip chip of light extraction and the vertical blue-ray LED core of silicon substrate；And/or
First tool is oneType tool.
3. the preparation method of all around white glue chip as claimed in claim 1, it is characterised in that the white glue be silicones and
The mixture of titanic oxide material, and reflectivity is more than 95%.
4. the preparation method of the chip of white glue all around as described in claim 1 or 2 or 3, it is characterised in that
Specifically include in step sl：Chip-side is bonded on the first tool successively by two-sided tape；
Specifically include in step s 2：Second tool is bonded in another side surface of chip by two-sided tape.
5. the preparation method of white glue chip all around as claimed in claim 4, it is characterised in that the two-sided tape is high temperature
Hot stripping tape or the weak sticky adhesive tape of high temperature resistant.
6. the preparation method of the chip of white glue all around as described in claim 1 or 2 or 3, it is characterised in that in step s 4：
It is 0.01Mpa~0.1Mpa that pressure range is evacuated in vacuum tank.
7. a kind of LED component, it is characterised in that the LED component is included using system as claimed in any one of claims 1 to 6
White glue chip all around prepared by Preparation Method, in addition to a fluorescence film, the fluorescence film are affixed on the luminous table of the chip
Face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610847988.4A CN107871809A (en) | 2016-09-26 | 2016-09-26 | The preparation method and a kind of LED component of a kind of chip of white glue all around |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610847988.4A CN107871809A (en) | 2016-09-26 | 2016-09-26 | The preparation method and a kind of LED component of a kind of chip of white glue all around |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107871809A true CN107871809A (en) | 2018-04-03 |
Family
ID=61751535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610847988.4A Pending CN107871809A (en) | 2016-09-26 | 2016-09-26 | The preparation method and a kind of LED component of a kind of chip of white glue all around |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107871809A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109345963A (en) * | 2018-10-12 | 2019-02-15 | 芯光科技新加坡有限公司 | A kind of display device and its packaging method |
| CN110459663A (en) * | 2019-06-28 | 2019-11-15 | 广东晶科电子股份有限公司 | A kind of LED component and preparation method thereof |
| CN110486357A (en) * | 2018-05-15 | 2019-11-22 | 深圳市裕展精密科技有限公司 | The preparation method of framework |
| CN110956902A (en) * | 2019-12-02 | 2020-04-03 | 深圳市洲明科技股份有限公司 | LED display module lamp seam glue pouring process |
| CN112150936A (en) * | 2019-06-28 | 2020-12-29 | 深圳市洲明科技股份有限公司 | LED display module and glue filling method thereof |
| CN112582523A (en) * | 2020-12-03 | 2021-03-30 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
| CN117577764A (en) * | 2024-01-16 | 2024-02-20 | 长春希龙显示技术有限公司 | Packaged white light device and preparation method thereof |
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| CN105390595A (en) * | 2015-12-01 | 2016-03-09 | 广州市信自达电子科技有限公司 | Preparation method for unidirectional white light component of high color gradation consistency |
| CN105720165A (en) * | 2014-12-05 | 2016-06-29 | 晶能光电（江西）有限公司 | White-light LED chip manufacturing method |
| CN105810780A (en) * | 2014-12-30 | 2016-07-27 | 晶能光电（江西）有限公司 | Method for manufacturing white LED (Light Emitting Diode) chip |
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2016
- 2016-09-26 CN CN201610847988.4A patent/CN107871809A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103534822A (en) * | 2011-04-20 | 2014-01-22 | 株式会社Elm | Light emitting device and method for manufacturing same |
| CN105720165A (en) * | 2014-12-05 | 2016-06-29 | 晶能光电（江西）有限公司 | White-light LED chip manufacturing method |
| CN105810780A (en) * | 2014-12-30 | 2016-07-27 | 晶能光电（江西）有限公司 | Method for manufacturing white LED (Light Emitting Diode) chip |
| CN105390595A (en) * | 2015-12-01 | 2016-03-09 | 广州市信自达电子科技有限公司 | Preparation method for unidirectional white light component of high color gradation consistency |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110486357A (en) * | 2018-05-15 | 2019-11-22 | 深圳市裕展精密科技有限公司 | The preparation method of framework |
| CN109345963A (en) * | 2018-10-12 | 2019-02-15 | 芯光科技新加坡有限公司 | A kind of display device and its packaging method |
| CN110459663A (en) * | 2019-06-28 | 2019-11-15 | 广东晶科电子股份有限公司 | A kind of LED component and preparation method thereof |
| CN112150936A (en) * | 2019-06-28 | 2020-12-29 | 深圳市洲明科技股份有限公司 | LED display module and glue filling method thereof |
| CN112150936B (en) * | 2019-06-28 | 2022-12-27 | 深圳市洲明科技股份有限公司 | LED display module and glue filling method thereof |
| CN110956902A (en) * | 2019-12-02 | 2020-04-03 | 深圳市洲明科技股份有限公司 | LED display module lamp seam glue pouring process |
| CN112582523A (en) * | 2020-12-03 | 2021-03-30 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
| CN112582523B (en) * | 2020-12-03 | 2022-05-24 | 佛山市国星光电股份有限公司 | LED device, manufacturing method of LED device and LED car lamp |
| CN117577764A (en) * | 2024-01-16 | 2024-02-20 | 长春希龙显示技术有限公司 | Packaged white light device and preparation method thereof |
| CN117577764B (en) * | 2024-01-16 | 2024-05-03 | 长春希龙显示技术有限公司 | Packaged white light device and preparation method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180403 |
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