CN107801296A - The printed circuit board (PCB) and terminal device of fringe radiation can be reduced - Google Patents
The printed circuit board (PCB) and terminal device of fringe radiation can be reduced Download PDFInfo
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- CN107801296A CN107801296A CN201711081987.4A CN201711081987A CN107801296A CN 107801296 A CN107801296 A CN 107801296A CN 201711081987 A CN201711081987 A CN 201711081987A CN 107801296 A CN107801296 A CN 107801296A
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- pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention belongs to field of circuit boards, a kind of more particularly to printed circuit board (PCB) and terminal device that can reduce fringe radiation, the printed circuit board (PCB) that can reduce fringe radiation of the present invention includes the pcb board with signals layer and internal planes, internal planes include bus plane and ground plane, the surrounding side of pcb board is coated with metal hemming edge, and the upper side and lower side of metal hemming edge extends to the edge of pcb board upper surface and the edge of lower surface respectively inwards.Pcb board upper and lower surface edge and surrounding are carried out metalized by the present invention, obtain the shielding construction for surrounding whole plate face, RF energy are prevented to external radiation by the shielding construction, so as to reach the purpose for reducing PCB edge radiation.
Description
Technical field
The invention belongs to field of circuit boards, more particularly to a kind of printed circuit board (PCB) that can reduce fringe radiation and terminal to set
It is standby.
Background technology
For high-frequency high-speed PCB, because the layer coupling magnetic flux of power plane and ground level is revealed, RF electric currents edge can be caused
PCB edge to radiate, cause the electromagnetic radiation of system more than EMC standards, and the three elements for producing EMC problems are electromagnetism does
Disturb source, coupling path and sensitive equipment.
With the raising of electronic apparatus system speed, and the constantly improve of electronic device process technology, signal rising edge
Increasingly faster, the transmission line effect on pcb board is more and more very important, the sequential at the same time brought, signal integrity, electromagnetism
The problems such as compatible, also becomes increasingly conspicuous.The work clock constantly to accelerate, i.e. high-speed digital signal, caused electromagnetic interference is into influenceing
One key factor of equipment performance, the serious mutual interference of internal system is not only resulted in, reduce the antijamming capability of system, simultaneously
Also very strong electromagnetic radiation can be produced to exterior space and environment.For multi-layer PCB, high speed logic or high frequency clock are being used
When, the harmonic wave of logical timer can cause resonance on PCB, produce RF energy (RF electric currents), and power plane and ground level are mutual
Couple RF energy, and these energy are radiated into free space and environment in horizontal edge, fringe radiation is formed, and then make
PCB turns into an effective electromagnetic radiation source.
And for reducing PCB edge radiation, a kind of method generally used in the industry at present is to follow " 20H " rule.20H is advised
Then proposed in 1980 by W.Michael King, and reported first in its works by Mark.I.Montrose earliest, and
As the important EMI design rule of industry high-speed digital circuit PCB making sheet, wherein " H " refers to the thickness of corresponding two interplanars
Degree, 20H rules are the distance that power plane inside contracts 20H than ground level.The rule is based on once presence change on circuit board
, then there is the principle of associated electromagnetic field radiation in electric current, size identical bus plane and stratum edge can produce marginal effect
Should, the field that is generated by it amount be marginal field, and these RF fields, which are measured, to launch from PCB limit, the problem of causing EMI.Power supply
DeGrain during contraction 10H in plane；When power plane inside contracts 20H, then 70% marginal flux border is absorbed；In power plane
During contracting 100H, then 98% marginal flux border is can absorb；Radiation caused by edge effect can be suppressed by thus inside contracting bus plane.
But to realize 20H rules, power plane is inside contracted into 20H, it is assumed that H is that (0.15mm, this is more by 0.006inch
It is a relatively common numerical value in layer PCB design), then it is 0.120inch (3.0mm) that can calculate 20H, now requires that power supply is put down
Face inside contracts 0.12inch (3mm) than ground level.At the same time, for the consideration of impedance control and RF current reflux, power supply is closed on
The track of non-ground attribute is not allow in the wiring layer of plane or copper foil exceeds the scope of power plane.Which results in edges of boards
Larger one piece of area does not allow the pin for the non-ground attribute that grafting device be present and the non-ground attribute via of surface-mounted device, and this is just
PCB plate face utilization rate is reduced, this is to being greatly unfavorable for some PCB (such as small size PCB, High density of PCB etc.)
Factor.Not to mention in PCB laminated construction, the big feelings of numerical value in the distance ratio hypothesis above of power plane and ground level
Condition.
With the development of technology, PCB certainly will tend to smaller szie higher frequency, and the at this moment diminution of PCB physical sizes can make
Obtain resonant frequency increase.Now if continued using the design for inside contracting bus plane, then the high band near resonance point then can
There is higher emittance, antenna effect can be more serious.
In order to solve the above-mentioned technical problem, people have carried out long-term exploration, such as Chinese patent discloses a kind of installation
Two-part electromagnetic radiation shielding device [application number on a printed circuit：CN98105612.1] it includes one and is used for holding
The electricity or the substantially unlimited frame unit of electronics part and the shell or outer cover part of a closing that requirement of receiving shields, it is above-mentioned
Framework and outer cover part are formed with conductive material, and the periphery that all there are some to be suitable to link closely each other, so, are being used
When said frame part and outer cover part the above-mentioned part on above-mentioned PCB can be enclosed in one sealing device in, its
Be characterised by, the periphery of said frame part and outer cover part has such shape, i.e., can apply when in use one it is lasting tight
Power is detained, so that the periphery of above-mentioned two component between above-mentioned frame unit and outer cover part is close to establish on edge and kept for week
The electrical contact on side.
Although such scheme proposes a kind of device that can play electromagnetic shielding action, but it structure to be present excessively multiple
It is miscellaneous, it is necessary to add-on device on circuit boards, the problems such as input cost is high.
The content of the invention
A kind of regarding the issue above, the present invention provides printing that can reduce fringe radiation electricity simple in construction
Road plate；
The another object of this programme is to provide a kind of terminal device using above-mentioned printed circuit board (PCB).
To reach above-mentioned purpose, present invention employs following technical proposal：
The printed circuit board (PCB) that the present invention can reduce fringe radiation includes the pcb board with signals layer and internal planes, described
Internal planes include bus plane and ground plane, the surrounding side of the pcb board is coated with metal hemming edge, and described metal hemming edge
The upper side and lower side extend to the edge of pcb board upper surface and the edge of lower surface respectively inwards.
Pass through above-mentioned technical proposal, pcb board upper and lower surface edge and surrounding are subjected to metalized, obtained whole plate
The shielding construction that bread encloses, RF energy is prevented to external radiation by the shielding construction, so as to reach the mesh for reducing PCB edge radiation
's.
The printed circuit board (PCB) of fringe radiation can be reduced above-mentioned, described pcb board upper surface has is used as signal
The top layer of layer, the lower surface of pcb board have the bottom as signals layer, and described bus plane and ground plane are successively set on top layer
Between bottom, and the upper side and lower side of described metal hemming edge extends respectively to pcb board upper and lower surface and is located at top layer
Outer circumferential and bottom outer circumferential.
Can reduce the printed circuit board (PCB) of fringe radiation above-mentioned, be also equipped between described top layer and bottom to
A few layer signal layer, and there is at least one layer of ground plane between described top layer and bottom, and described metal hemming edge and top layer
At least one layer of ground plane is connected between bottom.
The printed circuit board (PCB) of fringe radiation can be reduced above-mentioned, described metal hemming edge is made up of copper foil material,
Described ground plane is also made up of copper foil material, and both are connected with each other.
The printed circuit board (PCB) of fringe radiation can be reduced above-mentioned, described metal hemming edge and coupled ground connection
Layer integral structure is set, and metal hemming edge is stretched out by coupled ground plane and obtained.
The printed circuit board (PCB) of fringe radiation can be reduced above-mentioned, the copper foil surface of described metal hemming edge is passes through
The surface of welding resistance windowing processing.
The printed circuit board (PCB) of fringe radiation can be reduced above-mentioned, be coated on a circle metal of pcb board surrounding side
Some vias are offered on bound edge.
The printed circuit board (PCB) of fringe radiation can be reduced above-mentioned, edge and the pcb board table of described metal hemming edge
The ground copper foil in face is connected.
The printed circuit board (PCB) of fringe radiation can be reduced above-mentioned, the surrounding side of described bus plane and pcb board
Electric clearance is left between edge.
A kind of terminal device using the above-mentioned printed circuit board (PCB) that can reduce fringe radiation.
The present invention has the advantages that simple in construction, shield effectiveness is good compared to prior art.
Brief description of the drawings
Fig. 1 is four layers of pcb board diagrammatic cross-section of the embodiment of the present invention one；
Fig. 2 is six layers of pcb board diagrammatic cross-section of the embodiment of the present invention two；
Fig. 3 is the multi-layer PCB board diagrammatic cross-section of the embodiment of the present invention three.
Reference：Signals layer 1；Bus plane 2；Ground plane 3；Metal hemming edge 4.
Embodiment
The printed circuit board (PCB) that can reduce fringe radiation of the present invention is mainly used in electronic device field, solves existing
The shortcomings of electromagnetic interference between the electronic equipment of technology or between electronic equipment internal component is serious, it is of the invention below
Preferred embodiment and with reference to accompanying drawing, is further described, but the invention is not restricted to these implementations to technical scheme
Example.
Embodiment one
Although prior art employs the method that bus plane 2 inside contracts and realizes the effect that fringe radiation suppresses, but with skill
The development of art, the trend that PCB tends to smaller szie higher frequency is more and more obvious, if only from the angle of PCB physical sizes
Can be so that resonant frequency increases, now if continued using the design for inside contracting bus plane 2, then attached in resonance point to reduce PCB
Higher emittance then occurs near high band, and antenna effect can be more serious.So 20H theory has not met certain
Actual demand under a little situations.Compared with 20H rules, the present invention proposes a kind of printed circuit that can reduce fringe radiation
Plate, it carries out shielding processing to PCB edge, so as to which emittance is reflected back in PCB inner spaces, so that fringe radiation obtains
Reduced to effective；In addition, the present invention deliberately need not carry out inside contracting processing to power plane, it is only necessary to by power plane with PCB
Edge keeps certain electric clearance, so as to make full use of PCB plate face space to be laid out the processing such as wiring.
Specifically, as shown in figure 1, the printed circuit board (PCB) that can reduce fringe radiation of the present embodiment includes having signals layer
1 and the pcb board of internal planes, described internal planes include bus plane 2 and ground plane 3, the surrounding side of the pcb board is coated with gold
Belong to bound edge 4, that is to say, that PCB outer circumferentials are metals, and the outer circumferential different from the pcb board of prior art is the PCB of insulation
Substrate, and the upper side and lower side of described metal hemming edge 4 extends to the side at the edge and lower surface of pcb board upper surface respectively inwards
Edge, that is to say, that metal hemming edge has certain width to wrap edges of boards at the upper and lower surface edge of pcb board, electricity
Electric clearance is left between active layer 2 and the surrounding lateral edge of pcb board.
Art personnel should be known that electric clearance refers between two conductive parts or conductive parts
The most short space length measured between equipment protection interface.I.e. in the case where ensureing electric property stabilization and safety, pass through
Air can realize the beeline of insulation.
The present embodiment uses four layers of pcb board, and specifically, described pcb board upper surface has the top layer as signals layer 1,
The lower surface of pcb board has the bottom as signals layer 1, and described bus plane 2 and ground plane 3 are successively set on top layer and bottom
Between, and the upper side and lower side of described metal hemming edge 4 extends respectively to the circumference that pcb board upper and lower surface is located at top layer
The edge of outside and the outer circumferential of bottom, top layer and bottom typically can all leave the segment distance of pcb board edge one, that is to say, that top
Also there are certain width spaces in layer, and the metal hemming edge described in the present embodiment is to extend to this width with bottom outer circumferential
To spend in space, that is to say, that metal hemming edge surrounds top layer in the upper surface of pcb board, surrounds bottom in the lower surface of pcb board,
Metal hemming edge is set at PCB upper and lower surface edge to there is certain width to wrap edges of boards.
Preferably, metal hemming edge 4 is made up of copper foil material, and ground plane 3 is also made up of copper foil material, and both mutually interconnect
Connect, that is to say, that ground plane 3 forms shielding construction together with PCB edge, equivalent to by shielding construction by the edges of boards of whole pcb board
It is surrounded with metal, now, when RF energy caused by PCB work runs into shielding construction, shielding construction is anti-to energy production
Penetrate, weaken or even absorb, so as to prevent RF energy from, to external radiation, reaching the purpose for reducing PCB edge radiation.
And preferably, described metal hemming edge 4 is set with the integral structure of ground plane 3, and metal hemming edge 4 is by ground plane 3
Stretch out and obtain.
Here close-coupled between ground plane 3 and bus plane 2, that is to say, that Jie between bus plane 2 and ground plane 3
Matter thickness takes less value, to improve the electric capacity between bus plane 2 and ground plane 3.Two signals are adjacent with an internal planes,
Such as, top layer is adjacent with bus plane 2, and bottom is adjacent with ground plane 3, and shielding is provided for signal using the big copper foil of internal planes.
Further, the copper foil surface of described metal hemming edge 4 is the surface handled that opened a window by welding resistance, specifically
It is that specific manifestation form of the metal hemming edge on pcb board is exposed copper foil, is not covered with the ink of insulation, art
Personnel should be known that when PCB is produced, if the copper foil in certain block region has carried out welding resistance windowing processing, then the region is exactly
It is exposed outside.
In addition to above-mentioned processing, additionally it is possible to the pcb board side of metallization is surface-treated, as above tin etc..
Preferably, the present embodiment offers some rules point on the circle metal hemming edge 4 for being coated on pcb board surrounding side
The via of cloth, art personnel should be known that via is also referred to as plated through-hole, in dual platen and multi-layer sheet, for connection
Printed conductor between each layer, a common aperture, i.e. via are bored in the intersection for the wire that each layer needs to connect.
Here via refers to ground via, is the mistake of the same network attribute of metal hemming edge with internal layer ground plane, edges of boards
Hole, main function is the connection for strengthening metal hemming edge and ground plane, for providing complete low-impedance path for the backflow of signal,
The coupling between signal and backflow is ensure that, so as to inhibit EMI.The position of these vias is just in PCB sides, metal bag region
It is interior, but because be with identical network attribute, therefore be not in short circuit situation
Bound edge copper foil positioned at pcb board upper and lower surface edge can be connected with the ground copper foil of pcb board upper and lower surface, and
It can be adjusted as the ground copper foil on pcb board surface, its width with specific reference to actual conditions, if PCB space as far as possible greatly
Greatly, device is few, and is laid out away from edges of boards, then the copper foil width at pcb board upper and lower surface edge can be with larger, if PCB is laid out
When device it is intensive, the remaining space of edges of boards is few, then at least ensure leave a circle be no more than factory process ability ground copper foil.
Further, during pcb board is made, the copper foil profile of PCB edge exceeds pcb board outer frame shape, exceeds
Size do not Qiang Zhiyaoqiu, as the case may be depending on, PCB sides need not do specially treated；Or put along PCB housings
Metallization long slot bore is put, the side inwall of slotted eye is overlapped with PCB edge, and opposite side is maintained at beyond PCB, and PCB sides need not
Specially treated.
The present embodiment also discloses a kind of terminal device using the above-mentioned printed circuit board (PCB) that can reduce fringe radiation,
The terminal device can be the electronic equipments such as mobile phone, flat board, computer, TV, using the electronics of the printed circuit board (PCB) of the present embodiment
The EMI of each circuit board can be greatly reduced in equipment, minimize the electronic equipment that ground influences to close on, or even the circuit board closed on.
State as the pcb board presentation of the present embodiment：The edge of the upper surface (top layer) of pcb board it is exposed a circle copper
Paper tinsel, the side of pcb board are exposed copper foils, the edge of the lower surface (bottom) of pcb board it is exposed a circle copper foil, this three parts connect
It is an entirety to be connected together, meanwhile, in the copper foil at pcb board upper and lower surface edge, the copper foil and pcb board of pcb board side
What the ground plane 3 in portion was also connected to, or ground plane 3 and foregoing entirety is further connected as an entirety, if using universal meter
Examine, it can be found that this entirety communicates with the ground network on plate.
The pcb board of the present embodiment need not carry out inside contracting processing to bus plane 2, it is only necessary to allow bus plane 2 to be protected with PCB edge
Certain electric clearance is held, the screen layer at edge is connected with the ground plane 3 of inside, strengthens the globality of pcb board, improves
The stability of pcb board, pcb board is set inherently to have the function that fringe radiation can be reduced, without the extra device for being used to shield,
While simple in construction, overall cost input is reduced, is advantageous to electronic device field toward miniaturization, the hair in high speed direction
Exhibition.
Embodiment two
The present embodiment is similar with embodiment one, and difference is, the circuit board of the present embodiment uses 6 Rotating fields, specifically
Ground says, is also equipped with one layer or two layers of signals layer 1 between top layer and bottom, and the overlapped way between each layer of the present embodiment is from upper
It can be followed successively by under：
1st, signals layer 1- ground planes 3- signals layers 1- signals layers 1- bus plane 2- signals layers 1；
2nd, signals layer 1- signals layers 1- bus planes 2- ground planes 3- signals layer 1- signals layers 1；
3rd, signals layer 1- ground planes 3- signals layers 1- bus planes 2- ground plane 3- signals layers 1.
Following defect in such scheme 1 be present：Separate between bus plane 2 and ground plane 3 farther out, without abundant coupling
Close；Signals layer 1 and the direct neighbor of signals layer 1, signal isolation is bad, and crosstalk easily occurs.
Such scheme 2 has sufficient coupling relative to scheme 1, bus plane 2 and ground plane 3, and comparing scheme 1 has necessarily
Advantage, but there are still the adjacent situation of signals layer 1, signal isolation is bad, easily occurs the problem of crosstalk and does not have
To solution；
Scheme 3 reduces a signals layer 1 relative to scheme 1 and scheme 2, more internal planes, although being available for connecting up
Aspect reduce, but the program solves scheme 1 and the defects of scheme 2 shares, in scheme 3：Bus plane 2 and ground plane are tight
Close coupling is closed：Each signals layer 1 and internal planes direct neighbor, with other signals layers 1 have it is effective isolate, be not susceptible to go here and there
Disturb；The signals layer 1 adjacent with internal planes can be used for transmitting high speed signal respectively for both sides, and two internal planes can be shielded effectively
The interference of the interference of the outer bound pair signals layer 1 and the signals layer 1 to the external world.
So four layers of pcb board of the present embodiment use the overlapped way of scheme 3, both meet that there is more signals layer 1, have
Beneficial to the installation work between component, and isolated between every two layers of signals layer 1 using bus plane 2 and/or ground plane 3, avoided
The problems such as crosstalk of signal.
Embodiment three
The present embodiment is similar with embodiment one, and difference is, the circuit board of the present embodiment uses 8 Rotating fields, such as Fig. 3
The shown diagrammatic cross-section for multi-layer PCB board, 2 layer signal layers 1 specifically, between top layer and bottom are also equipped with, in addition,
Also there is extra two layers of ground plane 3, at this moment, the overlapped way between each layer is followed successively by from top to bottom：Signals layer 1- ground planes
3- signals layer 1-ground plane 3- bus plane 2- signals layer 1- ground plane 3- signals layers 1；Or also there is one layer of extra ground connection
Layer 3 and one layer of bus plane 2, at this moment, the overlapped way between each layer is followed successively by from top to bottom：Signals layer 1- ground plane 3- signals layers
1- bus plane 2- ground plane 3- signals layer 1- bus plane 2- signals layers 1.
The embodiment of the present invention and the stacked arrangement mode implemented in three between each layer follow following principle：
1st, signals layer 1 should (ground plane 3 of bus plane 2/) at least adjacent with an internal planes, utilize the big copper film of internal planes
To provide shielding for signals layer 1；
2nd, should close-coupled between bus plane 2 and ground plane 3, that is to say, that Jie between internal power plane 2 and stratum
Matter thickness should take less value, to improve the electric capacity between bus plane 2 and stratum, increase resonant frequency, if power supply and ground
If potential difference between line is little, less thickness of insulating layer, such as 5mil can be used；
3rd, the high speed transmission of signals layer in circuit should be signal intermediate layer, and be clipped between two internal planes, so
The copper film of two internal planes can provide electromagnetic shielding for high speed transmission of signals, while also can be effectively by the radiation of high speed signal
It is limited between two internal planes, does not interfere externally；
4th, two direct neighbors of signals layer 1 are avoided, crosstalk are readily incorporated between adjacent signals layer 1, so as to cause circuit
Disabler, addition ground plane 3 can be effectively prevented from crosstalk between two signals layers 1；
5th, the internal planes of multiple ground connection can be effectively reduced impedance ground, for example, a-signal layer 1 and B signal layer 1 use
Each single ground plane 3, can be effectively reduced common mode disturbances；
6th, the symmetry of Rotating fields is taken into account.
The advantage of the invention is that：
1st, the present invention is not only suitable for the situation of low frequency, is also applied for the situation of high frequency, the trend of load electronic equipment development；
2nd, the present invention carries out shielding processing to PCB edge, so as to which emittance is reflected back in PCB inner spaces, so as to
Fringe radiation is set effectively to be reduced；
3rd, the present invention deliberately need not carry out inside contracting processing to bus plane 2, it is only necessary to allow bus plane 2 to be kept with PCB edge
The processing such as certain electric clearance, the plate face space part wiring so as to make full use of PCB.
Specific embodiment described herein is only to spirit explanation for example of the invention.Technology belonging to the present invention is led
The technical staff in domain can be made various modifications or supplement to described specific embodiment or be replaced using similar mode
Generation, but without departing from the spiritual of the present invention or surmount scope defined in appended claims.
Although signals layer 1 has more been used herein；Bus plane 2；Ground plane 3；The grade term of metal hemming edge 4, but do not arrange
Except the possibility using other terms.It is used for the purpose of more easily describing and explaining the essence of the present invention using these terms；
Any additional limitation is construed as all to disagree with spirit of the present invention.
Claims (10)
1. a kind of printed circuit board (PCB) that can reduce fringe radiation, including the pcb board with signals layer (1) and internal planes, described
Internal planes include bus plane (2) and ground plane (3), it is characterised in that the surrounding side of the pcb board is coated with metal hemming edge
(4), and the upper side and lower side of described metal hemming edge (4) extends to the edge and lower surface of pcb board upper surface respectively inwards
Edge.
2. the printed circuit board (PCB) according to claim 1 that fringe radiation can be reduced, it is characterised in that described pcb board
Upper surface has the top layer as signals layer (1), and the lower surface of pcb board has the bottom as signals layer (1), described power supply
Layer (2) and ground plane (3) are successively set between top layer and bottom, and the upper side and lower side difference of described metal hemming edge (4)
Extend to pcb board upper and lower surface and be located at the outer circumferential of top layer and the outer circumferential of bottom.
3. the printed circuit board (PCB) according to claim 2 that fringe radiation can be reduced, it is characterised in that described top layer and
At least one layer of signals layer (1) is also equipped between bottom, and there is at least one layer of ground plane between described top layer and bottom, and
Described metal hemming edge is connected with least one layer of ground plane between top layer and bottom.
4. according to the printed circuit board (PCB) that can reduce fringe radiation described in any one claim of claim 1-3, it is special
Sign is that described metal hemming edge (4) is made up of copper foil material, and described ground plane (3) is also made up of copper foil material, and both
It is connected with each other.
5. the printed circuit board (PCB) according to claim 3 that fringe radiation can be reduced, it is characterised in that described metal bag
Side (4) is set with coupled ground plane (3) integral structure, and metal hemming edge (4) from coupled ground plane (3) to
It is outer extension and obtain.
6. the printed circuit board (PCB) according to claim 5 that fringe radiation can be reduced, it is characterised in that described metal bag
The copper foil surface on side (4) is the surface handled that opened a window by welding resistance.
7. the printed circuit board (PCB) according to claim 6 that fringe radiation can be reduced, it is characterised in that be coated on pcb board
Some vias are offered on one circle metal hemming edge (4) of surrounding side.
8. the printed circuit board (PCB) according to claim 7 that fringe radiation can be reduced, it is characterised in that described metal bag
The edge on side (4) is connected with the ground copper foil on pcb board surface.
9. the printed circuit board (PCB) according to claim 1 that fringe radiation can be reduced, it is characterised in that described bus plane
(2) electric clearance is left between the surrounding lateral edge of pcb board.
10. a kind of terminal of printed circuit board (PCB) that can reduce fringe radiation using described in claim 1-9 any one is set
It is standby.
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| CN201711081987.4A CN107801296A (en) | 2017-11-07 | 2017-11-07 | The printed circuit board (PCB) and terminal device of fringe radiation can be reduced |
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| CN201711081987.4A CN107801296A (en) | 2017-11-07 | 2017-11-07 | The printed circuit board (PCB) and terminal device of fringe radiation can be reduced |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109348614A (en) * | 2018-10-29 | 2019-02-15 | 苏州福莱盈电子有限公司 | A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing |
| WO2020006813A1 (en) * | 2018-07-05 | 2020-01-09 | 易力声科技(深圳)有限公司 | Patch antenna using bonding wires for frequency modulation |
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN114430609A (en) * | 2020-10-29 | 2022-05-03 | 深南电路股份有限公司 | Battery protection plate, processing method and electronic equipment |
| WO2023035603A1 (en) * | 2021-09-08 | 2023-03-16 | 中兴通讯股份有限公司 | Pcb, pcb mounting box, case assembly, and case |
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| WO2020006813A1 (en) * | 2018-07-05 | 2020-01-09 | 易力声科技(深圳)有限公司 | Patch antenna using bonding wires for frequency modulation |
| CN109348614A (en) * | 2018-10-29 | 2019-02-15 | 苏州福莱盈电子有限公司 | A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing |
| CN111225496A (en) * | 2020-01-10 | 2020-06-02 | 东莞市五株电子科技有限公司 | Metal half-clad structure, manufacturing process and PCB |
| CN111225496B (en) * | 2020-01-10 | 2023-03-10 | 东莞市五株电子科技有限公司 | Manufacturing process of metal semi-clad structure |
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