CN107731762A - The plastic package method of sensitive chip and the plastic packaging component of sensitive chip - Google Patents
The plastic package method of sensitive chip and the plastic packaging component of sensitive chip Download PDFInfo
- Publication number
- CN107731762A CN107731762A CN201711001321.3A CN201711001321A CN107731762A CN 107731762 A CN107731762 A CN 107731762A CN 201711001321 A CN201711001321 A CN 201711001321A CN 107731762 A CN107731762 A CN 107731762A
- Authority
- CN
- China
- Prior art keywords
- sensitive chip
- plastic
- viscose glue
- light sensation
- packaged glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of plastic package method of sensitive chip, the present invention sets packaged glass before plastic packaging is carried out on sensitive chip, and is coated with the first light sensation viscose glue in packaged glass surrounding.So plastic package die can be pressed on packaged glass, without being directly pressed on sensitive chip, be crushed and polluted so as to avoid sensitive chip.After plastic packaging terminates, the first light sensation viscose glue of degrading, the first light sensation viscose glue loses viscosity, so as to which packaged glass be taken out, so that the photosensitive region of sensitive chip is exposed outside, light can be directly incident on sensitive chip, without the refraction or reflection by packaged glass, so as to improve the quality of image.The invention also discloses a kind of plastic packaging component of sensitive chip.
Description
Technical field
The present invention relates to camera technology field, plastic package method and photosensitive core more specifically to a kind of sensitive chip
The plastic packaging component of piece.
Background technology
CSP：Chip Scale Package, it is the meaning of wafer-level package.CSP encapsulation can allow chip area with encapsulating
The area of substrate is very close, is generally got up by the tin ball of package substrate bottom and the connection of wiring board.CSP encapsulation senses
As shown in Figure 1, including sensitive chip 100, is packaged in photosensitive the packaged glass 200 being packaged on sensitive chip 100 optical chip
The package substrate 300 of the bottom of chip 100, the bottom of package substrate 300 are provided with tin ball.The pin of sensitive chip 100 is by lead
Lead to Xi Qiuchu.But can reflect, reflect and energy loss when light penetration packaged glass, influence image effect.
If packaged glass removed, make sensitive chip exposed outside, when carrying out plastic packaging to CSP encapsulation sensitive chips, plastic package die
It can directly bear against on sensitive chip, it is likely that crush sensitive chip.In addition, sensitive chip can also be polluted.
Therefore, how to evade the influence of packaged glass, improve image effect, at the same and can evade sensitive chip be crushed and
Pollution, is those skilled in the art's critical problem urgently to be resolved hurrily.
The content of the invention
It is an object of the invention to provide a kind of plastic package method of sensitive chip, the plastic package method can not only evade encapsulation glass
Influence of the glass to image, while and can evades sensitive chip and is crushed and pollutes.
To reach above-mentioned purpose, the present invention provides following technical scheme：
A kind of plastic package method of sensitive chip, including：
S1：Packaged glass is carried on sensitive chip, the edge of packaged glass is located at the photosensitive area of sensitive chip
On the edge in domain；
S2：The first light sensation viscose glue is coated with the outer surface of the surrounding of packaged glass；
S3：Plastic package die is pressed on packaged glass, carries out plastic packaging；
S4：Degrade the first light sensation viscose glue, packaged glass is taken out.
Preferably, step S02 is also included before step S1：In the edge coating the of the photosensitive region of sensitive chip
Two light sensation viscose glues；The step S4 is specially：Degrade the first light sensation viscose glue and the second light sensation viscose glue, packaged glass is taken out.
Preferably, step S01 is also included before step S02：In the bottom of sensitive chip, package substrate, photosensitive core are set
The functional pin of piece is packaged the pad that lead leads to the bottom of package substrate.
Preferably, " the first light sensation viscose glue of degraded " in the step S4 specifically includes：First light is dissolved by ultraviolet light
Feel viscose glue.
Preferably, " carry out plastic packaging " specifically includes in the step S3：The epoxy of liquid is injected into the plastic package die
Resin material, it will be in after epoxide resin material cooling in sensitive chip around the part outside photosensitive region and sensitive chip
Component seals up.
Present invention also offers a kind of plastic packaging component of sensitive chip, including sensitive chip, around sensitive chip
Component and plastic part, the plastic part are close by the part that photosensitive region is removed in the component and the sensitive chip
Seal, the photosensitive region of the sensitive chip is exposed outside.
Preferably, the plastic part is epoxy resin.
Preferably, the bottom of the sensitive chip is additionally provided with package substrate, and the functional pin of the sensitive chip is sealed
On the pad for the bottom that dress lead leads to the package substrate.
Preferably, it is coated with insulating coating outside the package lead.
Preferably, tin ball is welded with the pad of the bottom of the package substrate.
It can be seen from the above technical proposal that the present invention is set before plastic packaging is carried out on sensitive chip encapsulates glass
Glass, and it is coated with the first light sensation viscose glue in packaged glass surrounding.So plastic package die can be pressed on packaged glass, without straight
Connect and be pressed on sensitive chip, be crushed and pollute so as to avoid sensitive chip.After plastic packaging terminates, the first light sensation of degraded glues
Glue, the first light sensation viscose glue lose viscosity, so as to which packaged glass be taken out, so that the photosensitive region of sensitive chip is exposed outside, light
Line can be directly incident on sensitive chip, without the refraction or reflection by packaged glass, so as to improve the quality of image.
Brief description of the drawings
Scheme in order to illustrate the embodiments of the present invention more clearly, it will use below required described in embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For field technique personnel, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the plastic package method for the sensitive chip that a specific embodiment of the invention provides；
Fig. 2 is the structural representation of the sensitive chip that a specific embodiment of the invention provides and package substrate；
Fig. 3 is the sensitive chip top view that a specific embodiment of the invention provides；
Fig. 4 is Fig. 3 front view；
Fig. 5 is the structural representation of sensitive chip, packaged glass and package substrate that a specific embodiment of the invention provides
Figure；
Fig. 6 is the state diagram that moment during plastic packaging is carried out to sensitive chip that a specific embodiment of the invention provides；
Fig. 7 is the structural representation of the plastic packaging component for the sensitive chip that a specific embodiment of the invention provides.
Wherein, 1 it is sensitive chip, 2 be plastic part, 3 be package substrate, 4 be package lead, 5 be tin ball, 61 is the first light
Sense viscose glue, 62 be the second light sensation viscose glue, 7 be packaged glass, 8 be component, 9 be plastic package die, 10 be camera lens.
Embodiment
The invention discloses a kind of plastic package method of sensitive chip, the plastic package method can not only evade packaged glass to shadow
The influence of picture, while and can evades sensitive chip and is crushed and pollutes.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.Base
In embodiments of the invention, those of ordinary skill in the art obtained on the premise of creative work is not made it is all its
Its embodiment, belongs to the scope of protection of the invention.
It refer to accompanying drawing 1-7.In a specific embodiment of the invention, the plastic package method of sensitive chip comprises the following steps：
S1：Packaged glass 7 is carried on sensitive chip 1, the edge of packaged glass 7 is located at the sense of sensitive chip 1
On the edge in light region.
Packaged glass 7 in the step encapsulates the photosensitive region of sensitive chip 1.
S2：The first light sensation viscose glue 61 is coated with the outer surface of the surrounding of packaged glass 7.
The purpose for being coated with the first light sensation viscose glue 61 is plastic packaging material and the adhesion of packaged glass 7 when avoiding follow-up plastic packaging.
S3：Plastic package die 9 is pressed on packaged glass 7, carries out plastic packaging.
In this step, plastic package die 9 has been pressed on packaged glass 7, without being directly pressed on sensitive chip 1,
It is crushed or pollutes so as to avoids sensitive chip 1.After plastic package die 9 is installed in place, plastic packaging is injected into plastic package die 9
Material, wait to be cooled.
S4：Degrade the first light sensation viscose glue 61, packaged glass 7 is taken out.
After plastic packaging terminates, the first light sensation viscose glue 61 of degrading, the first light sensation viscose glue 61 is lost viscosity, will can thus encapsulate
Glass 7 takes out.
The present embodiment sets packaged glass 7 before plastic packaging is carried out on sensitive chip 1, and in the surrounding of packaged glass 7
It is coated with the first light sensation viscose glue.So plastic package die 9 can be pressed on packaged glass 7, without being directly pressed on sensitive chip 1
On, it is crushed and pollutes so as to avoids sensitive chip 1.After plastic packaging terminates, the first light sensation viscose glue 61 of degrading, the first light sensation glues
Glue 61 loses viscosity, and so as to which packaged glass 7 be taken out, so that the photosensitive region of sensitive chip 1 is exposed outside, light can be direct
Incide on sensitive chip 1, without the refraction or reflection by packaged glass 7, so as to improve the quality of image.
In a specific embodiment of the invention, in step S 1 " packaged glass 7 is carried on sensitive chip 1, makes encapsulation glass
The edge of glass 7 is located in the edge of the photosensitive region of sensitive chip 1 " also include step S02 before：In sensitive chip
The edge of 1 photosensitive region is coated with the second light sensation viscose glue 62.The purpose that the second light sensation viscose glue 62 is coated with the step be by
Packaged glass 7 is fixed.The edge of packaged glass 7 is located at the surrounding of the photosensitive region of sensitive chip 1 in step sl
In edge, then packaged glass 7 is fixed on sensitive chip 1 by the second light sensation viscose glue 62.Which improves packaged glass 7
Stability, it is easy to subsequently to the pressed of plastic package die 9.After plastic packaging terminates, the second light sensation viscose glue 62 of degraded and the first light sensation glue
Glue 61, packaged glass 7 is taken out.
In a specific embodiment of the invention, S01 is also included before step S02 " in the bottom of sensitive chip 1 setting envelope
Substrate 3 is filled, the functional pin of sensitive chip 1 is packaged the pad that lead 4 leads to the bottom of package substrate 3." set in the step
Package substrate 3, further avoid the pollution to sensitive chip 1 during plastic packaging, so as to further increase image
Quality.
In an of the invention specific embodiment, in above-mentioned steps S4 " the first light sensation viscose glue 61 " of degraded specifically includes：It is logical
Cross ultraviolet light and dissolve the first light sensation viscose glue 61.Second light sensation viscose glue 62 and the dissolving for passing through ultraviolet light.
In a specific embodiment of the invention, " carry out plastic packaging " specifically includes in step S3：Liquid is injected into plastic package die 9
The epoxide resin material of state, the part and photosensitive that will be in after epoxide resin material cooling in sensitive chip 1 outside photosensitive region
Component 8 around chip 1 seals up, it is achieved thereby that plastic packaging.
The invention also discloses a kind of plastic packaging component of sensitive chip 1, including sensitive chip 1, around sensitive chip 1
Component 8 and plastic part 2.The plastic part 2 seals the part that photosensitive region is removed in component 8 and sensitive chip 1
Firmly, the photosensitive region of sensitive chip 1 is exposed outside.In the present embodiment, base is replaced using plastic part 2, is taken the photograph so as to reduce
As the size of module.In addition, the photosensitive region of sensitive chip 1 is exposed outside, light without going past packaged glass 7 refraction or
Reflection, and can be directly incident on sensitive chip 1, so as to improve influence quality.Specifically, it is preferably epoxy by plastic part 2
Resin.Epoxy resin has excellent adhesive strength to the surface of metal and nonmetallic materials, and dielectric properties are good, deformation retract
Rate is small, and product size stability is good.
In a specific embodiment of the invention, package substrate 3 is also provided with the bottom of sensitive chip 1.Sensitive chip 1
Functional pin is packaged on the pad for the bottom that lead 4 leads to package substrate 3.Package substrate 3 is by the bottom package of sensitive chip 1
Firmly, the pollution of the bottom during plastic packaging to sensitive chip 1 is so avoided, so as to further increase image matter
Amount.
Further, insulating coating is coated with outside package lead 4, so that it is guaranteed that the circuit connection of sensitive chip 1 is steady
It is qualitative.
It is specific real in the present invention one for the ease of the connection of the pad and camera module wiring board of the bottom of package substrate 3
Apply in example, tin ball 5 has been welded on the pad of the bottom of package substrate 3.
The bottom of package substrate 3 can also be not provided with tin ball 5, by the pad of the position of tin ball 5 expose can also, so as to
Reduce scolding tin height.
The described above of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.It is right
A variety of modifications of these embodiments will be apparent for those skilled in the art, and as defined herein one
As principle can realize in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention will
It will not be intended to be limited to the embodiments shown herein, and be to fit to consistent with principles disclosed herein and features of novelty
Most wide scope.
Claims (10)
- A kind of 1. plastic package method of sensitive chip, it is characterised in that including：S1：Packaged glass (7) is carried on sensitive chip (1), the edge of packaged glass (7) is located at sensitive chip (1) Photosensitive region edge on；S2：The first light sensation viscose glue (61) is coated with the outer surface of the surrounding of packaged glass (7)；S3：Plastic package die (9) is pressed on packaged glass (7), carries out plastic packaging；S4：Degrade the first light sensation viscose glue (61), packaged glass (7) is taken out.
- 2. the plastic package method of sensitive chip according to claim 1, it is characterised in that also include step before step S1 S02：The second light sensation viscose glue (62) is coated with the edge of the photosensitive region of sensitive chip (1)；The step S4 is specially：Drop The first light sensation viscose glue (61) and the second light sensation viscose glue (62) are solved, packaged glass (7) is taken out.
- 3. the plastic package method of sensitive chip according to claim 2, it is characterised in that also include step before step S02 Rapid S01：Package substrate (3) is set in the bottom of sensitive chip (1), and the functional pin of sensitive chip (1) is packaged lead (4) and drawn To the pad of the bottom of package substrate (3).
- 4. the plastic package method of the sensitive chip according to claim 1, it is characterised in that " degraded the in the step S4 One light sensation viscose glue (61) " specifically includes：First light sensation viscose glue (61) is dissolved by ultraviolet light.
- 5. the plastic package method of sensitive chip according to claim 1, it is characterised in that in the step S3 " carry out plastic packaging " Specifically include：The epoxide resin material of injection liquid into the plastic package die (9), by photosensitive core after epoxide resin material cooling The part outside photosensitive region and the component (8) around sensitive chip (1) seal up in piece (1).
- 6. a kind of plastic packaging component of sensitive chip, including sensitive chip (1), the component (8) around sensitive chip (1) with And plastic part (2), it is characterised in that the plastic part (2) will remove in the component (8) and the sensitive chip (1) The part of photosensitive region seals up, and the photosensitive region of the sensitive chip (1) is exposed outside.
- 7. the plastic packaging component of sensitive chip according to claim 6, it is characterised in that the plastic part (2) is asphalt mixtures modified by epoxy resin Fat.
- 8. the plastic packaging component of sensitive chip according to claim 7, it is characterised in that the bottom of the sensitive chip (1) Package substrate (3) is additionally provided with, the functional pin of the sensitive chip (1) is packaged lead (4) and leads to the package substrate (3) Bottom pad on.
- 9. the plastic packaging component of sensitive chip according to claim 8, it is characterised in that the package lead (4) coats outside There is insulating coating.
- 10. the plastic packaging component of sensitive chip according to claim 8, it is characterised in that the bottom of the package substrate (3) Pad on be welded with tin ball (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711001321.3A CN107731762A (en) | 2017-10-24 | 2017-10-24 | The plastic package method of sensitive chip and the plastic packaging component of sensitive chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711001321.3A CN107731762A (en) | 2017-10-24 | 2017-10-24 | The plastic package method of sensitive chip and the plastic packaging component of sensitive chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107731762A true CN107731762A (en) | 2018-02-23 |
Family
ID=61212648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711001321.3A Pending CN107731762A (en) | 2017-10-24 | 2017-10-24 | The plastic package method of sensitive chip and the plastic packaging component of sensitive chip |
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| Country | Link |
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| CN (1) | CN107731762A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108922855A (en) * | 2018-07-12 | 2018-11-30 | 信利光电股份有限公司 | The production method and camera module base of chip-scale micro-plastic seal camera module base |
| CN111371970A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN112233987A (en) * | 2019-07-15 | 2021-01-15 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure |
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| US20090256222A1 (en) * | 2008-04-14 | 2009-10-15 | Impac Technology Co., Ltd. | Packaging method of image sensing device |
| CN103700634A (en) * | 2013-11-06 | 2014-04-02 | 南昌欧菲光电技术有限公司 | Camera module, and encapsulating structure and encapsulating method thereof |
| CN105762159A (en) * | 2015-01-05 | 2016-07-13 | 意法半导体有限公司 | Image sensor device with sensing surface cavity and related methods |
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2017
- 2017-10-24 CN CN201711001321.3A patent/CN107731762A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101292357A (en) * | 2005-09-01 | 2008-10-22 | 美光科技公司 | Microelectronic imaging devices and associated methods for attaching transmissive elements |
| US20090256222A1 (en) * | 2008-04-14 | 2009-10-15 | Impac Technology Co., Ltd. | Packaging method of image sensing device |
| CN103700634A (en) * | 2013-11-06 | 2014-04-02 | 南昌欧菲光电技术有限公司 | Camera module, and encapsulating structure and encapsulating method thereof |
| CN105762159A (en) * | 2015-01-05 | 2016-07-13 | 意法半导体有限公司 | Image sensor device with sensing surface cavity and related methods |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108922855A (en) * | 2018-07-12 | 2018-11-30 | 信利光电股份有限公司 | The production method and camera module base of chip-scale micro-plastic seal camera module base |
| CN111371970A (en) * | 2018-12-26 | 2020-07-03 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN111371970B (en) * | 2018-12-26 | 2022-03-15 | 中芯集成电路（宁波）有限公司 | Packaging method of camera shooting assembly |
| CN112233987A (en) * | 2019-07-15 | 2021-01-15 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure |
| CN112233987B (en) * | 2019-07-15 | 2022-11-01 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure |
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