CN107656588B

CN107656588B - Server system with optimized heat dissipation and installation method

Info

Publication number: CN107656588B
Application number: CN201710929574.0A
Authority: CN
Inventors: 罗嗣恒
Original assignee: Suzhou Wave Intelligent Technology Co Ltd
Current assignee: Suzhou Wave Intelligent Technology Co Ltd
Priority date: 2017-10-09
Filing date: 2017-10-09
Publication date: 2020-01-03
Anticipated expiration: 2037-10-09
Also published as: WO2019072115A1; CN107656588A

Abstract

A server system for optimizing heat dissipation and an installation method thereof comprise a server node, a power supply module, a power supply distribution plate and a hard disk backboard, wherein a fan is arranged between the server node and the hard disk backboard, the power supply module supplies power to the hard disk backboard after being connected with the power supply distribution plate through a cable, the hard disk module is installed on the other side of the hard disk backboard, and the hard disk module is connected with the hard disk backboard through a cable; the server node is connected with the hard disk back plate through the node side plate; the fan is connected with the hard disk back plate through a cable, and an optimized heat dissipation channel formed during the working process of the fan comprises cold air which is sucked by the fan and then discharged through the server node from the hard disk module and the hard disk back plate in sequence. The invention integrates the power supply and signal interconnection functions on the hard disk back plate, so as to improve the air duct structure, improve the performance of the server and enhance the working stability of the server system.

Description

Server system with optimized heat dissipation and installation method

Technical Field

The invention relates to a server heat dissipation optimization system, in particular to a server system with optimized heat dissipation and an installation method.

Background

With the continuous rise and development of internet and cloud computing technologies, higher requirements are put forward on data processing capacity and storage capacity of servers. The general large-scale data center machine room is small in size and precious in land, and the rent and the manufacturing cost of the machine room are very expensive no matter the machine room is rented or the machine room is built by self.

In order to save the occupied area, fully utilize the space and produce the server products deployed at high density. The product generally has three characteristics of centralized power supply, centralized heat dissipation and centralized management. The common server structure is mainly a 2U chassis and is deployed on a machine room rack. In order to increase the number of servers deployed in 2U space on a machine room rack, four subsatellite servers are produced. Namely: 4 server nodes are arranged in the space of 2U, so that the space utilization rate of the machine room can be effectively improved.

For example, a four subsatellite server contains: 4 server nodes, system cooling fan, hard disk module, 2 power modules, and 5 parts in the system middle plate. Wherein: the power supply of the server node, the system cooling fan and the hard disk module is realized by collecting power from the system middle plate.

In a traditional four-satellite server system structure, server nodes directly get electricity from a system middle plate, and a fan and a hard disk back plate arranged in the system get electricity from the system middle plate through a power supply cable. With the performance of the new generation of CPUs getting better, the corresponding power consumption also gets larger. The current running on the system board is also getting larger and larger, so that the system board needs to be provided with larger vent holes to solve the heat dissipation problem of the new generation of CPU. However, the opening of larger vents in the system may result in a reduction in the current carrying capacity of the system midplane, and when the system is continuously operating at full load, there may be a risk that the temperature of the system midplane PCB may continue to rise, causing board burn-up.

Disclosure of Invention

The invention provides a server system with optimized heat dissipation and an installation method, which are used for solving the problem of poor heat dissipation system of a server in the prior art, the system removes a system middle plate, integrates the signal and power supply interconnection functions of the original system middle plate on a hard disk backboard, and installs a fan between a node and the hard disk backboard, so that on the basis of meeting the power supply requirement, the flow resistance of a fan air channel is greatly reduced, and the heat dissipation is greatly improved.

The invention is realized by the following technical scheme:

a server system for optimizing heat dissipation comprises a server node, a power supply module, a power supply distribution plate and a hard disk back plate, wherein a fan is arranged between the server node and the hard disk back plate, the power supply module supplies power to the hard disk back plate after being connected with the power supply distribution plate through a cable, a hard disk module is installed on the other side of the hard disk back plate, and the hard disk module is connected with the hard disk back plate through a cable; the server node is connected with the hard disk back plate through the node side plate; the fan is connected with the hard disk back plate through a cable, and an optimized heat dissipation channel formed during the working process of the fan comprises cold air which is sucked by the fan and then discharged through the server node from the hard disk module and the hard disk back plate in sequence.

According to the server system for optimizing heat dissipation, 4 sets of mutually corresponding server nodes and fans are arranged to form the four-subsatellite server.

In the server system for optimizing heat dissipation, 2 sets of power supply modules are arranged at the middle positions of 4 sets of server nodes.

According to the server system for optimizing heat dissipation, 4 sets of hard disk modules are arranged.

A server system installation method for optimizing heat dissipation comprises the following steps:

preparing a module to be installed and accessories, wherein the module to be installed comprises a node tray, a main board, a CPU, an internal memory, a hard disk back plate, a node side plate, a power supply module, a power distribution plate and power supply and signal cables;

then fixing the mainboard on the node tray, and then installing the CPU and the memory on the mainboard;

then the node side plates are inserted on the main board to form a single server node;

then fixing the fan, the power distribution plate and the hard disk back plate on the server case, inserting the power module on the power distribution plate, and connecting the power distribution plate and the hard disk back plate through a power supply cable;

installing a hard disk module with a hard disk on a tray and sequentially connecting the hard disk module with a hard disk back plate;

and finally, inserting the assembled server nodes into the server case.

According to the installation method of the server system with the optimized heat dissipation, 4 sets of the server nodes and the fans are arranged correspondingly, and the 4 sets of the server nodes are assembled and then inserted into the server cases one by one to form the four-subsatellite server.

According to the installation method of the server system with the optimized heat dissipation, 2 sets of power supply modules are arranged in the middle of 4 sets of server nodes.

According to the installation method of the server system with the optimized heat dissipation, 4 sets of hard disk modules are arranged.

Compared with the prior art, the invention has the advantages that:

1. the invention not only can solve the problem of heat dissipation caused by increased power consumption in the existing four-subsatellite server, but also can be suitable for the adverse effect of heat dissipation in other types of servers, and integrates the power supply and signal interconnection functions on the hard disk back plate so as to improve the air duct structure and the server performance.

2. The invention reduces the flow resistance of the air channel, enhances the working stability of the server system, and particularly has more obvious advantage of solving the system heat dissipation problem under the product configuration that the CPU performance is continuously enhanced and the power consumption is more and more large.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.

FIG. 1 is a schematic diagram of a four-subsatellite server system in the prior art;

FIG. 2 is a schematic mechanical diagram of the middle of the system of FIG. 1;

fig. 3 is a schematic structural diagram of a four-subsatellite server system of the present invention.

Reference numerals: 1-system middle plate, 2-hard disk backboard, 3-fan, 4-server node, 5-hard disk module, 6-fan interface, 7-air channel opening, 8-server node interface, 9-power module interface, 10-hard disk backboard power supply interface; 11-node side plate, 12-power distribution plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.

Wherein, the technical terms involved in the specification have the following meanings:

HDD BP, English called Hard disk backplane, Chinese meaning is Hard disk backboard; PDB, English is called Power distribution board, and Chinese means is Power distribution board; NODE denotes a server NODE, PSU denotes a power supply module, PDB denotes a power supply distribution board, FAN denotes a FAN, and HDD denotes a hard disk module.

As shown in fig. 1-3, a comparison of a prior art four-subsatellite server system and the present invention is illustrated.

As shown in fig. 1, a four-subsatellite server system structure adopted in the prior art includes 4

server nodes

4, 1

system middle board

1, 4 fans 3, 24-port

hard disk backplane

2, 4

hard disk modules

5, and 2 power modules. 2 power supply modules PSU0 and PSU1 are plugged in a system middle board to supply power for 4 server nodes, FANs FAN0\ FAN1\ FAN2\ FAN3 are located between the system middle board and an HDD BP and are plugged in the system middle board to take power through cables, 4 hard disk modules HDD0-5\ HDD6-11\ HDD12-17\ HDD18-23 are plugged in a 24-port HDD BP, and the HDD BP is interconnected with the system middle board through cables to realize the communication of power supply and signal links.

Fig. 2 is a schematic diagram showing the structure of a board in a prior art system. The board card belongs to a passive board, does not contain active components such as chips, MOS, triodes and the like, and is used for realizing the power supply of all functional units of a server system and the interconnection and the switching of signals. The system middle plate is provided with 4

server node interfaces

8, 2

PSU interfaces

9, 4

air duct openings

7, 4

fan interfaces

6 and 4 HDDBP power supply interfaces 10.

Therefore, in the heat dissipation process of the whole server, the fan draws air from right to left in the work process, cold air in the air channel flows through the 4 hard disk modules and the hard disk back plate, then is sucked by the fan and passes through the air channel hole in the system middle plate, then is cooled by the CPU, the memory, the PCH, the BMC and other components in the server node, and finally is discharged from the left side. In the existing scheme, a scheme of a system middle plate is adopted, so that the power consumption of a CPU is continuously increased along with the continuous improvement of the performance of the CPU on a server node. Under the condition that the rated rotating speed of a system fan cannot be increased, the flow resistance of an air channel is required to be reduced to take away more heat. Thus, it is necessary to enlarge the duct openings in the panels of the system as shown in FIG. 2. If the hole of the air duct is enlarged, the current-carrying path of the power supply current for the server node is inevitably narrowed, the current-carrying capacity of the middle plate of the system is reduced, and the problem of local PCB overheating is caused.

As shown in fig. 3, the server system for optimizing heat dissipation in this embodiment includes a server node 4, a power module, a power distribution board 12 and a hard disk backplane 2, where a fan3 is disposed between the server node 4 and the hard disk backplane 2, the power module is connected to the power distribution board 12 through a cable and then supplies power to the hard disk backplane 2, a hard disk module 5 is installed on the other side of the hard disk backplane 2, and the hard disk module 5 is connected to the hard disk backplane 2 through a cable; the server node 4 is connected with the hard disk back plate 2 through a node side plate 11; fan3 is connected with hard disk backplate 2 through the cable, and the optimization heat dissipation channel that fan3 during operation formed includes that cold wind is followed hard disk module 5, hard disk backplate 2 quilt in proper order fan3 sucks and discharges behind server node 4 again. In the embodiment, the power module PSU0\ PSU1 is interconnected with the PDB, then the PDB is interconnected with the HDD BP through a cable, and power supply to each functional unit of the system is realized through the HDD BP. In the system, the HDD BP not only has the function of interconnecting with the hard disk module, but also comprises power supply interconnection and signal interconnection of a server NODE NODE0\1\2\3 and a FAN FAN0\1\2\ 3.

And the server node realizes power taking and signal interconnection to the HDD BP through the node side plate and the HDD BP. The method comprises the following steps: the server NODE NODE0 and the NODE side plate 0 are plugged on the HDD BP to get electricity and signal interconnection. The server NODE NODE1 and the NODE side plate 1 are plugged on the HDD BP to get electricity and signal interconnection. The server NODE NODE2 and the NODE side plate 2 are plugged on the HDD BP to get electricity and signal interconnection. The server NODE NODE3 and the NODE side plate 3 are plugged on the HDD BP to get electricity and signal interconnection.

The system is adopted to optimize the working process of the air channel after heat dissipation, when the server works, the fan draws air from right to left, cold air in the air channel flows through the hard disk module, then the system fan directly pumps the air flow out to the CPU, the memory, the PCH, the BMC and the like of the server node for cooling, and finally the hot air flow is discharged from the left side. Therefore, the server system with optimized heat dissipation can well solve the heat dissipation problem caused by the middle plate of the system, and further has no problem of poor current carrying capacity.

As shown in fig. 3, the method for installing a server system with optimized heat dissipation of the present invention includes the following steps:

firstly, preparing a server node tray, a main board, a CPU, a memory, a hard disk, an HDD BP, a power supply and signal cable, a node side plate, a PDB and a power supply module;

fixing the mainboard on a server node tray, and installing the CPU and the memory on the mainboard after the mainboard is fixed;

inserting the node side plate on the main board to form a single server node;

fourthly, fixing the HDD BP and the PDB on the four-subsatellite chassis;

inserting a power supply module PSU0\1 on the PDB, and connecting a power supply cable between the PDB and the HDD BP;

sixthly, the hard disk is arranged on the tray and is sequentially inserted at the BP end of the HDD.

And finally, inserting the assembled server nodes into the four-child server chassis one by one.

The technical contents not described in detail in the present invention are all known techniques.

Claims

1. A server system for optimizing heat dissipation is characterized by comprising a server node, a power supply module, a power supply distribution plate and a hard disk backboard, wherein a fan is arranged between the server node and the hard disk backboard, the power supply module supplies power to the hard disk backboard after being connected with the power supply distribution plate through a cable, a hard disk module is installed on the other side of the hard disk backboard, and the hard disk module is connected with the hard disk backboard through a cable; the server node is connected with the hard disk back plate through the node side plate; the fan is connected with the hard disk back plate through a cable, and an optimized heat dissipation channel formed when the fan works comprises cold air which is sucked by the fan from the hard disk module and the hard disk back plate in sequence and then is discharged after passing through the server node; the server node and the fan are provided with 4 sets of mutually corresponding four-subsatellite servers.

2. The server system for optimizing heat dissipation of claim 1, wherein the power module is provided with 2 sets of server nodes, and is arranged in the middle of the 4 sets of server nodes.

3. The server system for optimizing heat dissipation of claim 1, wherein 4 sets of hard disk modules are provided.

4. A method of installing a server system with optimized heat dissipation as recited in any one of claims 1-3, comprising the steps of:

and finally, inserting the assembled server nodes into the server case.

5. The method for installing the server system with the optimized heat dissipation function as claimed in claim 4, wherein 4 sets of the server nodes and the fans are arranged in a mutually corresponding mode, and the 4 sets of the server nodes are assembled and then inserted into the server cases one by one to form the four-subsatellite server.

6. The method for installing the server system with the optimized heat dissipation function as recited in claim 5, wherein the power supply module is provided with 2 sets and is arranged in the middle of 4 sets of server nodes.

7. The method for installing the server system with the optimized heat dissipation function as claimed in claim 5, wherein 4 sets of the hard disk modules are provided.