CN107645886B - A kind of high-power high integration signal processing component structure in space - Google Patents
A kind of high-power high integration signal processing component structure in space Download PDFInfo
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- CN107645886B CN107645886B CN201710858016.XA CN201710858016A CN107645886B CN 107645886 B CN107645886 B CN 107645886B CN 201710858016 A CN201710858016 A CN 201710858016A CN 107645886 B CN107645886 B CN 107645886B
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Abstract
A kind of space is related to space optical remote field with high-power high integration signal processing component structure, and a bottom stage plate is arranged under a signal processing mainboard of the structure, a signal processing backboard and a timing and power panel；Each signal processing mainboard, signal processing backboard and timing and the surrounding of power panel are respectively provided with thermally conductive frame；The surface of each signal processing mainboard, signal processing backboard and timing and power panel is respectively provided with heat-conducting plate, and heat-conducting plate will be radiated by thermally conductive frame in heat transmission to the spoke cold plate being connected with the upper end multi-disc CCD；Multi-disc CCD passes through the side connecting plate at both ends as a whole and connecting rod is fixed, and is integrally provided on bottom stage substrate, and pinboard is arranged on CCD, is connected with outer signals.Thermal stability of the present invention is more perfect, and heat dissipation performance is more excellent；Greatly reduce the volume and weight of signal processing component；It has saved cost and has reduced the difficulty of design.
Description
Technical field
The invention belongs to space optical remote fields, and in particular to a kind of high-power high integration signal processing group in space
Part structure.
Background technique
Urgent need with space remote sensing field to space camera high-resolution, wide covering leads to focal plane subassembly and preceding
The integrated level and power consumption of end signal processing module constantly expand, and signal processing component is general and focal plane subassembly passes through flexible circuit board
One is integrally attached on remote sensor.Increasing for signal processing component volume and power consumption can dynamics and heat to entire remote sensing camera
Characteristic makes a big impact, and brings very big difficulty to structure design.
Traditional Space Remote Sensors signal processing component mostly uses square chest type grafting to form, and signal processing and timing plate are general
It is connected in structural frames, each structural member is connected by the cabinet of slideway and outside and is integral.Circuit board passes through structural frames
The primary mode to shell of switching has certain influence for electrical and thermal conductivity, and still further aspect structure switchover frame also increases entirely
The architecture quality of component.This structure type bring volume is big, quality is heavy, electrical and thermal conductivity difference disadvantage will affect optical system
The stability of system and the mechanical property of complete machine.
Summary of the invention
In order to solve the problems in the existing technology, the present invention provides a kind of high-power high integration signals in space
Processing component structure, solves in the prior art that high-power high integration signal processing component mechanics thermal stability is poor, conductive and heat-conductive
Property the difference and big problem of structure design difficulty.
The technical proposal for solving the technical problem of the invention is as follows:
A kind of high-power high integration signal processing component structure in space, the structure include: bottom stage substrate, multiple signals
Processing main plate, multiple signal processing backboards, multiple timing and power panel, multiple heat-conducting plates, multiple thermally conductive frames, side connecting plate, spoke
Cold plate, connecting rod, pinboard and multiple bottom stage plates；One signal processing mainboard, a signal processing backboard and a timing and
Power panel forms a piece of CCD, and a bottom stage plate is arranged under every CCD；Each signal processing mainboard, signal processing backboard and timing
And the surrounding of power panel is respectively provided with thermally conductive frame；The surface of each signal processing mainboard, signal processing backboard and timing and power panel
It is respectively provided with heat-conducting plate, the heat-conducting plate will be carried out by thermally conductive frame in heat transmission to the spoke cold plate being connected with the upper end multi-disc CCD
Heat dissipation；Multi-disc CCD passes through the side connecting plate at both ends as a whole and connecting rod is fixed, and is integrally provided on bottom stage substrate,
Pinboard is arranged on CCD, is connected with outer signals.
The beneficial effects of the present invention are: the present invention is directly radiated heat transmission to spoke cold plate by thermally conductive frame, lead to
Thermally conductive frame, heat-conducting plate and heat-conducting glue are crossed, keeps thermal stability more perfect, heat dissipation performance is more excellent；By removing casing assembly,
Greatly reduce the volume and weight of signal processing component；It has saved cost and has reduced the difficulty of design.
Detailed description of the invention
A kind of high-power high integration signal processing component structural design drawing in the space of the present invention Fig. 1.
Fig. 2 present invention control and signal processing module composition figure
In figure: 1, CCD, 2, spoke cold plate, 3, connecting rod, 4, pinboard, 5, side connecting plate, 6, load card, 7, substrate, 8, letter
Number processing main plate heat-conducting plate, 9, fastening screw, 10, auricle, 11, signal processing mainboard, 12, signal processing backboard, 13, timing and
Power panel, 14, signal processing backboard heat-conducting plate, 15, timing and power panel heat-conducting plate, 16, signal processing mainboard frame, 17, signal
Handle backboard frame, 18, timing and power supply sheet frame and 19, bottom stage plate.
Specific embodiment
The present invention is described in further details with reference to the accompanying drawings and examples.
A kind of high-power high integration signal processing component structure in space, the structure include: CCD1, spoke cold plate 2, connection
Bar 3, pinboard 4, side connecting plate 5, load card 6, substrate 7, signal processing mainboard heat-conducting plate 8, fastening screw 9, auricle 10, signal
Processing main plate 11, signal processing backboard 12, timing and power panel 13, signal processing backboard heat-conducting plate 14, timing and power panel are led
Hot plate 15, signal processing mainboard frame 16, signal processing backboard frame 17, timing and power supply sheet frame 18, bottom stage plate 19.
Signal processing mainboard 11, signal processing backboard 12, timing and power panel 13 are respectively fixed to signal processing mainboard frame
16, on signal processing backboard frame 17, timing and power supply sheet frame 18.Signal processing mainboard heat-conducting plate 8, signal processing backboard plate are thermally conductive
Plate 14, timing and power panel heat-conducting plate 15 and signal processing mainboard frame 16, signal processing backboard frame 17, timing and power supply sheet frame 18
Between have heat-conducting glue increase heating conduction.Between heat-conducting plate and signal processing mainboard 11, signal processing backboard 12, timing and power panel 13
The way of contact is soft contact, is equipped with heat conductive pad.On signal processing mainboard 11, signal processing backboard 12, timing and power panel 13
High-power heat-dissipation device passes through signal processing mainboard heat-conducting plate 8, signal processing backboard heat-conducting plate 14, timing and power panel heat-conducting plate
15 pass through conduction pattern in heat transfer to sheet frame.Design has a spoke cold plate 2, spoke cold plate 2 and sheet frame signal processing on CCD1
It is coated with thermally conductive matter between mainboard frame 16, signal processing backboard frame 17, timing and power supply sheet frame 18, makes up the gap of joint face and increasing
Add heating conduction.CCD1 is made of signal processing mainboard 11, signal processing backboard 12, timing and power panel 13.Signal processing master
Plate 11, signal processing backboard 12, timing and power panel 13 are closely joined together by four fastening screws 9, in fastening screw 9
Heart hole and external connection bar 3 have matching relationship, and easy disassembly reduces process complexity and assembly difficulty.A piece of CCD1 is divided into
One block of bottom stage plate 19 is set, is connect with control and signal processing module 1 by connector, clock synchronization and hard instruction switching are carried out
Deng.Bottom stage plate 19 is connected on substrate 7, in the present embodiment, 8 groups of controls and signal processing module 1 by respective auricle 10 with
Substrate 7 is fixed, is integral by connecting rod 3 and the connection of side connecting plate 5.
Total is full-closed structure, in signal processing mainboard frame 16, signal processing backboard frame 17, timing and power panel
Connecting link design between frame 18 has seam allowance and slideway, to prevent electromagnetic exposure or interference.Pinboard 4 is arranged on CCD1, and outer
Sector signal is connected.
For convenience of infusing and fall weldering on software, the corresponding set of circuits plate design of a piece of CCD1 has load card 6.
Claims (3)
1. a kind of high-power high integration signal processing component structure in space, which is characterized in that the structure includes: bottom stage base
Plate, multiple signal processing mainboards, multiple signal processing backboards, multiple timing and power panel, multiple heat-conducting plates, multiple thermally conductive frames,
Side connecting plate, spoke cold plate, connecting rod, pinboard and multiple bottom stage plates；One signal processing mainboard, a signal processing backboard and
One timing and power panel form a piece of CCD, and a bottom stage plate is arranged under every CCD；Each signal processing mainboard, signal processing
Backboard and timing and the surrounding of power panel are respectively provided with thermally conductive frame；Each signal processing mainboard, signal processing backboard and timing and electricity
The surface of source plate is respectively provided with heat-conducting plate, the spoke that heat transmission is extremely connected with the upper end multi-disc CCD by the heat-conducting plate by thermally conductive frame
It radiates on cold plate；Multi-disc CCD passes through the side connecting plate at both ends as a whole and connecting rod is fixed, and is integrally provided in bottom
On stylobate plate, pinboard is arranged on CCD, is connected with outer signals.
2. a kind of high-power high integration signal processing component structure in space according to claim 1, which is characterized in that
Circuit board in the every CCD is fixed by screw.
3. a kind of high-power high integration signal processing component structure in space according to claim 2, which is characterized in that
One load card is all set on each circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858016.XA CN107645886B (en) | 2017-09-21 | 2017-09-21 | A kind of high-power high integration signal processing component structure in space |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858016.XA CN107645886B (en) | 2017-09-21 | 2017-09-21 | A kind of high-power high integration signal processing component structure in space |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107645886A CN107645886A (en) | 2018-01-30 |
| CN107645886B true CN107645886B (en) | 2019-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710858016.XA Expired - Fee Related CN107645886B (en) | 2017-09-21 | 2017-09-21 | A kind of high-power high integration signal processing component structure in space |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998005058A2 (en) * | 1996-07-15 | 1998-02-05 | The Regents Of The University Of California | A vacuum compatible miniature ccd camera head |
| US6944022B1 (en) * | 2002-08-30 | 2005-09-13 | Themis Computer | Ruggedized electronics enclosure |
| CN104241224A (en) * | 2014-07-30 | 2014-12-24 | 中国科学院长春光学精密机械与物理研究所 | Enhancement heat conduction structure for high-power CCD of space optical remote sensor |
| CN204350519U (en) * | 2014-11-30 | 2015-05-20 | 上海航空电器有限公司 | A kind of printed board assembly structure |
| CN204377320U (en) * | 2015-02-09 | 2015-06-03 | 英属维京群岛商百崴宇智股份有限公司台湾分公司 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
| TWI576039B (en) * | 2015-02-04 | 2017-03-21 | Wei xiao-wei | Stacked printed circuit board computer cooling module assembly |
| CN107124854A (en) * | 2017-05-26 | 2017-09-01 | 航天东方红卫星有限公司 | A kind of storehouse assembly thermal controls apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4730232A (en) * | 1986-06-25 | 1988-03-08 | Westinghouse Electric Corp. | High density microelectronic packaging module for high speed chips |
| CN2694339Y (en) * | 2003-11-28 | 2005-04-20 | 中国科学院空间科学与应用研究中心 | Embedded computer system adapted for aerospaceplane |
| DE102014012826A1 (en) * | 2014-08-28 | 2016-03-03 | Diehl Aerospace Gmbh | Modular assembly |
-
2017
- 2017-09-21 CN CN201710858016.XA patent/CN107645886B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998005058A2 (en) * | 1996-07-15 | 1998-02-05 | The Regents Of The University Of California | A vacuum compatible miniature ccd camera head |
| US6944022B1 (en) * | 2002-08-30 | 2005-09-13 | Themis Computer | Ruggedized electronics enclosure |
| CN104241224A (en) * | 2014-07-30 | 2014-12-24 | 中国科学院长春光学精密机械与物理研究所 | Enhancement heat conduction structure for high-power CCD of space optical remote sensor |
| CN204350519U (en) * | 2014-11-30 | 2015-05-20 | 上海航空电器有限公司 | A kind of printed board assembly structure |
| TWI576039B (en) * | 2015-02-04 | 2017-03-21 | Wei xiao-wei | Stacked printed circuit board computer cooling module assembly |
| CN204377320U (en) * | 2015-02-09 | 2015-06-03 | 英属维京群岛商百崴宇智股份有限公司台湾分公司 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
| CN107124854A (en) * | 2017-05-26 | 2017-09-01 | 航天东方红卫星有限公司 | A kind of storehouse assembly thermal controls apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107645886A (en) | 2018-01-30 |
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| CB03 | Change of inventor or designer information |
Inventor after: Liu Xiaofeng Inventor after: He Xin Inventor before: Liu Xiaofeng Inventor before: He Cuan |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190514 Termination date: 20200921 |
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| CF01 | Termination of patent right due to non-payment of annual fee |