CN107634023A - A kind of carbon fiber silicon chip of solar cell support plate - Google Patents
A kind of carbon fiber silicon chip of solar cell support plate Download PDFInfo
- Publication number
- CN107634023A CN107634023A CN201710624011.0A CN201710624011A CN107634023A CN 107634023 A CN107634023 A CN 107634023A CN 201710624011 A CN201710624011 A CN 201710624011A CN 107634023 A CN107634023 A CN 107634023A
- Authority
- CN
- China
- Prior art keywords
- support plate
- silicon chip
- main body
- groove
- plate main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 64
- 239000010703 silicon Substances 0.000 title claims abstract description 64
- 229920000049 Carbon (fiber) Polymers 0.000 title claims abstract description 11
- 239000004917 carbon fiber Substances 0.000 title claims abstract description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 18
- 230000002787 reinforcement Effects 0.000 claims abstract description 18
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000005260 corrosion Methods 0.000 claims abstract description 11
- 230000007797 corrosion Effects 0.000 claims abstract description 11
- 239000000835 fiber Substances 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a kind of carbon fiber silicon chip of solar cell support plate, including：The support plate reinforcement of support plate main body, the support plate gib block of support plate main body back side both sides and support plate main body back side array, support plate reinforcement are vertical with support plate gib block；Support plate main body uses high temperature resistant, corrosion-resistant and high intensity carbon fibre material；There is the rectangular opening of array in support plate main body, the week side of boss of rectangular opening has first step and forms the first groove with side wall, the week side of boss of first step has second step and forms the second groove with side wall, and the week side of boss of silicon chip is contacted with second step face with by the second step support.The support plate main body of the present invention uses carbon fibre material, realizes the being readily cleaned property of support plate；The support plate reinforcement of array strengthens the non-deformability of support plate；First step and second step, which are set, makes the fretwork area below silicon chip bigger, reduces the contact area of silicon chip and support plate, and the silicon chip efficiency of heating surface is high.
Description
Technical field
The present invention relates to manufacture of solar cells technical field, more particularly to a kind of carbon fiber silicon chip of solar cell carries
Plate.
Background technology
The finiteness of conventional energy resource resource and the increase of environmental pressure, make in the world many countries strengthen again to new energy
Source and the support of renewable energy technologies development.New energy is power is most determined in 21st century development of world economy five big
One of technical field.Solar energy is a kind of cleaning, efficiently and the never new energy of exhaustion, and therefore, national governments are all by solar energy
Important content of the utilization of resources as National Sustainable Development Strategies.And photovoltaic generation has safe and reliable, noiseless, without dirt
Dye, restrict less, the advantages that fault rate is low, easy maintenance, the various and sparsely populated reality of length and breadth of land severe cold, landform in China western part
Under the conditions of, there play the role of to be very unique.
Solar cell is photovoltaic generation core devices, and during manufacture of solar cells, silicon chip is placed on support plate,
Solar cell filming equipment is entered by carrier for bearing, manufacturing process reaction is carried out in a device, oxygen can be generated in manufacturing process
Change the material such as aluminium and silicon nitride, the material adhesive ability is stronger, and the support plate of common material is difficult to clean after being attached to.Meanwhile work
The process of skill processing procedure, chamber are heated to 400 DEG C of high temperature, up to 600 DEG C, in the environment of high temperature, support plate temperature distortion
It is a technical barrier, deformation is excessive, causes technological effect poor, properties of product are not up to standard.The span of cell coating equipment pipeline
Degree is big, and Transmission system is based on cost consideration due to structure constraint, can not accomplish high-power, high torque, so cause to transmit
System can not bear heavier support plate, so the material of silicon chip support plate and structure are a major challenge, support plate should size be big, weight
Gently, it is while rigid good.In addition, silicon chip, in making technology, silicon chip needs to be heated, traditional silicon chip support plate, silicon chip is direct
It is seated on solid support plate, heat time length, heat is largely taken away by support plate, high energy consumption and is unfavorable for the heated of silicon chip.
The Chinese utility model patent of Application No. 01420788733.1 provides a kind of PECVD plated films and plated with lap guard
Step frame, including for carrying the support plate frame of silicon chip, the side wall of support plate frame towards silicon chip is provided with step, and silicon chip is positioned over
On the step of support plate frame, the medial extension of step holds silicon chip so that support plate frame between silicon chip edge with not connecting silicon
Gap above and below piece.The utility model can effectively prevent plasma around being plating to front side of silicon wafer edge so that the sun
The silicon chip film-coated yield that rich plating phenomenon is not present, improves product in energy battery production.But this kind of structure still suffers from silicon chip with carrying
Plate contact area is excessive and the problem of taking away amount of heat by support plate, so as to cause silicon chip thermal efficiency low and high energy consumption.
The Chinese utility model patent of Application No. 201621385774.1 provides a kind of tiltedly loading end carbon fiber support plate,
It is the structure improvement to the silicon chip support plate in board-like pecvd process, the groove for loading silicon chip, the side of groove is offered on support plate
The loading end for being used for holding silicon chip along having, loading end is to be arranged in carried silicon chip to the tilted inclined entrusting surface of groove, inclined entrusting surface
At least two sides on.The contact surface of support plate and silicon chip is modified to tiltedly hold in the palm by the utility model from existing 90 ° of platform terraces
Face, and then silicon chip and support plate contact are made into linear contact lay by face contact, contact surface is greatly reduced, is avoided in plated film production process
Influence, avoid film layer from adversely affecting, improve the plating membrane efficiency of cell piece.Although this kind of structure is in Application No.
Existing 90 ° of platform terraces are modified to inclined entrusting surface to reduce silicon on the basis of 01420788733.1 Chinese utility model patent
The contact area of piece and support plate, but due to silicon chip and support plate linear contact lay, under long-time heating and silicon chip self gravitation effect,
Form certain snap-in force between the silicon chip and support plate of linear contact lay and be easy to cause follow-up silicon chip to be not easy to take away, and silicon chip is heated
There is no support to produce recessed deformation and influence silicon chip quality in the case of deadweight afterwards.
Therefore, it is necessary to design a kind of more reasonable structure support plate to meet silicon chip film-coated needs.
The content of the invention
In order to solve the above problems, the invention provides a kind of carbon fiber silicon chip of solar cell support plate, including：Support plate master
Body, support plate gib block and support plate reinforcement；
The support plate gib block is connected to the support plate main body back side both sides, the support plate by first the first nut of screw fit
Reinforcement is connected to the support plate main body back side, and the support plate reinforcement and institute by second screw fit the second nut array
State that support plate gib block is vertical, coordinate transmission system to realize the continuous service of the support plate body by the support plate gib block；
The support plate main body uses high temperature resistant, corrosion-resistant and high intensity carbon fibre material；
There is the rectangular opening of array, the week side of boss of the rectangular opening has first step and forms the with side wall in the support plate main body
One groove, the week side of boss of the first step have second step and form the second groove with side wall, the week side of boss of silicon chip and described the
Two step surfaces are contacted with by the second step support.
Wherein, the support plate gib block and support plate reinforcement use high temperature resistant, corrosion-resistant and high intensity carbon fibre material.
Wherein, first screw, the first nut, the second screw and the second nut use high temperature resistant, corrosion-resistant and high-strength
The ceramic material of degree.
Wherein, the depth of first groove is less than the depth of the rectangular opening, and the depth of second groove is less than institute
The depth of the first groove is stated, the thickness of silicon chip is less than or equal to the depth of second groove.
Beneficial effects of the present invention：
1. support plate main body uses carbon fibre material, the carbon fibre material has high temperature resistant, corrosion-resistant and high intensity material property,
Realize the being readily cleaned property of support plate；
2. support plate main body is connected with support plate gib block by the screw-nut of special substance, and overleaf sets the special material of array
The support plate reinforcement of matter, compared with traditional support plate, structure is novel, and non-deformability is strengthened；
3. starting with from carrying board structure, on the premise of ensureing carrying silicon chip, contact of the silicon chip with support plate is reduced as far as possible, is made by thermal effect
More preferably, thus the present invention first step and second step set, make the fretwork area below silicon chip bigger, reduce silicon chip with
The contact area of support plate, the good heated of silicon chip is realized, silicon chip is heated faster.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly described.
Fig. 1 is the support plate positive structure schematic disclosed in the embodiment of the present invention；
Fig. 2 is the support plate structure schematic diagram disclosed in the embodiment of the present invention；
Fig. 3-5 be respectively in support plate front installation diagram disclosed in the embodiment of the present invention A-A cutd open to, B-B direction sectional view and B-B direction
M positions mplifying structure schematic diagram in view.
Numeral represents in figure：
1. the silicon chip of 2. first 3. second screw of screw of support plate main body 4.
5. the nut of 6. support plate reinforcement of support plate gib block, 7. first nut 8. second
9. the groove of 10. second step of first step, 11. first groove 12. second
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes.
With reference to figure 1-4, carbon fiber silicon chip of solar cell support plate provided by the invention, including：Support plate main body 1, support plate are led
To bar 5 and support plate reinforcement 6；Support plate gib block 5 coordinates the first nut 7 to be connected to the back side two of support plate main body 1 by the first screw 2
Side, support plate reinforcement 6 coordinate the array of the second nut 8 to be connected to the back side of support plate main body 1, and support plate reinforcement 6 by the second screw 3
It is vertical with support plate gib block 5, the continuous service of support plate body is realized by the cooperation transmission system of support plate gib block 5；Support plate main body
1st, support plate gib block 5 and support plate reinforcement 6 use high temperature resistant, corrosion-resistant and high intensity carbon fibre material；First screw 2,
One nut 7, the second screw 3 and the second nut 8 use high temperature resistant, corrosion-resistant and high intensity ceramic material.
With reference to figure 5, there is the rectangular opening of array in support plate main body 1, the week side of boss of rectangular opening has first step 9 and and side wall
The first groove 11 is formed, the week side of boss of first step 9 has second step 10 and forms the second groove 12, the week side of boss of silicon chip with side wall
Contacted with the face of second step 10 with by the support of second step 10；The depth of first groove 11 is less than the depth of rectangular opening, and second is recessed
The depth of groove 12 is less than the depth of the first groove 11, and the thickness of silicon chip 4 is less than or equal to the depth of the second groove 12.
The support plate main body 1 of the present invention uses carbon fibre material, and the carbon fibre material has high temperature resistant, corrosion-resistant and high intensity
Material property, realize the being readily cleaned property of support plate；The screw spiral shell that support plate main body 1 passes through special substance with support plate gib block 5
Mother's connection, and the support plate reinforcement 6 of the special substance of array is overleaf set, compared with traditional support plate, structure is novel, resists
Deformability is strengthened；Start with from carrying board structure, on the premise of ensureing carrying silicon chip 4, reduce contact of the silicon chip 4 with support plate as far as possible,
Make more preferable by thermal effect, therefore the first step 9 of the present invention and second step 10 are set, and make the fretwork area of the lower section of silicon chip 4 more
Greatly, reduce the contact area of silicon chip 4 and support plate, realize the good heated of silicon chip 4, silicon chip 4 is heated faster..
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to above-described embodiment will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (4)
- A kind of 1. carbon fiber silicon chip of solar cell support plate, it is characterised in that including：Support plate main body, support plate gib block and support plate reinforcement；The support plate gib block is connected to the support plate main body back side both sides, the support plate by first the first nut of screw fit Reinforcement is connected to the support plate main body back side, and the support plate reinforcement and institute by second screw fit the second nut array State that support plate gib block is vertical, coordinate transmission system to realize the continuous service of the support plate body by the support plate gib block；The support plate main body uses high temperature resistant, corrosion-resistant and high intensity carbon fibre material；There is the rectangular opening of array, the week side of boss of the rectangular opening has first step and forms the with side wall in the support plate main body One groove, the week side of boss of the first step have second step and form the second groove with side wall, the week side of boss of silicon chip and described the Two step surfaces are contacted with by the second step support.
- 2. a kind of carbon fiber silicon chip of solar cell support plate according to claim 1, it is characterised in that the support plate is oriented to Bar and support plate reinforcement use high temperature resistant, corrosion-resistant and high intensity carbon fibre material.
- A kind of 3. carbon fiber silicon chip of solar cell support plate according to claim 1, it is characterised in that first spiral shell Nail, the first nut, the second screw and the second nut use high temperature resistant, corrosion-resistant and high intensity ceramic material.
- A kind of 4. carbon fiber silicon chip of solar cell support plate according to claim 1, it is characterised in that first groove Depth be less than the depth of the rectangular opening, the depth of second groove is less than the depth of first groove, the thickness of silicon chip Depth of the degree less than or equal to second groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710624011.0A CN107634023A (en) | 2017-07-27 | 2017-07-27 | A kind of carbon fiber silicon chip of solar cell support plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710624011.0A CN107634023A (en) | 2017-07-27 | 2017-07-27 | A kind of carbon fiber silicon chip of solar cell support plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107634023A true CN107634023A (en) | 2018-01-26 |
Family
ID=61099437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710624011.0A Pending CN107634023A (en) | 2017-07-27 | 2017-07-27 | A kind of carbon fiber silicon chip of solar cell support plate |
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| Country | Link |
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| CN (1) | CN107634023A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110978720A (en) * | 2019-11-29 | 2020-04-10 | 无锡智上新材料科技有限公司 | Preparation method of high-temperature-resistant carbon fiber composite material carrier plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5084107A (en) * | 1989-06-05 | 1992-01-28 | Mitsubishi Denki Kabushiki Kaisha | Solar cell and solar cell array with adhered electrode |
| CN202549900U (en) * | 2012-03-29 | 2012-11-21 | 常州比太科技有限公司 | Transmission carrier plate for solar silicon chip manufacturing process |
| CN204834574U (en) * | 2015-07-09 | 2015-12-02 | 钧石(中国)能源有限公司 | Preparation HIT solar cell's support plate and heating device |
| CN207038493U (en) * | 2017-07-27 | 2018-02-23 | 常州比太科技有限公司 | A kind of carbon fiber silicon chip of solar cell support plate |
-
2017
- 2017-07-27 CN CN201710624011.0A patent/CN107634023A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5084107A (en) * | 1989-06-05 | 1992-01-28 | Mitsubishi Denki Kabushiki Kaisha | Solar cell and solar cell array with adhered electrode |
| CN202549900U (en) * | 2012-03-29 | 2012-11-21 | 常州比太科技有限公司 | Transmission carrier plate for solar silicon chip manufacturing process |
| CN204834574U (en) * | 2015-07-09 | 2015-12-02 | 钧石(中国)能源有限公司 | Preparation HIT solar cell's support plate and heating device |
| CN207038493U (en) * | 2017-07-27 | 2018-02-23 | 常州比太科技有限公司 | A kind of carbon fiber silicon chip of solar cell support plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110978720A (en) * | 2019-11-29 | 2020-04-10 | 无锡智上新材料科技有限公司 | Preparation method of high-temperature-resistant carbon fiber composite material carrier plate |
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