CN107591494B - A kind of OLED device and its packaging method - Google Patents
A kind of OLED device and its packaging method Download PDFInfo
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- CN107591494B CN107591494B CN201710639598.2A CN201710639598A CN107591494B CN 107591494 B CN107591494 B CN 107591494B CN 201710639598 A CN201710639598 A CN 201710639598A CN 107591494 B CN107591494 B CN 107591494B
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Abstract
The present invention provides a kind of OLED device packaging method, the gelling object for being encircled into semi-enclosed shape and structure including choosing encapsulation cover plate and being provided with；Surrounding corner is respectively arranged with thermally conductive film and is coated with the filling glue of certain viscosity in the place in addition to surrounding corner in the corresponding gelling object enclosed area of encapsulation cover plate；Under the conditions of certain temperature, heated baking is carried out to encapsulation cover plate, so that filling gum softening is flowed and filled in completely entire gelling object enclosed area；After the completion of baking to be heated, there is the substrate of OLED device to carry out contraposition pressing the side on encapsulation cover plate with gelling object enclosed area and pre-production, and after the completion of aligning pressing, with the side for deviating from gelling object enclosed area on ultraviolet light irradiation encapsulation cover plate, filling glue in region is enclosed to gelling object and gelling object and is solidified.Implement the present invention, can make filling glue is flawless uniformly to fill up gelling object enclosed area, prevents OLED device surrounding corner without filling glue protection, to guarantee OLED device packaging effect.
Description
Technical field
The present invention relates to OLED technology field more particularly to a kind of OLED device and its packaging method.
Background technique
Relative to liquid crystal display, as the OLED display of display of new generation, then there is self-luminous, respond fast, view
Many advantages, such as angle is wide and color is saturated, packaged type is organic thin by making on the substrate comprising OLED device
Film, so that the organic film is sandwiched between cathode and anode metal or conductive layer, once applying voltage to the two poles of the earth, then this has
Machine film can shine.However, due to the water oxygen in air can make the work wave metal of OLED device cathode be oxidized and can with it is organic
Material chemically reacts, so that OLED device fails, therefore effective encapsulation of OLED device, makes OLED device and water oxygen
It is adequately isolated most important to the OLED device service life is extended.
Currently, face is encapsulated as one of OLED encapsulation common method, this method obstructs water oxygen using dam glue, and use is filled out
Filling glue enables OLED device to successfully manage external pressure and barrier water oxygen, and further prevents filling glue and OLED by passivation layer
Device directly contacts and influences device property.Although the packaging method is flexible and convenient, different sized products can be coped with flexibly,
It is a kind of packaging method of great development, but glue is filled in solidification process flawless uniformly to fill up dam glue region, it is special
It is not dam glue surrounding corner regions, and then influences the performance of barrier water oxygen, OLED device is caused to fail.
Summary of the invention
The technical problem to be solved by the embodiment of the invention is that providing a kind of OLED device and its packaging method, can make
Glue is flawless uniformly fills up dam glue region for filling, prevents OLED device surrounding corner from protecting without filling glue, to guarantee OLED
Device packaging effect.
In order to solve the above-mentioned technical problem, the embodiment of the invention provides a kind of OLED device packaging methods, comprising steps of
Encapsulation cover plate is chosen, the gelling object for being encircled into semi-enclosed shape and structure is provided on the encapsulation cover plate；
Surrounding corner in the gelling object enclosed area, which is corresponded to, in the encapsulation cover plate is respectively arranged with thermally conductive film, and
The encapsulation cover plate corresponds to the filling glue that place of the gelling object enclosed area in addition to surrounding corner is coated with certain viscosity；
Under the conditions of certain temperature, the encapsulation cover plate for being provided with gelling object, thermally conductive film and filling glue is added
Heat baking, so that the filling gum softening is flowed and filled in the completely entire gelling object enclosed area；
After the completion of the heated baking, there will be described be full of to fill glue on the encapsulation cover plate after the heated baking
The side of gelling object enclosed area and pre-production have the substrate of OLED device to carry out contraposition pressing, and have pressed to the contraposition
Cheng Hou is right away from the side of the gelling object enclosed area on the encapsulation cover plate after the heated baking described in ultraviolet light irradiation
The gelling object and the gelling object enclose the filling glue in region and are solidified.
Wherein, the gelling object be dam glue, and the dam glue on the encapsulation cover plate enclosed area at semienclosed
Quadrilateral structure.
Wherein, the thermally conductive film is semi-transparent metals thermally conductive film or transparent metal thermally conductive film.
Wherein, the thermally conductive film is in equilateral triangular structure of right angle, and equal both sides are corresponding glued close to the dam
Enclose two sides in region.
Wherein, the filling glue is UV glue.
Wherein, the heated baking be lower than 40 degree at a temperature of carry out.
The embodiment of the invention also provides a kind of OLED device, are prepared using OLED device packaging method above-mentioned.
The embodiment of the present invention provides a kind of OLED device again, including making the substrate for having OLED device and being encapsulated in institute
State the encapsulation cover plate above substrate；Wherein,
The encapsulation cover plate is formed with the gelling object for being encircled into semi-enclosed shape and structure in the side towards the substrate,
And the thermally conductive film of filling glue and its corresponding surrounding corner distribution is filled in the gelling object enclosed area；
Wherein, under the conditions of certain temperature, to it is described be provided with gelling object, thermally conductive film and fill glue encapsulation cover plate into
Row heated baking so that the filling gum softening is flowed and filled in the completely entire gelling object enclosed area, and described will add
Encapsulation cover plate and the substrate after hot baking are solidified after carrying out contraposition pressing with the irradiation realization of UV light.
Wherein, the thermally conductive film is semi-transparent metals thermally conductive film or transparent metal thermally conductive film.
Wherein, the filling glue is UV glue；The gelling object is dam glue.
The implementation of the embodiments of the present invention has the following beneficial effects:
In embodiments of the present invention, thermally conductive film is first set in the surrounding corner of gelling object enclosed area (i.e. packaging area)
After be coated filling glue, by thermally conductive film have stronger heat absorption capacity come improve filling glue gelling object enclosed area surrounding
Mobility so that filling glue it is flawless uniformly fill up gelling object enclosed area, prevent OLED device surrounding corner without filling
Glue protection, to guarantee OLED device packaging effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without any creative labor, according to
These attached drawings obtain other attached drawings and still fall within scope of the invention.
Fig. 1 is the flow chart for the OLED device packaging method that the embodiment of the present invention one provides；
Encapsulation cover plate prepares the vertical view of scene application in the OLED device packaging method that Fig. 2 provides for the embodiment of the present invention one
Figure；
Fig. 3 is the front view of Fig. 2；
OLED device encapsulates the application structure of scene in the OLED device packaging method that Fig. 4 provides for the embodiment of the present invention one
Schematic diagram；
The OLED device that Fig. 5 provides for the embodiment of the present invention three faces cut away view.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with attached drawing
Step ground detailed description.
As shown in Figure 1, for a kind of OLED device packaging method in the embodiment of the present invention one, provided, comprising the following steps:
Step S1, encapsulation cover plate is chosen, the glue for being encircled into semi-enclosed shape and structure is provided on the encapsulation cover plate
Condensate；
Step S2, the encapsulation cover plate correspond to surrounding corner in the gelling object enclosed area be respectively arranged with it is thermally conductive thin
Film, and correspond to place of the gelling object enclosed area in addition to surrounding corner in the encapsulation cover plate and be coated with certain viscosity
Fill glue；
Step S3, under the conditions of certain temperature, gelling object, thermally conductive film and the encapsulation cover plate for filling glue are provided with to described
Heated baking is carried out, so that the filling gum softening is flowed and filled in the completely entire gelling object enclosed area；
Step S4, after the completion of the heated baking, will there is described be full of on the encapsulation cover plate after the heated baking
The side and pre-production for filling the gelling object enclosed area of glue have the substrate of OLED device to carry out contraposition pressing, and to described right
After the completion of the pressing of position, away from the gelling object enclosed area on the encapsulation cover plate after the heated baking described in ultraviolet light irradiation
Side solidifies the filling glue in the gelling object and the gelling object enclosed area.
Detailed process is that in step sl, gelling object includes but is not limited to dam glue, and the gelling object is surrounded using raised line
At the semi-enclosed structure of polygon, such as quadrangle, pentagon, hexagon structure, the polygonized structure which is encircled into
It should be according to the shape that OLED device encapsulates come concrete decision, so that allowing for gelling object enclosed area becomes with the recessed of an opening
Slot.In step s 2, encapsulation cover plate is corresponding in the surrounding corner distribution thermally conductive film of gelling object enclosed area and except surrounding
Glue is filled in place setting certain viscosity (such as low viscosity) except corner, and being arranged so thermally conductive film is exactly to improve gelling object
The surrounding corner heat absorption capacity of enclosed area, using thermally conductive film, heat absorption capacity is strong in thermal environment, can make quadrangle regional temperature
Higher than other regions, the filling glue of softening is obtained in advance.It should be noted that the shape and structure of thermally conductive film is according to gelling object
The surrounding corner shape of enclosed area designs, and generallys use equilateral triangle, equilateral right angled triangle etc., and thermally conductive film
Two sides are as close as possible to gelling object (such as dam glue) enclosed area inside edge, and another a line is then as close as possible to nearest filling
Glue, so that filling glue fast softening is filled to the surrounding corner of gelling object enclosed area.In step s3, using certain temperature
Degree condition (such as less than 40 degree) carries out heated baking, it is ensured that in the case that gelling object does not deform, using thermally conductive film because of temperature
It spends raising and increases filling glue in the mobility of four angular zones, the flawless uniform entirely gelling object that fills up of filling glue is enable to surround
Region prevents OLED device quadrangle without filling glue protection.In step s 4, by the cover board alignment OLED device after heated baking
Substrate carries out contraposition pressing, and passes through UV(ultraviolet light) light irradiation to gelling object and filling glue solidify, to realize OLED
Device encapsulation, guarantees OLED device packaging effect.
In one embodiment, as shown in Figures 2 and 3, for encapsulation cover plate 1 before non-heated baking, gelling object 2 is dam glue,
And the dam glue is in semi-enclosed quadrilateral structure using the dam glue enclosed area that raised line is formed, such as frame shape；Thermally conductive film 3 is using half
Transparent metal thermally conductive film or transparent metal thermally conductive film, and be in equilateral triangular structure of right angle, equal both sides correspond to close
Two sides of dam glue enclosed area；It fills glue 4 and uses UV glue；
Further, by above-mentioned gelling object 2, thermally conductive film 3 and filling glue 4 lower than 40 degree at a temperature of carry out heating baking
It is roasting, and by after above-mentioned heated baking encapsulation cover plate and the production substrate 5 that has OLED device carry out contraposition pressing, and with UV illumination
Penetrate realization solidification, the OLED device (as shown in Figure 4) after being encapsulated.
Corresponding to the OLED device packaging method of the embodiment of the present invention one, second embodiment of the present invention provides a kind of OLED devices
Part, the OLED device are prepared using the OLED device packaging method in the embodiment of the present invention one, and detailed process refers to this
Related content in inventive embodiments one, this is no longer going to repeat them.
Corresponding to the OLED device of the embodiment of the present invention two, the embodiment of the present invention three provides a kind of OLED device again, from
OLED device is described in detail in shape and structure and connection relationship, is specifically included:
Production has the substrate 11 of OLED device and is encapsulated in the encapsulation cover plate 12 of 11 top of substrate；Wherein,
Encapsulation cover plate 12 is formed with the gelling object 13 for being encircled into semi-enclosed shape and structure in the side towards substrate 11, and
The thermally conductive film 15 of filling glue 14 and its corresponding surrounding corner distribution is filled in gelling object enclosed area.
Wherein, thermally conductive film 15 is semi-transparent metals thermally conductive film or transparent metal thermally conductive film.
Wherein, filling glue 14 is UV glue；Gelling object 13 is dam glue.
Wherein, thermally conductive film 15 is in equilateral triangular structure of right angle, and equal both sides are corresponding close to the gelling object 13
Two sides of enclosed area.
The implementation of the embodiments of the present invention has the following beneficial effects:
In embodiments of the present invention, thermally conductive film is first set in the surrounding corner of gelling object enclosed area (i.e. packaging area)
After be coated filling glue, by thermally conductive film have stronger heat absorption capacity come improve filling glue in dam glue enclosed area surrounding
Mobility prevents OLED device surrounding corner without filling glue so that filling glue is flawless uniformly to fill up gelling object enclosed area
Protection, to guarantee OLED device packaging effect.
Above disclosed is only a preferred embodiment of the present invention, cannot limit the power of the present invention with this certainly
Sharp range, therefore equivalent changes made in accordance with the claims of the present invention, are still within the scope of the present invention.
Claims (10)
1. a kind of OLED device packaging method, which is characterized in that comprising steps of
Encapsulation cover plate is chosen, the gelling object for being encircled into semi-enclosed shape and structure is provided on the encapsulation cover plate；
Surrounding corner in the gelling object enclosed area is corresponded in the encapsulation cover plate and is respectively arranged with thermally conductive film, and described
Encapsulation cover plate corresponds to the filling glue that place of the gelling object enclosed area in addition to surrounding corner is coated with certain viscosity；
Under the conditions of certain temperature, heating baking is carried out to the encapsulation cover plate for being provided with gelling object, thermally conductive film and filling glue
It is roasting, so that the filling gum softening is flowed and is filled in the completely entire gelling object enclosed area；
After the completion of the heated baking, will there is the gelling full of filling glue on the encapsulation cover plate after the heated baking
The side of object enclosed area and pre-production have the substrate of OLED device to carry out contraposition pressing, and press and complete to the contraposition
Afterwards, away from the side of the gelling object enclosed area on the encapsulation cover plate after the heated baking described in ultraviolet light irradiation, to institute
The filling glue stated in gelling object and the gelling object enclosed area is solidified.
2. OLED device packaging method as described in claim 1, which is characterized in that the gelling object is dam glue, and the dam
Glue is encircled into semienclosed quadrilateral structure on the encapsulation cover plate.
3. OLED device packaging method as claimed in claim 2, which is characterized in that the thermally conductive film is led for semi-transparent metals
Hot film or transparent metal thermally conductive film.
4. OLED device packaging method as claimed in claim 3, which is characterized in that the thermally conductive film is in equilateral right angle trigonometry
Shape structure, and equal corresponding two sides close to dam glue enclosed area in both sides.
5. OLED device packaging method as claimed in claim 4, which is characterized in that the filling glue is UV glue.
6. OLED device packaging method as described in claim 1, which is characterized in that the heated baking is lower than 40 degree
At a temperature of carry out.
7. a kind of OLED device, which is characterized in that using such as OLED device packaging method of any of claims 1-6
It is prepared.
8. a kind of OLED device, which is characterized in that including making the substrate for having OLED device and being encapsulated in above the substrate
Encapsulation cover plate；Wherein,
The encapsulation cover plate is formed with the gelling object for being encircled into semi-enclosed shape and structure in the side towards the substrate, and
The thermally conductive film of filling glue and its corresponding surrounding corner distribution is filled in the gelling object enclosed area；
Wherein, under the conditions of certain temperature, the encapsulation cover plate for being provided with gelling object, thermally conductive film and filling glue is added
Heat baking so that the filling gum softening is flowed and filled in the completely entire gelling object enclosed area, and the heating is dried
Encapsulation cover plate and the substrate after roasting are solidified after carrying out contraposition pressing with the irradiation realization of UV light.
9. OLED device as claimed in claim 8, which is characterized in that the thermally conductive film be semi-transparent metals thermally conductive film or
Transparent metal thermally conductive film.
10. OLED device as claimed in claim 9, which is characterized in that the filling glue is UV glue；The gelling object is dam
Glue.
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| CN201710639598.2A CN107591494B (en) | 2017-07-31 | 2017-07-31 | A kind of OLED device and its packaging method |
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| CN201710639598.2A CN107591494B (en) | 2017-07-31 | 2017-07-31 | A kind of OLED device and its packaging method |
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| CN108365124B (en) * | 2018-02-13 | 2019-05-31 | 武汉华星光电半导体显示技术有限公司 | OLED encapsulation method and OLED encapsulating structure |
| CN108538763B (en) * | 2018-04-24 | 2020-05-15 | 京东方科技集团股份有限公司 | Heating assembly, packaging device and packaging method |
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| JP2000030857A (en) * | 1998-07-08 | 2000-01-28 | Futaba Corp | Organic el element and its manufacture |
| CN103594488B (en) * | 2013-11-21 | 2016-01-20 | 四川虹视显示技术有限公司 | A kind of method for packing of OLED display device and encapsulating structure |
| CN104022234B (en) * | 2014-06-24 | 2016-10-26 | 深圳市华星光电技术有限公司 | OLED sealed in unit and the method for packing of oled panel |
| CN104183785B (en) * | 2014-06-27 | 2016-05-11 | 京东方科技集团股份有限公司 | A kind of method for packing, OLED display floater and OLED display unit of OLED device |
| CN106848099B (en) * | 2017-02-21 | 2019-01-22 | 深圳市华星光电技术有限公司 | OLED encapsulation method and OLED encapsulating structure |
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Address after: No.9-2 Tangming Avenue, Guangming New District, Shenzhen, Guangdong 518000 Patentee after: TCL Huaxing Photoelectric Technology Co.,Ltd. Address before: No.9-2 Tangming Avenue, Guangming New District, Shenzhen, Guangdong 518000 Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |