CN107433788A - A kind of fine pattern thermal transfer structure - Google Patents
A kind of fine pattern thermal transfer structure Download PDFInfo
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- CN107433788A CN107433788A CN201610352086.3A CN201610352086A CN107433788A CN 107433788 A CN107433788 A CN 107433788A CN 201610352086 A CN201610352086 A CN 201610352086A CN 107433788 A CN107433788 A CN 107433788A
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- Prior art keywords
- fine pattern
- radiation
- sensitive resin
- layer
- resin bed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
- B41M5/42—Intermediate, backcoat, or covering layers
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Decoration By Transfer Pictures (AREA)
Abstract
A kind of fine pattern thermal transfer structure, including basic courses department, the transparent abscission layer being arranged on the side surface of basic courses department one, transparent abscission layer is arranged on relative to the UV-radiation-sensitive resin bed on another side surface of basic courses department, and it is arranged on UV-radiation-sensitive resin bed and fine pattern is set relative to the PUR bisque on another side surface of transparent abscission layer, a side surface of the UV-radiation-sensitive resin bed.This fine pattern thermal transfer structure, fine micron order grain pattern can be produced using UV-radiation-sensitive resin bed, and be transferred in and treat on hot stamping material；The technique for omitting spraying finished product overcoat simultaneously, the feature of environmental protection is lifted while lifting case hardness.
Description
Technical field
The present invention relates to a kind of fine pattern thermal transfer structure.
Background technology
Thermal-printing Technology is applied to fabric thermal transfer printing and produced very early, and as high-tech develops rapidly, heat turns
Print technology is using more and more extensive.There are hot-pressing transfer printing type and thermal dye sublimation transfer printing type from ink assortment；From being turned
Print thing classification has fabric, plastics (plate, piece, film), ceramics and coated metal plate etc.；Classify from mode of printing
Wire mark, flat stamping, gravure, convex print, ink-jet and colour band printing etc. can be divided into；There is heat-transferring printing paper from stock classification
With thermal transfer plastic foil etc..
Thermal transfer is design is good, makes copperplate, then pattern point color is carved in by electric carving machinery
On copperplate.Copperplate is taken on printing machinery pattern printing in PET film again, then passes through thermal transfer machinery
Pattern is transferred on product.It is mainly used in plastics, EVA, stainless steel, is adapted to a large amount of productions.
The structure of hot-pressing transfer printing marble paper has three types.
1. it is made up of heat-transferring printing paper, ink layer and adhesive phase.
2. it is made up of heat-transferring printing paper, transparent abscission layer, ink layer and adhesive phase.Transparent abscission layer can conduct
The diaphragm of ink.
3. it is made up of heat-transferring printing paper, transparent abscission layer, ink layer, adhesive phase and PUR bisque.It is sprinkled with
Finished product rub resistance, fastness and the adhesive force that the heat-transferring printing paper of PUR bisque transfers out are most strong.
Heat transfer film be applied to plastic cement (ABS, AS, PS, PVC, EVA, PP, PE), metal, leather,
The planes of the products such as ceramics, timber, curved surface, abnormity, the face of cylinder, thermoprint, extensive use are carried out on cone face
In industries such as commodity, cosmetics, toy, electrical equipment, building materials, stationery, gift, packaging for foodstuff, labels
In the printing decoration of product and packing material.With adhesive force is good, wear-resisting, light resistance is good, pattern is true to nature, color
The features such as color gorgeous, greatly improve the class of product.Particularly plastic products plane, curved surface, the face of cylinder,
Polychrome printing can be completed once on cone face, and process is few, efficiency high, cost are low, and non-environmental-pollution, is business
The once creative innovation of product printing.Your added value of product is set to increase.
Traditional grain pattern is realized by ink layer, but ink layer is due to the original of material property itself
Cause, micron order or more fine grain pattern can not be presented.
Meanwhile in the conventional technology, hardness is transferred to improve, is prevented finally spraying UV finished products with spraying method
Sheath, to lift hardness and protect the printing lines of ink layer, but spraying method yield rate is low and not environmentally.
The content of the invention
In view of situation above, in order to solve the problems, such as that above-mentioned technology is present, the present invention proposes a kind of fine pattern heat
Structure, including basic courses department, the transparent abscission layer being arranged on the side surface of basic courses department one are transferred, is arranged on transparent de-
Absciss layer is relative to the UV-radiation-sensitive resin bed on another side surface of basic courses department, and is arranged on UV-radiation-sensitive
Resin bed is relative to the PUR bisque on another side surface of transparent abscission layer, the UV-radiation-sensitive resin bed
A side surface set fine pattern.
The surface that described UV-radiation-sensitive resin bed corresponds to transparent abscission layer is smooth minute surface, and described is saturating
Bright abscission layer is also smooth minute surface relative to the surface of UV-radiation-sensitive resin bed.
Preferably, the surface that described UV-radiation-sensitive resin bed corresponds to PUR bisque has fine figure
Case.
It is photosensitive as another preferred scheme, in addition to auxiliary UV line photosensitive resin layer, the auxiliary UV line
Resin bed is arranged between basic courses department and transparent abscission layer, and the transparent abscission layer passes through the photosensitive tree of auxiliary UV line
Lipid layer is arranged on a side surface of basic courses department.
Described auxiliary UV line photosensitive resin layer has the first essence relative to the surface of UV-radiation-sensitive resin bed
Thin pattern, described transparent abscission layer have the first fine pattern relative to the surface of UV-radiation-sensitive resin bed,
Described UV-radiation-sensitive resin bed has the second fine figure relative to the surface of auxiliary UV line photosensitive resin layer
Case, the second described fine pattern are the reverse patterns corresponding with the first fine pattern, described ultraviolet sense
Photopolymer resin layer is smooth minute surface relative to the surface of PUR bisque.
Above-described fine pattern and the preferable lines spacing of the first fine pattern and the second fine pattern exist
100 nanometers between some tens of pm.
Alternatively, ink layer can also be included, the ink layer is arranged on UV-radiation-sensitive resin
Between layer and PUR bisque.
After technology proposed by the present invention is taken, a kind of fine pattern thermal transfer knot according to embodiments of the present invention
Structure, fine micron order grain pattern can be produced using UV-radiation-sensitive resin bed, and be transferred in and treat hot stamping material
On material；The technique for omitting spraying finished product overcoat simultaneously, the feature of environmental protection is lifted while lifting case hardness.
Brief description of the drawings
Fig. 1 shows a kind of fine pattern thermal transfer structural representation of according to embodiments of the present invention 1 and embodiment 2
A kind of fine pattern thermal transfer structure that Fig. 2 shows shown in Fig. 1 realizes the method schematic diagram of thermal transfer
Fig. 3 shows a kind of fine pattern thermal transfer structural representation of according to embodiments of the present invention 3 and embodiment 4
A kind of fine pattern thermal transfer structure that Fig. 4 shows shown in Fig. 3 realizes the method schematic diagram of thermal transfer
Embodiment
Each preferred embodiment of the present invention is described below with reference to accompanying drawings.There is provided referring to attached
The description of figure, to help to the reason of the example embodiment of the invention limited by appended claims and their equivalents
Solution.It includes helping the various details that understand, but they can only be counted as it is exemplary.Therefore, originally
Art personnel to embodiment described herein it will be recognized that can make various changes and modifications, without de-
From scope and spirit of the present invention.Moreover, in order that specification is more clear succinct, it is ripe to this area by omitting
Know function and the detailed description of construction.
(embodiment 1)
First, a kind of fine pattern thermal transfer structure according to an embodiment of the invention is described into reference picture 1,
(the present embodiment removes sequence number 30), a kind of fine pattern thermal transfer structure, including basic courses department 22 as shown in Figure 1,
The transparent abscission layer 26 being arranged on the side surface of basic courses department 22 1, transparent abscission layer 26 is arranged on relative to base
UV-radiation-sensitive resin bed 28 on another side surface in plinth portion 22, and it is arranged on UV-radiation-sensitive resin bed
28 relative to the PUR bisque 32 on another side surface of transparent abscission layer 26, the UV-radiation-sensitive resin
One side surface of layer 28 sets fine pattern.Described UV-radiation-sensitive resin bed 28 corresponds to transparent disengaging
The surface of layer 26 is smooth minute surface, and described transparent abscission layer 26 is relative to UV-radiation-sensitive resin bed 28
Surface is also smooth minute surface.Described UV-radiation-sensitive resin bed 28 corresponds to the surface of PUR bisque 32
With fine pattern.
The method for realizing thermal transfer of the present embodiment, as shown in Fig. 2 the basic courses department 22 of thermal transfer structure is saturating
Cross hot-melt adhesive powder layer 32 to be layed on material 34 to be transferred, and basic courses department 22 is entered using thermal transfer equipment
Row hot pressing, UV-radiation-sensitive resin bed 28 is set to be imprinted on through PUR bisque 32 on material to be transferred.Will be transparent
The basic courses department 22 of abscission layer 26 and its top divests, therefore the outermost layer of end product is UV-radiation-sensitive resin
Layer 28, and its outer surface has spacing at 100 nanometers between some tens of pm, the fine lines of sub-micron grade
Pattern.Because UV-radiation-sensitive resin bed 28 is transparent, although its all outer surface is plane, still may be used
See its internal fine pattern.The more general ink layer of case hardness of this other UV-radiation-sensitive resin bed 28
Height, all patterns exposed to outside are not easy to be damaged, and are also not required to spray the protection of ultraviolet finished product again on the outside of finished product
Layer.
(embodiment 2)
Secondly, another fine pattern thermal transfer knot according to an embodiment of the invention is described into reference picture 1
Structure, as shown in figure 1, a kind of fine pattern thermal transfer structure, including basic courses department 22, it is arranged on basic courses department 22
Transparent abscission layer 26 on one side surface, it is arranged on opposite side of the transparent abscission layer 26 relative to basic courses department 22
UV-radiation-sensitive resin bed 28 on surface, and UV-radiation-sensitive resin bed 28 is arranged on relative to transparent de-
PUR bisque 32 on another side surface of absciss layer 26, the side table of the UV-radiation-sensitive resin bed 28
Face sets fine pattern.The surface that described UV-radiation-sensitive resin bed 28 corresponds to transparent abscission layer 26 is
Smooth minute surface, described transparent abscission layer 26 are also smooth mirror relative to the surface of UV-radiation-sensitive resin bed 28
Face.The surface that described UV-radiation-sensitive resin bed 28 corresponds to PUR bisque 32 has fine pattern.
Difference with embodiment 1 is, in addition to ink layer 30, and the ink layer 30 is arranged on UV-radiation-sensitive tree
Between lipid layer 28 and PUR bisque 32.
The method for realizing thermal transfer of the present embodiment, as shown in Fig. 2 the basic courses department 22 of thermal transfer structure is saturating
Cross hot-melt adhesive powder layer 32 to be layed on material 34 to be transferred, and basic courses department 22 is entered using thermal transfer equipment
Row hot pressing, UV-radiation-sensitive resin bed 28 is set to be imprinted on material to be transferred through PUR bisque 32 with ink layer 30
On material.The basic courses department 22 of transparent abscission layer 26 and its top is divested, therefore the outermost layer of end product is purple
Outside line photosensitive resin layer 28, and its outer surface has spacing at 100 nanometers between some tens of pm, secondary micron
The fine grain pattern of level.Because UV-radiation-sensitive resin bed 28 is transparent, although its all outer surface
It is plane, still it can be seen that its internal fine pattern.The case hardness of this other UV-radiation-sensitive resin bed 28
More general ink floor height, all patterns exposed to outside are not easy to be damaged, while can also protect the ink of inner side
Layer 30, finished product outside are also not required to spray ultraviolet finished product overcoat again.
(embodiment 3)
Again, another fine pattern thermal transfer knot according to an embodiment of the invention is described into reference picture 3
Structure, (the present embodiment removes sequence number 30) as shown in Figure 3, a kind of fine pattern thermal transfer structure, including basis
Portion 22, the transparent abscission layer 26 being arranged on the side surface of basic courses department 22 1, it is arranged on the transparent phase of abscission layer 26
For the UV-radiation-sensitive resin bed 28 on another side surface of basic courses department 22, and it is arranged on UV-radiation-sensitive
Resin bed 28 is relative to the PUR bisque 32 on another side surface of transparent abscission layer 26, the ultraviolet
One side surface of photosensitive resin layer 28 sets fine pattern.Described UV-radiation-sensitive resin bed 28 corresponds to
The surface of transparent abscission layer 26 is smooth minute surface, and described transparent abscission layer 26 is relative to UV-radiation-sensitive resin
The surface of layer 28 is also smooth minute surface.Described UV-radiation-sensitive resin bed 28 corresponds to PUR bisque
32 surface has fine pattern.Also include auxiliary UV line photosensitive resin layer 24, the auxiliary UV line sense
Photopolymer resin layer 24 is arranged between basic courses department 22 and transparent abscission layer 26, and the transparent abscission layer 26 is by auxiliary
UV-radiation-sensitive resin bed 24 is helped to be arranged on a side surface of basic courses department 22.
Described auxiliary UV line photosensitive resin layer 24 has the relative to the surface of UV-radiation-sensitive resin bed 28
One fine pattern.Described transparent abscission layer 26 has first relative to the surface of UV-radiation-sensitive resin bed 28
Fine pattern.Described UV-radiation-sensitive resin bed 28 relative to auxiliary UV line photosensitive resin layer 24 surface
With the second fine pattern.The second described fine pattern is the reverse pattern corresponding with the first fine pattern.
Described UV-radiation-sensitive resin bed 28 is smooth minute surface relative to the surface of PUR bisque 32.Described essence
The lines spacing of thin pattern is at 100 nanometers between some tens of pm.
The method for realizing thermal transfer of the present embodiment, as shown in figure 4, the basic courses department 22 of thermal transfer structure is saturating
Cross hot-melt adhesive powder layer 32 to be layed on material 34 to be transferred, and basic courses department 22 is entered using thermal transfer equipment
Row hot pressing, UV-radiation-sensitive resin bed 28 is set to be imprinted on through PUR bisque 32 on material to be transferred.Will be transparent
Abscission layer 26 and its auxiliary UV line photosensitive resin layer 24 of top and basic courses department 22 divest, thus finally into
The outermost layer of product is UV-radiation-sensitive resin bed 28, and there is spacing to arrive some tens of pm at 100 nanometers for its outer surface
Between, the fine grain pattern of sub-micron grade.The case hardness of this other UV-radiation-sensitive resin bed 28 is compared with one
As ink floor height, all patterns exposed to outside are not easy to be damaged, and are also not required to spray ultraviolet again on the outside of finished product
Finished product overcoat.
(embodiment 4)
A kind of fine pattern thermal transfer knot next, with reference to Fig. 3 descriptions according to another embodiment of the invention
Structure, as shown in figure 3, a kind of fine pattern thermal transfer structure, including basic courses department 22, it is arranged on basic courses department 22
Transparent abscission layer 26 on one side surface, it is arranged on opposite side of the transparent abscission layer 26 relative to basic courses department 22
UV-radiation-sensitive resin bed 28 on surface, and UV-radiation-sensitive resin bed 28 is arranged on relative to transparent de-
PUR bisque 32 on another side surface of absciss layer 26, the side table of the UV-radiation-sensitive resin bed 28
Face sets fine pattern.The surface that described UV-radiation-sensitive resin bed 28 corresponds to transparent abscission layer 26 is
Smooth minute surface, described transparent abscission layer 26 are also smooth mirror relative to the surface of UV-radiation-sensitive resin bed 28
Face.The surface that described UV-radiation-sensitive resin bed 28 corresponds to PUR bisque 32 has fine pattern.
Also include auxiliary UV line photosensitive resin layer 24, the auxiliary UV line photosensitive resin layer 24 is arranged on basic courses department
Between 22 and transparent abscission layer 26, the transparent abscission layer 26 is set by auxiliary UV line photosensitive resin layer 24
Put on a side surface of basic courses department 22.
Described auxiliary UV line photosensitive resin layer 24 has the relative to the surface of UV-radiation-sensitive resin bed 28
One fine pattern.Described transparent abscission layer 26 has first relative to the surface of UV-radiation-sensitive resin bed 28
Fine pattern.Described UV-radiation-sensitive resin bed 28 relative to auxiliary UV line photosensitive resin layer 24 surface
With the second fine pattern.The second described fine pattern is the reverse pattern corresponding with the first fine pattern.
Described UV-radiation-sensitive resin bed 28 is smooth minute surface relative to the surface of PUR bisque 32.Described essence
The lines spacing of thin pattern is at 100 nanometers between some tens of pm.Also include ink layer 30, the ink layer
30 are arranged between UV-radiation-sensitive resin bed 28 and PUR bisque 32.
The method for realizing thermal transfer of the present embodiment, as shown in figure 4, the basic courses department 22 of thermal transfer structure is saturating
Cross hot-melt adhesive powder layer 32 to be layed on material 34 to be transferred, and basic courses department 22 is entered using thermal transfer equipment
Row hot pressing, UV-radiation-sensitive resin bed 28 is set to be imprinted on material to be transferred through PUR bisque 32 with ink layer 30
On material.Transparent abscission layer 26 and its auxiliary UV line photosensitive resin layer 24 of top and basic courses department 22 are divested,
Therefore the outermost layer of end product is UV-radiation-sensitive resin bed 28, and its outer surface has spacing at 100 nanometers
To between some tens of pm, the fine grain pattern of sub-micron grade.The table of this other UV-radiation-sensitive resin bed 28
The more general ink floor height of surface hardness, all patterns exposed to outside are not easy to be damaged, while can also protect inner side
Ink layer 30, be also not required to spray ultraviolet finished product overcoat again on the outside of finished product.
After technology proposed by the present invention is taken, a kind of fine pattern thermal transfer knot according to embodiments of the present invention
Structure, fine micron order grain pattern can be produced using UV-radiation-sensitive resin bed, and be transferred in and treat hot stamping material
On material；The technique for omitting spraying finished product overcoat simultaneously, the feature of environmental protection is lifted while lifting case hardness.
The present invention is described in detail above, principle and reality of the specific case used herein to the present invention
The mode of applying is set forth, and the explanation of above example is only intended to help the method and its core for understanding the present invention
Thought；Meanwhile for those of ordinary skill in the art, according to the thought of the present invention, in embodiment
And there will be changes in application, in summary, this specification content should not be construed as to the present invention's
Limitation.
Through the above description of the embodiments, those skilled in the art can be understood that the present invention can
Implement.Certainly, above listed situation is merely illustrative, and the present invention is not limited to this.Those skilled in the art
Member can be suitably applied to this hair it should be understood that according to other deformations or simplified of technical solution of the present invention
It is bright, and should be included within the scope of the invention.
Claims (11)
1. a kind of fine pattern thermal transfer structure, it is characterised in that including basic courses department (22), be arranged on base
Transparent abscission layer (26) on the side surface of plinth portion (22) one, transparent abscission layer (26) is arranged on relative to base
UV-radiation-sensitive resin bed (28) on another side surface in plinth portion (22), and it is arranged on UV-radiation-sensitive
Resin bed (28) is relative to the PUR bisque (32) on another side surface of transparent abscission layer (26), institute
The side surface for stating UV-radiation-sensitive resin bed (28) sets fine pattern.
2. a kind of fine pattern thermal transfer structure according to claim 1, it is characterised in that described
The surface that UV-radiation-sensitive resin bed (28) corresponds to transparent abscission layer (26) is smooth minute surface, described
Transparent abscission layer (26) is also smooth minute surface relative to the surface of UV-radiation-sensitive resin bed (28).
3. a kind of fine pattern thermal transfer structure according to claim 1, it is characterised in that described
The surface that UV-radiation-sensitive resin bed (28) corresponds to PUR bisque (32) has fine pattern.
4. a kind of fine pattern thermal transfer structure according to claim 1, it is characterised in that also include
Auxiliary UV line photosensitive resin layer (24), the auxiliary UV line photosensitive resin layer (24) are arranged on basic courses department
(22) between transparent abscission layer (26), the transparent abscission layer (26) passes through the photosensitive tree of auxiliary UV line
Lipid layer (24) is arranged on a side surface of basic courses department (22).
5. a kind of fine pattern thermal transfer structure according to claim 4, it is characterised in that described
Auxiliary UV line photosensitive resin layer (24) has the first essence relative to the surface of UV-radiation-sensitive resin bed (28)
Thin pattern.
6. a kind of fine pattern thermal transfer structure according to claim 4, it is characterised in that described
Transparent abscission layer (26) has the first fine pattern relative to the surface of UV-radiation-sensitive resin bed (28).
7. a kind of fine pattern thermal transfer structure according to claim 4, it is characterised in that described
UV-radiation-sensitive resin bed (28) has the second essence relative to the surface of auxiliary UV line photosensitive resin layer (24)
Thin pattern.
8. a kind of fine pattern thermal transfer structure according to claim 7, it is characterised in that described
Second fine pattern is the reverse pattern corresponding with the first fine pattern.
9. a kind of fine pattern thermal transfer structure according to claim 4, it is characterised in that described
UV-radiation-sensitive resin bed (28) is smooth minute surface relative to the surface of PUR bisque (32).
10. according to claim 1), (3), (5), (6), (one kind any one of 7 or 8 is fine
Pattern thermal transfer structure, it is characterised in that the lines spacing of described fine pattern arrives tens of micro- at 100 nanometers
Between rice.
11. a kind of fine pattern thermal transfer structure according to claim 1, it is characterised in that also wrap
Ink layer (30) is included, the ink layer (30) is arranged on UV-radiation-sensitive resin bed (28) and hot-melt adhesive powder
Between layer (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352086.3A CN107433788A (en) | 2016-05-25 | 2016-05-25 | A kind of fine pattern thermal transfer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352086.3A CN107433788A (en) | 2016-05-25 | 2016-05-25 | A kind of fine pattern thermal transfer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107433788A true CN107433788A (en) | 2017-12-05 |
Family
ID=60453866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610352086.3A Pending CN107433788A (en) | 2016-05-25 | 2016-05-25 | A kind of fine pattern thermal transfer structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113263847A (en) * | 2021-05-17 | 2021-08-17 | 安徽金彩防伪技术有限公司 | Heat transfer gold stamping stained paper and heat transfer anti-counterfeiting printing process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05330259A (en) * | 1992-05-29 | 1993-12-14 | Dainippon Printing Co Ltd | Protective layer transfer film and photographic matter |
| JPH11170714A (en) * | 1997-12-11 | 1999-06-29 | Alps Electric Co Ltd | Thermal transfer recording medium and manufacture thereof |
| CN101758678A (en) * | 2008-12-24 | 2010-06-30 | 株式会社Uviinc | Transfer paper with ultraviolet offset printing layer and ultraviolet enhancement layer and preparation method thereof |
| CN101837693A (en) * | 2009-03-16 | 2010-09-22 | 明滕薄膜股份有限公司 | Thermal transfer structure with micro-texture pattern |
| CN204641124U (en) * | 2015-01-12 | 2015-09-16 | 江苏学泰印务有限公司 | A kind of variable color pearly-lustre heat transfer film |
-
2016
- 2016-05-25 CN CN201610352086.3A patent/CN107433788A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05330259A (en) * | 1992-05-29 | 1993-12-14 | Dainippon Printing Co Ltd | Protective layer transfer film and photographic matter |
| JPH11170714A (en) * | 1997-12-11 | 1999-06-29 | Alps Electric Co Ltd | Thermal transfer recording medium and manufacture thereof |
| CN101758678A (en) * | 2008-12-24 | 2010-06-30 | 株式会社Uviinc | Transfer paper with ultraviolet offset printing layer and ultraviolet enhancement layer and preparation method thereof |
| CN101837693A (en) * | 2009-03-16 | 2010-09-22 | 明滕薄膜股份有限公司 | Thermal transfer structure with micro-texture pattern |
| CN204641124U (en) * | 2015-01-12 | 2015-09-16 | 江苏学泰印务有限公司 | A kind of variable color pearly-lustre heat transfer film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113263847A (en) * | 2021-05-17 | 2021-08-17 | 安徽金彩防伪技术有限公司 | Heat transfer gold stamping stained paper and heat transfer anti-counterfeiting printing process |
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Application publication date: 20171205 |
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