CN107371360B - Apparatus for mounting component - Google Patents
Apparatus for mounting component Download PDFInfo
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- CN107371360B CN107371360B CN201710176150.1A CN201710176150A CN107371360B CN 107371360 B CN107371360 B CN 107371360B CN 201710176150 A CN201710176150 A CN 201710176150A CN 107371360 B CN107371360 B CN 107371360B
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- shooting
- optical path
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- pattern characteristics
- component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- Operations Research (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of apparatus for mounting component, can be with very high precision in a short time to substrate installation portion part in the outer dimension change of component without carrying out optical axis adjustment and focusing.Mounting head has the through hole until transparent holding member, the holding member is able to maintain the component with pattern characteristics portion and is installed on the substrate with pattern characteristics portion, by filming apparatus to the pattern characteristics portion of holding member and substrate in the first shooting optical path for passing through holding member and the first through hole and being reflected by the first reflective optics, and it is shot simultaneously by holding member and the second through hole and by the pattern characteristics portion of holding member and substrate in the second shooting optical path that the first reflective optics and the second reflective optics reflect, the position in two pattern characteristics portions of shooting unit and component can be made mobile to carry out position adjustment accordingly along through hole orientation by device for moving and adjusting.
Description
Technical field
The present invention relates to the apparatus for mounting component for installing component to substrate.
Background technique
In recent years, with using smart phone or tablet terminal as the miniaturization of the electronic equipment of representative and high performance
Develop, the densification of components, more pins of electrode terminal and the thin space such as semiconductor element used in these terminals
The development of change accelerates.Therefore, into the mounting device of substrate installation semiconductor element, it is desirable that in the limited stenosis area of substrate
It is installed with high precision in domain.
In general, partly being led in the semiconductor mounting method for being referred to as die bond by the reading of the identification mechanisms such as camera
Identification marking that the electrode surface of volume elements part is formed, the identification marking that is formed of electrode surface in substrate, based on obtained opposite
Location information and installed after being aligned, so as to the installation of defined precision.But in common mounting device
In, the adsorption mouth of semiconductor element is made of opaque component, therefore before adsorbing semiconductor element by adsorption mouth, is passed through
CCD camera etc. identifies the identification marking of semiconductor element.When therefore, not to by adsorption mouth absorption semiconductor element
Positional shift is modified, and is installed in the case where deviateing the position of identification, is existed and be cannot achieve asking for high precision int
Topic.
As the device for coping with this requirement, following mounting device is proposed, which is arranged in adsorption mouth
There is optical path direction to convert component, the identification mechanism of the side by being set to adsorption mouth reads the semiconductor adsorbed by adsorption mouth
The identification marking of element is modified acquired positional shift, thus mentions to obtain the positional shift generated by absorption
The precision of height installation (for example, referring to patent document 1).
Figure 10 A is the structure chart for schematically showing the mounting device 101 of the semiconductor device proposed in patent document 1.
Mounting device 101 is the device for installing semiconductor element 102 to substrate 103.Multiple contrapositions are formed in semiconductor element 102
Identification marking 104, in the region of ratio installation semiconductor element 102 of substrate 103, place is formed with multiple contrapositions use in the outer part
Identification marking 105.The prism 109 that is internally provided with of the adsorption mouth 106 of semiconductor element 102 is kept to be used as optical path side in absorption
To mapping device, by the inclined-plane 109a of prism 109 to the identification marking 104 and base of semiconductor element 102 from below
The reflection image of the identification marking 105 of plate 103 is totally reflected, and carries out direction transformation to side.The prism hypotenuse/facet surfaces 109a's of optical path
Lower part and side are made of transparent glass.Therefore, it can be read by being set to the CCD camera 111 of the side of adsorption mouth 106
The location information of identification marking 104 and identification marking 105.
Figure 10 B is an example for the contraposition of identification marking 104,105 for showing the mounting device 101 of Figure 10 A, semiconductor element
The top view of part 102 and substrate 103.As shown in Figure 10 B, with the identification marking 104 of semiconductor element 102 and on the outside of it
The mode that the identification marking 105 of substrate 103 is arranged in the range of the visual field width W or less of CCD camera 111 is aligned.It is logical
Cross in a visual field and read above-mentioned identification marking 104,105, thus only by X or Y-direction to CCD camera 111 into
Row position control is just able to carry out focusing, to identify each identification marking 104,105.
According to above-mentioned such mounting device 101, CCD camera 111 and the drive shaft of adsorption mouth 106 are discretely configured, because
The central portion of this semiconductor element 102 that can be kept in the central portion of adsorption mouth 106, i.e. adsorption mouth 106 pressurizes, no
Torque can be generated in central portion, positional shift when engagement can be prevented, to greatly improve installation accuracy.Especially for micro-
Small semiconductor element (for example, being on one side the semiconductor element of the square of 0.2~0.5mm), can easily be done contraposition
And engagement.
Citation
Patent document 1: International Publication No. 2003/041478
The development of the densification of semiconductor device is significant, thus it requires more precisely installing depositing for large capacity than previous
The big high function semiconductor element of the shapes such as reservoir or application processor.
It is outer in order to be identified in a visual field but in the manufacturing device for the semiconductor device that patent document 1 is proposed
The big semiconductor element of shape needs the multiplying power of CCD camera being set as low range.However, the resolution ratio due to image reduces, because
This has that accuracy of identification reduces to which the deviation of installation accuracy increases.For example, in the shape ruler using semiconductor element
In the case where the CCD camera that very little is the large component of 12mm × 12mm and use multiplying power is 0.3 times, the resolution ratio of every pixel is
12~15 μm, installation accuracy is ± 15~± 20 μm.
On the other hand, the feelings by the large-scale semiconductor element 102 of two visual field identifications be not intended to by a visual field
Under condition, in order to respectively be identified to identification marking, it is necessary to a CCD camera 111 be made to be moved to each identification marking.Especially
It is, in the case where installing the component of 1mm × 1mm after being mounted with the large component of 12mm × 12mm, in order to right in the visual field
Each identification marking of component is respectively identified, it is necessary to a CCD camera 111 be made to be moved to the position of each identification marking.
But if keeping CCD camera 111 mobile, the vibration generated when mobile due to, reduces accuracy of identification.In addition,
Only make CCD camera 111 in one direction move in the case where can not focus, therefore must with ensure from CCD camera 111 to
The constant mode of the optical path length of identification marking 104 on semiconductor element 102 keeps CCD camera 111 mobile.Therefore, to identification
Until time it is elongated, there are problems for productivity.
Summary of the invention
Problems to be solved by the invention
In view of the above subject, apparatus for mounting component of the invention is designed to provide following apparatus for mounting component, should
Apparatus for mounting component, can be with very high essence without carrying out optical axis adjustment and focusing in the outer dimension change of component
Degree is in a short time to substrate installation portion part.
Solution for solving the problem
In order to achieve the above objectives, according to one method of the present invention, a kind of apparatus for mounting component is provided, is had: installation
Head has holding member in lower end, and has the first through hole and the second through hole until the holding member, institute
State the component that holding member is able to maintain the first pattern characteristics portion and the second pattern characteristics portion with contraposition, and by the portion
Part is installed to the substrate in the first pattern characteristics portion and the second pattern characteristics portion with contraposition, and the holding member energy
Enough penetrated optically shoots；First reflective optics, be configured at the mounting head first through hole and
The top of second through hole, first reflective optics make through first through hole and second perforation
The first shooting optical path and the second shooting optical path in hole are distinguished in the top of first through hole and second through hole
To the direction that intersects from the through hole orientation of first through hole and second through hole and different to each other
Direction reflection；Second reflective optics, make the first shooting optical path and described second shooting either optical path to
Direction identical with another party is appointed is reflected；Shooting unit, with filming apparatus, which, which utilizes, passes through the holding structure
Part and first through hole of the mounting head and first shooting reflected by first reflective optics
Optical path, the institute in first pattern characteristics portion and the substrate to the upper surface of the component kept by the holding member
It states the first pattern characteristics portion to be shot, while utilizing second perforation by the holding member and the mounting head
Hole and the second shooting optical path reflected by first reflective optics and second reflective optics are right
Described the second of second pattern characteristics portion of the upper surface of the component kept by the holding member and the substrate
Pattern characteristics portion is shot；And device for moving and adjusting, with first pattern characteristics portion of the component and described
The position in the second pattern characteristics portion correspondingly, makes the shooting unit move to carry out position along the through hole orientation
Set adjustment.
Invention effect
Aforesaid way according to the present invention, in the outer dimension change of component, without carrying out optical axis adjustment and focusing,
It can be with very high precision in a short time to substrate installation portion part.
Detailed description of the invention
Figure 1A is said for the installation action to apparatus for mounting component involved in first embodiment of the invention
Bright partial, longitudinal cross-sectional.
Figure 1B is the enlarged plan view of the mounting head of apparatus for mounting component involved in first embodiment.
Fig. 1 C is near the first reflective optics of the mounting head of apparatus for mounting component involved in first embodiment
Amplification longitudinal section view.
Fig. 1 D is the first and second reflection optics of the mounting head of apparatus for mounting component involved in first embodiment
The amplification longitudinal section view of arrangement adjacent.
Fig. 1 E is the mounting head of apparatus for mounting component involved in first embodiment and the top view of shooting unit.
Fig. 2A is for the first through hole to the mounting head by apparatus for mounting component involved in first embodiment
The top view that observe with the second through hole, widget and the respective pattern characteristics portion of substrate are illustrated.
Fig. 2 B is for the first and second shooting optical path and the first and second reflection optics in the case where Fig. 2A
The explanatory diagram that relationship between system is illustrated.
Fig. 2 C is for the first through hole to the mounting head by apparatus for mounting component involved in first embodiment
The top view that component observe with the second through hole, big and the respective pattern characteristics portion of substrate are illustrated.
Fig. 2 D is for the first and second shooting optical path and the first and second reflection optics in the case where Fig. 2 C
The explanatory diagram that relationship between system is illustrated.
Fig. 3 is the enlarged plan view of the mounting head of apparatus for mounting component involved in second embodiment.
Fig. 4 A is for the first through hole to the mounting head by apparatus for mounting component involved in second embodiment
The top view that observe with the second through hole, widget and the respective pattern characteristics portion of substrate are illustrated.
Fig. 4 B is the explanation of the identification region based on filming apparatus of apparatus for mounting component involved in second embodiment
Figure.
Fig. 5 is the mounting head of apparatus for mounting component involved in third embodiment and the top view of shooting unit.
Fig. 6 is the mounting head of apparatus for mounting component involved in the 4th embodiment and the top view of shooting unit.
Fig. 7 be for the mounting head by apparatus for mounting component involved in the 5th embodiment the first through hole with
The top view that second through hole is observed, widget and the respective pattern characteristics portion of substrate are illustrated.
Fig. 8 is for first and second count in the mounting head to apparatus for mounting component involved in sixth embodiment
The explanatory diagram that the relationship taken the photograph between optical path and the first reflective optics and two the second reflective optics is illustrated.
Fig. 9 A is for a through hole to the mounting head by apparatus for mounting component involved in the 7th embodiment
The top view that observe, micro-element and the respective pattern characteristics portion of substrate are illustrated.
Fig. 9 B is for the first shooting optical path in the case where Fig. 9 A and between the first and second reflective optics
The explanatory diagram that is illustrated of relationship.
Fig. 9 C is for the second shooting optical path in the case where Fig. 9 A and between the first and second reflective optics
The explanatory diagram that is illustrated of relationship.
Figure 10 A is the sketch structure figure for schematically showing the mounting device of the semiconductor device proposed in patent document 1.
Figure 10 B is an example for the contraposition of the identification marking of mounting device for showing Figure 10 A, component and substrate vertical view
Figure.
Description of symbols
1 mounting head
1a main parts
2 components
The upper surface 2a
The lower surface 2b
The first pattern characteristics of 3a portion
The second pattern characteristics of 3b portion
5 adsorption mouths
6 heaters
11 shooting units
The first filming apparatus of 11a
The second filming apparatus of 11b
11c shoots platform
Mono- filming apparatus of 11e
Mono- identification region of 11f
The region that 11g-A, 11g-B should be identified
12
13 substrates
14 coupling members
40 lift drive mechanisms
41 vacuum pumps
42 image processing apparatus
50 position calculation parts
51 control devices
52 head moving mechanisms
61 first reflective optics
The first reflecting surface of 61a
The second reflecting surface of 61b
62 second reflective optics
The first mirrored sides of 62a
The second mirrored sides of 62b
63a third reflective optics
The 4th reflective optics of 63b
64 triangular prisms
65 first shooting optical paths
66 second shooting optical paths
67 heater modules
68 refrigerating modules
The first through hole of 69a
The second through hole of 69b
70 device for moving and adjusting
71 prism modules
72 thirds shoot optical path
73 reflective optics
74 second reflective optics
The side 74a
75 second reflective optics
The side 75a
80 through hole orientations
90 and sized parts pattern characteristics portion between the corresponding size (amount of movement) of difference
Specific embodiment
Hereinafter, the embodiments of the present invention will be described with reference to the drawings.
(first embodiment)
Figure 1A is the schematic cross sectional view for showing the structure of apparatus for mounting component of first embodiment of the invention.Figure 1B is
The top view of the mounting head 1 of apparatus for mounting component made in the state of reflective optics exposing.Fig. 1 C and Fig. 1 D is respectively
The partially enlarged summary longitudinal section view that reflective condition for the shooting optical path to reflective optics is illustrated.Fig. 1 E
It is the top view for showing the relationship between mounting head 1 and shooting unit 11.
The apparatus for mounting component of first embodiment of the invention shown in Figure 1A~Fig. 1 E be configured to have mounting head 1,
First reflective optics 61, the second reflective optics 62, shooting unit 11 and device for moving and adjusting 70.
Mounting head 1 includes at least head main part 1a and is fixed on a holding member for the lower end of main part 1a 5.As
An example, holding member 5 are made of adsorption mouth 5.Adsorption mouth 5 is able to maintain component 2, and by the component 2 kept to being held in platform
12 substrate 13 is installed, and by can be constituted through the transparent material of shooting optically.It should be noted that component
2 keeping method uses such as vacuum suction, electrostatic or mechanical clamps.Platform 12 can be under the control of control device 51
By well known driving device etc., moved on the XY direction orthogonal with up and down direction (Z-direction) and the direction θ around Z-direction.
Component 2 as member for mount an example and function, such as illustrate by silicon, CaCl2 or silicon carbide etc.
Tube core, that is, IC chip of thin plate-like member of quadrangle etc. that opaque material is constituted.A face of component 2 (in figure 1A
For upper surface) 2a, such as first pattern characteristics such as small square are formed at least a pair of of diagonal position of square component 2
Example of the portion 3a and the second pattern characteristics portion 3b as contraposition identification marking (referring to Fig. 2A).In another face (in Figure 1A
In be lower surface) 2b, be formed with such as the heat curable adhesive as epoxy resin, acrylic resin or silicone resin, thermoplasticity
The adhesive layer (not shown) that bonding agent, conductive adhesive or paste solder are constituted.Adhesive layer is an example of bonding layer.
In addition, substrate 13 is constituted such as by silicon, glass, stainless steel or resin substrate, flat shape be it is round or
Person is rectangular-shaped etc..In upper surface (being in figure 1A upper surface) 2a of substrate 13, such as the component peace of the substrate 13 in quadrangle
At least a pair of of diagonal bits of the holding position nearby and near the first pattern characteristics portion 3a of component 2 and the second pattern characteristics portion 3b
It sets and is also formed with first pattern characteristics such as small L-shaped shape portion 16a and the second pattern characteristics portion 16b, as contraposition identification mark
The example of knowledge (referring to Fig. 2A).
There is the vacuum chamber (not shown) connecting with vacuum pump 41 in adsorption mouth 5 and connect with vacuum chamber multiple
Suction hole (not shown) can carry out vacuum holding to component 2 by suction hole.Adsorption mouth 5 is for example by sapphire, quartz, glass
Glass or heat resistant plastice etc. are constituted.
Head main part 1a include the prism module 71 of cuboid plate shape, cuboid plate shape refrigerating module 68 and
The heater module 67 of cuboid plate shape.The first reflective optics 61 and the second reflected light are configured in prism module 71
System 62.After it can be identified by the first reflective optics 61 and the second reflective optics 62 progress light chopper
Shooting unit 11 is configured on the direction of image.
It is fixed with refrigerating module 68 in the lower end surface of prism module 71, in the fixed having heaters in the lower end surface of refrigerating module 68
Module 67 is fixed with adsorption mouth 5 in the lower end surface of heater module 67.
It, can be via suction in the heater 6 that heater module 67 is built-in with an example as heating device and functions
Attached mouth 5 heats component 2.In order to soften adhesive layer when installing component 2 to substrate 13 or the engagement such as make solder
Material molten, and the heating for using the heater 6 to carry out.
Cooling channel (not shown) of the refrigerating module 68 configured with circulations such as Cooling Waters carries out cooling so that head main body
Portion 1a is not heated because of heater 6 in heater module 67.
In refrigerating module 68 and heater module 67, there is perforation along the vertical direction in the up-down direction until keeping
The upper surface of component 5 and be respectively provided with the long holes such as ellipse flat shape the first through hole 69a and the second through hole
69b.When the adsorption mouth 5 for maintaining component 2 is located at the top of the installation site of substrate 13, in the lower end of the first through hole 69a
In opening, the first pattern characteristics portion 16a of the first pattern characteristics portion 3a of the contraposition of component 2 and substrate 13 is located at can be saturating
The position that holding member 5 is detected is crossed, and in the lower ending opening of the second through hole 69b, the second of the contraposition of component 2
Second pattern characteristics portion 16b of pattern characteristics portion 3b and substrate 13 is located at can be through the position that holding member 5 is detected
(referring to Fig. 2A).
As an example, the first reflective optics 61 is by having two reflectings surface for deviating from each other 180 degree, i.e., the first reflection
First prism 61 of the rectangular shape of face 61a and the second reflecting surface 61b is constituted.First reflective optics 61 can be like this
It is made of reflecting prism or reflecting mirror.First prism 61 is accommodated in the prism module on the top of the head main part 1a of mounting head 1
In 71, and configure in the top of the first through hole 69a and the second through hole 69b, in the upper end opening of the first through hole 69a
It is inside configured with the first reflecting surface 61a of the first reflective optics 61, and is configured in the upper end opening of the second through hole 69b
There is the second reflecting surface 61b of the first reflective optics 61.Thereby, it is possible to by two first and the second reflecting surface 61a,
61b makes longitudinal the first shooting optical path 65 and the second pickup light by the first through hole 69a and the second through hole 69b
Road 66 the top of the first through hole 69a and the second through hole 69b respectively to the first through hole 69a and the second through hole
The direction (such as orthogonal transverse direction) and mutually different direction that the through hole orientation 80 of 69b intersects are (for example, deviate 180
The direction of degree, that is, be right direction and left oblique direction obliquely downward in Figure 1B and Fig. 2 B) reflection.
Second reflective optics 62 configures in the prism module 71 on the top of the head main part 1a of mounting head 1, as
An example is made of the second prism 62 of triangle plate.Second reflective optics 62 can like this by reflecting prism or
Reflecting mirror is constituted.As shown in Figure 2 B, the second prism 62 passes through anti-using two sides for being equivalent to hypotenuse, i.e., first
It penetrates side 62a and the second mirrored sides 62b reflects in 90 degrees respectively, so as to make the first shooting optical path 65 and second count
Take the photograph either optical path 66 shooting optical path (for example, in fig. ib for second shooting optical path 66) Xiang Yuren another party (for example,
It is the first shooting optical path 65 in Figure 1B) reflection of identical direction.
As an example, shooting unit 11 passes through two filming apparatus will being made of respectively camera etc., i.e., and first and the
Two filming apparatus 11a, 11b are fixed on a shooting platform 11c and constitute.Platform 11c is shot can move relatively relative to mounting head 1
Dynamic mode is linked by coupling member 14 and mounting head 1, is configured to integrally move with mounting head 1.It is keeping as a result,
When the top for the installation site for thering is the adsorption mouth 5 of component 2 to be located at substrate 13, the of the upper surface of the component 2 kept by adsorption mouth 5
First pattern characteristics portion 16a of one pattern characteristics portion 3a and substrate 13 enters the first shooting dress using the first shooting optical path 65
11a is set, to be shot, which penetrates transparent adsorption mouth 5, penetrates through the first through hole of mounting head 1
69a reflects 90 degree towards the first filming apparatus 11a in the first reflecting surface 61a of the first reflective optics 61.In addition, by inhaling
Second pattern characteristics portion 16b of the second pattern characteristics portion 3b of the upper surface for the component 2 that attached mouth 5 is kept and substrate 13 utilizes the
Two shooting optical paths 66 enter the second filming apparatus 11b, to be shot, which penetrates transparent adsorption mouth
5, the second through hole 69b of mounting head 1 is penetrated through, in the second reflecting surface 61b direction and second count of the first reflective optics 61
After taking the photograph 90 degree opposite of a lateral reflection of device 11b, reflected in the first mirrored sides 62a of the second reflective optics 62 and second
Side 62b reflect 90 degree respectively and towards the second filming apparatus 11b.From the first reflecting surface 61a of the first reflective optics 61
The first shooting optical path 65 towards the first filming apparatus 11a and the second mirrored sides 62b court from the second reflective optics 62
The second shooting optical path 66 to the second filming apparatus 11b is parallel.By using this structure, in the adsorption mouth 5 for maintaining component 2
It, can be by the first filming apparatus 11a and the second filming apparatus 11b to by adsorbing when positioned at the top of the installation site of substrate 13
First pattern characteristics portion 3a of the upper surface for the component 2 that mouth 5 is kept and the first pattern characteristics portion 16a and component 2 of substrate 13
The second pattern characteristics portion 3b and substrate 13 the second pattern characteristics portion 16b simultaneously shot.In this way, in the first pickup light
It is primary in the first reflecting surface 61a reflection of the first reflective optics 61 in road 65, in the second shooting optical path 66, first
The second reflecting surface 61b, the first mirrored sides 62a of the second reflective optics 62, the second reflection side of reflective optics 61
Face 62b reflects three times, whole total reflection four times.In this way, in the configuration aspects of mounting head 1, can not mounting head 1 just on
Side's configuration filming apparatus, and in the case where the side of mounting head 1 configures filming apparatus, lead between component side to filming apparatus
Reflective optics overall reflective even-times is crossed, so as to each two figures by filming apparatus to component 2 and substrate 13
Pattern characteristics portion is shot simultaneously.
In addition, being connected with image processing apparatus 42, first and second count in first and second filming apparatus 11a, 11b
Device 11a, 11b and image processing apparatus 42 is taken the photograph to function as an example of pattern recognition device.It can be according to by first
And second image information that takes of filming apparatus 11a, 11b, utilize image processing apparatus 42 to carry out the public affairs such as background subtraction
The image procossing known, thus read the first pattern characteristics portion 3a and the second pattern characteristics portion 3b position and substrate 13 first
The position of pattern characteristics portion 16a and the second pattern characteristics portion 16b.First pattern characteristics portion 3a of the component 2 being kept and
The image of the first pattern characteristics portion 16a and the second pattern characteristics portion 16b of second pattern characteristics portion 3b and substrate 13 are penetrating
After adsorption mouth 5, penetrate through the first through hole 69a and the second through hole 69b respectively, by the first reflective optics 61 and/
Or second reflective optics 62 to the shooting face of first and second filming apparatus 11a, 11b carry out direction transformation, import
It is special thus, it is possible to read the first pattern of component 2 by image processing apparatus 42 to first and second filming apparatus 11a, 11b
First pattern characteristics portion 16a of the location information and substrate 13 of sign portion 3a and the second pattern characteristics portion 3b and the second pattern are special
The location information of sign portion 16b (referring to Fig. 2A).Here, according to the first pattern characteristics portion 3a of two positions on component 2 and
The location information of second pattern characteristics portion 3b, calculated by the position calculation part 50 being connect with image processing apparatus 42 relative to
The relative coordinate of the component 2 of the coordinate of the center of gravity of adsorption mouth 5, as position offset.Equally, according to two positions on substrate 13
The location information of the first pattern characteristics portion 16a and the second pattern characteristics portion 16b that set, by being connect with image processing apparatus 42
Position calculation part 50 calculate the relative coordinate of the substrate 13 of the coordinate of the center of gravity relative to platform 12, as position offset.
Calculated each information is exported to control device 51.It should be noted that in fig. 2, the dotted line 11a- of the quadrangle of lower-left
A is the identification region of the first filming apparatus 11a including the first pattern characteristics portion 3a and the first pattern characteristics portion 16a,
The dotted line 11b-B of the quadrangle of upper right is second including the second pattern characteristics portion 3b and the second pattern characteristics portion 16b
The identification region of filming apparatus 11b.
Mounting head 1 is also equipped with a lift drive mechanism 40 and head moving mechanism 52.
Head lift drive mechanism 40 is relative to the platform 12 for being arranged and keeping substrate 13 in the mode opposed with mounting head 1
Mounting head 1 is driven on the vertical direction of plane (such as up and down direction, that is, Z-direction).
Head moving mechanism 52 can make mounting head 1 in the moving direction with the mounting head 1 based on head lift drive mechanism 40
(such as up and down direction) orthogonal transverse direction moves on (such as the direction XY).
Control device 51 respectively adjust by correct lift drive mechanism 40, heater 6, vacuum pump 41, head moving mechanism 52, movement
Engagement positions 70, image processing apparatus 42, position calculation part 50 and platform 12 carry out drive control.Control device 51 being capable of basis
It is identified by image processing apparatus 42 and by the calculated position coordinates of position calculation part 50, respectively drives a lift drive mechanism
40, head moving mechanism 52, heater 6, vacuum pump 41, to carry out component while carrying out the contraposition of component 2 and substrate 13
Installation.
Device for moving and adjusting 70 can make to be fixed with the first and second filming apparatus under the control of control device 51
The size of the shooting platform 11c of 11a, 11b and component 2 correspondingly, specifically, with the first pattern characteristics portion 3a of component 2 and
The position of second pattern characteristics portion 3b is mobile accordingly along through hole orientation 80, to carry out position adjustment.As shifting
The example of dynamic adjustment device 70, can be made of cylinder isoline actuator, or can by motor, rectilinear guide and
The direct acting device that can linearly move back and forth that ball-screw is constituted is constituted.
To by device for moving and adjusting 70 make the mobile content for carrying out position adjustment of shooting unit 11 in further detail into
Row explanation.
Component 2 it is of different sizes in the case where, by keeping shooting unit 11 mobile, change the first reflection optical system respectively
System 61 and second reflective optics 62 reflection position and make first and second shooting optical path 65,66 move in parallel, energy
It is enough special by identical two first and second filming apparatus 11a, 11b the first patterns to the component 2 for being located at different location
Sign portion 3a and the second pattern characteristics portion 3b are identified.For example, as Fig. 2A in the case where widget 2A, the void of Fig. 2 B
Each position on the component 2 of first shooting optical path 65A shown in the single dotted broken line of line and Fig. 2 D and the second shooting optical path 66A
Set it is close to each other, can by first and second filming apparatus 11a, 11b to the first pattern characteristics portion 3a of widget 2A with
And second the first pattern characteristics portion 16a and the second pattern characteristics portion 3b of pattern characteristics portion 3b and substrate 13 known simultaneously
Not.On the other hand, as Fig. 2 C in the case where big component 2B, shooting unit 11 can be made by device for moving and adjusting 70
The position of first shooting optical path 65A shown in single dotted broken line from Fig. 2 D and the second shooting optical path 66A are moved to the void of Fig. 2 D
First shooting optical path 65B shown in line and the second shooting optical path 66B, in other words, as shown in arrow 81 like that from single dotted broken line
Position 11A be moved to the position 11B of dotted line.So, if as shown in the dotted line of Fig. 2 D first shooting optical path 65B and
Second shooting optical path 66B is such, changes the reflection position of the first reflective optics 61 and the second reflective optics 62 respectively
It sets, then each position phase on the component 2 of the first shooting optical path 65B shown in the dotted line of Fig. 2 D and the second shooting optical path 66B
It is mutually separate, it can be by first and second filming apparatus 11a, 11b to the first pattern characteristics portion 3a of big component 2B and the
The the first pattern characteristics portion 16a and the second pattern characteristics portion 3b of two pattern characteristics portion 3b and substrate 13 are identified simultaneously.?
This, as an example, the size of widget 2B is 1mm × 1mm, and the size of big component 2A is 12mm × 12mm.
It should be noted that for the amount of movement of the shooting unit 11 generated by device for moving and adjusting 70, for example, making
The movement of shooting unit 11 and the position of the first pattern characteristics portion 3a of widget 2B and the first pattern characteristics portion 3a of big component 2A
Position the corresponding size 90 of difference.
Apparatus for mounting component involved in the first embodiment carries out installation action as described below.A system below
The installation action of column carries out action control by control device 51.
The position for separating constant distance is arranged in the load transfer station (not shown) of boarded parts 2 and the platform 12 of mounted board 13.
Mounting head 1 has the head moving mechanism 52 and Vertical Square of the horizontal direction for the reciprocating movement being able to carry out between load transfer station and platform 12
To head lift drive mechanism 40, drive control is carried out by control device 51 respectively.Shooting unit 11 is configured to pacifying
Side near dress head 1 carries out mobile adjustment by device for moving and adjusting 70.
In this state, firstly, under the control of control device 51, for the component 2 being mounted on load transfer station, pass through
Load transfer station identifies first and second pattern characteristics portion 3a, the 3b for being formed in component 2 with camera (not shown), reads and
The location information of the mounting head 1 of self-control device 51.
Later, according to identification information (the first and second pattern characteristics portion of first and second pattern characteristics portion 3a, 3b
The location information of the relative coordinate of 3a, 3b) and mounting head 1 location information (location information of the absolute coordinate of mounting head 1), lead to
The drive control for crossing head moving mechanism 52 and head lift drive mechanism 40 makes mounting head 1 in the direction X, Y and θ (around Z-direction
Direction of rotation) on be equipped on load transfer station component 2 align and decline, contact the adsorption mouth 5 of mounting head 1 with component 2, pass through
Vacuum suction acts the adsorption mouth 5 that component 2 is held in mounting head 1.It is formed to it should be noted that having in load transfer station
In the case where the positioning mechanism for storing concave shape of all parts 2 etc., the first filming apparatus 11a and second can also not used
Filming apparatus 11b.Here, mounting head 1 can also be heated in advance by heater 6 in order to shorten the set-up time.
Next, under the control of control device 51, according to it is being stored in the storage unit being held in control device 51, take
It is loaded in the information of the parts mount position of the substrate 13 on platform 12, passes through the drive of head moving mechanism 52 and head lift drive mechanism 40
Dynamic control, makes mounting head 1 be moved to the top position of the parts mount position of substrate 13, makes the first pattern characteristics portion of component 2
The the first pattern characteristics portion 16a and the second pattern characteristics portion 16b of 3a and the second pattern characteristics portion 3b and substrate 13, which enter, to be come
The first count in optical path 65 and the second shooting optical path 66 is shot from the first of the first through hole 69a and the second through hole 69b
It takes the photograph in the identification region of device 11a and the identification region of the second filming apparatus 11b.
Next, under the control of control device 51, special by first pattern of the first filming apparatus 11a to component 2
While first pattern characteristics portion 16a of sign portion 3a and substrate 13 is shot, by the second filming apparatus 11b to component 2
The second pattern characteristics portion 16b of second pattern characteristics portion 3b and substrate 13 are shot.
Next, according to the image taken, passing through the image of image processing apparatus 42 under the control of control device 51
Processing, to two first and second pattern characteristics portion 3a, 3b on the component 2 for being held in mounting head 1 and two on substrate 13
A first and second pattern characteristics portion 16a, 16b carries out image recognition simultaneously, according to image recognition result, is calculated by position
Portion 50 carrys out relative coordinate of the calculating unit 2 relative to substrate 13.
Next, according to the calculated result of position calculation part 50, passing through head moving mechanism under the control of control device 51
52 move mounting head 1 along the direction X, Y, θ, or/and move platform 12 along X, Y, 0 direction and carry out position adjustment, with right
Positional shift is modified, and passing through head lift drive mechanism 40 while pressurizeing towards substrate 13 to component 2 later makes component 2
Decline and is installed.Here, the heat of heater 6 is transmitted to the adhesive layer at the back side of component 2 via the adsorption mouth 5 of mounting head 1
Amount, the adhesive layer softened due to heat are pressed against substrate 13 and are bonded.
According to this installation method, before it will install, by two first and second filming apparatus 11a, 11b with
Image processing apparatus 42 is to first and second pattern characteristics portion 3a, 3b of component 2 and the first pattern characteristics portion 16a of substrate 13
And second the total four pattern characteristics portions pattern characteristics portion 16b shot and carried out image recognition simultaneously, therefore do not pass through
Filming apparatus carries out multiple shooting action, only by a shooting action, therefore can shorten the shooting processing time, moreover it is possible to
Enough reduce accuracy of identification deviation, and can according to before will installing component 2 and the location information of substrate 13 installed,
Therefore it can be installed with very high precision.
In addition, component 2 it is of different sizes in the case where, need following such mobile adjustment movement.Here, as one
Example, is illustrated following situation: after carrying out installation action to Fig. 2 B and widget 2A shown in fig. 2 C, next,
Installation action is carried out to big component 2B shown in Fig. 2 C and Fig. 2 D.In widget 2A and big component 2B, component 2 first with
And second pattern characteristics portion 3a, 3b position and substrate 13 the first pattern characteristics portion 16a and the second pattern characteristics portion 16b
Position differs greatly, it is therefore desirable to keep identification region mobile.
Therefore, firstly, under the control of control device 51, make shooting unit 11 i.e. first and the second filming apparatus 11a,
11b is mobile special with the position of the first pattern characteristics portion 3a of widget 2B and the first pattern of big component 2A relative to mounting head 1
The corresponding size 90 of the difference of the position of sign portion 3a.Specifically, making shooting unit 11 relative to mounting head 1 with from the single-point of Fig. 2 D
The position of scribing line to Fig. 2 D dotted line position mode it is mobile.
After next, carry out the holding of component 2, the movement above the installation site towards substrate 13, component 2 with
Substrate 13 is shot while adding up to four pattern characteristics portion 3a, 3b, 16a, 16b, after identifying processing and position calculating, into
The installation of row component.
It should be noted that conversely, to big component 2B shown in Fig. 2 C and Fig. 2 D carry out installation action followed by
In the case where carrying out installation action to Fig. 2 B and widget 2A shown in fig. 2 C, it is right that mobile adjustment need to be only carried out round about
Installation action is carried out afterwards.
As described above, according to first embodiment, it, only need to be with the first figure of component 2 even if the outer dimension of component 2 becomes larger
The position of pattern characteristics portion 3a and the second pattern characteristics portion 3b correspondingly, by device for moving and adjusting 70 make two filming apparatus
11a, 11b are integrally mobile along a direction (through hole orientation 80), change respectively the first reflective optics 61 with
And second reflective optics 62 reflection position, without carrying out subtle optical axis adjustment and focusing.Therefore, exist
When the outer dimension change of component 2, without carrying out subtle optical axis adjustment and focusing, therefore it can be existed with very high precision
To 13 installing component 2 of substrate in short time.In addition, even big component 2, can also be accurately proceed knowledge in a short time
Not.Thereby, it is possible to easily cope with to change associated production type switching with the outer dimension of component 2, additionally it is possible to cope with more product
Kind production.
In addition, by the first reflective optics 61 and the second reflective optics 62 simultaneously by the first pattern characteristics portion
The image information of 3a and the second pattern characteristics portion 3b are guided to the respective cog region of first and second filming apparatus 11a, 11b
In domain, the position of the first pattern characteristics portion 3a and the second pattern characteristics portion 3b of component 2 are found out respectively by image processing apparatus 42
The position coordinates of coordinate, the first pattern characteristics portion 16a of substrate 13 and the second pattern characteristics portion 16b are set, so as to pass through position
Set the position coordinates that calculation part 50 calculates separately the in-plane of component 2 and substrate 13.As a result, even if not using low range
Camera, also can in each visual field of first and second filming apparatus 11a, 11b simultaneously observe each two first
Pattern characteristics portion 3a, 16a each other and second pattern characteristics portion 3b, 16b each other, can be improved four pattern characteristics portion 3a, 3b,
The resolution ratio of 16a, 16b, either shape are, for example, the widget of big component or 1mm × 1mm as 12mm × 12mm,
It can be installed in a short time to substrate 13 with very high precision.
(second embodiment)
It should be noted that various other ways can also be passed through the present invention is not limited to the first embodiment
To implement.
For example, shooting unit 11 is not limited to have two filming apparatus 11a, 11b, electricity can have a filming apparatus
11e.That is, as shown in figure 3, configure a filming apparatus 11e as shooting unit 11, and it will be by the reflecting prism etc. of triangle
The third reflective optics 63a and the 4th reflective optics 63b of composition are configured at shooting unit 11, filming apparatus 11e
It is integrally moved with third reflective optics 63a and the 4th reflective optics 63b by device for moving and adjusting 70.And
And second shooting optical path 66 it is identical with first embodiment, but replace first shooting optical path 65 and formed third shooting optical path 72,
It is identical as the first shooting optical path 65 of first embodiment from 1 side of mounting head to the optical path for entering shooting unit 11, but entering
When shooting unit 11, after shooting 90 degree of 66 lateral reflection of optical path to second by third reflective optics 63a, in the second shooting
90 degree, which are reflected, by the 4th reflective optics 63b near optical path 66 enters filming apparatus 11e.
As a result, in an identification region 11f of filming apparatus 11e, the component 2 of Fig. 4 A should be known with two of substrate 13
Other region 11g-A, 11g-B are adjacently presented as shown in Figure 4B.
According to the second embodiment, two shooting optical paths 56,66 can be applied to by a filming apparatus 11e, because
This structure is simpler, further, it is possible to which cost of implementation reduces.In addition, being not necessarily to multiple filming apparatus according to the second embodiment
Mutual synchronous driving, the beat that can be identified with high precision, and shooting action can be shortened etc..
(third embodiment)
Optical path 65 is shot into the first of the first filming apparatus 11a from the reflective optics of mounting head 1 and enters second
The second shooting optical path 66 of filming apparatus 11b is not limited to that as in the first embodiment in parallel, one can also be formed as shown in Figure 5
Fixed fixed angle.
According to the third embodiment, the layout of the first filming apparatus 11a and the second filming apparatus 11b oneself can be improved
By spending.
(the 4th embodiment)
Even if into the first of the first filming apparatus 11a the shooting optical path 65 and entering from the reflective optics of mounting head 1
The second shooting optical path 66 of second filming apparatus 11b is parallel as in the first embodiment, can also be as shown in fig. 6, by second
Filming apparatus 11b is configured to deviate relative to the first filming apparatus 11a 90 degree of phase.In this case, will be from second
It shoots optical path 66 to enter before the second filming apparatus 11b, needs to reflect 90 degree by the reflective optics such as triangular prism 73.
According to the 4th embodiment, if being combined with first embodiment, can be laid out with the configuration of shooting unit 11
Independently apply first embodiment.
(the 5th embodiment)
In addition, the position of the first pattern characteristics portion 3a of component 2 and the second pattern characteristics portion 3b are not limited to diagonal section,
It can be as shown in fig. 7, being arranged respectively at the arbitrary part such as the middle part on one side.
According to the 5th embodiment, if being combined with first to fourth embodiment, even for elongated rectangle
Component etc. can also apply first to fourth embodiment, can be improved the design freedom of component shape.
(sixth embodiment)
First shooting optical path 65 is not limited to only be reflected by the first reflective optics 61, can also with as shown in figure 8,
Two secondary reflections are carried out by the side 75a for being equivalent to bottom edge of the first reflective optics 61 and the second reflective optics 75,
The second shooting optical path 66 can also pass through the bottom edge that is equivalent to of the first reflective optics 61 and the second reflective optics 74
Side 74a carries out two secondary reflections.Second reflective optics 75,76 is able to the triangle by making to shoot 90 degree of optical path reflection
Reflecting mirror or prism constitute.
According to the sixth embodiment, the freedom degree of the configuration layout of reflective optics can be improved.
(the 7th embodiment)
It, can also be with the present invention is not limited to be divided into two through holes as the first through hole 69a and the second through hole 69b
As shown in Figure 9 A by a through hole dual-purpose as through hole 69c.So, structure is simpler.
Alternatively, it is also possible to as shown in Figure 9 B, in the structure of Fig. 9 A, extend the first reflecting surface 61c of the first prism 61
To the center of mounting head 1.So, for the first shooting optical path 65C, by the upper surface for the component 2 that adsorption mouth 5 is kept
The first pattern characteristics portion 3a and substrate 13 the first pattern characteristics portion 16a penetrate transparent adsorption mouth 5, penetrate through mounting head 1
A through hole 69c, reflect 90 degree towards the first filming apparatus 11a in the first reflecting surface 61c.Thereby, it is possible to be formed as
The structure that one shooting optical path 65C passes through the center of mounting head 1.It should be noted that using the when using the second shooting optical path
Second reflecting surface 61d of one prism 61.
It should be noted that can also be as shown in Figure 9 C, in the structure of Fig. 9 A, as the example different from Fig. 9 B, make
Second reflecting surface 61f extends to the center of mounting head 1.So, it for the second shooting optical path 66C, is protected by adsorption mouth 5
First pattern characteristics portion 3a of the upper surface for the component 2 held and the first pattern characteristics portion 16a of substrate 13 penetrate transparent suction
Attached mouth 5 penetrates through a through hole 69c of mounting head 1, after the second reflecting surface 61f reflects 90 degree, in the first mirrored sides 62a
90 degree are reflected respectively with the second mirrored sides 62b, then towards the second filming apparatus 11b.Thereby, it is possible to be formed as the second shooting
The structure that optical path 66C passes through the center of mounting head 1.It should be noted that using the first prism when using the first shooting optical path
61 the first reflecting surface 61e.
According to the 7th embodiment, it is not limited to be based on using two through holes 69a, 69b as in the first embodiment
Two visuals field shooting, can also be shot by using a visual field of a through hole 69c, also can be such as Fig. 9 A institute
Show and is applied to small semiconductor element like that.
It should be noted that in various embodiments, the position for substrate 13 relative to platform 12 can also not use upper
The filming apparatus for the shooting unit stated, but shooting identification is carried out by other filming apparatus of substrate position identification, thus
Obtain position coordinates.
It should be noted that passing through any embodiment or change in appropriately combined above-mentioned various embodiment or variations
Shape example can be realized the effect that each has.In addition, embodiment can be combined with each other or by embodiment group each other
Conjunction perhaps combines embodiment with embodiment and also can be by the feature in different embodiment or embodiment each other
Combination.
Industrial availability
Apparatus for mounting component involved in aforesaid way of the invention, which has, accurately in a short time installs component
It is used when installing the component of the large size such as high-speed large capacity memory, application processor, CPU in the effect of substrate
It is particularly useful in apparatus for mounting component.
Claims (8)
1. a kind of apparatus for mounting component, has:
Mounting head has holding member in lower end, and has the first through hole and the second until holding member
Through hole, the holding member are able to maintain the portion in the first pattern characteristics portion and the second pattern characteristics portion with contraposition
Part, and the component is installed to the substrate in the first pattern characteristics portion and the second pattern characteristics portion with contraposition, and institute
Stating holding member can be by optically through shooting；
First reflective optics, be configured at the mounting head first through hole and second through hole it is upper
Side, first reflective optics make respectively through the first pickup light of first through hole and second through hole
Road and the second shooting optical path are passed through to described first respectively in the top of first through hole and second through hole
The direction of the through hole orientation intersection of through-hole and second through hole and direction reflections different to each other；
Second reflective optics, make the first shooting optical path and described second shooting either optical path to it is another
The identical direction reflection in side；
Shooting unit, with filming apparatus, which utilizes the institute by the holding member and the mounting head
The the first shooting optical path stating the first through hole and being reflected by first reflective optics, to by the holding member
First pattern characteristics portion of the upper surface of the component kept and first pattern characteristics portion of the substrate carry out
Shooting, while utilizing through the holding member and second through hole of the mounting head and being reflected by described first
Optical system and the second shooting optical path of second reflective optics reflection, to what is kept by the holding member
Second pattern characteristics portion of the upper surface of the component and second pattern characteristics portion of the substrate are shot；With
And
Device for moving and adjusting, with first pattern characteristics portion of the component and the position in second pattern characteristics portion
Correspondingly, the shooting unit is made to move to carry out position adjustment along the through hole orientation.
2. apparatus for mounting component according to claim 1, wherein
The direction and the second shooting optical path that the first shooting optical path is reflected by first reflective optics are described
The direction of first reflective optics reflection is the direction intersected with the through hole orientation and is to deviate from each other 180 degree
Direction, and it is described second shooting optical path by second reflective optics progress two secondary reflections, 90 degree of every secondary reflection, from
And enter the shooting unit as with the parallel optical path of the first shooting optical path.
3. apparatus for mounting component according to claim 1, wherein
The shooting unit has the first filming apparatus being equipped in the first shooting optical path and the second shooting optical path
Second filming apparatus of middle outfit, the shooting unit carry out the first shooting optical path based on first filming apparatus simultaneously
In shooting and based on second filming apparatus it is described second shooting optical path in shooting.
4. apparatus for mounting component according to claim 2, wherein
The shooting unit has the first filming apparatus being equipped in the first shooting optical path and the second shooting optical path
Second filming apparatus of middle outfit, the shooting unit carry out the first shooting optical path based on first filming apparatus simultaneously
In shooting and based on second filming apparatus it is described second shooting optical path in shooting.
5. apparatus for mounting component according to claim 1, wherein
The shooting unit has the filming apparatus being equipped in the first shooting optical path and the second shooting optical path, passes through
The filming apparatus carries out the shooting in shooting and the second shooting optical path in the first shooting optical path simultaneously.
6. apparatus for mounting component according to claim 2, wherein
The shooting unit has the filming apparatus being equipped in the first shooting optical path and the second shooting optical path, passes through
The filming apparatus carries out the shooting in shooting and the second shooting optical path in the first shooting optical path simultaneously.
7. apparatus for mounting component according to claim 1, wherein
It is doubled as by a through hole as first through hole and second through hole.
8. apparatus for mounting component according to claim 2, wherein
It is doubled as by a through hole as first through hole and second through hole.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016095394 | 2016-05-11 | ||
| JP2016-095394 | 2016-05-11 | ||
| JP2016-222128 | 2016-11-15 | ||
| JP2016222128A JP6390925B2 (en) | 2016-05-11 | 2016-11-15 | Component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107371360A CN107371360A (en) | 2017-11-21 |
| CN107371360B true CN107371360B (en) | 2019-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710176150.1A Active CN107371360B (en) | 2016-05-11 | 2017-03-22 | Apparatus for mounting component |
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| CN (1) | CN107371360B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019102771A (en) * | 2017-12-08 | 2019-06-24 | アスリートＦａ株式会社 | Electronic component mounting device and electronic component mounting method |
| CN110446423A (en) * | 2019-08-21 | 2019-11-12 | 常州铭赛机器人科技股份有限公司 | Easy-to-mount absorption executing agency and the placement equipment with it |
| WO2021060064A1 (en) * | 2019-09-27 | 2021-04-01 | パナソニックＩｐマネジメント株式会社 | Mounting system, head unit, and imaging method |
| JP7451259B2 (en) * | 2020-03-26 | 2024-03-18 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
| JP7450429B2 (en) * | 2020-03-26 | 2024-03-15 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
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| CN1542543A (en) * | 2003-04-10 | 2004-11-03 | 富士机械制造株式会社 | Image-taking apparatus |
| CN1675977A (en) * | 2002-08-08 | 2005-09-28 | 松下电器产业株式会社 | Device and method for detecting whether or not component holder is good, and apparatus and method for mounting electronic component |
| JP2014207271A (en) * | 2013-04-11 | 2014-10-30 | パナソニック株式会社 | Monitoring device and component mounting apparatus |
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| US5971250A (en) * | 1997-05-09 | 1999-10-26 | Quad Systems Corp. | Contactless bonding tool heater |
| CN1675977A (en) * | 2002-08-08 | 2005-09-28 | 松下电器产业株式会社 | Device and method for detecting whether or not component holder is good, and apparatus and method for mounting electronic component |
| CN1542543A (en) * | 2003-04-10 | 2004-11-03 | 富士机械制造株式会社 | Image-taking apparatus |
| JP2014207271A (en) * | 2013-04-11 | 2014-10-30 | パナソニック株式会社 | Monitoring device and component mounting apparatus |
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