CN107357375B - Efficient heat dissipation device of sealed chassis and sealed chassis - Google Patents
Efficient heat dissipation device of sealed chassis and sealed chassis Download PDFInfo
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- CN107357375B CN107357375B CN201710586925.2A CN201710586925A CN107357375B CN 107357375 B CN107357375 B CN 107357375B CN 201710586925 A CN201710586925 A CN 201710586925A CN 107357375 B CN107357375 B CN 107357375B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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Abstract
The embodiment of the invention provides a high-efficiency heat dissipation device of a sealed chassis and the sealed chassis, wherein the high-efficiency heat dissipation device comprises: the device comprises a case wall plate, an inner radiating fin, an outer radiating fin, an inner radiating fan and an outer radiating fan; the inner radiating fins are fixedly arranged on the inner side surface of the chassis wall plate; the outer radiating fins are fixedly arranged on the outer side face of the chassis wall plate; an air inlet of the inner cooling fan is communicated with the inner side of the case wall plate, and an air outlet of the inner cooling fan is communicated with an inner air guide groove formed between the inner cooling fins; the air inlet of the outer cooling fan is communicated with the outer side of the chassis wall plate, and the air outlet of the outer cooling fan is communicated with an outer air guide groove formed between the outer cooling fins. In the technical scheme provided by the embodiment of the invention, the effective radiating area and the heat convection coefficient are increased, and the generated air flows flow through the inner air guide groove and the outer air guide groove under the action of the inner radiating fan and the outer radiating fan to form forced convection, so that the temperature distribution of the chassis wall plate is more uniform, and the radiating efficiency can be improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a high-efficiency heat dissipation device of a sealed chassis and the sealed chassis.
Background
When the case type equipment (such as a codec, a server, a desktop computer host and the like) works, more heat can be generated, and if the generated heat cannot be timely emitted, the damage of some components in the case is easy to cause. For example, heat dissipation of most sealed chassis devices is performed by a fan or a cold pipe carried by a main board, specifically, heat is transferred to an inner side surface of a wall plate of a chassis under the action of the fan or the cold pipe carried by the main board, then transferred to an outer side surface of the wall plate of the chassis by heat conduction, and finally the heat is dissipated from the outer side surface of the wall plate of the chassis to the air by natural heat conduction, heat convection and heat radiation. However, in general, the heat dissipation capability of the fan of the main board is insufficient, which easily results in uneven temperature distribution in the chassis and the chassis wall, thereby affecting the overall heat dissipation efficiency of the device. In addition, although the heat conduction efficiency of the cold guide pipe is high, the cold guide pipe can only transfer heat to part of the case wall plate, so that uneven temperature distribution of the case wall plate is more likely to be caused, and the overall heat dissipation efficiency of the equipment is affected.
Therefore, the sealing type chassis equipment in the prior art has at least the following heat dissipation problems: in the heat dissipation process, the temperature distribution of the chassis wall plate is uneven, so that the heat dissipation efficiency is low.
Disclosure of Invention
The embodiment of the invention aims to provide a high-efficiency heat dissipation device of a sealed chassis and the chassis so as to improve heat dissipation efficiency. The specific technical scheme is as follows:
in a first aspect, an embodiment of the present invention provides a high-efficiency heat dissipation device for a sealed chassis, where the device includes: the device comprises a case wall plate, an inner radiating fin, an outer radiating fin, an inner radiating fan and an outer radiating fan;
the inner radiating fins are fixedly arranged on the inner side surface of the chassis wall plate; the outer radiating fins are fixedly arranged on the outer side face of the chassis wall plate;
an air inlet of the inner cooling fan is communicated with the inner side of the chassis wall plate, and an air outlet of the inner cooling fan is communicated with an inner air guide groove formed between the inner cooling fins;
the air inlet of the outer cooling fan is communicated with the outer side of the chassis wall plate, and the air outlet of the outer cooling fan is communicated with an outer air guide groove formed between the outer cooling fins.
Optionally, the inner radiator fan and the outer radiator fan are installed on the inner side of the chassis wall plate;
the chassis wall plate is provided with an air inlet through hole, and the air inlet through hole corresponds to the air inlet position of the outer cooling fan;
the case wall plate is provided with an air guide strip, and the air guide strip is provided with a first air guide hole and a second air guide hole;
the first air guide hole is communicated with an air outlet of the outer cooling fan;
the second air guide hole is communicated with the outer air guide groove.
Optionally, the air guiding strip has a hollow structure, the first air guiding hole and the second air guiding hole are respectively arranged on one side wall and the other side wall of the air guiding strip, and the first air guiding hole and the second air guiding hole are both communicated with the inner cavity of the air guiding strip;
the chassis wall plate is provided with a mounting through hole, and the air guide strip is embedded in the mounting through hole.
Optionally, the second air guide holes are in one-to-one correspondence with the outer air guide grooves;
the sum of the effective air guiding areas of the first air guiding holes is larger than the sum of the effective air guiding areas of the second air guiding holes.
Optionally, with respect to the air outlet direction of the second air guiding hole, the first air guiding hole to the second air guiding hole have a gradient, and the gradient ranges from 15 degrees to 30 degrees.
Optionally, the air inlet through hole and the second air guide hole are both positioned at the bottom of the outer air guide groove.
Optionally, the device further comprises an inner cover plate, wherein the inner cover plate is covered at the top ends of the inner radiating fins so as to seal the notch of the inner air guide groove.
Optionally, the device further includes an inner casing, where the inner casing is fixed to an inner side surface of the chassis wall plate, and covers the air guide strip and an outer portion of the outer cooling fan.
Optionally, the inner heat dissipation fins are arranged in parallel, and the outer heat dissipation fins are arranged in parallel;
the inner radiating fins and the outer radiating fins are arranged in a staggered mode.
In a second aspect, an embodiment of the present invention provides a sealed chassis, where the chassis includes at least one efficient heat dissipating device of the sealed chassis described in any one of the foregoing.
The embodiment of the invention provides a high-efficiency heat dissipation device of a sealed chassis, which comprises: chassis wall, inner heat sink fins, outer heat sink fins, inner heat sink fan, and outer heat sink fan. The air inlet of the inner cooling fan is communicated with the inner side of the chassis wall plate, and the air outlet of the inner cooling fan is communicated with an inner air guide groove formed between the inner cooling fins, so that air containing heat in the inner side of the chassis wall plate can be sucked from the air inlet of the inner cooling fan and then flows into the inner air guide groove formed between the inner cooling fins from the air outlet of the inner cooling fan. In this process, heat is transferred to the inner cooling fins and the inner side of the chassis wall plate mainly by forced convection. At the same time, heat is transferred from the inner heat radiating fins and the inner side surface of the case wall plate to the outer heat radiating fins and the outer side surface of the case wall plate mainly through a heat conduction mode.
And the air inlet of the outer cooling fan is communicated with the outer side of the chassis wall plate, and the air outlet of the outer cooling fan is communicated with the outer air guide groove, so that air with lower temperature at the outer side of the chassis wall plate can be sucked from the air inlet of the outer cooling fan and flows into the outer air guide groove formed between the outer cooling fins from the air outlet of the outer cooling fan. In this process, heat is transferred to the air outside the chassis wall plate mainly by forced convection.
Therefore, in the technical scheme provided by the embodiment of the invention, the inner radiating fins and the outer radiating fins are added, so that the effective radiating area can be increased; the inner cooling fan and the outer cooling fan are added, so that the heat convection coefficient can be improved. Further, in the heat dissipation process, under the action of the inner heat dissipation fan and the outer heat dissipation fan, generated air flows through the inner air guide groove and the outer air guide groove, so that the temperature distribution of the chassis wall plate is uniform. Therefore, by adopting the technical scheme provided by the embodiment of the invention, the heat dissipation efficiency can be improved.
The embodiment of the invention also provides a sealed chassis, which comprises at least one high-efficiency heat dissipation device of the sealed chassis.
The efficient heat dissipation device of the sealed chassis has the technical effects, so that the sealed chassis comprising the efficient heat dissipation device has the same technical effects.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is an exploded view of a high-efficiency heat dissipating device of a sealed chassis according to an embodiment of the present invention;
fig. 2 is a schematic axial structure diagram of a high-efficiency heat dissipating device of a sealed chassis according to an embodiment of the present invention
Fig. 3 is a schematic diagram of another explosion structure of a high-efficiency heat dissipating device of a sealed chassis according to an embodiment of the present invention;
fig. 4 is a schematic diagram of an external structure of a high-efficiency heat dissipating device of a sealed chassis according to an embodiment of the present invention;
FIG. 5 is a schematic top view of FIG. 4;
FIG. 6 is a schematic rear view of the structure of FIG. 4;
FIG. 7 is a schematic view of the cross-sectional structure of A-A of FIG. 4;
fig. 8 is an enlarged view of a portion B in fig. 7;
fig. 9 is a schematic diagram of another axial side structure of a high-efficiency heat dissipating device of a sealed chassis according to an embodiment of the present invention;
FIG. 10 is a schematic view of a structure of an air guiding strip;
FIG. 11 is a schematic view of another configuration of an air guiding strip;
fig. 12 is a schematic diagram illustrating an assembly process of a high-efficiency heat dissipating device of a sealed chassis according to an embodiment of the present invention;
FIG. 13 is a schematic view showing the flow of air under the action of an external radiator fan;
fig. 14 is a schematic diagram of internal heat transfer after the efficient heat dissipating device of the sealed chassis provided in the embodiment of the present invention is applied to the chassis;
fig. 15 is a schematic diagram of external heat transfer after the efficient heat dissipating device of the sealed chassis provided in the embodiment of the present invention is applied to the chassis;
fig. 16 is a schematic structural diagram of a sealed chassis according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to solve the technical problem that the heat dissipation efficiency is low due to uneven temperature distribution of a case wall plate in the heat dissipation process of the conventional sealed case equipment, the embodiment of the invention provides a high-efficiency heat dissipation device of a sealed case and the sealed case.
The words of inner and outer directions in the embodiment of the invention are relative to the case that the high-efficiency heat dissipation device of the sealed case is applied to the sealed case, and the inside of the case is the inside and the outside of the case is the outside. The case wall plate can be used as a detachable cover plate on the case and can also be used as other wall plates except the detachable cover plate on the case.
The following first describes in detail a high-efficiency heat dissipating device for a sealed chassis provided by an embodiment of the present invention.
Referring to fig. 1 and 3, a high-efficiency heat dissipation device for a sealed chassis according to an embodiment of the present invention may include: a case wall plate 1, an inner radiator fin 2, an outer radiator fin 3, an inner radiator fan 4 and an outer radiator fan 5; in specific use, the inner cooling fan 4 and/or the outer cooling fan 5 can be ultra-silent fans, so that the overall noise of the equipment suitable for the efficient cooling device of the sealed chassis can be reduced. Of course, other types of fans may be used, and will not be described in detail herein. The inner cooling fan 4 and/or the outer cooling fan 5 can be ultrathin, so that the space occupied by the fan on the inner side of the chassis wall plate 1 can be saved, and other components on the inner side of the chassis wall plate 1 can be conveniently arranged. Of course, other types of fans may be used, and will not be described in detail herein.
The inner radiating fins 2 are fixedly arranged on the inner side surface of the chassis wall plate 1; the outer radiating fins 3 are fixedly arranged on the outer side surface of the chassis wall plate 1; specifically, the inner radiator fins 2, the outer radiator fins 3 and the chassis wall plate 1 may be separately manufactured and then mounted together by a conventional mounting manner, which may be welding, riveting, screw connection, etc., for example, the inner radiator fins 2 and the outer radiator fins 3 are respectively welded to the inner side and the outer side of the chassis wall plate 1. Of course, the inner radiator fins 2, the outer radiator fins 3 and the chassis wall plate 1 may be integrally formed, for example, by die casting.
Referring to fig. 2 and 12c, an air inlet 401 of the inner cooling fan 4 is communicated with the inner side of the chassis wall plate 1, and an air outlet 402 of the inner cooling fan 4 is communicated with an inner air guide groove 6 formed between the inner cooling fins 2; thus, the inner cooling fan 4 can suck the air inside the chassis wall plate 1 and blow the air into the inner air guide groove 6.
Referring to fig. 3 and 13, an air inlet 501 of the outer cooling fan 5 is communicated with the outside of the chassis wall plate 1, and an air outlet 502 of the outer cooling fan 5 is communicated with an outer air guide groove 7 formed between the outer cooling fins 3; thus, the outer cooling fan 5 can suck and blow air outside the chassis wall plate 1 into the outer air guide groove 7.
Referring to fig. 13-15, the air inlet of the inner radiator fan 4 is communicated with the inner side of the chassis wall plate 1, and the air outlet 402 of the inner radiator fan 4 is communicated with the inner air guide groove 6 formed between the inner radiator fins 2, so that air containing heat inside the chassis wall plate 1 can be sucked from the air inlet 401 of the inner radiator fan 4 and then flows into the inner air guide groove 6 formed between the inner radiator fins 2 from the air outlet 402 of the inner radiator fan 4. In this process, heat is transferred to the inner radiator fins 2 and the inner side of the chassis wall plate 1 mainly by means of heat convection. At the same time, heat is transferred from the inner side surfaces of the inner radiating fins 2 and the case wall plate 1 to the outer side surfaces of the outer radiating fins 3 and the case wall plate 1 mainly through a heat conduction mode.
And, the air inlet 501 of the outer cooling fan 5 is communicated with the outer side of the chassis wall plate 1, and the air outlet 502 of the outer cooling fan 5 is communicated with the outer air guiding groove 7, so that the air with lower temperature at the outer side of the chassis wall plate 1 can be sucked from the air inlet 501 flowing through the outer cooling fan 5 and flows into the outer air guiding groove 7 formed between the outer cooling fins 3 from the air outlet 502 of the outer cooling fan 5. In this process, heat is transferred to the air outside the chassis wall plate 1 mainly by forced convection.
It will be appreciated by those skilled in the art that the heat transfer process described above actually includes heat transfer modes such as natural convection, heat conduction, heat radiation, etc.
In the embodiment of the invention, the inner radiating fins 2 and the outer radiating fins 3 are added, so that the effective radiating area can be increased; the inner radiator fan 4 and the outer radiator fan 5 are added, and the heat convection coefficient can be improved. Further, in the heat dissipation process, under the action of the inner heat dissipation fan 4 and the outer heat dissipation fan 5, the generated air flows through the inner air guide groove 6 and the outer air guide groove 7, so that the temperature distribution of the chassis wall plate 1 can be more uniform. Therefore, by adopting the technical scheme provided by the embodiment of the invention, the heat dissipation efficiency can be improved.
The mounting positions of the inner radiator fan 4 and the outer radiator fan 5 may be set as required, and may be both mounted on the outer side of the chassis wall plate 1 or may be both mounted on the inner side of the chassis wall plate 1. Some of them may be mounted on the inner side and others may be mounted on the outer side. As long as it is ensured that the air inlet 401 of the inner radiator fan 4 is in communication with the inside of the chassis wall plate 1, the air outlet 402 of the inner radiator fan 4 is in communication with the inner air guide groove 6, and the air inlet 501 of the outer radiator fan 5 is in communication with the outside of the chassis wall plate 1, and the air outlet 502 of the outer radiator fan 5 is in communication with the outer air guide groove 7. The inner cooling fan 4 and the outer cooling fan 5 are arranged on the inner side of the case wall plate 1, so that the volume of the whole case can be reduced, and the damage to the fans can be avoided.
With continued reference to fig. 1 and 3, both the inner radiator fan 4 and the outer radiator fan 5 are mounted inside the chassis wall plate 1. The arrangement is convenient for arranging the complete outer radiating fins 3 on the outer side surface of the chassis wall plate 1 so as to ensure that the outside has larger effective radiating area. Meanwhile, the outer side structure of the case wall plate 1 can be simpler, and the appearance attractiveness can be improved conveniently. For example, the chassis wall plate 1 has a rectangular shape, and the outer radiator fins 5 extend from one edge of the chassis wall plate 1 to an edge opposite to the one edge. Wherein, the inner radiator fan 4 and the outer radiator fan 5 can be fixed on the inner side surface of the chassis wall plate 1 through screws, and simultaneously, a pressing strip 11 can be further arranged for pressing the outer radiator fan 5 on the inner side surface of the chassis wall plate 1. Of course, the inner radiator fan 4 and the outer radiator fan 5 may be mounted on the inner side of the chassis wall plate 1 in other manners, which will not be described herein.
Specifically, referring to fig. 1, 3 and 13 again, the chassis wall plate 1 is provided with an air inlet through hole 101, and the air inlet through hole 101 corresponds to the air inlet 501 of the external cooling fan 5 in position; the case wall plate 1 is provided with an air guide strip 8, and the air guide strip 8 is provided with a first air guide hole 801 and a second air guide hole 802; the first air guide hole 801 is communicated with the air outlet 502 of the outer cooling fan 5; the second air guide hole 802 communicates with the outer air guide groove 7.
The air inlet 501 of the outer cooling fan 5 is communicated with the outside through the air inlet through hole 101 on the chassis wall plate 1, and the air outlet 502 of the outer cooling fan 5 is communicated with the outer air guide groove 7 through the air guide strip 8. The outer cooling fan 5 sucks the air with lower temperature outside the chassis wall plate 1 through the air inlet through hole 101, and is discharged from the air outlet 502 of the outer cooling fan 5, the discharged air with lower temperature enters the inner cavity of the air guide strip 8 from the first air guide hole 801, and is guided into the outer air guide groove 7 from the second air guide hole 802, so as to dissipate heat from the outer side surface of the chassis wall plate 1 and the outer cooling fins 3.
For example, the outer cooling fan 5 may be disposed outside the chassis wall plate 1 by referring to the above-mentioned inner cooling fan 4 disposed inside the chassis wall plate 1 and the positional relationship between the inner cooling fan 4 and the inner cooling fins 3. Specifically, the outer cooling fan 5 is mounted on the outer side of the chassis wall plate 1, the air inlet 501 of the outer cooling fan 5 is communicated with the outer side of the chassis wall plate 1, and the air outlet 502 of the outer cooling fan 5 is communicated with the outer air guiding groove 7.
By referring to the above-mentioned positional relationship between the outer heat dissipation fan 5 and the outer heat dissipation fins 3 and the outer heat dissipation fan 5 disposed on the inner side of the chassis wall plate 1, the inner heat dissipation fan 4 may be disposed on the inner side of the chassis wall plate 1. Specifically, the inner cooling fan 4 is disposed inside the chassis wall plate 1, and the chassis wall plate 1 is provided with a through hole which is the same as or similar to the air inlet through hole 101 for the inner cooling fan 4, and the air inlet 401 of the inner cooling fan 4 is opposite to the through hole; an air guiding structure which is the same as or similar to the air guiding strip 8 can be arranged for the inner cooling fan 4, the air outlet 402 of the inner cooling fan 4 is communicated with the air inlet of the air guiding structure, and the air outlet of the air guiding structure is communicated with the inner air guiding groove 6.
Further, the air guiding strip 8 has a hollow structure, the first air guiding hole 801 and the second air guiding hole 802 are respectively arranged on one side wall and the other side wall of the air guiding strip 8, and the first air guiding hole 801 and the second air guiding hole 802 are both communicated with the inner cavity of the air guiding strip 8; the inner cavity of the air guide strip 8 can be directly used as an air guide channel of the air guide strip 8. The air guide strip 8 arranged in the mode is simple in structure and convenient to process.
Specifically, as shown in fig. 10, the air guiding strip 8 may be a rectangular tube structure with two ends blocked, and of course, may be other types of tube structures with two ends blocked, for example, a circular tube, a polygonal tube, etc. For example, the blocking plates are welded at both ends of the rectangular pipe, and then the first and second air guide holes 801 and 802 are cut or drilled at the sides of the rectangular pipe. As shown in fig. 11, both ends of the air guide strip 8 may be non-blocking. When the air guide strip 8 is mounted on the chassis wall plate 1, ports at two ends of the air guide strip 8 can be blocked through other structures of the high-efficiency heat dissipation device of the sealed chassis, so that air guide efficiency is guaranteed.
In the embodiment shown in fig. 3, the chassis wall plate 1 is provided with the mounting through hole 102, the air guide strip 8 is embedded in the mounting through hole 102, and the air guide strip 8 is mounted in such a manner that the mounting manner is simple, the air guide length of the air guide strip 8 is convenient to shorten, and the miniaturization of the structure of the air guide strip 8 is also convenient.
It can be appreciated that the primary function of the first air guiding holes 801 is to receive the air blown by the external cooling fan 5 into the inner cavity of the air guiding strip 8, so the number of the first air guiding holes 801 may be only one, and the first air guiding holes 801 are communicated with all the air outlets of the external cooling fan 5. Such a configuration of the first air guide hole 801 may facilitate processing. Of course, the number of the first air guiding holes 801 may be plural, that is, two or more.
In general, there are a plurality of outer wind guide grooves 7, and the main function of the second wind guide holes 802 is to guide the wind entering the inner cavity of the wind guide strip 8 into each outer wind guide groove 7. Therefore, in order to smoothly guide the wind into each of the outer wind guide grooves 7, a plurality of second wind guide holes 802 may be provided, and the second wind guide holes 802 are in one-to-one correspondence with the outer wind guide grooves 7. Of course, the number of the second air guiding holes 802 may be only one, and the one second air guiding hole 802 is communicated with the plurality of outer air guiding grooves 7.
Specifically, the first air guiding hole 801 may be rectangular, and the second air guiding hole 802 may be circular, and of course, the first air guiding hole 801 may also be other shapes, such as an arc shape, a circular shape, a semicircular shape, or the like. The second air guiding holes 802 may also have other shapes, such as rectangular, arc-shaped, or semi-circular.
Referring to fig. 10 and 11, the air guiding strip 8 is a rectangular tube, a first air guiding hole 801 of a rectangle is formed in a first side wall of the rectangular tube, a plurality of second air guiding holes 802 are formed in a second side wall of the rectangular tube, and the second air guiding holes 802 are circular holes which are arranged at intervals along the length direction of the rectangular tube.
In one implementation manner of the embodiment of the present invention, the second air guiding holes 802 are in one-to-one correspondence with the outer air guiding grooves 7, so that the air blown by the outer cooling fan 5 blows to the outer air guiding grooves 7 after passing through the second air guiding holes 802;
the total effective air guiding area of the first air guiding holes 801 is larger than that of the second air guiding holes 802, so that the air blown out by the outer cooling fan 5 is extruded after passing through the air guiding channels of the air guiding strips 8, and the air guiding effect is improved.
In a specific application, the air blown by the external cooling fan 5 is extruded after passing through the air guiding channel of the air guiding strip 8, and the air speed of the air exiting from the second air guiding hole 802 of the air guiding strip 8 is obviously improved relative to the air speed of the air entering into the first air guiding hole 801. In this way, the air flow coming out of the second air guide hole 802 flows in the outer air guide groove 7 for a longer distance, so that the contact time between the air flow and the outer radiating fins 3 and the outer side surface of the chassis wall plate 1 is increased, the heat exchange efficiency is improved, and the chassis wall plate 1 and the outer radiating fins 3 can be fully radiated.
It will be appreciated that since the outer radiator fan 5 is located inside the chassis wall plate 1, and the outer air guide groove 7 is located outside the chassis wall plate 1. Therefore, the air guiding strip 8 for guiding the air from the air outlet 502 of the outer cooling fan 5 to the outer air guiding groove 7 should have a height difference between the first air guiding hole 801 and the second air guiding hole 802 along the direction perpendicular to the chassis wall plate 1.
In one implementation manner of the embodiment of the present invention, with respect to the air outlet direction of the second air guiding hole 802, the first air guiding hole 801 to the second air guiding hole 802 have a gradient, and the gradient is shown as an angle a in fig. 8, and the gradient ranges from 15 degrees to 30 degrees. Through the slope, the air with lower temperature outside the chassis wall plate 1 can enter the outer air guide groove 7 in a large amount along the second air guide holes 802 of the air guide strip 8 under the action of the outer cooling fan 5 and the air guide strip 8, so that the cooling efficiency is improved. Referring to fig. 13, both the air inlet through hole 101 and the second air guide hole 802 are located at the bottom of the outer air guide groove 7. Under the shielding effect of the outer radiating fins 3, the possibility that dust, sand, flying cotton and the like enter the inner side of the chassis wall plate 1 from the air inlet through hole 101 and the second air guide hole 802 can be reduced.
Referring to fig. 9, the efficient heat dissipating device of the sealed chassis may further include an inner cover plate 9, where the inner cover plate 9 covers the top ends of the inner heat dissipating fins 2 to block the notch of the inner air guiding slot 6. Wherein, the top end is the direction vertical to the chassis wall plate 1, and the inner heat radiation fin 2 is far away from the edge of the chassis wall plate 1.
The inner cover plate 9, the inner heat radiation fins 2 and the inner side surface of the chassis wall plate 1 enclose the inner air guide groove 6 with two ends (two ends along the air guide direction of the inner air guide groove 6) open and the notch is closed, compared with the structure with the open notch, the former can enable the hot air blown by the inner heat radiation fan 4 to always flow along the length direction of the inner air guide groove 6, and the hot air cannot be dispersed to the inner side of the chassis wall plate 1 in the half way by the notch of the inner air guide groove 6. Therefore, the effective contact area between the hot air flow and the inner side surfaces of the inner radiating fins 2 and the chassis wall plate 1 can be increased, and the heat exchange efficiency can be improved, so that the overall heat dissipation efficiency can be improved.
Referring to fig. 3 and 9, the efficient heat dissipating device of the sealed chassis may further include an inner casing 10, wherein the inner casing 10 is fixed to an inner side surface of the chassis wall plate 1, and covers the air guide bar 8 and the outer heat dissipating fan 5.
The inner housing 10 can seal the portions of the air guide strips 8 and the outer cooling fans 5 located inside the chassis wall plate 1 in a closed space enclosed by the inner housing 10 and the chassis wall plate 1, and isolate the air guide strips 8 and the outer cooling fans 5 from the inside of the chassis. External air is prevented from entering the inner side of the chassis wall plate 1 under the action of the external cooling fan 5, so that the air quantity blown into the external air guide groove 7 is reduced, the heat dissipation efficiency of the outer side surface of the chassis wall plate 1 and the external cooling fins 3 can be prevented from being reduced, and the power consumption of the external cooling fan 5 is further reduced. In addition, dust, smoke, vapor, etc. can be further prevented from entering the inside of the chassis wall plate 1 from the side of the outer radiator fan 5 and/or the air guide strip 8.
In one implementation of the embodiment of the present invention, the inner heat dissipation fins 2 are arranged in parallel, and the outer heat dissipation fins 3 are arranged in parallel;
the inner radiating fins 2 and the outer radiating fins 3 are arranged in a staggered manner, specifically, the inner radiating fins 2 and the outer radiating fins 3 can be arranged vertically, and of course, other angles can be staggered, so that the heat dissipation efficiency can be effectively improved.
It should be noted that, in the case of parallel arrangement between the inner heat dissipation fins 2 and parallel arrangement between the outer heat dissipation fins 3, the blowing direction of the inner heat dissipation fan 4 may be set to be the same as the length direction of the inner air guiding slot 6, and the air outlet direction of the second air guiding hole 802 of the air guiding strip 8 may be set to be the same as the length direction of the outer air guiding slot 7, so that the distance of the air flow flowing along the length directions of the inner air guiding slot 6 and the outer air guiding slot 7 may be ensured, the heat exchange contact area may be increased, and the heat dissipation efficiency may be further improved.
In one implementation of the embodiment of the present invention, the inner cover plate 9 may be mounted on the chassis wall plate 1 by matching a first screw with a first stud, one of the inner cover plate 9 and the chassis wall plate 1 is provided with the first stud, and the other is provided with a first through hole, and the first screw passes through the first through hole and is mounted in the hole of the first stud. The inner casing 10 may also be mounted on the chassis wall plate 1 by the cooperation of a second screw and a second stud, one of the inner casing 10 and the chassis wall plate 1 is provided with the second stud, and the other is provided with a second through hole, and the second screw passes through the second through hole and is mounted in the hole of the second stud.
In addition, referring to fig. 12, a process of installing the high-efficiency heat sink of the sealed chassis is shown in the order of fig. 12a to 12b to 12c to 12d in fig. 12, and in fig. 12a, the inner radiator fins 2 and the outer radiator fins 3 have been provided on the inner and outer sides of the chassis wall plate 1. On the basis of fig. 12a, the inner radiator fan 4 is further installed, thereby completing the installation of fig. 12 b. On the basis of fig. 12b, the outer cooling fan 5 is installed at a position aligned with the air inlet through hole 101, and the air guide strip 8 is embedded at a position of the installation through hole 102, so that the installation of fig. 12c is completed. On the basis of fig. 12c, the inner cover plate 9 is covered on the inner heat dissipation fins 2 and is connected with the chassis wall plate 1 through the cooperation of screws and studs, meanwhile, the inner cover 10 is also installed on the chassis wall plate 1 and covers the outer sides of the outer heat dissipation fan 5 and the air guide strip 8, so that the installation of fig. 12d is completed, namely the installation of the efficient heat dissipation device of the sealed chassis is completed.
The following describes a sealed chassis provided in the embodiments of the present invention in detail.
The sealed chassis provided by the embodiment of the invention comprises at least one high-efficiency heat dissipation device, wherein the high-efficiency heat dissipation device is any high-efficiency heat dissipation device of the sealed chassis. The sealed chassis has the same technical effect as the efficient heat dissipation device corresponding to the sealed chassis.
For example, referring to fig. 16, the sealed chassis shown in the figure is formed by enclosing a first efficient heat dissipating device 01, a second efficient heat dissipating device 02, a third chassis wall plate 03, a fourth chassis wall plate 04, a fifth chassis wall plate and a sixth chassis wall plate, where the first efficient heat dissipating device 01 and the second efficient heat dissipating device 02 are efficient heat dissipating devices of any one of the sealed chassis. The inner sides of the first chassis wall plate of the first efficient heat dissipation device 01 and the second chassis wall plate of the second efficient heat dissipation device 02 are oppositely arranged, and all the chassis wall plates are connected in a sealing mode. The sealed chassis provided in this way has the technical effects of the efficient heat sink of any one of the sealed chassis described above.
Compared with the prior art, the heat dissipation efficiency can be improved from about 60% to about 85% -95% by applying the technical scheme provided by the embodiment of the invention. The modularized design of the efficient heat dissipation device of the sealed chassis enables the efficient heat dissipation device to be applied to chassis of different products, namely the applicability of the efficient heat dissipation device of the sealed chassis can be improved. For example, when the chassis wall plate 1 of the high-efficiency heat dissipating device of the sealed chassis is used as the cover plate, the inner heat dissipating structure of the chassis wall plate 1, that is, the inner heat dissipating fins 2, the inner heat dissipating fan 4, the inner cover plate 9, the inner cover 10, and the like are not connected to other chassis wall plates constituting the chassis, so that the high-efficiency heat dissipating device of the sealed chassis is convenient to detach.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (10)
1. An efficient heat sink for a sealed enclosure, the apparatus comprising: the device comprises a case wall plate (1), inner radiating fins (2), outer radiating fins (3), an inner radiating fan (4) and an outer radiating fan (5);
the inner radiating fins (2) are fixedly arranged on the inner side surface of the chassis wall plate (1); the outer radiating fins (3) are fixedly arranged on the outer side surface of the chassis wall plate (1);
an air inlet of the inner cooling fan (4) is communicated with the inner side of the chassis wall plate (1), and an air outlet of the inner cooling fan (4) is communicated with an inner air guide groove (6) formed between the inner cooling fins (2); the air containing heat inside the chassis wall plate (1) is sucked from an air inlet (401) of the inner cooling fan (4), and then flows into an inner air guide groove (6) formed between the inner cooling fins (2) from an air outlet (402) of the inner cooling fan (4);
an air inlet of the outer cooling fan (5) is communicated with the outer side of the chassis wall plate (1), and an air outlet of the outer cooling fan (5) is communicated with an outer air guide groove (7) formed between the outer cooling fins (3); the air with low temperature outside the case wall plate (1) is sucked from the air inlet (501) of the outer cooling fan (5) and flows into the outer air guide groove (7) formed between the outer cooling fins (3) from the air outlet (502) of the outer cooling fan (5);
the efficient heat dissipation device further comprises a pressing strip (11), and the pressing strip (11) is used for pressing the outer heat dissipation fan (5) on the inner side face of the chassis wall plate (1).
2. The device according to claim 1, characterized in that the inner radiator fan (4) and the outer radiator fan (5) are mounted inside the chassis wall plate (1);
the chassis wall plate (1) is provided with an air inlet through hole (101), and the air inlet through hole (101) corresponds to the air inlet position of the outer cooling fan (5);
the case wall plate (1) is provided with an air guide strip (8), and the air guide strip (8) is provided with a first air guide hole (801) and a second air guide hole (802);
the first air guide hole (801) is communicated with an air outlet of the outer cooling fan (5);
the second air guide hole (802) is communicated with the outer air guide groove (7).
3. The device according to claim 2, wherein the air guiding strip (8) has a hollow structure, the first air guiding hole (801) and the second air guiding hole (802) are respectively formed on one side wall and the other side wall of the air guiding strip (8), and the first air guiding hole (801) and the second air guiding hole (802) are both communicated with the inner cavity of the air guiding strip (8);
the chassis wall plate (1) is provided with a mounting through hole (102), and the air guide strip (8) is embedded in the mounting through hole (102).
4. A device according to claim 3, characterized in that the second air guiding holes (802) are in one-to-one correspondence with the outer air guiding grooves (7);
the sum of the effective air guiding areas of the first air guiding holes (801) is larger than the sum of the effective air guiding areas of the second air guiding holes (802).
5. The device according to any of claims 2-4, characterized in that the first air guiding hole (801) to the second air guiding hole (802) have a slope in relation to the air outlet direction of the second air guiding hole (802), the slope being in the range of 15 degrees to 30 degrees.
6. The device according to any of claims 2-4, characterized in that the air inlet opening (101) and the second air guiding opening (802) are both located at the bottom of the outer air guiding groove (7).
7. The device according to any one of claims 1-4, further comprising an inner cover plate (9), said inner cover plate (9) being provided to cover the top ends of the inner heat fins (2) to block the notches of the inner air guiding grooves (6).
8. The device according to any one of claims 2-4, further comprising an inner casing (10), wherein the inner casing (10) is fixed to an inner side surface of the chassis wall plate (1) and covers the outside of the air guiding strip (8) and the outer cooling fan (5).
9. The device according to any one of claims 1-4, characterized in that the inner heat fins (2) are arranged in parallel and the outer heat fins (3) are arranged in parallel;
the inner radiating fins (2) and the outer radiating fins (3) are arranged in a staggered mode.
10. A sealed chassis, wherein the chassis comprises at least one high-efficiency heat sink, the high-efficiency heat sink being a high-efficiency heat sink of the sealed chassis of any one of claims 1-9.
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| CN201710586925.2A CN107357375B (en) | 2017-07-18 | 2017-07-18 | Efficient heat dissipation device of sealed chassis and sealed chassis |
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| CN201710586925.2A CN107357375B (en) | 2017-07-18 | 2017-07-18 | Efficient heat dissipation device of sealed chassis and sealed chassis |
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| CN107357375B true CN107357375B (en) | 2023-10-20 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107992174A (en) * | 2017-12-04 | 2018-05-04 | 四川省守望信息科技有限责任公司 | The method for improving main frame radiating efficiency |
| CN107864600B (en) * | 2017-12-13 | 2023-09-01 | 福建科立讯通信有限公司 | Heat abstractor and desk-top equipment for desk-top equipment |
| CN109246990B (en) * | 2018-10-11 | 2020-06-16 | 温州澳鼎建材有限公司 | Control circuit board installation box body that radiating efficiency is high |
| CN110456890A (en) * | 2019-07-03 | 2019-11-15 | 黎明职业大学 | A kind of radiator for host computer |
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| CN1691316A (en) * | 2004-04-27 | 2005-11-02 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
| CN205784670U (en) * | 2016-05-19 | 2016-12-07 | 拜默实验设备（上海）股份有限公司 | A kind of high-efficiency condensation device |
| CN106774751A (en) * | 2017-01-03 | 2017-05-31 | 北京飞讯数码科技有限公司 | A kind of outer surface heat abstractor |
| CN207249562U (en) * | 2017-07-18 | 2018-04-17 | 北京东土科技股份有限公司 | The efficient radiating apparatus and closed type cabinet of a kind of closed type cabinet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030137807A1 (en) * | 2002-01-22 | 2003-07-24 | Mitac International Corp. | Heat dissipating device |
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| CN1691316A (en) * | 2004-04-27 | 2005-11-02 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
| CN205784670U (en) * | 2016-05-19 | 2016-12-07 | 拜默实验设备（上海）股份有限公司 | A kind of high-efficiency condensation device |
| CN106774751A (en) * | 2017-01-03 | 2017-05-31 | 北京飞讯数码科技有限公司 | A kind of outer surface heat abstractor |
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