CN107316034A - A kind of fingerprint module and preparation method thereof - Google Patents
A kind of fingerprint module and preparation method thereof Download PDFInfo
- Publication number
- CN107316034A CN107316034A CN201710587190.5A CN201710587190A CN107316034A CN 107316034 A CN107316034 A CN 107316034A CN 201710587190 A CN201710587190 A CN 201710587190A CN 107316034 A CN107316034 A CN 107316034A
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- China
- Prior art keywords
- fingerprint
- color
- layer
- module
- chipset
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 137
- 239000011241 protective layer Substances 0.000 claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 claims abstract description 33
- 238000005507 spraying Methods 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000008542 thermal sensitivity Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 238000005516 engineering process Methods 0.000 abstract description 13
- 239000003973 paint Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Laminated Bodies (AREA)
Abstract
Include fingerprint chipset and protective layer the invention discloses a kind of fingerprint module; protective layer is substratum transparent or ink layer; color photopolymer layer is provided between fingerprint chipset and protective layer; plastic packaging layer of the two sides of color photopolymer layer respectively with protective layer and fingerprint chipset is mutually be bonded, and the two sides of color photopolymer layer is attached with mould release membrance before bonding.The present invention also provides a kind of preparation method of fingerprint module, and the preparation method of fingerprint module comprises the following steps：The plastic packaging layer body of fingerprint chipset body is fitted with color photopolymer layer body, the first fingerprint chip module is formed；In the color photopolymer layer body surface spraying protective layer body of the first fingerprint chip module, the second fingerprint chip module is formed；Second fingerprint chip module is cut into simple grain fingerprint module.The fingerprint module that the present invention is provided simplifies making technology, shortens fabrication cycle, reduce cost of manufacture, improve the competitiveness of product in market without the plastic packaging layer surface paint color layer in fingerprint chipset.
Description
Technical field
The present invention relates to touch screen technology, more particularly to a kind of fingerprint module and preparation method thereof.
Background technology
At present, in touch screen technology field, fingerprint recognition has high uniqueness, high stability, high accuracy, high security
The features such as, therefore, fingerprint recognition is widely used in touch screen technology field, and market potential is huge.
In the prior art, the fingerprint module of Coating schemes, when making the color layers on its surface and protective layer, typically
Using following technique：The fingerprint chipset opened greatly is first cut into one single chip according to required size, then in one single chip plastic packaging
Layer surface sprays through at least twice and toasts processing and fabricating color layers, then armor coated in color layer surface.
But, there is following defect in the fingerprint module of existing Coating schemes：
Technology difficulty is big, complex process.In addition, using simple grain processing mode, low production efficiency, fabrication cycle is long, make
Cost is high, is unfavorable for strengthening product competitiveness in the market.
The content of the invention
In order to overcome the deficiencies in the prior art, an object of the present invention is to provide a kind of fingerprint module, its without
The plastic packaging layer surface paint color layer of fingerprint chipset, simplifies making technology, shortens fabrication cycle, reduce and be fabricated to
This, improves the competitiveness of product in market.
The second object of the present invention is to provide a kind of preparation method of fingerprint module, and the preparation method reduces at least two
The process for the paint color layer that road is complicated and technology difficulty is big, simplifies technical process, reduces technology difficulty, and improve life
Produce efficiency, shorten fabrication cycle, reduce cost of manufacture, thus improve the competitiveness of product in market.
An object of the present invention adopts the following technical scheme that realization：
A kind of fingerprint module, including fingerprint chipset and protective layer, the protective layer be substratum transparent or ink layer, it is described
Be provided with color photopolymer layer between fingerprint chipset and the protective layer, the two sides of the color photopolymer layer respectively with the protection
Layer is mutually bonded with the plastic packaging layer of the fingerprint chipset, and the two sides of the color photopolymer layer is attached with mould release membrance before bonding.
Further, the color photopolymer layer is lighttight thermal adhesive.
Further, the color of the color photopolymer layer is black, white, gold or silver color.
Further, the color of the protective layer is black, golden or silver color.
The second object of the present invention adopts the following technical scheme that realization：
A kind of preparation method of fingerprint module, the preparation method of the fingerprint module comprises the following steps：
The plastic packaging layer body of fingerprint chipset body is fitted with color photopolymer layer body, the first fingerprint chip dies are formed
Group；
In the color photopolymer layer body surface spraying protective layer body of the first fingerprint chip module, the second fingerprint is formed
Chip module；
The second fingerprint chip module is cut into simple grain fingerprint module.
Further, the plastic packaging layer body by fingerprint chipset body is fitted with color photopolymer layer body, formation the
One fingerprint chip module specifically includes following steps：
The application of adhesive on the first mould release membrance, cooling, with this body surface of the color photopolymer layer of first mould release membrance
The second mould release membrance of face laminating, forms color photopolymer layer group；
First mould release membrance of the color photopolymer layer group is peeled off, the color dry film of first mould release membrance will be peeled off
Layer group fitted with the fingerprint chipset body with abutted equipment, wherein the color photopolymer layer body of the color photopolymer layer group and
The plastic packaging layer body laminating of the fingerprint chipset body, deaeration；
Second mould release membrance of the color photopolymer layer group fitted with the fingerprint chipset body is peeled off, described first is formed
Fingerprint chip module.
Further, the abutted equipment surface is provided with the cavity for fitting, the cavity to be provided with and is used to fix institute
State the first locating slot of fingerprint chipset body and the second locating slot for fixing the color photopolymer layer group；It is described to peel off
The color photopolymer layer group of first mould release membrance is fitted with the fingerprint chipset body and will peel off first mould release membrance
The color photopolymer layer group fitted with the fingerprint chipset body with abutted equipment and specifically include following steps：
The abutted equipment surface is provided with laminating cavity, and interior be provided with of the cavity is used to fix the fingerprint chipset body
The first locating slot and the second locating slot for fixing the color photopolymer layer group；By the plastic packaging of the fingerprint chipset body
Layer body is placed towards away from the described first positioning groove bottom wall, by the second mould release membrance of the color photopolymer layer group towards described second
The bottom wall of locating slot is placed, by the plastic packaging layer of the color photopolymer layer body of color photopolymer layer group and the fingerprint chipset body originally
Show consideration for and close.
Further, the area of the protective layer body is more than or equal to the area of the fingerprint chipset body.
Further, the protective layer body is substratum transparent or ink layer.
Further, it is described the second fingerprint chip module is cut into simple grain fingerprint module to be specially：By described
Two fingerprint chip modules are laser-cut into simple grain fingerprint module.
Compared with prior art, the beneficial effects of the present invention are：
The fingerprint module that above-mentioned technical proposal is provided, the two sides of color photopolymer layer respectively with the plastic packaging layer of fingerprint chipset and
Protective layer is mutually bonded, and without the plastic packaging layer surface paint color layer in fingerprint chipset, is simplified making technology, is shortened making
In the cycle, cost of manufacture is reduced, improve the competitiveness of product in market.The present invention also provides a kind of making side of fingerprint module
Method, this method fits color photopolymer layer group with the plastic packaging layer body of fingerprint chipset body, then in color photopolymer layer body
Simple grain fingerprint module is cut into after surface spraying protective layer body again, without the plastic packaging layer surface paint color in fingerprint chipset
Layer, the process for reducing the paint color layer that at least twice are complicated and technology difficulty is big, simplifies technical process, reduces technique
Difficulty, and improve production efficiency, shorten fabrication cycle, cost of manufacture is reduced, thus improve the market competition of product
Power.
Brief description of the drawings
The schematic diagram for the fingerprint module that Fig. 1 provides for the present invention；
The schematic diagram for the second fingerprint chip module that Fig. 2 provides for the present invention；
The schematic diagram for the fingerprint chipset body that Fig. 3 provides for the present invention；
The schematic diagram for the color photopolymer layer group that Fig. 4 provides for the present invention；
The fingerprint module fabrication processing figure that Fig. 5 provides for the present invention.
In figure：10th, fingerprint chipset；11st, fingerprint sensor；12nd, plastic packaging layer；20th, protective layer；30th, color photopolymer layer；
50th, fingerprint chipset body；51st, fingerprint sensor layer；52nd, plastic packaging layer body；60th, color photopolymer layer group；61st, first is release
Film；62nd, color photopolymer layer body；63rd, the second mould release membrance；70th, protective layer body.
Embodiment
Below, with reference to accompanying drawing and embodiment, the present invention is described further, it is necessary to which explanation is, not
Under the premise of afoul, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
Fig. 1, fingerprint module provided in an embodiment of the present invention, including fingerprint chipset 10 and protective layer 20 are refer to, is protected
Layer 20 is substratum transparent or ink layer, and color photopolymer layer 30, fingerprint chip are provided between fingerprint chipset 10 and protective layer 20
Group 10 includes fingerprint sensor 11 and plastic packaging layer 12, and plastic packaging layer 12 faces user, the two sides point of color photopolymer layer 30 when in use
Mutually not be bonded with protective layer 20 and plastic packaging layer 12, the two sides of color photopolymer layer 30 is attached with mould release membrance before bonding.
The fingerprint module that above-mentioned technical proposal is provided, the modeling of the two sides of color photopolymer layer 30 respectively with fingerprint chipset 10
Sealing 12 is mutually bonded with protective layer 20, without the plastic packaging 12 surface spraying color layers of layer in fingerprint chipset 10, simplifies processing procedure
Technique, shortens fabrication cycle, reduces cost of manufacture, improves the competitiveness of product in market.
Specifically, mould release membrance is high temperature resistant mould release membrance.
As preferred embodiment, color photopolymer layer 30 is lighttight thermal adhesive, has viscosity during heating
And mobility.The thickness of color photopolymer layer 30 is 12-20um, and fingerprint chipset 10 can be effectively covered in the thickness range.Face
The dielectric constant of color photopolymer layer 30 is 8-10.The color of color photopolymer layer 30 is black, white, gold or silver color, also may be used certainly
To be other colors, the invention is not restricted to this.In embodiments of the present invention, color photopolymer layer 30 is black.
As preferred embodiment, the color of protective layer 20 is black, golden or silver color or other colors.
In the present embodiment, protective layer 20 is black.The thickness of protective layer 20 is 6-12um, and hardness is 5-9H, and dielectric constant is 8-10.
It is preferred that, the thickness of protective layer 20 is 8um, and the hardness of protective layer 20 is 6H, and the dielectric constant of protective layer 20 is 9.5.
As shown in Figure 2-5, the present invention also provides a kind of preparation method of fingerprint module, and the preparation method of fingerprint module includes
Following steps：
S01：The plastic packaging layer body of fingerprint chipset body is fitted with color photopolymer layer body, the first fingerprint chip is formed
Module；
Specifically, fingerprint chipset body 50 includes fingerprint sensor layer 51 and plastic packaging layer body 52, fingerprint sensor layer
51 are made up of multiple simple grain fingerprint sensors 11 being arranged in array.The application of adhesive on the first mould release membrance 61, is cooled into
Solid state color photopolymer layer body 62, the second mould release membrance of being fitted on the surface of color photopolymer layer body 62 with the first mould release membrance 61
63, form color photopolymer layer group 60.First mould release membrance 61 of color photopolymer layer group 60 is peeled off, the first mould release membrance 61 will be peeled off
Color photopolymer layer group 60 fitted with fingerprint chipset body 50, wherein the color photopolymer layer body 62 of color photopolymer layer group 60 with
The plastic packaging layer body 52 of fingerprint chipset body 50 is fitted using abutted equipment.Abutted equipment surface is provided with the chamber for fitting
Being provided with body, cavity is used to fix the first locating slot (not shown) of fingerprint chipset body 50 and for fixing color photopolymer layer
Second locating slot (not shown) of group 60；By the plastic packaging layer body 52 of fingerprint chipset body 50 towards away from the first locating slot bottom
Wall is placed, and the bottom wall of the second mould release membrance 63 of color photopolymer layer group 60 towards the second locating slot is placed.In color photopolymer layer group
60 fitted with fingerprint chipset body 50 after carry out deaeration.Deaeration temperature is 50-60 DEG C, and deaeration pressure is 5-6kg, inclined heated plate
For 30-40min.It is preferred that, deaeration temperature is 55 DEG C, and deaeration pressure is 5.5kg, and inclined heated plate is 35min.Will be with fingerprint chip
Second mould release membrance 63 of the color photopolymer layer group 60 that group body 50 is fitted is peeled off, and forms the first fingerprint chip module.
S02：In the color photopolymer layer body surface spraying protective layer body of the first fingerprint chip module, the second fingerprint is formed
Chip module；
Specifically, be made after the first fingerprint chip module, in the surface spraying protective layer body 70 of color photopolymer layer body 62,
Into continuous tunnel furnace baking, the second fingerprint chip module is formed.The baking temperature of continuous tunnel furnace is 75-85 DEG C, and the speed of service is 4.7-
5.1Hz, baking time is 30-40min.It is preferred that, the baking temperature of continuous tunnel furnace is 80 DEG C, and the speed of service is 4.9Hz, during baking
Between be 35min.The color of protective layer body 70 is black, golden or silver color or other colors.Protect in the present embodiment
Sheath body 70 is black.The thickness of protective layer body 70 is 6-12um, and hardness is 5-9H, and dielectric constant is 8-10.It is preferred that,
The thickness of protective layer body 70 is 8um, and the hardness of protective layer body 70 is 6H, and the dielectric constant of protective layer body 70 is 9.5.Protect
The area of sheath body 70 is more than or equal to the area of fingerprint chipset body 50.Protective layer body 70 is substratum transparent or ink
Layer.
S03：Second fingerprint chip module is cut into simple grain fingerprint module.
Specifically, being simple grain fingerprint module by obtained second fingerprint chip module laser cutting.The speed of laser cutting
For 150-400mm/s, frequency is 40-60kHz, gets number of times ready for 20-40 times.It is preferred that, the speed of laser cutting is 260mm/
S, frequency is 50kHz, and it is 30 times to get number of times ready, and simple grain fingerprint module includes being followed successively by fingerprint sensor 11, plastic packaging from top to bottom
Layer 12, color photopolymer layer 30 and protective layer 20.
By the preparation method of above-described embodiment by the plastic packaging layer of color photopolymer layer group 60 and fingerprint chipset body 50 this
Body 52 is fitted, and then after the surface spraying protective layer body 70 of color photopolymer layer body 62, then cuts into simple grain fingerprint module, nothing
Need to fingerprint chipset plastic packaging layer surface paint color layer, reduce that at least twice are complicated and the big paint color of technology difficulty
The process of layer, simplifies technical process, reduces technology difficulty, and improves production efficiency, shortens fabrication cycle, reduces
Cost of manufacture, thus improve the competitiveness of product in market.
Above-mentioned embodiment is only the preferred embodiment of the present invention, it is impossible to limit the scope of protection of the invention with this,
The change and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed scope.
Claims (10)
1. a kind of fingerprint module, it is characterised in that including fingerprint chipset and protective layer, the protective layer is substratum transparent or oil
Layer of ink, is provided with color photopolymer layer, the two sides difference of the color photopolymer layer between the fingerprint chipset and the protective layer
Plastic packaging layer with the protective layer and the fingerprint chipset is mutually be bonded, and the two sides of the color photopolymer layer is adhered to before bonding
There is mould release membrance.
2. fingerprint module as claimed in claim 1, it is characterised in that the color photopolymer layer bonds for lighttight thermal sensitivity
Agent.
3. fingerprint module as claimed in claim 2, it is characterised in that the color of the color photopolymer layer is black, white, gold
Color or silver color.
4. fingerprint module as claimed in claim 1, it is characterised in that the color of the protective layer is black, golden or silver color.
5. a kind of preparation method of fingerprint module, it is characterised in that the preparation method of the fingerprint module comprises the following steps：
The plastic packaging layer body of fingerprint chipset body is fitted with color photopolymer layer body, the first fingerprint chip module is formed；
In the color photopolymer layer body surface spraying protective layer body of the first fingerprint chip module, the second fingerprint chip is formed
Module；
The second fingerprint chip module is cut into simple grain fingerprint module.
6. the preparation method of fingerprint module as claimed in claim 5, it is characterised in that the modeling by fingerprint chipset body
Sealing body is fitted with color photopolymer layer body, is formed the first fingerprint chip module and is specifically included following steps：
The application of adhesive on the first mould release membrance, cooling, in the color photopolymer layer body surface patch with first mould release membrance
The second mould release membrance is closed, color photopolymer layer group is formed；
First mould release membrance of the color photopolymer layer group is peeled off, the color photopolymer layer group of first mould release membrance will be peeled off
Fitted with the fingerprint chipset body with abutted equipment, wherein the color photopolymer layer body of the color photopolymer layer group with it is described
The plastic packaging layer body laminating of fingerprint chipset body, deaeration；
Second mould release membrance of the color photopolymer layer group fitted with the fingerprint chipset body is peeled off, first fingerprint is formed
Chip module.
7. the preparation method of fingerprint module as claimed in claim 6, it is characterised in that the abutted equipment surface, which is provided with, to be used for
Provided with the first locating slot for being used to fix the fingerprint chipset body and for fixed described in the cavity of laminating, the cavity
Second locating slot of color photopolymer layer group；The color photopolymer layer group and the fingerprint that first mould release membrance will be peeled off
The laminating of chipset body abutted equipment specifically includes following steps：
The plastic packaging layer body of the fingerprint chipset body is placed towards away from the described first positioning groove bottom wall, the color is done
The bottom wall of second mould release membrance of film layer group towards second locating slot is placed, by the color photopolymer layer body of color photopolymer layer group
Fitted with the plastic packaging layer body of the fingerprint chipset body.
8. the preparation method of fingerprint module as claimed in claim 5, it is characterised in that the area of the protective layer body is more than
Or equal to the area of the fingerprint chipset body.
9. the preparation method of fingerprint module as claimed in claim 5, it is characterised in that the protective layer body is substratum transparent
Or ink layer.
10. the preparation method of fingerprint module as claimed in claim 5, it is characterised in that described by the second fingerprint chip
Module cuts into simple grain fingerprint module：The second fingerprint chip module is laser-cut into simple grain fingerprint module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710587190.5A CN107316034A (en) | 2017-07-18 | 2017-07-18 | A kind of fingerprint module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710587190.5A CN107316034A (en) | 2017-07-18 | 2017-07-18 | A kind of fingerprint module and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107316034A true CN107316034A (en) | 2017-11-03 |
Family
ID=60177809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710587190.5A Pending CN107316034A (en) | 2017-07-18 | 2017-07-18 | A kind of fingerprint module and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107316034A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106971136A (en) * | 2016-01-14 | 2017-07-21 | 深圳市汇顶科技股份有限公司 | Biological monitor and its processing method |
| CN108427909A (en) * | 2018-01-29 | 2018-08-21 | 广东越众光电科技有限公司 | A kind of production method of patterning fingerprint module |
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| TWI575462B (en) * | 2016-03-01 | 2017-03-21 | 南茂科技股份有限公司 | Fingerprint identification packge sturcture and maufacturing method thereof |
| CN207541631U (en) * | 2017-07-18 | 2018-06-26 | 广东越众光电科技有限公司 | A kind of fingerprint module |
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| CN104156710A (en) * | 2014-08-26 | 2014-11-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device and terminal device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106971136A (en) * | 2016-01-14 | 2017-07-21 | 深圳市汇顶科技股份有限公司 | Biological monitor and its processing method |
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| CN108427909A (en) * | 2018-01-29 | 2018-08-21 | 广东越众光电科技有限公司 | A kind of production method of patterning fingerprint module |
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Address after: Room 301, Building 7, Luyi South Road, Tangxia Town, Dongguan City, Guangdong Province Applicant after: Guangdong Xingxing Electronic Technology Co.,Ltd. Address before: 523718 C15, No. A10 Industrial Luyi Road, Keyuan City, Tangxia Town, Dongguan City, Guangdong Province Applicant before: GUANGDONG YUEZHONG PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
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Application publication date: 20171103 |