CN107163904B - Hot melt adhesive consisting of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin and preparation method thereof - Google Patents
Hot melt adhesive consisting of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin and preparation method thereof Download PDFInfo
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- CN107163904B CN107163904B CN201710558874.2A CN201710558874A CN107163904B CN 107163904 B CN107163904 B CN 107163904B CN 201710558874 A CN201710558874 A CN 201710558874A CN 107163904 B CN107163904 B CN 107163904B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
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Abstract
The invention relates to a hot melt adhesive consisting of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin and a preparation method thereof. The hot melt adhesive comprises the following components in percentage by weight: 50-93 parts of high molecular weight polyamide resin with the weight of 5-30 parts, 5-30 parts of low molecular weight polyamide resin with the weight of 100-200 parts, and 2-20 parts of grafted polyolefin resin. The preparation method comprises the following steps: mixing high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin, and melting, extruding and discharging the mixture on an extruder at the temperature of 140-170 ℃ to obtain the hot melt adhesive. The high molecular weight polyamide resin is beneficial to improving the adhesive strength of the hot melt adhesive, the low molecular weight polyamide resin is beneficial to increasing the compatibility of the polyamide resin and the grafted polyolefin, and the grafted polyolefin is beneficial to improving the water resistance of the hot melt adhesive and improving the adaptability to fabrics.
Description
Technical Field
The invention belongs to the field of high-molecular polyamide hot melt adhesives, and relates to a three-component hot melt adhesive consisting of high-molecular-weight copolyamide resin, low-molecular-weight copolyamide resin and grafted polyolefin resin and a preparation method thereof.
Background
The hot melt adhesive is a single-component, anhydrous and solvent-free adhesive which is solid at normal temperature, acts on the surface of an adherend in a molten state, and rapidly solidifies to form adhesive joint when cooled; as an environment-friendly adhesive, the adhesive is widely used for bonding the lining and the fabric of the clothes for a long time in the textile manufacturing, thereby not only reducing the cost and greatly improving the working efficiency, but also ensuring that the clothes are durable, stiff and smooth. The hot melt adhesive for clothing has good washing resistance, namely good solvent resistance during dry washing and good water resistance during wet washing. A qualified hot-melt adhesive for clothes must ensure that the lining and the fabric are still tightly combined after the clothes are subjected to dry cleaning and wet cleaning for many times.
Polyamide is currently the most common hot melt adhesive for clothing. The polyamide hot melt adhesive for clothing is usually fatty thermoplastic copolyamide, which is obtained by carrying out high-temperature polycondensation reaction on fatty dibasic acid, fatty diamine, lactam or omega-amino acid. U.S. patent USP 2,252,555 discloses the preparation of polyamides and the early use as hot melt adhesives in the preparation of laminated facestocks. U.S. Pat. No. 4, 3,515,702 reports a thermoplastic polyamide based on laurolactam for heat-sealing textile materials. Due to the existence of a large amount of amide groups, amino groups and carboxyl groups in the molecular structure of the polyamide, the polyamide hot melt adhesive has good adhesive property to a plurality of textile materials and endows an adhesive layer with excellent solvent resistance. However, due to these polar groups, polyamide hot melt adhesives sometimes have the disadvantage of inadequate water resistance.
Chinese patent CN101307218A also discloses a polyamide hot melt adhesive with water washing resistance, which claims that the improvement of water resistance of the polyamide hot melt adhesive is attributed to an aliphatic diamine with tertiary carbon atoms, but the diamine is difficult to prepare, high in price, difficult to obtain and not beneficial to a large number of applications.
With the continuous development of the clothing industry, various new clothing manufacturing processes and novel fabrics are widely adopted. For example, many garment materials have been surface treated with silicones in order to improve hand and increase water repellency. These facing surfaces have lower surface energy and lower permeability resulting in low adherability properties. Similar to other high-molecular hot-melt adhesives, the existing polyamide hot-melt adhesives exhibit very limited adhesive properties to these difficult-to-bond fabrics. For another example, some garments require long post-processing, such as enzymatic washing under high temperature conditions and in aqueous acid or base, to achieve a particular appearance. Therefore, new requirements are provided for the adaptability of the hot melt adhesive for the clothes to various fabrics and the washing resistance of the hot melt adhesive for the clothes, particularly the washing resistance.
Disclosure of Invention
The purpose of the invention is as follows: in order to solve the problems of poor water resistance and poor adaptability to fabrics of the existing polyamide hot melt adhesive for clothing, the hot melt adhesive consisting of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin and the preparation method thereof are provided.
The technical scheme adopted by the invention is as follows:
a hot melt adhesive composed of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin is characterized by comprising the following components in percentage by weight: 50-93 parts of high molecular weight polyamide resin with the weight of 5-30 parts, 5-30 parts of low molecular weight polyamide resin with the weight of 100-200 parts, and 2-20 parts of grafted polyolefin resin.
As optimization, the three-component hot melt adhesive consisting of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin comprises the following components in percentage by weight: 70-93 parts of high molecular weight polyamide resin with the weight of 5-10, 5-20 parts of low molecular weight polyamide resin with the weight of 100-150 and 2-10 parts of grafted polyolefin resin.
Preferably, the grafted polyolefin resin is grafted polyethylene resin and grafted polypropylene resin.
Preferably, the grafted polyethylene resin or the grafted polypropylene resin is organosilicon graft modified polyethylene resin or polypropylene resin.
Preferably, the polyamide resin is aliphatic polyamide and is obtained by polycondensation of the following monomers: the fat-soluble organic compound comprises at least one C4-18 fatty dibasic acid, at least one C6-12 fatty diamine and optionally one or more C6-12 fatty lactams or fatty omega-amino acids.
The fatty dibasic acid with 4-18 carbon atoms comprises: succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, 1, 2-dimethyladipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, hexadecanedioic acid, octadecanedioic acid and the like.
The aliphatic diamine with 6-12 carbon atoms comprises: hexamethylenediamine, decamethylenediamine, dodecanediamine, 2, 3-dimethylbutanediamine, 2-methylpentanediamine, 2-hexylbutanediamine, 2, 4-methylhexanediamine, and the like.
The fatty lactam or fatty omega-amino acid with 6-12 carbon atoms comprises: caprolactam, caprylocactam, 11-aminoundecanoic acid, laurolactam and the like.
The preparation method comprises the following steps:
mixing 50-93 parts of high molecular weight polyamide resin, 5-30 parts of low molecular weight polyamide resin and 2-20 parts of grafted polyolefin resin, and then melting, extruding and discharging the mixture on an extruder at the temperature of 140-170 ℃ to obtain the hot melt adhesive.
The invention has the advantages that: the three-component hot melt adhesive consists of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin, has high water washing stability and adaptability to various fabrics, and is suitable for adhering clothing fabric and lining cloth. The high molecular weight polyamide resin provides good bonding strength for the hot melt adhesive, the low molecular weight polyamide resin is beneficial to increasing the compatibility of the polyamide resin and the grafted polyolefin, and the grafted polyolefin is beneficial to improving the water resistance of the hot melt adhesive and improving the adaptability to fabrics.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below so that those skilled in the art can better understand the advantages and features of the present invention, and thus the scope of the present invention will be more clearly defined. The embodiments described herein are only a few embodiments of the present invention, rather than all embodiments, and all other embodiments that can be derived by one of ordinary skill in the art without inventive faculty based on the embodiments described herein are intended to fall within the scope of the present invention.
Example 1: hot melt adhesive 1
1 part by weight of hot melt adhesive comprises:
the high molecular weight polyamide G1 is prepared from monomers consisting of adipic acid and sebacic acid as diacids, hexamethylenediamine and decamethylenediamine as diamines, and caprolactam by a high temperature, high pressure polycondensation reaction known in the polyamide resin industry. G1 has a melting point of 122 ℃ and a melting index of 8G/10min (160 ℃,2.16kg)
The low molecular weight polyamide D1 is prepared from monomers consisting of adipic acid and dodecanedioic acid as dibasic acids, hexamethylenediamine and decamethylenediamine as diamines and caprolactam through a high-temperature high-pressure polycondensation reaction known in the polyamide resin industry. D1 had a melting point of 120 ℃ and a melt index of 140g/10min (160 ℃,2.16kg)
Preparation of the hot melt adhesive 1: 8.8kg of high molecular weight polyamide resin G1, 0.7kg of low molecular weight polyamide resin D1, 0.5kg of organosilicon grafted polyethylene PE SI 3361TP and 10G of antioxidant 1098 are mixed, and then melted and extruded together on an extruder at the temperature of 140-160 ℃ to obtain the hot melt adhesive 1.
Hot-pressing the hot melt adhesive 1 and the high molecular weight polyamide resin G1 into a film with the thickness of 100 microns, then respectively clamping the obtained film between two pieces of fabric for hot melt adhesion, and carrying out peel strength and water washing resistance tests after cooling. The results show that, for the conventional non-silicon treated fabric, the hot melt adhesive 1 and the high molecular weight polyamide resin G1 have similar peel strength before washing, but after washing for 2 hours at 60 ℃, the peel strength retention of the hot melt adhesive 1 is 12% higher than that of the high molecular weight polyamide resin G1. For the silicon treated fabric, the peel strength before washing is 18% higher than that of high molecular weight polyamide resin G1 by hot melt adhesive 1. Tests show that the hot melt adhesive G1 has good water washing resistance and better adaptability to different fabrics.
Example 2: composition and preparation method of hot melt adhesive 1
1 part by weight of hot melt adhesive comprises:
high molecular weight polyamide G2 was prepared from monomers consisting of adipic and dodecanedioic acid as diacids, hexamethylenediamine as diamine, and 11-aminoundecanoic acid by high temperature, high pressure polycondensation reactions well known in the polyamide resin industry. G2 has a melting point of 110 ℃ and a melt index of 10G/10min (160 ℃,2.16kg)
Preparing a hot melt adhesive 2: 9kg of high molecular weight polyamide resin G2, 0.6kg of low molecular weight polyamide resin D1, 0.4kg of silicone grafted polypropylene PP SI 3262TP and 10G of antioxidant 1098 are mixed, and then melted and extruded together on an extruder at the temperature of 150-170 ℃ to obtain the hot melt adhesive 2.
Hot-pressing the hot melt adhesive 2 and the high molecular weight polyamide resin G2 into a film with the thickness of 100 microns, then respectively clamping the obtained film between two pieces of fabric for hot melt adhesion, and carrying out peel strength and water washing resistance tests after cooling. The results show that for the conventional non-silicon treated fabric, the hot melt adhesive 2 and the high molecular weight polyamide resin G2 have similar peel strength before washing, but after washing for 2 hours at 60 ℃, the peel strength retention of the hot melt adhesive 2 is 15% higher than that of the high molecular weight polyamide resin G1. For the silicon-treated fabric, the peel strength before washing is 15% higher than that of high molecular weight polyamide resin G2 by hot melt adhesive 2. Tests show that the hot melt adhesive G2 has good water washing resistance and better adaptability to different fabrics.
Example 3: hot melt adhesive 3
The hot melt adhesive comprises the following components in parts by weight:
the high molecular weight polyamide G3 is prepared from monomers consisting of adipic acid as a diacid and hexamethylenediamine diamine, caprolactam and 11-aminoundecanoic acid by high temperature, high pressure polycondensation known in the polyamide resin industry. G3 has a melting point of 115 ℃ and a melt index of 13G/10min (160 ℃,2.16kg)
The low molecular weight polyamide D2 adipic acid and dodecanedioic acid are dibasic acids, and monomers consisting of pentanediamine and dodecanediamine, and caprolactam are prepared by high temperature and high pressure polycondensation reactions known in the polyamide resin industry. D2 had a melting point of 125 ℃ and a melt index of 100g/10min (160 ℃,2.16kg)
Preparing a hot melt adhesive 3: 8.2kg of high molecular weight polyamide resin G1, 1kg of low molecular weight polyamide resin D1, 0.8kg of organosilicon grafted polyethylene PE SI 3361TP and 10G of antioxidant 1098 are mixed, and then melted and extruded together on an extruder at the temperature of 140-160 ℃ to obtain the hot melt adhesive 1.
Hot-pressing the hot melt adhesive 3 and the high molecular weight polyamide resin G3 into a film with the thickness of 100 microns, then respectively clamping the obtained film between two pieces of fabric for hot melt adhesion, and carrying out peel strength and water washing resistance tests after cooling. The results show that, for the conventional non-silicon treated fabric, the hot melt adhesive 3 and the high molecular weight polyamide resin G3 have similar peel strength before washing, but after washing for 2 hours at 60 ℃, the peel strength retention of the hot melt adhesive 3 is 14% higher than that of the high molecular weight polyamide resin G3. For the silicon-treated fabric, the peel strength before washing is 20% higher than that of high molecular weight polyamide resin G3 by hot melt adhesive 3. Tests show that the hot melt adhesive G3 has good water washing resistance and better adaptability to different fabrics.
Claims (4)
1. The three-component hot melt adhesive is characterized in that the hot melt adhesive is prepared by mixing raw materials and then melting and extruding the mixed raw materials at 140-170 ℃, wherein the raw materials comprise, by weight:
50 to 93 parts of a high molecular weight polyamide resin having a melt index of 5 to 30g/10min,
5 to 30 parts of a low molecular weight polyamide resin having a melt index of 100 to 200g/10min,
2-20 parts of grafted polyolefin resin; wherein:
the polyamide resin is aliphatic polyamide resin and is obtained by polycondensation of the following monomers: at least one fatty dibasic acid with 4-18 carbon atoms, at least one fatty diamine with 6-12 carbon atoms, and optionally one or more fatty lactams or fatty omega-amino acids with 6-12 carbon atoms;
the fatty dibasic acid comprises: succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, 1, 2-dimethyladipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, hexadecanedioic acid and octadecanedioic acid;
the aliphatic diamine comprises: hexamethylenediamine, decamethylenediamine, dodecanediamine, 2, 3-dimethylbutanediamine, 2-methylpentanediamine, 2-hexanediamine and 2,2, 4-methylhexanediamine;
the fatty lactam or fatty omega-amino acid comprises: caprolactam, caprylolactam, 11-aminoundecanoic acid, and laurolactam.
2. The three-component hot melt adhesive according to claim 1, wherein the raw materials comprise, by weight: 70-93 parts of high molecular weight polyamide resin with the melt index of 5-10 g/10min, 5-20 parts of low molecular weight polyamide resin with the melt index of 100-150 g/10min and 2-10 parts of grafted polyolefin resin.
3. The three-component hot melt adhesive according to claim 1 or 2, wherein the grafted polyolefin resin is a mixture of a grafted polyethylene resin and a grafted polypropylene resin.
4. The three-component hot melt adhesive according to claim 3,
the grafted polyethylene resin is organosilicon grafted modified polyethylene resin,
the grafted polypropylene resin is organosilicon grafted modified polypropylene resin.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710558874.2A CN107163904B (en) | 2017-07-11 | 2017-07-11 | Hot melt adhesive consisting of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin and preparation method thereof |
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| CN201710558874.2A CN107163904B (en) | 2017-07-11 | 2017-07-11 | Hot melt adhesive consisting of high molecular weight polyamide resin, low molecular weight polyamide resin and grafted polyolefin resin and preparation method thereof |
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| CN107163904A CN107163904A (en) | 2017-09-15 |
| CN107163904B true CN107163904B (en) | 2020-08-04 |
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| CN114656917A (en) * | 2020-12-23 | 2022-06-24 | 上海天洋热熔粘接材料股份有限公司 | Phenol yellowing resistant copolyamide hot melt adhesive and preparation method thereof |
| CN113088241A (en) * | 2021-05-08 | 2021-07-09 | 郑州中原思蓝德高科股份有限公司 | Hot melt adhesive and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101818043A (en) * | 2010-02-08 | 2010-09-01 | 启东市鑫鑫粘合剂有限公司 | Grafted polyolefin resin modified polyamine hotmelt adhesive and preparation method thereof |
| CN103059558A (en) * | 2012-12-28 | 2013-04-24 | 苏州度辰新材料有限公司 | A modified polyamide resin composition and backplane substrate film prepared by the same |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101818043A (en) * | 2010-02-08 | 2010-09-01 | 启东市鑫鑫粘合剂有限公司 | Grafted polyolefin resin modified polyamine hotmelt adhesive and preparation method thereof |
| CN103059558A (en) * | 2012-12-28 | 2013-04-24 | 苏州度辰新材料有限公司 | A modified polyamide resin composition and backplane substrate film prepared by the same |
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