CN107148143B - Printed circuit board and print circuit plates making method - Google Patents
Printed circuit board and print circuit plates making method Download PDFInfo
- Publication number
- CN107148143B CN107148143B CN201710538939.7A CN201710538939A CN107148143B CN 107148143 B CN107148143 B CN 107148143B CN 201710538939 A CN201710538939 A CN 201710538939A CN 107148143 B CN107148143 B CN 107148143B
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- pad
- circuit board
- printed circuit
- resistor
- conductive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Security & Cryptography (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to electronic circuit fields, and in particular to a kind of printed circuit board and print circuit plates making method, printed circuit board include dielectric layer, coating, the first pad, the second pad and anti-copying route.Anti-copying route includes first resistor, and first pad and second pad are electrically connected by the anti-copying route.When imitated personnel pass through detection instrument, such as when on-off relationship between the first pad of multimeter detection and the second pad, can because anti-copying route in first resistor resistance value be greater than multimeter detected value and the on-off relationship between the first pad of false judgment and the second pad, thus the impossible circuit for copying entire printed circuit board.So as to the right of protecting circuit designed person, the fruit of labour that imitated personnel plagiarize circuit designers can be effectively prevented.
Description
Technical field
The present invention relates to electronic circuit fields, in particular to a kind of printed circuit board and print circuit plates making side
Method.
Background technique
Printed circuit board (Printed Circuit Board, PCB) is support electronic component and electronic component electricity
The carrier of gas connection.The schematic diagram of Electronic Design is the realization principle of entire hardware design and the embodiment of concrete scheme, is hardware
The committed step of design, embodies the model of component in entire circuit, and the important information of value and connection relationship etc. is electricity
The vital strategic secrets of sub- Chevron Research Company (CRC).Very big loss can be caused to company if leakage.And the design philosophy of schematic diagram, finally need
It is converted into the device and its connection relationship of actual welding on PCB, to form the product with specific function.
In general, design and be achieved in that unidirectional and positive, i.e., Electronics Engineer first passes through drawing principle figure body
Its existing design philosophy, then by drawing, processing PCB, welding device realizes its design philosophy.
But with the development of the entire industry of Electronic Design, practitioner is rapidly increasing, while the threshold designed exists
It gradually decreases.Then, the method for so-called " reverse design " or " counter to draw " schematic diagram occur: i.e. in certain electronic product
Top-Down Design is completed, and after launch, is disassembled its product, by the mark on the devices such as chip, is measured by instrument
The value of capacitance-resistance inductor component obtains the used device information of the product, by the on-off function of multimeter, measures each device one by one
Connection relationship between each pin, so that the connection relationship of acquisition device, reversely draws out schematic diagram.
The way of above-mentioned this " counter to draw " schematic diagram is the very big infringement to former designer's intellectual property, for entire industry
Development, be a kind of serious damage.But since the way is hidden, for simple circuit, can carry out rapidly " reversely setting
Meter ".And " reverse design " makes reverse design person have kind of the psychology of " decryption ", therefore after launch products, is difficult to wipe out.
Therefore, urgent need, which designs one kind, can prevent the pcb board of " reverse design ".
Summary of the invention
In view of this, the embodiment of the present invention is designed to provide a kind of printed circuit board and print circuit plates making side
Method prevents imitated personnel from carrying out " reverse design " to improve above-mentioned problem, makes imitated personnel can not be to molding printed circuit
Plate is replicated.
To achieve the goals above, The technical solution adopted by the invention is as follows:
In a first aspect, printed circuit board includes dielectric layer, coating, first the present invention provides a kind of printed circuit board
Pad, the second pad and anti-copying route.First pad and the second pad are set on coating, and anti-copying route is set to Jie
Matter layer, the first pad are electrically connected by anti-copying route and the second pad, coating blanket dielectric layer.Wherein, anti-copying line
The electrology characteristic on road meets preset standard, for preventing detection instrument from detecting the on-off shape between the first pad and the second pad
State.
With reference to first aspect, the resistance value of anti-copying route is greater than for measuring on-off between the first pad and the second pad
The detected value of the detection instrument of state, so that it is breaking shape that detection instrument, which measures the first pad and the on off operating mode of the second pad,
State.Anti-copying route includes first resistor and conductive layer, and conductive layer is set to dielectric layer, and conductive layer offers mounting hole, and first
Resistance is set in mounting hole.Conductive layer is divided into mutual independent first part and second part by first resistor, and first
Divide and the first pad is electrically connected, second part and the second pad are electrically connected, and first part and second part are electric by first
Resistance connection.In the present invention, the resistance value of first resistor is greater than 80 ohm.
With reference to first aspect, first part is electrically connected by the first via hole and the first pad, and second part passes through second
Via hole is electrically connected.First via hole is set to the lower section of the first pad, and father's via hole is set to the lower section of the second pad, the first via hole
Metal layer is provided with the inner wall of the second via hole.
With reference to first aspect, conductive layer is the copper sheet layer of printing.
With reference to first aspect, the mode of first resistor is set for plating resistance material.
Second aspect, the present invention provides a kind of print circuit plates making method, print circuit plates making method is used for root
Printed circuit board is made according to circuit diagram to be printed.Print circuit plates making method includes according to circuit diagram to be printed in circuit
First node and second node are chosen in figure.Wherein first node corresponds to the first pad on printed circuit board, second node
Corresponding to the second pad on printed circuit board.Then it is formed on the dielectric layer of printed circuit board for preventing detection instrument to examine
Measure the anti-copying route of the on off operating mode between the first pad and the second pad so that the first pad by anti-copying route with
Second pad connection, to make imitated personnel that can not judge that the on-off between the first pad and the second pad is closed by detection instrument
System is effectively prevented imitated personnel and replicates molding printed circuit board.
In conjunction with second aspect, in the first implementation of second aspect of the present invention, first node and second is being chosen
When node, need to meet: first node and second node are electrically connected, and the electric current between first node and second node is less than default
Value.
In conjunction with second aspect, in the first implementation of second aspect of the present invention, setting anti-copying route is included in
Dielectric layer painting is set to conductive layer, then etches the installation region for installing first resistor on the electrically conductive；Then in conductive layer
Coat photoresists；The photoresists for covering installation region are removed after exposing the photoresists of coating, are formed for installing first resistor
Mounting hole.Then resistance material is coated with to form first resistor in mounting hole, remaining photoresists is removed after the completion of being coated with.
In conjunction with second aspect, in the first implementation of second aspect of the present invention, when being coated with resistance material, according to
The width of the resistance value of first resistor and the resistivity of resistance material, conductive layer determines the length and width dimensions and thickness of first resistor, root
The time for being coated with resistance material is determined according to thickness.The mode for being coated with resistance material can be plating.
Compared with the prior art, the invention has the following advantages:
A kind of printed circuit board provided by the invention and print circuit plates making method, printed circuit board include dielectric layer,
Coating, the first pad, the second pad and anti-copying route.First pad and the second pad are set to the surface of coating, prevent
Duplication route is set to the surface of dielectric layer, and the first pad and the second pad are electrically connected by the anti-copying route.It is anti-
The electrology characteristic parameter of duplication route meets preset standard, to Interference Detection tool detect the first pad and the second pad it
Between on off operating mode.When imitated personnel pass through leading between detection instrument, such as the first pad of multimeter detection and the second pad
When disconnected relationship, can because the electrology characteristic parameter error of anti-copying route judge on-off between the first pad and the second pad
Relationship, to be unable to complete the circuit for copying entire printed circuit board.So as to the right of protecting circuit designed person, so as to
Enough it is effectively prevented the fruit of labour that imitated personnel plagiarize circuit designers.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.Therefore, below to the reality of the invention provided in the accompanying drawings
The detailed description for applying example is not intended to limit the range of claimed invention, but is merely representative of selected implementation of the invention
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall within the protection scope of the present invention.
Fig. 1 shows a kind of the first multi-angled view of printed circuit board provided by the present invention.
Fig. 2 shows the schematic cross-sections of printed circuit board.
Fig. 3 shows the flow chart of print circuit plates making method.
Fig. 4 shows the schematic diagram for making printed circuit board.
Fig. 5 shows the sub-step figure of step S20 in Fig. 3.
Fig. 6 shows the dielectric layer schematic diagram after setting conductive layer.
Fig. 7 shows the dielectric layer schematic diagram after setting photoresists.
Fig. 8 shows the dielectric layer schematic diagram provided with anti-copying route.
Fig. 9 shows molding printed circuit board schematic cross-section.
Icon: 100- printed circuit board；101- pad；The first pad of 102-；The second pad of 103-；111- coating；
The first via hole of 112-；The second via hole of 113-；120- dielectric layer；121- photoresists；130- anti-copying route；131- first part；
132- second part；133- first resistor；The installation region 134-；135- mounting hole；136- conductive layer；200- schematic diagram；U1-
One chip；The second chip of U2-；
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that the orientation or position of the instructions such as term " on ", "lower", "inner", "outside"
Set relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when the orientation or position usually put
Relationship is set, is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In the description of the present invention, it is also necessary to explanation, herein, such as first and second or the like relationship art
Language is only used to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying this
There are any actual relationship or orders between a little entities or operation.The terms "include", "comprise" or its it is any its
He is intended to non-exclusive inclusion by variant, so that the process, method, article or equipment including a series of elements is not
Only include those elements, but also including other elements that are not explicitly listed, or further include for this process, method,
Article or the intrinsic element of equipment.In the absence of more restrictions, being wanted by what sentence "including a ..." limited
Element, it is not excluded that there is also other identical elements in the process, method, article or apparatus that includes the element.For
For those skilled in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
With reference to the accompanying drawing, it elaborates to some embodiments of the present invention.In the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
First embodiment
Fig. 1 and Fig. 2 are please referred to, the first embodiment of the present invention provides a kind of printed circuit board 100, the printed circuit
Plate 100 includes dielectric layer 120 and coating 111, and the coating 111 is covered in the dielectric layer 120.
Referring to Fig. 1, the coating 111 is provided with multiple pads 101, specifically, the pad 101 includes the first weldering
Disk 102 and the second pad 103.First pad 102 and second pad 103 be used to welding circuit element pin or
Terminal, the coating 111 are additionally provided with multiple via holes (figure is not marked), and the inner wall of the via hole is provided with conductive metal layer,
Each pad 101 is (such as conductive by remaining element for being set to the via hole of 101 lower section of the pad with being set to dielectric layer 120
136) layer is electrically connected.
The surface of the dielectric layer 120 is provided with anti-copying route 130, first pad 102 and second pad
103 are electrically connected by the anti-copying route 130, when first pad 102 and second pad 103 are welded with circuit
When the pin of element, the pin is electrically connected by the anti-copying route 130.
In the embodiment of the present invention, the electrology characteristic of the anti-copying route 130 meets preset standard, is used for Interference Detection
Tool detects the on off operating mode between the first pad 102 and the second pad 103, so as to prevent detection instrument from detecting
Connection relationship between first pad 102 and the second pad 103, that is to say prevents from detecting the electricity that the first pad 102 is connected
The connection relationship between circuit element that circuit component and the second pad 103 are connected.Wherein, detection instrument detects the first pad
102 and the second electrology characteristic between pad 103, the first pad 102 and the second pad are judged according to electrology characteristic detected
On off operating mode between 103.
The electrology characteristic includes resistance value, current value or the voltage value between the first pad 102 and the second pad 103, excellent
Selection of land, in the embodiment of the present invention, the electrology characteristic between the first pad 102 and the second pad 103 is resistance value.The pre- bidding
Standard refers to that the resistance value between the first pad 102 and the second pad 103 is greater than preset value, and the preset value is according to detection instrument
Difference and it is different.In this present embodiment, for imitated personnel, on printed circuit board 100 to be judged two pads 101 it
Between on-off relationship, the on-off shelves of multimeter can be used to detect the resistance value of route to judge circuit on-off, on-off shelves be for
Whether measuring the conducting of route (short circuit).Buzzer and LED light can generally be cooperated, buzzer issues sound or LED light is bright, indicates
Route is conducting.Generally define be 80 ohm and the following are conductings, otherwise to be not turned on.That is, by multimeter
Red-black two test pencils connect a route two sides, if the resistance value of this route is lower than 80 ohm, multimeter issues sound, and
Think that this route is conducting.By the above multimeter on-off testing principle it is found that multimeter is the resistance by detecting route
Value judges circuit on-off, if the resistance value at route both ends is greater than preset value (this example is 80 ohm), multimeter thinks this
Service interruption, for open circuit.One end in the red-black both ends of the on-off shelves of multimeter is connected to first pad 101, the other end
It is connected to second pad 101, multimeter can test out the on-off relationship between two pads 101.
Referring to Fig. 2, the anti-copying route 130 includes conductive layer 136 and first resistor 133.The conductive layer 136 is set
It is placed in the dielectric layer 120.In the present embodiment, the conductive layer 136 can be one layer of copper sheet for being printed in dielectric layer 120
Layer, but not limited to this, it can also be remaining metal with good conductivity, the mode of printing can be plating.The conductive layer
136 offer mounting hole 135.The mounting hole 135 is for being arranged first resistor 133.
In this present embodiment, the conductive layer 136 is divided into mutually independent first part 131 by the mounting hole 135
With second part 132, first resistor 133 is provided in the mounting hole 135.First part 131 and second part 132 be not direct
It is connected, but is connected by first resistor 133.
It is of the invention in the remaining embodiments, conductive layer 136 can also be divided into first part by the mounting hole 135
131 and second part 132, first part 131 connected with 132 part of second part, mounting hole 135 need not completely cut off conductive layer
136.Mounting hole 135 only needs the resistance value between the first pad 102 and the second pad 103 to be greater than for first resistor 133 to be arranged
Preset value.
The first part 131 is electric by the first via hole 112 and the first pad 102 for being set to 102 lower section of the first pad
Property connection, the second part 132 is by being set to 103 electrical property of the second via hole 113 and the second pad of the lower section of the second pad 103
Connection.The first part 131 and the second part 132 are electrically connected by the first resistor 133.
In the present embodiment, the first resistor 133 can be set to the installation by way of resistance material is electroplated
Hole 135.The resistance value of the first resistor 133 is greater than 80 ohm, and in the present embodiment, the resistance value of the first resistor 133 can be with
It is set as 82 ohm.It, can be according to formula according to the width of the conductive layer 136, and the resistivity of used resistance material:
Acquire the thickness of plating resistance material.Wherein, R is the resistance value of first resistor 133, and L is the length of first resistor 133
Degree, for ρ by first resistor 133 using the resistivity of resistance material, S is the cross-sectional area of first resistor 133.In the present embodiment
In, the width of the first resistor 133 is of same size with the conductive layer 136, therefore can determine cross section according to formula
Product S, so that it is determined that being coated with the thickness of resistance material, the rate of the thickness and plating that are coated with resistance material as needed can be true
Surely the time of resistance material is electroplated.
In the present embodiment, the dielectric layer 120 and the coating 111 are made of insulating material, when the covering
When layer 111 is covered in the dielectric layer 120, anti-copying route 130 is blanked, and the coating 111 only has pad 101 and is emerging in
Outside, imitated personnel can not intuitively obtain the internal structure of printed circuit board 100, when the on-off shelves measurement first using multimeter
It is anti-due to being provided between the first pad 102 and the second pad 103 when on-off relationship between pad 102 and the second pad 103
Route 130 is replicated, and the anti-copying route 130 includes the first resistor 133 that resistance value is greater than preset value, in the present embodiment
In, the resistance value of first resistor 133 is 82 ohm.Therefore multimeter will judge that between the first pad 102 and the second pad 103 be disconnected
Road has achieved the purpose that anti-copying to mistakenly judge the on-off relationship between the first pad 102 and the second pad 103,
Protect the right of circuit designers.
Second embodiment
Second embodiment of the invention discloses a kind of print circuit plates making method.Print circuit plates making method be used for according to
Printed circuit board 100 described in first embodiment are manufactured according to the circuit diagram to be printed being pre-designed.Please refer to Fig. 3:
The print circuit plates making method the following steps are included:
Step S10: first node and second node are chosen in circuit diagram according to circuit diagram to be printed.Wherein, described
First node corresponds to the first pad 102 of the printed circuit board 100, and the second node corresponds to the printed circuit board
100 the second pad 103.
The selection of first node and second node need to meet the following conditions: in circuit diagram, the first node and second
Node is directly electrically connected, such as is directly connected to by conducting wire；Electric current between first node and second node is less than preset value,
Such as 0.01 milliampere (this preset value should be according to the parameter setting of circuit diagram and detection instrument to be printed), according to be printed
Each component of circuit diagram electrical parameter and each component connection relationship, can determine the electricity between each component
The information such as stream, voltage.It chooses and anti-copying route 130 is set between wherein lesser two nodes of electric current, thus anti-when being provided with
After replicating route 130, the first resistor 133 of anti-copying route 130 will not influence the quality of electric signal, and will not generate biggish
Power consumption.Referring to Fig. 4, can be with RST signal, the piece choosing letter in selection principle Figure 200 between the first chip U1 and the second chip U2
Number (CS), enable signal (EN), for example, the end RST of the first chip U1 is first node, then corresponding second chip U2
The end RST is second node.
Step S20: forming anti-copying route 130 on the dielectric layer 120 of printed circuit board 100, so that first weldering
Disk 102 is connect by the anti-copying route 130 with second pad 103.
Wherein, the electrology characteristic parameter of the anti-copying route 130 meets preset standard, for preventing detection instrument from detecting
On off operating mode between first pad 102 and second pad 103 out.
By anti-copying route 130 by being coated with or the modes such as electronic printing are arranged on the surface of dielectric layer 120, anti-copying
Route 130 includes conductive layer 136 and first resistor 133.Conductive layer 136 is separated into 131 He of first part by first resistor 133
Second part 132.First part 131 and the first pad 102 are electrically connected, and second part 132 and the second pad 103 electrically connect
It connects.First part 131 and second part 132 are connected by first resistor 133.
The electrology characteristic of the anti-copying route 130 meets preset standard, so as to make detection instrument work make mistake
Judgement, when the resistance value of anti-copying route 130 is greater than preset value, the detection instrument made mistakenly judge the first pad 102 with
On-off relationship between second pad 103 is open circuit, so as to prevent detection instrument from detecting the company between different pads 101
Relationship is connect, such as in the present embodiment, when imitated personnel are measured using multimeter, if between two measured pads 101
Resistance value be greater than 80 ohm of preset value, then multimeter judge between two measured pads 101 is open circuit.
Step S20 includes sub-step S201-S207, please refers to Fig. 5:
Step S201: conductive layer 136 is coated in the dielectric layer.
Wherein, the conductive layer 136 can be one layer of copper sheet layer for applying and being located at 120 surface of dielectric layer, be also possible to be coated with
Remaining conductive metal layer in the surface of dielectric layer 120.The mode being coated with can be plating, but not limited to this.
Step S202: the installation region 134 for installing first resistor 133 is etched in the conductive layer 136.
Etching is the technology for removing material by chemical reaction or physical shock effect.It in this present embodiment, can be with
By photochemical etching, so that conductive layer 136 is contacted chemical solution in etching, have the function that dissolved corrosion, formed recess or
The molding effect of hollow out.
Referring to Fig. 6, conductive layer 136 is divided into mutual independent first part 131 and second by the installation region 134
Part 132.First part 131 and second part 132 are not directly connected.
Step S203: photoresists 121 are coated in the conductive layer 136.
The photoresists 121 cover the first part 131, second part 132 and the installation region 134.It is photosensitive
Glue 121 is also known as emulsion, is the photosensitive material being commonly used.Conductive layer can be coated on after mixing evenly by being dissolved in water
136 to cover conductive layer 136.
Step S204: the photoresists 121 of coating are exposed.
Processing is exposed to the photoresists 121 of coating, the photoresists 121 of coating are exposed under ultraviolet light, ultraviolet light
Irradiated 121 part of photoresists can lose water solubility, so that it is detached from photoresists 121 and moisture, solidification, it is photosensitive after solidification
Glue 121 is convenient for being removed, and re-expose can also be carried out in some processes, and the time of re-expose is identical as the main exposure time,
The resistance to print of printed circuit board 100 can be improved.
Step S205: removal is covered in the photoresists 121 of installation region 134, to form the installation of installation first resistor 133
Hole 135.
Removal is covered in the photoresists 121 of installation region 134, retains the photoresists 121 in remaining region, to form mounting hole
135.After mounting hole 135 forms, as shown in Figure 7.
Step S206: resistance material is coated with to form first resistor 133 in the mounting hole 135.
The mode for being coated with resistance material can be plating.According to the resistance value of first resistor 133 and the resistance of resistance material
Rate, conductive layer 136 width can determine the length and width dimensions and thickness of first resistor 133.It is determined and is electroplated according to the thickness
The time of resistance material.In the present embodiment, the resistance value of the first resistor 133 is greater than 80 ohm, can be set to 82 ohm.
Step S207: removal is covered in the installation region 134 of conductive layer 136 with the photoresists 121 of exterior domain.
Removal covers the photoresists 121 in remaining region, appears conductive layer 136.Remaining photoresists 121 are covered in conduction
Layer 136 will lead to fever, be easily damaged printed circuit board 100.
Referring to Fig. 9, molding figure is as shown in Figure 8 after removal photoresists 121.
By above-mentioned steps, printed circuit board 100 is processed into using patch.Pass through traditional technique processing and fabricating, example
Such as covering, patch, welding, the printed circuit board 100 after processing is as shown in figure 9, procedure of processing is traditional handicraft, existing skill
Art is no longer described in detail herein.
In conclusion a kind of printed circuit board provided by the invention and print circuit plates making method, printed circuit board packet
Include dielectric layer, coating, the first pad, the second pad and anti-copying route.The anti-copying route includes first resistor, described
First pad and second pad are electrically connected by the anti-copying route.When imitated personnel are by detection instrument, such as
When on-off relationship between the first pad of multimeter detection and the second pad, can because the first resistor in anti-copying route resistance
Value be greater than multimeter detected value and the on-off relationship between the first pad of false judgment and the second pad, thus impossible
Copy the circuit of entire printed circuit board.It is imitated so as to be effectively prevented so as to the right of protecting circuit designed person
The fruit of labour of personnel's plagiarization circuit designers.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
The embodiment of the present invention further discloses:
A1. a kind of printed circuit board, including dielectric layer, coating, the first pad, the second pad and anti-copying route, institute
It states the first pad and the second pad is set on the coating, the anti-copying route is set to the dielectric layer, and described
One pad is electrically connected by the anti-copying route and second pad, and the coating covers the dielectric layer, wherein
The electrology characteristic parameter of the anti-copying route meets preset standard, for Interference Detection tool detect first pad with
On off operating mode between second pad.
A2. the resistance value of printed circuit board according to a1, the anti-copying route is greater than preset value, detects for making
It is off state that tool, which measures the first pad and the on off operating mode of the second pad,.
A3. the resistance value of printed circuit board according to a1, the anti-copying route is greater than 80 ohm.
A4. printed circuit board according to a1, the anti-copying route include conductive layer and first resistor, the conduction
Layer is set to the dielectric layer, and first pad and the conductive layer are electrically connected, second pad and the conductive layer
It is electrically connected, the conductive layer offers mounting hole, and the first resistor is set in the mounting hole.
A5. printed circuit board according to a4, which is characterized in that the conductive layer is divided into mutually by the mounting hole
Independent first part and second part, the first part and first pad are electrically connected by the first via hole, described
Second part and second pad are electrically connected by the second via hole, and the first part and the second part are described in
First resistor is electrically connected.
A6. printed circuit board according to a5, first via hole are set to the lower section of first pad, and described
Two via holes are set to the lower section of second pad, and the hole wall of first via hole and second via hole is provided with metal
Layer, first pad are electrically connected by metal layer on the hole wall of first via hole and the first part, and described the
The metal layer on hole wall that two pads pass through second via hole is electrically connected with the second part.
A7. printed circuit board according to a4, the conductive layer are the copper sheet layer of printing.
A8. the printed circuit board according to A7, the set-up mode of the first resistor are plating resistance material.
B9. a kind of print circuit plates making method, which comprises
First node and second node are chosen in circuit diagram according to circuit diagram to be printed, wherein the first node
Corresponding to the first pad of printed circuit board, the second node corresponds to the second pad of printed circuit board；
It is formed on the dielectric layer of printed circuit board for preventing detection instrument from detecting first pad and described the
The anti-copying route of on off operating mode between two pads, so that first pad passes through the anti-copying route and described second
Pad is electrically connected.
B10. the print circuit plates making method according to B9, it is described to be selected in circuit diagram according to circuit diagram to be printed
It takes first node and second node includes:
The first node and the second node are electrically connected, the electricity between the first node and the second node
Stream is less than preset value.
B11. the print circuit plates making method according to B9, described formed on the dielectric layer of printed circuit board prevent again
Route processed includes:
Conductive layer is coated in the dielectric layer；
It is used to install the installation region of first resistor in the Conductive Layer Etch；
Photoresists are coated in the conductive layer；
Expose the photoresists of coating；
Removal is covered in the photoresists of the installation region, to form the mounting hole of installation first resistor；
It is coated with resistance material in the mounting hole to form first resistor；
Removal is covered in the installation region of conductive layer with the photoresists of exterior domain.
B12. the print circuit plates making method according to B11, it is described be coated in the mounting hole resistance material with
Forming first resistor includes:
First electricity is determined according to the width of the resistance value of the first resistor and the resistivity of resistance material, conductive layer
The length and width dimensions and thickness of resistance determine the time for being coated with resistance material according to the thickness.
B13. print circuit plates making method according to b12, the mode for being coated with resistance material are plating.
Claims (12)
1. a kind of printed circuit board, which is characterized in that the printed circuit board includes dielectric layer, coating, the first pad, second
Pad and anti-copying route, first pad and the second pad are set on the coating, the anti-copying route setting
In the dielectric layer, first pad is electrically connected by the anti-copying route and second pad, the coating
Cover the dielectric layer, wherein the resistance value of the anti-copying route is greater than preset value, for making the first weldering of detection instrument measurement
The on off operating mode of disk and the second pad is off state.
2. printed circuit board as described in claim 1, which is characterized in that the resistance value of the anti-copying route is greater than 80 Europe
Nurse.
3. printed circuit board as described in claim 1, which is characterized in that the anti-copying route includes conductive layer and the first electricity
Resistance, the conductive layer are set to the dielectric layer, and first pad and the conductive layer are electrically connected, second pad with
The conductive layer is electrically connected, and the conductive layer offers mounting hole, and the first resistor is set in the mounting hole.
4. printed circuit board as claimed in claim 3, which is characterized in that the conductive layer is divided into mutually by the mounting hole
Independent first part and second part, the first part and first pad are electrically connected by the first via hole, described
Second part and second pad are electrically connected by the second via hole, and the first part and the second part are described in
First resistor is electrically connected.
5. printed circuit board as claimed in claim 4, which is characterized in that first via hole is set to first pad
Lower section, second via hole are set to the lower section of second pad, and the hole wall of first via hole and second via hole is equal
It is provided with metal layer, the metal layer on hole wall that first pad passes through first via hole electrically connects with the first part
It connects, the metal layer on hole wall that second pad passes through second via hole is electrically connected with the second part.
6. printed circuit board as claimed in claim 3, which is characterized in that the conductive layer is the copper sheet layer of printing.
7. printed circuit board as claimed in claim 6, which is characterized in that the set-up mode of the first resistor is plating resistance
Material.
8. a kind of print circuit plates making method, which is characterized in that the described method includes:
First node and second node are chosen in circuit diagram according to circuit diagram to be printed, wherein the first node is corresponding
In the first pad of printed circuit board, the second node corresponds to the second pad of printed circuit board；
It is formed on the dielectric layer of printed circuit board for preventing detection instrument from detecting first pad and second weldering
The anti-copying route of on off operating mode between disk, so that first pad passes through the anti-copying route and second pad
It is electrically connected, wherein the resistance value of the anti-copying route is greater than preset value.
9. print circuit plates making method as claimed in claim 8, which is characterized in that described to be existed according to circuit diagram to be printed
First node is chosen in circuit diagram and second node includes:
The first node and the second node are electrically connected, and the electric current between the first node and the second node is small
In preset value.
10. print circuit plates making method as claimed in claim 8, which is characterized in that the medium in printed circuit board
Forming anti-copying route on layer includes:
Conductive layer is coated in the dielectric layer；
It is used to install the installation region of first resistor in the Conductive Layer Etch；
Photoresists are coated in the conductive layer；
Expose the photoresists of coating；
Removal is covered in the photoresists of the installation region, to form the mounting hole of installation first resistor；
It is coated with resistance material in the mounting hole to form first resistor；
Removal is covered in the installation region of conductive layer with the photoresists of exterior domain.
11. print circuit plates making method as claimed in claim 10, which is characterized in that described to be coated in the mounting hole
Resistance material includes: to form first resistor
The first resistor is determined according to the width of the resistance value of the first resistor and the resistivity of resistance material, conductive layer
Length and width dimensions and thickness determine the time for being coated with resistance material according to the thickness.
12. print circuit plates making method as claimed in claim 11, which is characterized in that the mode for being coated with resistance material
For plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710538939.7A CN107148143B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710538939.7A CN107148143B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
Publications (2)
| Publication Number | Publication Date |
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| CN107148143A CN107148143A (en) | 2017-09-08 |
| CN107148143B true CN107148143B (en) | 2019-08-30 |
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| CN201710538939.7A Expired - Fee Related CN107148143B (en) | 2017-07-04 | 2017-07-04 | Printed circuit board and print circuit plates making method |
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| CA2578608A1 (en) * | 2006-02-15 | 2007-08-15 | Wrg Services Inc. | Central processing unit and encrypted pin pad for automated teller machines |
| GB2504478A (en) * | 2012-07-27 | 2014-02-05 | Johnson Electric Sa | Security Wrap Film for Protecting Electronic Device |
| CN103839317B (en) * | 2014-03-06 | 2016-01-27 | 淮安市金恒泰科技有限公司 | key intelligent burglar alarm |
| CN105930747A (en) * | 2015-08-20 | 2016-09-07 | 天地融科技股份有限公司 | Electronic device and protection method for electronic device |
| CN205082051U (en) * | 2015-10-26 | 2016-03-09 | 博罗康佳精密科技有限公司 | V -cut foolproof circuit board |
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