CN107127974A - The welding method of intellective IC card carrier band - Google Patents
The welding method of intellective IC card carrier band Download PDFInfo
- Publication number
- CN107127974A CN107127974A CN201610279415.6A CN201610279415A CN107127974A CN 107127974 A CN107127974 A CN 107127974A CN 201610279415 A CN201610279415 A CN 201610279415A CN 107127974 A CN107127974 A CN 107127974A
- Authority
- CN
- China
- Prior art keywords
- carrier band
- card
- groove milling
- intellective
- conductive glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/526—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by printing or by transfer from the surfaces of elements carrying the adhesive, e.g. using brushes, pads, rollers, stencils or silk screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/022—Mechanical pre-treatments, e.g. reshaping
- B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material
- B29C66/02241—Cutting, e.g. by using waterjets, or sawing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
- B29C66/435—Making large sheets by joining smaller ones or strips together
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
- B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
Abstract
The invention provides a kind of welding method of intellective IC card carrier band, comprise the following steps：S0：Printed sheet material and electronics module are laminated, the card base is formed, and then cause the Ka Jinei to be formed with the safety chip；S1：Groove milling is carried out on card base, the groove milling position matched with the carrier band of required welding is obtained, groove milling position bottom has the contact point position for connecting the safety chip；S2：The carrier band is inserted into the groove milling position using conductive glue slice or conductive glue；S3：The carrier band is heated, sweat soldering is realized calmly.
Description
Technical field
The present invention relates to the welding method of the making of intellective IC card, more particularly to intellective IC card carrier band.
Background technology
Intelligent ic cards, generally refer to be embedded with the plastic clip (being typically the size of a credit card) of microchip
Common name.Some smart cards include a microelectronic chip, and smart card needs to carry out data friendship by read write line
Mutually, it is used to turn on external contact to realize the load of communication furthermore, it is understood that on intellective IC card generally having
Band, and can be used to realize the safety chip of data processing.
In the prior art, carrier band and safety chip are separation, it is necessary to be integrated on existing circuit board, so
And, there is uneven, the problems such as turning on exception and open defect after existing intellective IC card carrier band welding.
The content of the invention
In order to solve the above technical problems, the invention provides the welding method of intellective IC card carrier band, in this hair
There is provided a kind of welding method of intellective IC card carrier band in a bright optional scheme, comprise the following steps：
S0：Printed sheet material and electronics module are laminated, the card base is formed, and then cause the card base
Inside it is formed with the safety chip；
S1：Groove milling is carried out on card base, the groove milling position matched with the carrier band of required welding, the groove milling is obtained
Position bottom has the contact point position for connecting the safety chip；
S2：The carrier band is inserted into the groove milling position using conductive glue slice or conductive glue；
S3：The carrier band is heated, sweat soldering is realized calmly.
Optionally, in the step S2, when inserting of the carrier band, specific bag are carried out using conductive glue slice
Include：
Conductive glue slice is first punched into the size of the carrier band less than required welding, by the conducting resinl after cutting
Piece is positioned over the groove milling position, is punched the carrier band, is inserted the groove milling position.
Optionally, the conductive glue slice and conductive glue include matrix material and conducting particles, the carrier band
Realized and turned on by the conducting particles between safety chip, the conducting particles is located at described matrix material
In.
Optionally, when being punched the conductive glue slice, the part being punched is less than the carrier band of required welding
1/3。
Optionally, the width of the pad of the carrier band is 2.5 millimeters.
Optionally, in the step S2, when inserting of the carrier band, specific bag are carried out using conductive glue
Include：In one layer of conductive glue of the carrier band printing, it is punched out after drying, is then filled with the groove milling position.
Optionally, in the step S2, when inserting of the carrier band, specific bag are carried out using conductive glue
Include：Conductive glue is printed in the groove milling position using bat printing or roller applications, then by after the carrier band punching
It is put into the groove milling position.
Optionally, the thickness of printed conductive glue is 0.02 to 0.05 millimeter, during drying, will be printed
The carrier band for having conductive glue is placed in 50 degree of environment and dried.
Optionally, the conductive glue slice uses forward conduction base material, and the conductive glue is forward conduction glue.
Present invention also offers a kind of welding method of intellective IC card carrier band, comprise the following steps：
S00：Printed sheet material and electronics module are laminated, the card base is formed, and then cause the card base
Inside it is formed with the safety chip；
S10：Groove milling is carried out on card base, the groove milling position matched with the carrier band of required welding is obtained；
S20：In the corresponding position perforating via holes in groove milling position, the via hole bottom has connection described
The contact point position of safety chip；
S30：The carrier band is inserted into the groove milling position, and causes the conducting resinl post to enter the via hole；；
S40：The carrier band is heated, sweat soldering is realized calmly.
Optionally, in the step S1, also include before carrying out the inserting of the carrier band using conducting resinl post：
In the contact position printing of the carrier band or one layer of solid conduction glue post of dispensing, then the carrier band is punched out,
Then the carrier band after punching is inserted into the groove milling position so that the conducting resinl post enters the via hole.
Optionally, the thickness of the conducting resinl post is 0.15 to 0.25 millimeter.
The present invention forms card base using the mode of lamination, and then safety chip is placed in the card base, at this
On the basis of the card base of sample, in order to realize safety chip and the connection of carrier band and the welding of carrier band, while energy
Uneven, conducting exception and open defect are enough broken away from, the present invention has abandoned the welding manner of scolding tin, kept away
Any of the above problem that traditional scolding tin welding manner is brought is exempted from.
Brief description of the drawings
Fig. 1 is the schematic diagram of the welding method of intellective IC card carrier band in one embodiment of the invention；
Fig. 2 is the arrangement schematic diagram of conductive glue slice in one embodiment of the invention；
Fig. 3 is the arrangement schematic diagram of conductive glue in one embodiment of the invention；
Fig. 4 is the schematic diagram of the welding method of intellective IC card carrier band in one embodiment of the invention；
1- card bases；2- groove millings position；31- conductive glues；32- conductive glue slices；4- is carried；5- workbench；6-
Scraper；7- silk-screen half tones；8- via holes.
Embodiment
Welding method below with reference to Fig. 1 to Fig. 4 intellective IC card carrier bands provided the present invention is carried out in detail
Description, its be optional embodiment of the present invention, it is believed that those skilled in the art are not changing this hair
In the range of bright spirit and content, it can be modified and polished.
Fig. 1 to Fig. 3 is refer to, the invention provides a kind of welding method of intellective IC card carrier band, including such as
Lower step：
S0：Printed sheet material and electronics module are laminated, the card base 1 is formed, and then cause the card
The safety chip (not shown) is formed with base 1；Specifically, printed sheet material and electronics module are carried out
Lamination carries out 4 groove millings of carrier band after card, punching card is made using groove milling equipment；
S1：Groove milling is carried out on card base 1, the groove milling position 2 matched with the carrier band 4 of required welding, institute is obtained
Stating 2 bottoms of groove milling position has the contact point position for connecting the safety chip；
S2：The carrier band 4 is inserted into the groove milling position 2 using conductive glue slice 32 or conductive glue 31；
In an optional embodiment of the invention, in the step S2, described carry is carried out using conductive glue slice
When inserting of band, specifically includes：
Conductive glue slice 32 is first punched into the size of the carrier band 4 less than required welding, leading after cutting
Electric film 32 is positioned over the groove milling position 2, is punched the carrier band 4, is inserted the groove milling position 2.Enter
For one step, when being punched the conductive glue slice, the part being punched is less than the 1/3 of the carrier band of required welding.
The conductive glue slice 32 and conductive glue 31 include matrix material and conducting particles, the carrier band 4 with
Realized and turned on by the conducting particles between safety chip, the conducting particles is located in described matrix material.
Furthermore, it is understood that conducting particles, which is for connection to carrier band and chip bonding pad, causes conducting, matrix material can be
Glue, for fixed carrier band and conducting particles, while carrier band and card base can also be fixed, substitutes existing use
Hot pressing film fixes the effect of carrier band and card base.
In the preferred embodiment of the invention, conductive glue slice is forward conduction, in other words unilateal conduction, specific next
Say, conducting resinl is divided into two types, one kind is unilateal conduction (forward conduction)；One kind is Anisotropically conductive (X；Y
Direction is conductive), for the present invention, it is only necessary to unilateal conduction, incorgruous meeting produce pad and pad it
Between short circuit.
Fig. 2 is refer to, can be specifically described as：Conductive glue slice 32 is punched into than carrier band using die cutting device
4 is small by 1/3, is positioned over safety chip carrier band groove milling position 2 and (notes：Chip carrier band will be completely covered in conductive glue slice
Connect pad；Conductive glue slice will select forward conduction base material), carry and insert using carrier band welding equipment punching
Carry out conducting welding.By limiting 1/3 numerical value, it can effectively prevent that glue spills into carrier band after hot pressing,
It is not easy to clean to cause product rejection.
In addition, in preferred scheme of the present invention, the width of the pad of the carrier band 4 is 2.5 millimeters.Certainly,
2.5 millimeters designated herein are relocatable value, it is thus understood that 2.5 millimeters.The width of existing carrier band pad
Degree only has 0.8 millimeter, it is necessary to which extraction wire redesign, is changed to 2.5 millimeters, can be achieved to lead
It is logical.
In another optional embodiment of the invention, in the step S2, carried out using conductive glue described
When inserting of carrier band, specifically includes：In one layer of conductive glue 31 of the carrier band printing, it is punched out after drying,
It is then filled with the groove milling position 2.
In another optional embodiment, in the step S2, carried out using conductive glue 31 described
When inserting of carrier band, the groove milling position is printed in using bat printing or roller applications by conductive glue, then will be described
The groove milling position is put into after carrier band punching.
Wherein, the thickness of printed conductive glue 31 is 0.02 to 0.05 millimeter, during drying, will be printed
The carrier band 4 for having conductive glue 31 is placed in 50 degree of environment and dried.
When conductive glue 31 is printed on carrier band 4, using scraper 6 and silk-screen half tone 7 by conductive glue
31 are printed in the carrier band 4.Specifically, carrier band is placed on workbench 5, using scraper along can revolve
The silk-screen half tone 7 turned is slided, so as to realize the printing of conductive glue 31.In addition, in alternative of the present invention,
The netting index amount and size and the size of the conducting particles of the silk-screen half tone 7 match, be chosen as 200 to
300 mesh.Fig. 3 is refer to, can be specifically described as：1) one layer is being printed just in carrier band position using printing equipment
To conductive glue (0.01~0.02mm of thickness), place 50 degree environment glue and accelerate to dry, it is complete after reuse load
Welding equipment is punched out, and inserts the progress conducting welding of carrier band safety chip groove milling position.2) using shifting
Conductive glue is printed in safety chip carrier band groove milling position by print or roller applications, reuses carrier band welding equipment punching
Cut and carry and insert progress conducting welding；
S3：The carrier band is heated, sweat soldering is realized calmly.
Fig. 4 is refer to, another alternative embodiment of the invention additionally provides a kind of welding side of intellective IC card carrier band
Method, comprises the following steps：
S00：Printed sheet material and electronics module are laminated, the card base 1 is formed, and then cause the card
The safety chip (not shown) is formed with base 1；
S10：Groove milling is carried out on card base 1, the groove milling position 2 matched with the carrier band of required welding is obtained；
S20：In 2 corresponding position perforating via holes 8 of groove milling position, the bottom of via hole 8, which has, to be connected
Connect the contact point position of the safety chip；
S30：The carrier band is inserted into the groove milling position 2, and causes the conducting resinl post to enter the via hole
8；
S40：The carrier band is heated, sweat soldering is realized calmly.
Furthermore, it is understood that in the step S1, also wrapped before carrying out the inserting of the carrier band using conducting resinl post
Include：In the contact position printing of the carrier band or one layer of solid conduction glue post of dispensing, then the carrier band is carried out
Punching, then inserts the groove milling position so that the conducting resinl post enters described by the carrier band after punching
Via hole.Wherein, the thickness of the conducting resinl post is 0.15 to 0.25 millimeter.
Specifically, in safety chip carrier band connecting terminal position, printing or one layer of solid conduction glue post of dispensing are (thick
Spend 0.15~0.25mm), and in the card base load band safety chip contact correspondence position safe core of card base load band in other words
Piece contact weld pad correspondence position, which carries out playing via hole progress, beats via hole, then by carrier band be punched out and insert into
Row conducting welding, is specifically welded using the mode of constant temperature hot pressing, its carrier band is turned on chip and is connected
Connect.
In summary, the present invention forms card base using the mode of lamination, and then safety chip is placed in into the card
In base, on the basis of such card base, in order to realize safety chip and the connection of carrier band and the weldering of carrier band
Connect, while uneven, conducting exception and open defect can be broken away from, the present invention has abandoned the weldering of scolding tin
Connect mode, it is to avoid any of the above problem that traditional scolding tin welding manner is brought.
It can be seen that, the present invention has advantages below：
Advantage 1：Solve and carry uneven after welding, conducting exception and open defect, realize intelligence
IC-card carrier band welding batch production technique.
Advantage 2：Traditional manufacturing card is instead of, yields can be controlled in less than 0.3%, using special automatic
Groove milling equipment, production capacity 9000PCS or so per hour.
Claims (12)
1. a kind of welding method of intellective IC card carrier band, it is characterised in that：Comprise the following steps：
S0：Printed sheet material and electronics module are laminated, the card base is formed, and then cause the card base
Inside it is formed with the safety chip；
S1：Groove milling is carried out on card base, the groove milling position matched with the carrier band of required welding, the groove milling is obtained
Position bottom has the contact point position for connecting the safety chip；
S2：The carrier band is inserted into the groove milling position using conductive glue slice or conductive glue；
S3：The carrier band is heated, sweat soldering is realized calmly.
2. the welding method of intellective IC card carrier band as claimed in claim 1, it is characterised in that：In the step
In S2, when inserting of the carrier band is carried out using conductive glue slice, is specifically included：
Conductive glue slice is first punched into the size of the carrier band less than required welding, by the conducting resinl after cutting
Piece is positioned over the groove milling position, is punched the carrier band, is inserted the groove milling position.
3. the welding method of intellective IC card carrier band as claimed in claim 2, it is characterised in that：The conducting resinl
Piece and conductive glue include matrix material and conducting particles, by described between the carrier band and safety chip
Conducting particles realizes conducting, and the conducting particles is located in described matrix material.
4. the welding method of intellective IC card carrier band as claimed in claim 2, it is characterised in that：Led described in punching
During electric film, the part being punched is less than the 1/3 of the carrier band of required welding.
5. the welding method that the intellective IC card as described in Claims 1-4 is one of any is carried, it is characterised in that：
The width of the pad of the carrier band is 2.5 millimeters.
6. the welding method of intellective IC card carrier band as claimed in claim 1, it is characterised in that：In the step
In S2, when inserting of the carrier band is carried out using conductive glue, is specifically included：In one layer of the carrier band printing
It is punched out after conductive glue, drying, is then filled with the groove milling position.
7. the welding method of intellective IC card carrier band as claimed in claim 1, it is characterised in that：In the step
In S2, when inserting of the carrier band is carried out using conductive glue, is specifically included：Use bat printing or roller applications
Conductive glue is printed in the groove milling position, then the groove milling position will be put into after the carrier band punching.
8. the welding method of intellective IC card carrier band as claimed in claims 6 or 7, it is characterised in that：It is printed
Conductive glue thickness be 0.02 to 0.05 millimeter, during drying, the carrier band for being printed with conductive glue is put
Dried in 50 degree of environment.
9. the welding method of intellective IC card carrier band as claimed in claim 1, it is characterised in that：The conducting resinl
Piece uses forward conduction base material, and the conductive glue is forward conduction glue.
10. a kind of welding method of intellective IC card carrier band, it is characterised in that：Comprise the following steps：
S00：Printed sheet material and electronics module are laminated, the card base is formed, and then cause the card base
Inside it is formed with the safety chip；
S10：Groove milling is carried out on card base, the groove milling position matched with the carrier band of required welding is obtained；
S20：In the corresponding position perforating via holes in groove milling position, the via hole bottom has connection described
The contact point position of safety chip；
S30：The carrier band is inserted into the groove milling position, and causes the conducting resinl post to enter the via hole；
S40：The carrier band is heated, sweat soldering is realized calmly.
11. the welding method of intellective IC card carrier band as claimed in claim 10, it is characterised in that：In the step
In rapid S1, also include before carrying out the inserting of the carrier band using conducting resinl post：In the contact position print of the carrier band
Brush or one layer of solid conduction glue post of dispensing, are then punched out to the carrier band, then by described in after punching
Carrier band inserts the groove milling position so that the conducting resinl post enters the via hole.
12. the welding method of intellective IC card carrier band as claimed in claim 9, it is characterised in that：The conducting resinl
The thickness of post is 0.15 to 0.25 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610279415.6A CN107127974A (en) | 2016-04-29 | 2016-04-29 | The welding method of intellective IC card carrier band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610279415.6A CN107127974A (en) | 2016-04-29 | 2016-04-29 | The welding method of intellective IC card carrier band |
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|---|---|
| CN107127974A true CN107127974A (en) | 2017-09-05 |
Family
ID=59720622
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| CN201610279415.6A Pending CN107127974A (en) | 2016-04-29 | 2016-04-29 | The welding method of intellective IC card carrier band |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111178481A (en) * | 2019-12-27 | 2020-05-19 | 苏州海博智能系统有限公司 | Method for manufacturing metal visual card |
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| CN111178481B (en) * | 2019-12-27 | 2023-09-05 | 苏州海博智能系统有限公司 | Manufacturing method of metal visual card |
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