CN107094224A - The manufacture method and terminal process equipment of camera module - Google Patents
The manufacture method and terminal process equipment of camera module Download PDFInfo
- Publication number
- CN107094224A CN107094224A CN201710276808.6A CN201710276808A CN107094224A CN 107094224 A CN107094224 A CN 107094224A CN 201710276808 A CN201710276808 A CN 201710276808A CN 107094224 A CN107094224 A CN 107094224A
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- China
- Prior art keywords
- association
- process chip
- chip
- flexible pcb
- camera module
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention provides a kind of manufacture method and terminal process equipment of camera module, including：There is provided camera, flexible PCB, association's process chip and connector, association's process chip and the connector are respectively positioned at the corresponding tow sides of the flexible PCB；The image sensor chip of the camera transmits original image signal to association's process chip, and the original image signal is transmitted to terminal process equipment by the connector again after being handled through association's process chip.In the present invention, image signal processing chip receives the image after processing, alleviates the pressure that image signal processing chip carries out image procossing, improves picture quality., also will not be because of the performance of the heating influence image sensor chip of association's process chip in addition, association's process chip is arranged in stiffening plate by the present invention, it is to avoid because camera module highly increases caused by association's process chip.
Description
Technical field
The present invention relates to the manufacture method and terminal of camera module technical field, more particularly to a kind of camera module
Processing equipment.
Background technology
Picture signal processing（Image Signal Process, ISP）Technology is a kind of skill of conventional camera processing
Art is the requirement according to human eye vision to being post-processed to the view data exported in imaging sensor.With camera picture
Element is improved constantly, requirement of the later stage to image-capable also more and more higher.It is single that low pixel imaging sensor carries ISP processing
Member, and high pixel image processing sensor is generally using the output of Raw forms plus platform ISP scheme.But be limited to camera module with
ISP chip transmission bandwidths, also the built-in ISP of meeting is pre-processed and is compressed to alleviate bandwidth problem high-end image sensor to image
With platform ISP pressure.
With reference to shown in Fig. 1, current high-end image sensor is generally designed using stacking-type, and stacking-type imaging sensor is
By image sensor chip 1 with being stacked for the ISP chips 2 handled so that the chip for ISP processing is not take up shooting
Other spaces in head mould group, to reduce the area of whole camera module, the camera module for forming high pixel.So
And, image sensor chip 1 is bonded with for the ISP chips 1 handled, and the height for causing whole camera module is increased
Plus, and influence the yield of camera module.In addition, the power consumption of chip 2 for ISP processing is larger, heating is serious, in shooting head mould
The picture signal of group introduces thermal noise.
The content of the invention
It is an object of the invention to provide a kind of manufacture method of camera module and terminal process equipment, solve existing
It is used for the technical problem that the chip of ISP processing causes camera module highly to increase, influences yield, producing thermal noise in technology.
In order to solve the above-mentioned technical problem, the present invention provides a kind of manufacture method of camera module, including：
Camera, flexible PCB, association's process chip and connector are provided, association's process chip distinguishes position with the connector
In the corresponding tow sides of the flexible PCB；
The image sensor chip of the camera transmits original image signal to association's process chip, the original image signal
Transmitted again by the connector to terminal process equipment after association's process chip processing.
Optionally, the camera transmits original image signal to association's process chip, and association's process chip is to original image
Signal is cached or handled so that the bandwidth that association's process chip is transmitted to terminal process equipment through connector is less than image sensing
Device is transmitted to the bandwidth of association's process chip.
Optionally, interval is more than or equal to 0.2 millimeter between association's process chip and described image sensor chip, to subtract
The image quality that small association's process chip heating is caused to image sensor chip declines.
Optionally, the camera and the transmission of the communication protocol progress picture signal of association's process chip, institute are defined
The number of pin for being used for picture signal transmission between camera and association's process chip is stated less than association's process chip and institute
State the number of pin transmitted between connector for picture signal, the complexity of reduction flexible PCB wiring.
Optionally, it is transmitted in both directions agreement to define the camera and the communication protocol of association's process chip, saves use
In the serial line interface of control image sensor chip, the complexity of reduction flexible PCB wiring.
Optionally, there is adhesive filler, the association handles core between association's process chip and the flexible PCB
Piece is used to strengthen the intensity of the flexible PCB with the adhesive filler, to support the plug of the connector.
Optionally, association's process chip and the flexible PCB are bonded using surface mounting technology, at the association
Solder bump and the flexible PCB for managing chip are electrically connected, and association's process chip and the flexible PCB it
Between inject the adhesive filler.
Optionally, a stiffening plate is also set up on the flexible PCB, association's process chip compatibility is arranged at the benefit
Strong intralamellar part, the stiffening plate is used to strengthen the intensity of the flexible PCB, to support the plug of the connector；It is described to mend
Strong plate is additionally operable to strengthen the radiating of association's process chip.
Optionally, it is compatible to be the step of association's process chip is set：There is provided at the stiffening plate with hollow-out parts, the association
Reason chip adhesive is arranged at the hollow-out parts of the stiffening plate, exposes the solder bump of association's process chip；By the stiffening plate and
It is described association process chip one is arranged on the flexible PCB, and it is described association process chip solder bump with it is described soft
Property circuit board electrical connection.
Optionally, it is compatible to be the step of association's process chip is set：Stiffening plate with hollow-out parts is provided, mended described
Strong plate is bonded on the flexible PCB；Association's process chip is arranged in the hollow-out parts, and association's processing core
Piece is electrically connected by solder bump and the flexible PCB.
Optionally, it is compatible to be the step of association's process chip is set：Stiffening plate with recess, association's processing are provided
Chip adhesive is arranged at the recess of the stiffening plate, exposes the solder bump of association's process chip；By the stiffening plate with
It is described association process chip one is arranged on the flexible PCB, and it is described association process chip solder bump with it is described soft
Property circuit board electrical connection.
Accordingly, the present invention also provides a kind of terminal process equipment, including：Mainboard and the upper described implementation method of use
The camera module of formation, wherein, the mainboard is electrically connected with the connector, and the mainboard is received by the connector
Original image signal after association's process chip processing.
Relative to prior art, the manufacture method and terminal process equipment of camera module of the present invention have following beneficial
Effect：
The camera module of the present invention includes association's process chip, and association's process chip is separately positioned on flexible PCB pair with connector
The tow sides answered, association's process chip receives the original image signal of the image sensor chip output of camera, and by original image
Signal carries out ISP processing, then the original image signal after processing is transferred into image signal processing chip by connector, so that image
Signal processing chip receives the image after processing, alleviates the pressure that image signal processing chip carries out image procossing, carries
High image quality.
In addition, association's process chip is arranged in stiffening plate by the present invention, it is to avoid due to camera caused by association's process chip
Module highly increases, also will not be because of the performance of the heating influence image sensor chip of association's process chip.
Brief description of the drawings
Fig. 1 is the structural representation of stacking-type imaging sensor in the prior art；
Fig. 2 is the structural representation of camera module in one embodiment of the invention；
Fig. 3 is the structural representation of stiffening plate in one embodiment of the invention；
Fig. 4 is stiffening plate in one embodiment of the invention with assisting process chip to be bonded in the structural representation on servicing unit；
Fig. 5 is the structural representation of flexible PCB bonding association process chip in one embodiment of the invention；
Fig. 6 is the structural representation of flexible PCB bonding reinforcement plate in another embodiment of the present invention；
Fig. 7 is the structural representation of flexible PCB bonding association process chip in another embodiment of the present invention；
Fig. 8 is the structural representation of stiffening plate bonding association process chip in further embodiment of this invention；
Fig. 9 is the structural representation of flexible PCB bonding association process chip in further embodiment of this invention；
Figure 10 is signal transmission schematic diagram in one embodiment of the invention；
Figure 11 is schematic wiring diagram in one embodiment of the invention.
Embodiment
Many details are elaborated in the following description to fully understand the present invention.But the present invention can be with
Much it is different from other manner described here to implement, those skilled in the art can be in the situation without prejudice to intension of the present invention
Under do similar popularization, therefore the present invention is not limited to the specific embodiments disclosed below.
Secondly, the present invention is described in detail using schematic diagram, when the embodiment of the present invention is described in detail, for purposes of illustration only, institute
It is example to state schematic diagram, and it should not limit the scope of protection of the invention herein.
The problem of in order to solve in background technology, the present invention provides a kind of manufacture method and end of camera module
Equipment is managed, camera module includes association's process chip, and it is corresponding that association's process chip is separately positioned on flexible PCB with connector
Tow sides, association's process chip receives the original image signal of the image sensor chip output of camera, and by original image signal
ISP processing is carried out, then the picture signal being transferred to the original image signal after processing in terminal process equipment by connector is handled
Chip, so that image signal processing chip receives the image after processing, alleviates image signal processing chip and carries out image
The pressure of processing, improves picture quality.In addition, association's process chip is arranged in stiffening plate by the present invention, it is to avoid due to association's processing
Camera module highly increases caused by chip, also will not be because of the property of the heating influence image sensor chip of association's process chip
Energy.
It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with accompanying drawing to the present invention
The manufacture method of camera module be described in detail.
With reference to shown in Fig. 2, camera module of the invention includes camera 10, flexible PCB（FPC）20th, association's processing core
Piece（ISP Bridge）40 and connector（Connectors）30.Wherein, association's process chip 40 and 30 points of the connector
Wei Yu not the corresponding tow sides of the flexible PCB 20.The camera 10 includes image sensor chip（Do not show in Fig. 2
Go out）And the plain conductor being electrically connected with image sensor chip, plain conductor electrically picks out imaging sensor, and with it is soft
Property circuit board connection.Image sensor chip transmits original image signal to association's process chip 40, the original image signal
Handled through association's process chip 40, wherein, 40 pairs of the process chip of the association original image signal carries out ISP processing, including
HDR is rendered（HDR）, phase-detection auto-focusing（PDAF）, denoising（De-noise）, AWB, data pressure
Contracting, auto-exposure control, removal bad point, hue adjustment etc..Afterwards, the original image signal after processing is passed by the connector 30 again
The image signal processing chip transported in terminal process equipment primary processor（Not shown in figure）, image signal processing chip
The picture signal received is further processed.For example in one embodiment of the invention, the image sensing of the camera 10
Device chip transmits original image signal to association's process chip 40, and the data of original image signal are larger, and association's process chip 40 is first
Processing is compressed to original image signal, association's process chip 40, which again transmits compressed data to terminal processes through connector 30, to be set
It is standby, so as to improve data transmission efficiency.Wherein, association's process chip 40 is transmitted to terminal process equipment through connector 30（Do not mark）
Bandwidth be less than image sensor chip transmit to association process chip 40 bandwidth.
With continued reference to shown in Fig. 2, association's process chip 40 and the image sensor chip of the camera 10 are wrong respectively
Bit interval is arranged at the tow sides of flexible PCB 20, i.e., association process chip 40 is not corresponding with image sensor chip sets
Put, while strengthening image sensor chip and association's process chip radiating, the heat dispersion of camera module is improved, in an embodiment
Interval between middle association's process chip 40 and image sensor chip is more than or equal to 0.2 millimeter, is sent out with reducing association's process chip 40
The image quality that heat is caused to image sensor chip declines.
In addition, the flexible material of flexible PCB 20, its mechanical strength is relatively low, heretofore described association's process chip 40 with
There is adhesive filler, adhesive filler can realize association's process chip 40 and flexible PCB between the flexible PCB 20
Bonding between 20, while assist process chip 40 and adhesive filler to strengthen the mechanical strength of the flexible PCB 20,
Plug to support the connector 30.In the present embodiment, using surface mounting technology（SMT）Will association process chip 40 with it is soft
Property circuit board 20 engaged, assist process chip solder bump and flexible PCB in metal routing electrical connection, simultaneously
Adhesive filler, such as epoxy resin are injected between association's process chip and flexible PCB.Certainly, it is not limited in the present invention
Using surface mounting technology process chip 40 will be assisted to be bonded with flexible PCB 20, the form of laser welding can also be used, this
Limitation is refused this in invention.
With continued reference to shown in Fig. 2, in order to further increase on the mechanical strength of flexible PCB, the flexible PCB 20
A stiffening plate 50 is also set up, association's compatibility of process chip 40 is arranged at the inside of the stiffening plate 50, and association's processing core
Piece 40 is electrically connected by solder bump with flexible PCB 20.The stiffening plate is used to protect association's process chip, is used in combination
In strengthening the mechanical strength of the flexible PCB, to support the plug of the connector.In addition, stiffening plate 50 has well
Heat conductivility, additionally it is possible to the heat dispersion for strengthening association's process chip 40.Wherein, compatibility sets association's process chip 40
Step is：
First, there is provided stiffening plate 50 with reference to shown in Fig. 3, the stiffening plate 50 has in hollow-out parts 51, the present embodiment, using erosion
Carve or the mode such as mechanical jet-bedding forms hollow-out parts 51 in stiffening plate 50.Wherein, the thickness of stiffening plate 50 be 80 μm ~ 200 μm, example
Such as, 80 μm, 100 μm, 150 μm, 200 μm etc., the hollow-out parts 51 cut out are 1mm2~50mm2, this is according to association's process chip
The setting that size is carried out.
Then, with reference to shown in Fig. 4, association's process chip 40 is bonded to the hollow-out parts 51 for being arranged at the stiffening plate 50
It is interior, and the solder bump 41 of association's process chip 40 is exposed, wherein, the height of association's process chip 40 is 8050 μm ~ 200 μm,
Such as 100 μm, the thickness of solder bump 41 is 50 μm ~ 1500 μm, and such as 150 μm, process chip 40 and stiffening plate are assisted by described
Bonded between 50 by adhesive filler 70.Specifically, there is provided a servicing unit 60, the table of servicing unit 60 with reference to shown in Fig. 4
Mask toughness, and can be peeled off by methods such as heat treatments.First the stiffening plate 50 is bonded on the servicing unit 60,
Association's process chip 40 is arranged in hollow-out parts 51 again, and is bonded on servicing unit 60, injects viscous in hollow-out parts 51
Property filler 70 so that the stiffening plate 50 and association's process chip 40 bonding are integrated, then peel off the servicing unit 60.
Association's process chip 40 of the present embodiment and the total height of solder bump 41 are higher than the height of stiffening plate 50, be easy to solder bump 41 with
Flexible PCB 20 is electrically connected.
In the present embodiment, the servicing unit 60 is ultraviolet tape（UV tape）, by treatment with ultraviolet light so as to peel off
The auxiliary film 60, ultraviolet light causes the viscosity reduction of ultraviolet light adhesive tape, so that ultraviolet light adhesive tape is fallen off.Certainly,
In the other embodiment of the present invention, servicing unit of the invention is not limited to as ultraviolet tape, and the servicing unit 60 may be used also
Think blue film（Blue tape）, the stiffening plate 50 and association's process chip 40 bonding are integrated afterwards mechanically
Peel off the auxiliary film 60.In the present invention, as long as can be used in bonding reinforcement plate and association's process chip, and can therefrom it peel off
Within the thought range that the present invention is protected, for example, polyimides organic polymer etc., or shelled using modes such as laser ablations
From.
Again, with reference to shown in Fig. 5, the stiffening plate 50 and association's process chip 40 one are bonded in the flexibility
Association's process chip, is connected by circuit board 20 such as by the way of SMT with flexible PCB, and the solder of association's process chip 40
Salient point 41 is electrically connected with the flexible PCB 20, is injected between association's process chip 40 and the flexible PCB 20
Adhesive filler 70, strengthens the bonding between association's process chip 40 and the flexible PCB 20.In the present embodiment, reinforcement
Plate 50 can increase the mechanical strength of flexible PCB 20, to support the plug of connector.
In another embodiment of the invention, with reference to shown in Fig. 6, the step of compatibility sets association process chip 40 may be used also
Think：There is provided has stiffening plate 50 ', and stiffening plate 50 ' has hollow-out parts 51 ', using encapsulation glue or hot pressing by the reinforcement
In the bonding of plate 50 ' and the flexible PCB 20, wherein, the thickness of stiffening plate 50 ' is 200 μm；Then, will with reference to shown in Fig. 7
Association's process chip 40 bonding is arranged in the hollow-out parts 51 ', for example, will assist process chip by the way of laser welding
It is connected with flexible PCB, and association's process chip 40 is electrically connected by solder bump 41 with the flexible PCB 20,
Also, injection adhesive filler 70 causes association's process chip 40 to be bonded with stiffening plate 50 ' in hollow-out parts 51 ', to fix association
Process chip 40.
In addition, in another embodiment of the present invention, the step of compatibility sets association process chip 40 can also be：It is first
First, there is provided stiffening plate 50 " with reference to shown in Fig. 8, the stiffening plate 50 " has in recess 52, the present embodiment, the stiffening plate 50 "
Thickness be 80 μm ~ 200 μm, for example, 80 μm.The recess is formed on the stiffening plate 50 " by the way of mechanical stamping
52.Afterwards, association's process chip 40 bonds the recess 52 for being arranged at the stiffening plate 50 " by packaging plastic 70 ', and exposes
The solder bump 41 of association's process chip 40, the thickness of the packaging plastic 70 ' is 10 μm ~ 20 μm, for example, 10 μm, the weldering
The height for expecting salient point 41 is 80 μm ~ 150 μm, for example, 80 μm.Again, with reference to shown in Fig. 9, by the stiffening plate 50 " and the association
The bonding of the one of process chip 40 is arranged at the flexible PCB 20, process chip will be assisted such as by the way of SMT and flexible
Circuit board is connected, and the solder bump 41 is electrically connected with the flexible PCB 20.Afterwards, in association's process chip 40
Adhesive filler 70 is injected between the flexible PCB 20, to strengthen association's process chip 40 and the flexible PCB
Bonding between 20.
With reference to shown in Figure 10, described image sensor chip includes pel array 11 and positioned at the pel array 11 weeks
The reading circuit module 12 enclosed, the pel array 11 is used to convert optical signals into electric signal, and forms original image signal, institute
Reading circuit module 12 is stated by the power supply signal in described image sensor chip, control signal and original image signal output.Its
In, the original image signal is transferred to institute by the reading circuit module 12 by the metal line in the flexible PCB 20
Association's process chip 40 is stated, association's 40 pairs of process chip original image signal is handled, and the original image after processing is believed
Number it is transferred to the connector 30.Also, the reading circuit module 12 passes through the metal line in the flexible PCB 20
The power supply signal and the control signal are transmitted directly to the connector 20.
In order to reduce the complexity of metal line in flexible PCB 20, the camera 10 and association's processing core are defined
The communication protocol of piece 40 carries out the transmission of picture signal so that camera 10 described in flexible PCB 20 and association's processing core
Be used for the number of pin of picture signal transmission between piece 40 is used for less than between association's process chip 40 and the connector 30
The number of pin of picture signal transmission.For example, with reference to shown in Figure 11, described image sensor chip is based on CPHY high-speed communications
The original image signal is transferred to association's process chip 40 by agreement, is set between image sensor chip and association's process chip 40
Two groups of pins are put, every group of 3 cablings set 6 cablings altogether, and its transmission rate is 3Gbps ~ 8Gbps.Process chip 40 is assisted with connecting
The transmission for carrying out picture signal between device 30 by MIPI agreements is connect, four lines are set between association's process chip 40 and connector 30
MIPI, including 4 pairs of data wires and a pair of clock lines, totally 10 cablings.Meanwhile, also needed between association's process chip 40 and connector 30
2 I2C cablings are set, for the transmission of control signal, set 12 to walk between process chip 40 and connector 30 altogether so as to assist
Line.
In addition, the camera 10 and the communication protocol of association's process chip 40 are transmitted in both directions agreement, saving is used for
The serial line interface of image sensor chip, and up-high speed are controlled, descending low speed, i.e. camera 10 are transmitted to association's process chip 40
The speed of picture signal uses high-speed transfer, and the speed for the signal that association's process chip 40 is transmitted to camera 10 is passed using low speed
It is defeated, reduce the power consumption of whole camera module.
It should be noted that due to the distance between association process chip and camera be more than association's process chip and connector it
Between distance, therefore, the difficulty of metal line between process chip and camera is assisted in flexible PCB in order to reduce in the present invention
Degree so that the number of pin for being used for picture signal transmission between the camera and association's process chip is handled less than the association
Between chip 40 and the connector 30 be used for picture signal transmit number of pin, and eliminate the camera with it is described
It is used for the serial line interface for controlling image sensor chip between association's process chip.
Accordingly, the present invention also provides a kind of terminal process equipment, including：Mainboard and the above-mentioned implementation method shape of use
Into camera module, wherein, the mainboard and the connector are electrically connected, and the mainboard passes through the connector and receives institute
The image signal processing chip stated on the original image signal after association's process chip processing, mainboard receives the figure passed through after processing
Picture, alleviates the pressure that image signal processing chip carries out image procossing, improves picture quality.
In summary, the present invention provides a kind of manufacture method and terminal process equipment of camera module, images head mould
Group includes assisting process chip, and association process chip and connector are separately positioned on the corresponding tow sides of flexible PCB, and association is handled
Chip receives the original image signal of the image sensor chip output of camera, and by the progress ISP processing of original image signal, then by
Original image signal after processing is transferred to image signal processing chip by connector, is passed through so that image signal processing chip is received
Image after processing, alleviates the pressure that image signal processing chip carries out image procossing, improves picture quality.In addition, this hair
It is bright that association's process chip is arranged in stiffening plate, it is to avoid because camera module highly increases caused by association's process chip, also not
Can be because of the performance of the heating influence image sensor chip of association's process chip.
Although the present invention is disclosed as above with preferred embodiment, it is not for limiting the present invention, any this area
Technical staff without departing from the spirit and scope of the present invention, may be by the methods and techniques content of the disclosure above to this hair
Bright technical scheme makes possible variation and modification, therefore, every content without departing from technical solution of the present invention, according to the present invention
Any simple modifications, equivalents, and modifications made to above example of technical spirit, belong to technical solution of the present invention
Protection domain.
Claims (12)
1. a kind of manufacture method of camera module, it is characterised in that including：
Camera, flexible PCB, association's process chip and connector are provided, association's process chip distinguishes position with the connector
In the corresponding tow sides of the flexible PCB；
The image sensor chip of the camera transmits original image signal to association's process chip, the original image signal
Transmitted again by the connector to terminal process equipment after association's process chip processing.
2. the manufacture method of camera module according to claim 1, it is characterised in that the camera believes original image
Number transmit to association's process chip, association's process chip is cached or handled to original image signal so that association's process chip is passed through
Connector is transmitted to the bandwidth of terminal process equipment and transmitted less than imaging sensor to the bandwidth of association's process chip.
3. the manufacture method of camera module according to claim 1, it is characterised in that association's process chip with it is described
Interval is more than or equal to 0.2 millimeter between image sensor chip, and image sensor chip is made with reducing association's process chip heating
Into image quality decline.
4. the manufacture method of camera module according to claim 1, it is characterised in that define the camera with it is described
Assist the communication protocol of process chip to carry out the transmission of picture signal, image is used between the camera and association's process chip
The number of pin of signal transmission is less than the number of pins transmitted between association's process chip and the connector for picture signal
Amount, the complexity of reduction flexible PCB wiring.
5. the manufacture method of camera module according to claim 4, it is characterised in that define the camera with it is described
The communication protocol for assisting process chip is transmitted in both directions agreement, saves the serial line interface for controlling image sensor chip, is reduced
The complexity of flexible PCB wiring.
6. the manufacture method of camera module according to claim 4, it is characterised in that association's process chip with it is described
There is adhesive filler, association's process chip is used to strengthen the flexible electrical with the adhesive filler between flexible PCB
The intensity of road plate, to support the plug of the connector.
7. the manufacture method of the camera module according to claim 6, it is characterised in that use surface mounting technology will
Association's process chip is bonded with the flexible PCB, solder bump and the flexible PCB electricity of association's process chip
Gas is connected, and injects the adhesive filler between association's process chip and the flexible PCB.
8. the manufacture method of camera module according to claim 1, it is characterised in that also set on the flexible PCB
A stiffening plate is put, association's process chip compatibility is arranged inside the stiffening plate, the stiffening plate is used to strengthen the flexibility
The intensity of circuit board, to support the plug of the connector；The stiffening plate is additionally operable to strengthen the radiating of association's process chip.
9. the manufacture method of camera module according to claim 8, it is characterised in that compatibility sets association's processing core
The step of piece is：The stiffening plate with hollow-out parts is provided, association's process chip bonding is arranged at the hollow-out parts of the stiffening plate,
Expose the solder bump of association's process chip；By the stiffening plate and association's process chip one be arranged at the flexible electrical
On the plate of road, and the solder bump of association's process chip is electrically connected with the flexible PCB.
10. the manufacture method of camera module according to claim 8, it is characterised in that compatibility sets association's processing
The step of chip is：Stiffening plate with hollow-out parts is provided, the stiffening plate is bonded on the flexible PCB；Will be described
Association's process chip is arranged in the hollow-out parts, and association's process chip is electric by solder bump and the flexible PCB
Connection.
11. the manufacture method of camera module according to claim 8, it is characterised in that compatibility sets association's processing
The step of chip is：The stiffening plate with recess is provided, association's process chip bonding is arranged at the recess of the stiffening plate, cruelly
Expose the solder bump of association's process chip；By the stiffening plate with it is described association process chip one be arranged at the flexibility
On circuit board, and the solder bump of association's process chip is electrically connected with the flexible PCB.
12. a kind of terminal process equipment, it is characterised in that including：Any one in mainboard and use such as claim 1 ~ 11
The camera module of described implementation method formation, wherein, the mainboard is electrically connected with the connector, and the mainboard passes through
The connector receives the original image signal after association's process chip processing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610823612X | 2016-09-14 | ||
| CN201610823612 | 2016-09-14 |
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| CN107094224A true CN107094224A (en) | 2017-08-25 |
| CN107094224B CN107094224B (en) | 2021-06-18 |
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| CN201710276808.6A Active CN107094224B (en) | 2016-09-14 | 2017-04-25 | Manufacturing method of camera module and terminal processing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115835608A (en) * | 2023-02-16 | 2023-03-21 | 深圳市中旭新能源有限公司 | Packaging structure for distributed heat dissipation planning and photovoltaic power optimizer |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1953556A (en) * | 2006-11-21 | 2007-04-25 | 北京中星微电子有限公司 | A network pick-up device |
| CN101448099A (en) * | 2008-12-26 | 2009-06-03 | 深圳华为通信技术有限公司 | Multi-camera photographing method and equipment |
| CN101521698A (en) * | 2009-03-23 | 2009-09-02 | 中兴通讯股份有限公司 | Processor power control method and mobile terminal |
| US20100165138A1 (en) * | 2008-12-29 | 2010-07-01 | Red.Com, Inc. | Modular motion camera |
| CN202306757U (en) * | 2011-06-21 | 2012-07-04 | 沈阳天目科技有限公司 | Embedded flame detection device based on double-waveband |
| CN103037242A (en) * | 2013-01-10 | 2013-04-10 | 格科微电子（上海）有限公司 | Camera module test system |
| US20130250114A1 (en) * | 2010-12-01 | 2013-09-26 | Magna Electronics Inc. | System and method of establishing a multi-camera image using pixel remapping |
| CN103414854A (en) * | 2013-08-13 | 2013-11-27 | 三星半导体(中国)研究开发有限公司 | System-on-chip with image processing function and operation method thereof |
| CN105270287A (en) * | 2014-05-28 | 2016-01-27 | Lg电子株式会社 | Driver assistance apparatus and vehicle including the same |
| CN105791672A (en) * | 2015-01-09 | 2016-07-20 | 松下知识产权经营株式会社 | Imaging apparatus, imaging system, reconstruction apparatus, imaging method, and computer program |
| CN105844668A (en) * | 2016-03-27 | 2016-08-10 | 无锡智谷锐拓技术服务有限公司 | Urban environmental sanitation dispatching method based on distribution box |
| CN106328664A (en) * | 2016-10-12 | 2017-01-11 | 格科微电子（上海）有限公司 | Camera module manufacturing method and terminal handling equipment |
-
2017
- 2017-04-25 CN CN201710276808.6A patent/CN107094224B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1953556A (en) * | 2006-11-21 | 2007-04-25 | 北京中星微电子有限公司 | A network pick-up device |
| CN101448099A (en) * | 2008-12-26 | 2009-06-03 | 深圳华为通信技术有限公司 | Multi-camera photographing method and equipment |
| US20100165138A1 (en) * | 2008-12-29 | 2010-07-01 | Red.Com, Inc. | Modular motion camera |
| CN101521698A (en) * | 2009-03-23 | 2009-09-02 | 中兴通讯股份有限公司 | Processor power control method and mobile terminal |
| US20130250114A1 (en) * | 2010-12-01 | 2013-09-26 | Magna Electronics Inc. | System and method of establishing a multi-camera image using pixel remapping |
| CN202306757U (en) * | 2011-06-21 | 2012-07-04 | 沈阳天目科技有限公司 | Embedded flame detection device based on double-waveband |
| CN103037242A (en) * | 2013-01-10 | 2013-04-10 | 格科微电子（上海）有限公司 | Camera module test system |
| CN103414854A (en) * | 2013-08-13 | 2013-11-27 | 三星半导体(中国)研究开发有限公司 | System-on-chip with image processing function and operation method thereof |
| CN105270287A (en) * | 2014-05-28 | 2016-01-27 | Lg电子株式会社 | Driver assistance apparatus and vehicle including the same |
| CN105791672A (en) * | 2015-01-09 | 2016-07-20 | 松下知识产权经营株式会社 | Imaging apparatus, imaging system, reconstruction apparatus, imaging method, and computer program |
| CN105844668A (en) * | 2016-03-27 | 2016-08-10 | 无锡智谷锐拓技术服务有限公司 | Urban environmental sanitation dispatching method based on distribution box |
| CN106328664A (en) * | 2016-10-12 | 2017-01-11 | 格科微电子（上海）有限公司 | Camera module manufacturing method and terminal handling equipment |
Non-Patent Citations (1)
| Title |
|---|
| 陈斌等: "多摄像头视频采集系统中摄像头切换方案的设计与实现", 《微型机与应用》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115835608A (en) * | 2023-02-16 | 2023-03-21 | 深圳市中旭新能源有限公司 | Packaging structure for distributed heat dissipation planning and photovoltaic power optimizer |
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