CN106972006B - A kind of EMI inhibition structure and suppressing method based on resistive shorts via hole - Google Patents
A kind of EMI inhibition structure and suppressing method based on resistive shorts via hole Download PDFInfo
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- CN106972006B CN106972006B CN201710080709.0A CN201710080709A CN106972006B CN 106972006 B CN106972006 B CN 106972006B CN 201710080709 A CN201710080709 A CN 201710080709A CN 106972006 B CN106972006 B CN 106972006B
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
- Health & Medical Sciences (AREA)
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Abstract
The invention discloses a kind of, and the EMI based on resistive shorts via hole inhibits structure and suppressing method.Resistive shorts via hole is implanted into chip package base plate or printed circuit board, substrate includes at least one layer of medium and two layers of opposite metal layer, resistive shorts via hole deposits resistive material in drilling and fills metal, so that all metal layers is formed electrical connection, provides energy absorption path for EMI noise electric current.The present invention is suitable for inhibiting the EMI radiation of chip package and printed circuit board, compared to the prior art, solves the problems, such as that high frequency radiation inhibits, and has huge application value in the EMI design field of high speed encapsulation and printed circuit board.
Description
Technical field
The present invention relates to the Electromagnetic Interference Suppressing Techniques field of chip package and printed circuit board, specifically a kind of base
Inhibit structure and method in the EMI (Electromagnetic Interference, EMI) of resistive shorts via hole.
Background technique
With the fast lifting of message transmission rate and working frequency in high-speed digital system, especially in the world to next
The promotion of third-generation mobile communication demand effectively inhibits high frequency E MI to have become the important technology problem that Current electronic product faces.Beauty
Federal Communications Committee, state and International Electrotechnical Commission equal clear stipulaties different type electronic equipment spoke at 3 meters and at 10 meters
The maximum electric field limit value penetrated, with the amount of radiation of specification electronic product.Therefore, a large number of scientific researchers and engineer are encapsulating and are printing
When board design consider reduce how electromagnetic radiation.
The method of traditional inhibition electromagnetic radiation includes addition common-mode filter, electromagnetic bandgap structure, decoupling capacitor or short
Pass by hole etc..However, common-mode filter and electromagnetic bandgap structure are usually designed by means of additional structure, not only increased cost but also
Limit further increasing for wiring density, it is difficult to be widely used.Meanwhile there are equivalent series resistance, short circuits for decoupling capacitor
There are serious parasitic inductance effects for via hole, both common technologies is caused to act on high frequency electromagnetic radiation unrestraint.
Summary of the invention
It is an object of the invention to solve the deficiencies in the prior art, a kind of EMI suppression based on resistive shorts via hole is provided
Structure and method processed solve the problems, such as that high frequency radiation inhibits, practical, applied widely, encapsulate and print in high speed
The EMI design field of printed circuit board has huge application value.
In order to achieve the above object, the invention adopts the following technical scheme:
Chip package base plate or printed circuit board are implanted into the resistive shorts via hole through metal layer, so that metal layer shape
At electrical connection.
It is implanted into resistive shorts via hole in chip package base plate or printed circuit board, the perforative metal layer of via hole is made to form electricity
Gas connection.
The resistive shorts via hole runs through all metal layers, and all metal layers are connected to form resistive network, are made an uproar for EMI
Acoustoelectric current provides energy absorption path, to inhibit EMI.
The resistive shorts via hole is to deposit resistive material in common via hole and fill metal, metal in resistive material
Outer surface is enclosed with resistive material, so that metal is not contacted with hole wall is crossed.
The common resistive material such as ruthenic oxide, carbon film can be used in the resistive material.
The common metals material such as copper, iron can be used in the metal.
Size, position and the quantity of the resistive shorts via hole can adjust according to actual needs.It is preferred that all common
Resistive material is filled in via hole and metal forms resistive shorts via hole.
The surface impedance of the resistive shorts via hole is purely resistive, perception or capacitive.The selection of resistive material is according to EMI
The exceeded Frequency Band Selection of radiation, generally requiring surface impedance is 5~50 Ω, while it is special to can choose emotional resistance or capacitive reactances
The material of property.
One layer of medium and two layers of opposite metal layer, ability are included at least in the chip package base plate or printed circuit board
With EMI inhibitory effect, one layer of metal layer can not carry out water conservancy diversion and inhibit EMI.
The EMI includes external electromagnetic radiation and interference caused by all plate interior resonances.
The method of the present invention and device can be used for all circuit boards such as chip package base plate and printed circuit board, reach inhibition phase
Close the purpose of electronic product electromagnetic interference.
Compared with the prior art, the invention has the beneficial effects that:
Resistive shorts via hole of the invention is combined closely traditional short-circuit via hole technology, effectively inhibit include between plate resonance exist
Electromagnetic radiation caused by interior many reasons, and can be compatible with modern printed circuit board and packaged substrate technology.
The resistive material that the present invention can choose different surfaces impedance realizes that the electromagnetic radiation of different frequency range inhibits, and can press down
The electromagnetic radiation of 10GHz or more processed has inhibitory effect by a relatively large margin, and is not limited to noise source form, can inhibit
Electromagnetic radiation caused by any noise source.
The present invention has important application value in printed circuit board and chip package field.
Detailed description of the invention
Fig. 1 is the four layer package substrate schematic diagrames that the present invention is implanted into after a large amount of resistive shorts via holes.
Fig. 2 is the tomograph for the wire bonding formula BGA Package that the specific embodiment of the invention provides.
Fig. 3 is the side view for the wire bonding formula BGA Package that the specific embodiment of the invention provides.
Fig. 4 be the specific embodiment of the invention provide in wire bonding formula BGA Package using resistive short
Maximum field at 3 meters after via hole.
Fig. 5 is the embodiment commonly inhibitory effect comparison diagram of short-circuit via hole and resistive shorts via hole to electromagnetic radiation.
In figure: 1, first layer metal layer, 2, second layer metal layer, 3, third layer metal layer, 4, the 4th layers of metal layer, 5,
One layer of dielectric layer, 6, second layer dielectric layer, 7, third layer dielectric layer, 8, resistive material, 9, filling metal, 10, resistive shorts mistake
Hole, 11, cap, 12, package substrate.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples.
As shown in Figure 1, present invention specific implementation is to be implanted into multiple resistive shorts via holes 10 in four layer package substrates, wear
First layer medium 1, second layer medium 2 and third layer medium 3 are crossed, first layer metal layer 4, second layer metal layer 5, third layer gold are made
Belong to layer 6 and the 4th layer of metal layer 7 forms electrical connection.Resistive shorts via hole 10 contains resistive material 8 and filling metal 9.It is resistive
The range of choice of material is very extensive, including titanium dioxide rubidium, graphene etc..
The basic principle that the present invention realizes that EMI inhibits is as follows:
(a) when high speed signal transmits in circuit board, due to impedance discontinuity, reference planes are imperfect and plate interior resonance
Etc. reasons easily cause stronger radiation, much noise electric current can be coupled to resistive short via hole.
(b) when frequency is lower, the metal in resistive short via hole provides low impedance path for noise current, to press down
EMI radiation caused by resonance between making sheet.Meanwhile part electromagnetic energy is absorbed into thermal energy by resistive material.
(c) when frequency is higher, the parasitic inductance of common metal is larger can not to provide low impedance path, at this point, resistive short
The resistive material passed by hole provides low impedance path for noise current, to inhibit EMI radiation caused by noise current.Together
When, part electromagnetic energy is absorbed into thermal energy by resistive material.
As shown in Figure 2 and Figure 3, specific embodiments of the present invention are included in wire bonding formula base plate for packaging ball grid array interplantation
Multiple resistive shorts via holes are entered.Include cap 11, package substrate 12 and resistive short in wire bonding formula BGA Package
Pass by hole 10 etc..
The specific embodiment of the invention is specifically described resistive short by taking typical commercial wire bonding formula BGA Package as an example
Hole is passed by the inhibiting effect of electromagnetic radiation:
Specific embodiments of the present invention be included in wire bonding formula base plate for packaging ball grid array be implanted into it is 34 resistive short
Hole is passed by, electromagnetic radiation caused by noise current is effectively inhibited.
3 meters of field simulation results of embodiment are as shown in Figure 4 and Figure 5.Simulation result is sinusoidal for 2 mV based on common-mode noise source
Voltage obtains.Fig. 4 compared the 3 meters of fields for not being implanted into short-circuit via hole in package substrate and being implanted into after resistive shorts via hole.Such as Fig. 4
Shown, resistive shorts via hole of the present invention effectively inhibits the electromagnetic radiation in 0~25GHz, and maximum suppression amplitude is up to
28dB, and the inhibition amplitude in 5~15GHz is generally more than 10dB.The inhibitory effect of the resistive shorts via hole 0~
25GHz is effectively embodied.Fig. 5 compared common short-circuit via hole and resistive shorts via hole to the inhibitory effect of electromagnetic radiation.
As shown in figure 5, resistive shorts via hole of the present invention can effectively inhibit in 7~21GHz compared to common short-circuit via hole
Electromagnetic radiation, and average inhibitory effect is more than 5dB in the frequency range.Therefore, the resistive shorts via hole can solve routine
The technical problem that short-circuit via hole fails in high frequency.In conclusion the present invention has prominent significant technical effect, broadband is realized
EMI inhibits, the especially inhibition to high frequency (10GHz or more) electromagnetic radiation, in the EMI of high-speed chip encapsulation and printed circuit board
Design field has important application value.
The above embodiments are only used to illustrate the present invention, and not limitation of the present invention, in relation to the common of technical field
Technical staff can also make a variety of changes and modification without departing from the spirit and scope of the present invention, therefore all
Equivalent technical solution also belongs to scope of the invention, and scope of patent protection of the invention should be defined by the claims.
Claims (4)
1. a kind of EMI based on resistive shorts via hole inhibits structure, it is characterised in that: in chip package base plate or printed circuit board
It is implanted with the resistive shorts via hole through metal layer, so that metal layer forms electrical connection；
The resistive shorts via hole runs through all metal layers, and all metal layers are connected to form resistive network, is EMI noise electricity
Stream provides path, to inhibit EMI；
The resistive shorts via hole is to deposit resistive material in common via hole and fill metal, metal package in resistive material
Face is enclosed with resistive material, so that metal is not contacted with hole wall is crossed；
The surface impedance of the resistive shorts via hole is purely resistive, perception or capacitive, and surface impedance is 5~50 Ω.
2. a kind of EMI suppressing method based on resistive shorts via hole, it is characterised in that: in chip package base plate or printed circuit board
It is implanted into resistive shorts via hole, the perforative metal layer of via hole is made to form electrical connection；
The resistive shorts via hole runs through all metal layers, and all metal layers are connected to form resistive network, is EMI noise electricity
Stream provides path, to inhibit EMI；
The resistive shorts via hole is to deposit resistive material in common via hole and fill metal, metal package in resistive material
Face is enclosed with resistive material, so that metal is not contacted with hole wall is crossed；
The surface impedance of the resistive shorts via hole is purely resistive, perception or capacitive, and surface impedance is 5~50 Ω.
3. EMI according to claim 1 inhibits structure or EMI suppressing method as claimed in claim 2, feature to exist
In: two layers or more metal layer is included at least in the chip package base plate or printed circuit board.
4. EMI according to claim 1 inhibits structure or EMI suppressing method as claimed in claim 2, feature to exist
In: the EMI includes external electromagnetic radiation and interference caused by all plate interior resonances.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710080709.0A CN106972006B (en) | 2017-02-15 | 2017-02-15 | A kind of EMI inhibition structure and suppressing method based on resistive shorts via hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710080709.0A CN106972006B (en) | 2017-02-15 | 2017-02-15 | A kind of EMI inhibition structure and suppressing method based on resistive shorts via hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106972006A CN106972006A (en) | 2017-07-21 |
| CN106972006B true CN106972006B (en) | 2019-06-07 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1763947A (en) * | 2004-03-30 | 2006-04-26 | 株式会社东芝 | Lsi package provided with interface module, and transmission line header employed in the package |
| CN1890810A (en) * | 2003-12-04 | 2007-01-03 | 秦内蒂克有限公司 | Electronic circuit package with cavity resonance cut off member |
| CN101213638A (en) * | 2005-06-30 | 2008-07-02 | L.皮尔·德罗什蒙 | Electronic component and method of manufacture |
| CN102017147A (en) * | 2007-04-18 | 2011-04-13 | 因维萨热技术公司 | Materials systems and methods for optoelectronic devices |
| CN102044319A (en) * | 2009-10-23 | 2011-05-04 | 中国科学院物理研究所 | Composite wave absorbing material and preparation method thereof |
-
2017
- 2017-02-15 CN CN201710080709.0A patent/CN106972006B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1890810A (en) * | 2003-12-04 | 2007-01-03 | 秦内蒂克有限公司 | Electronic circuit package with cavity resonance cut off member |
| CN1763947A (en) * | 2004-03-30 | 2006-04-26 | 株式会社东芝 | Lsi package provided with interface module, and transmission line header employed in the package |
| CN101213638A (en) * | 2005-06-30 | 2008-07-02 | L.皮尔·德罗什蒙 | Electronic component and method of manufacture |
| CN102017147A (en) * | 2007-04-18 | 2011-04-13 | 因维萨热技术公司 | Materials systems and methods for optoelectronic devices |
| CN102044319A (en) * | 2009-10-23 | 2011-05-04 | 中国科学院物理研究所 | Composite wave absorbing material and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| Investigation of Shorting Vias for Suppressing Common-Mode Radiation in Different Frequency Range;Dongke Zhu, ErPing Li, Cheng Ping;《Electrical Design of Advanced Packaging and System(EDAPS)》;20161214;25-27 |
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| Publication number | Publication date |
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| CN106972006A (en) | 2017-07-21 |
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