CN106961790A - A kind of multi-layer PCB and preparation method thereof - Google Patents
A kind of multi-layer PCB and preparation method thereof Download PDFInfo
- Publication number
- CN106961790A CN106961790A CN201710262311.9A CN201710262311A CN106961790A CN 106961790 A CN106961790 A CN 106961790A CN 201710262311 A CN201710262311 A CN 201710262311A CN 106961790 A CN106961790 A CN 106961790A
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- China
- Prior art keywords
- pcb
- daughter boards
- layer
- pcb daughter
- connecting piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 25
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a kind of multilayer printed circuit board PCB and preparation method thereof, the multi-layer PCB includes：At least two PCB daughter boards being stacked, and at least one metal connecting piece；Wherein, each described PCB daughter board, including：PCB substrate, is deployed at least one signals layer in the PCB substrate, and be deployed at least one via being connected in the PCB substrate with least one described signals layer；In the adjacent PCB daughter boards of each two, at least one via of at least one via PCB daughter boards adjacent with second of the first adjacent PCB daughter boards is corresponded, and is attached between each corresponding described via by the metal connecting piece.Multi-layer PCB provided in an embodiment of the present invention, it is easy to make.
Description
Technical field
It is more particularly to a kind of the present invention relates to PCB (Printed Circuit Board, printed circuit board) technical field
Multi-layer PCB and preparation method thereof.
Background technology
With continuing to develop for information technology, PCB is widely applied to greatly among various electronic equipments.In order that PCB
Its vitality is remained in that in the evolution of future electronic equipment, the signal transmission to each signals layer in multi-layer PCB will
Seek also more and more higher.Accordingly, in order to meet the request signal transmission that multi-layer PCB is improved constantly, the number of plies of multi-layer PCB is also big
Amount increase, the signal layer number of part multi-layer PCB may be up to 56.
At present, each layer of multi-layer PCB is integrated, and the PCB number of plies is more, then PCB thickness is thicker so that multilayer
PCB is difficult to make.
The content of the invention
The embodiments of the invention provide a kind of multi-layer PCB and preparation method thereof, the multi-layer PCB is easy to make.
In a first aspect, the embodiments of the invention provide a kind of multi-layer PCB, including：
At least two PCB daughter boards being stacked, and at least one metal connecting piece；Wherein,
Each described PCB daughter board, including：PCB substrate, is deployed at least one signals layer in the PCB substrate, with
And it is deployed at least one via being connected in the PCB substrate with least one described signals layer；
In the adjacent PCB daughter boards of each two, at least one via PCB daughter boards adjacent with second of the first adjacent PCB daughter boards
At least one via correspond, be attached by the metal connecting piece between each corresponding described via.
Preferably,
The center line of each corresponding via is located along the same line.
Preferably,
The material of the metal connecting piece includes：Any one in gold, silver, copper, iron, nickel.
Preferably,
Also include：It is arranged at least one dielectric layer between the adjacent PCB daughter boards of each two.
Preferably,
Also include：Correspond the electro-magnetic shielding cover being arranged on outside each described metal connecting piece.
Second aspect, the embodiments of the invention provide a kind of preparation method of multi-layer PCB, including：
Make at least one metal connecting piece；
Disposed respectively at least one PCB substrate at least one signals layer and with least one described signals layer phase
At least one via even, forms PCB daughter boards；
Each to be formed PCB daughter boards are stacked, and utilize at least one metal connecting piece correspondence connection phase
In two adjacent PCB daughter boards, at least one mistake of at least one via PCB daughter boards adjacent with second of the first adjacent PCB daughter boards
Hole, to form multi-layer PCB.
Preferably,
It is described to be stacked each to be formed PCB daughter boards, including：
Determine the lamination order of each PCB daughter board；
Each to be formed PCB daughter boards are laminated according to the lamination order so that in each described PCB daughter board, relatively
The center line for each via answered is located along the same line.
Preferably,
The material of the metal connecting piece includes：Any one in gold, silver, copper, iron, nickel.
Preferably,
It is described be stacked each to be formed PCB daughter boards before, also include：
Make at least one dielectric layer；
Then,
It is described to be stacked each to be formed PCB daughter boards, including：
It is stacked between each to be formed PCB daughter boards and each described dielectric layer, the adjacent PCB daughter boards of each two
One dielectric layer is set.
Preferably,
Described at least one metal connecting piece of making, further comprises：In the outside difference of each metal connecting piece
One electro-magnetic shielding cover is set.
The embodiments of the invention provide a kind of multi-layer PCB and preparation method thereof, the multi-layer PCB has multiple be stacked
PCB daughter boards, each PCB daughter board includes PCB substrate, at least one signals layer for being deployed in the PCB substrate and portion
Affix one's name at least one via being connected in the PCB substrate with least one signals layer, two neighboring PCB daughter boards, first is adjacent
At least one via of at least one via PCB daughter boards adjacent with second of PCB daughter boards is corresponded, each corresponding via
Between be attached by metal connecting piece.As fully visible, each signals layer of the multi-layer PCB is no longer integral structure, should
Multi-layer PCB is laminated by multiple PCB daughter boards and formed, and each PCB daughter board of the PCB can be made respectively, then passes through metal connecting piece
The via that correspondence connects each PCB daughter board can form a multi-layer PCB, it is easy to make.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is a kind of structural representation for multi-layer PCB that one embodiment of the invention is provided；
Fig. 2 is a kind of flow chart for method for making multi-layer PCB that one embodiment of the invention is provided；
Fig. 3 is the flow chart of the method for another making multi-layer PCB that one embodiment of the invention is provided.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments, based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained on the premise of creative work is not made, belongs to the scope of protection of the invention.
As shown in figure 1, the embodiments of the invention provide a kind of multi-layer PCB, including：At least two PCB being stacked
Plate 101, and at least one metal connecting piece 102；Wherein,
Each described PCB daughter board 101, including：PCB substrate 1011, is deployed at least one in the PCB substrate 1011
Individual signals layer 1012, and it is deployed at least one be connected in the PCB substrate 1011 with least one described signals layer 1012
Individual via 1013；
In the adjacent PCB daughter boards 101 of each two, at least one via 1013 and the second phase of the first adjacent PCB daughter boards 101
At least one via 1013 of adjacent PCB daughter boards 101 is corresponded, and the gold is passed through between each corresponding described via 1013
Category connector 102 is attached.
In the above embodiment of the present invention, the multi-layer PCB has multiple PCB daughter boards being stacked, and each PCB daughter board is wrapped
At least one signals layer for include PCB substrate, being deployed in the PCB substrate and it is deployed in the PCB substrate and at least one
In at least one connected via of signals layer, two neighboring PCB daughter boards, at least one via of the first adjacent PCB daughter boards and the
At least one via of two adjacent PCB daughter boards is corresponded, and is connected between each corresponding via by metal connecting piece
Connect.As fully visible, each signals layer of the multi-layer PCB is no longer integral structure, and the multi-layer PCB is laminated by multiple PCB daughter boards
Formed, each PCB daughter board of the PCB can be made respectively, the via of each PCB daughter board is then connected by metal connecting piece correspondence
A multi-layer PCB can be formed, it is easy to make.
When further, in order to ensure transmitting signal by via and metal connecting piece between different PCB daughter boards, transmission
Signal will not decay in the junction of two corresponding vias, in one embodiment of the invention, each corresponding institute
The center line for stating via is located along the same line.
Further, it is of the invention one in order to ensure signal transmission can be carried out between different PCB by metal connecting piece
In embodiment, the material of the metal connecting piece includes：Any one in gold, silver, copper, iron, nickel.It should be appreciated that golden
Category connector can also be the alloy of the metals such as gold, silver, copper, iron, nickel.
Further, in order to avoid signal cross-talk, one embodiment of the invention occur for the signals layer on different PCB daughter boards
In, also include：It is arranged at least one dielectric layer between the adjacent PCB daughter boards of each two.Specifically, the material of dielectric layer should
When the ink for not possessing electric conductivity for plastics etc..
Further, when carrying out signal transmission by corresponding metal connecting piece in order to ensure different PCB daughter boards, transmission
Signal will not be received in the interference of external electromagnetic environment, one embodiment of the invention on connector, also included：One-to-one corresponding is set
Put at least one electro-magnetic shielding cover outside each metal connecting piece.It should be appreciated that electro-magnetic shielding cover can be with
Ground, and the material of electro-magnetic shielding cover can be that gold, silver, copper, iron, nickel etc. can absorb the metal material of electromagnetic signal.
As shown in Fig. 2 the embodiments of the invention provide a kind of method for making multi-layer PCB, including：
Step 201, at least one metal connecting piece is made；
Step 202, disposed respectively at least one PCB substrate at least one signals layer and with it is described at least one
At least one connected via of signals layer, forms PCB daughter boards；
Step 203, each to be formed PCB daughter boards are stacked, and utilize at least one described metal connecting piece pair
It should connect in two adjacent PCB daughter boards, at least one via PCB daughter boards adjacent with second of the first adjacent PCB daughter boards are extremely
A few via, to form multi-layer PCB.
In the above embodiment of the present invention, made respectively by multiple PCB daughter boards to multi-layer PCB, it is many producing
After individual metal connecting piece, then correspondence connection is carried out to multiple PCB daughter boards of making using metal connecting piece, form stacking and set
The multi-layer PCB of multiple PCB daughter boards is equipped with, integrated processing is not carried out in traditional technical scheme to multi-layer PCB for another example, it is easy to make
Make.
It is described to be stacked each to be formed PCB daughter boards in one embodiment of the invention, including：
Determine the lamination order of each PCB daughter board；
Each to be formed PCB daughter boards are laminated according to the lamination order so that in each described PCB daughter board, relatively
The center line for each via answered is located along the same line.
In one embodiment of the invention, it is described be stacked each to be formed PCB daughter boards before, also include：System
Make at least one dielectric layer；
Then, it is described to be stacked each to be formed PCB daughter boards, including：
It is stacked between each to be formed PCB daughter boards and each described dielectric layer, the adjacent PCB daughter boards of each two
One dielectric layer is set.
In one embodiment of the invention, described at least one metal connecting piece of making further comprises：In each gold
The outside of category connector sets an electro-magnetic shielding cover respectively.
In order to more clearly illustrate technical scheme and advantage, include 8 signals layers below to make one
Multi-layer PCB exemplified by, as shown in figure 3, can specifically include each following step：
Step 301, at least one metal connecting piece is made, and one is set respectively in the outside in each metal connecting piece
Electro-magnetic shielding cover.
Step 302,3 dielectric layers of printing ink to manufacture are utilized.
Step 303, dispose two signals layers respectively in 4 PCB substrates and be connected with each signals layer of deployment
At least one via, forms 4 PCB daughter boards.
Step 304, it is determined that the lamination order of the 4 PCB daughter boards formed.
Step 305, the 4 PCB daughter boards and 3 dielectric layers to be formed are stacked according to lamination order, each two is adjacent
One dielectric layer is set between PCB daughter boards.
Here, each to be formed PCB daughter boards and each dielectric layer are stacked, should be made in each PCB daughter board, it is corresponding
The center line of each via be located along the same line.
Step 306, two adjacent PCB daughter boards of outside each metal connecting piece correspondence connection for being provided with radome are utilized
In, at least one via of at least one via PCB daughter boards adjacent with second of the first adjacent PCB daughter boards, to form multilayer
PCB。
In summary, each embodiment of the invention at least has the advantages that：
1st, in one embodiment of the invention, the multi-layer PCB has multiple PCB daughter boards being stacked, and each PCB daughter board is wrapped
At least one signals layer for include PCB substrate, being deployed in the PCB substrate and it is deployed in the PCB substrate and at least one
In at least one connected via of signals layer, two neighboring PCB daughter boards, at least one via of the first adjacent PCB daughter boards and the
At least one via of two adjacent PCB daughter boards is corresponded, and is connected between each corresponding via by metal connecting piece
Connect.As fully visible, each signals layer of the multi-layer PCB is no longer integral structure, and the multi-layer PCB is laminated by multiple PCB daughter boards
Formed, each PCB daughter board of the PCB can be made respectively, the via of each PCB daughter board is then connected by metal connecting piece correspondence
A multi-layer PCB can be formed, it is easy to make.
2nd, in one embodiment of the invention, the center line of each corresponding via is located along the same line, it is ensured that no
During with transmitting signal by via and connector between PCB daughter boards, the signal of transmission will not two corresponding vias company
Decay at the place of connecing.
3rd, in one embodiment of the invention, a dielectric layer is provided between the adjacent PCB daughter boards of each two, can be avoided not
Occurs signal cross-talk with the signals layer on PCB daughter boards.
4th, in one embodiment of the invention, it is provided with electro-magnetic shielding cover outside each metal connecting piece, it can be ensured that no
When carrying out signal transmission by corresponding metal connecting piece with PCB daughter boards, the signal of transmission will not receive outside on connector
The interference of electromagnetic environment.
It should be noted that herein, such as first and second etc relational terms are used merely to an entity
Or operation makes a distinction with another entity or operation, and not necessarily require or imply exist between these entities or operation
Any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant be intended to it is non-
It is exclusive to include, so that process, method, article or equipment including a series of key elements not only include those key elements,
But also other key elements including being not expressly set out, or also include solid by this process, method, article or equipment
Some key elements.In the absence of more restrictions, by sentence, " including the key element that a 〃 " is limited is not arranged
Except also there is other identical factor in the process including the key element, method, article or equipment.
It is last it should be noted that：Presently preferred embodiments of the present invention is the foregoing is only, the skill of the present invention is merely to illustrate
Art scheme, is not intended to limit the scope of the present invention.Any modification for being made within the spirit and principles of the invention,
Equivalent, improvement etc., are all contained in protection scope of the present invention.
Claims (10)
1. a kind of multilayer printed circuit board PCB, it is characterised in that including：At least two PCB daughter boards being stacked, Yi Jizhi
A few metal connecting piece；Wherein,
Each described PCB daughter board, including：PCB substrate, is deployed at least one signals layer in the PCB substrate, and portion
Affix one's name at least one via being connected in the PCB substrate with least one described signals layer；
In the adjacent PCB daughter boards of each two, at least one via PCB daughter boards adjacent with second of the first adjacent PCB daughter boards are extremely
A few via is corresponded, and is attached between each corresponding described via by the metal connecting piece.
2. multi-layer PCB according to claim 1, it is characterised in that
The center line of each corresponding via is located along the same line.
3. multi-layer PCB according to claim 1, it is characterised in that
The material of the metal connecting piece includes：Any one in gold, silver, copper, iron, nickel.
4. multi-layer PCB according to claim 1, it is characterised in that also include：
It is arranged at least one dielectric layer between the adjacent PCB daughter boards of each two.
5. according to any described multi-layer PCB in Claims 1-4, it is characterised in that also include：
Correspond the electro-magnetic shielding cover being arranged on outside each described metal connecting piece.
6. a kind of multilayer printed circuit board PCB preparation method, it is characterised in that including：
Make at least one metal connecting piece；
Dispose at least one signals layer respectively at least one PCB substrate and be connected with least one described signals layer
At least one via, forms PCB daughter boards；
Each to be formed PCB daughter boards are stacked, and it is adjacent using at least one metal connecting piece correspondence connection
In two PCB daughter boards, at least one via of at least one via PCB daughter boards adjacent with second of the first adjacent PCB daughter boards, with
Form multi-layer PCB.
7. method according to claim 6, it is characterised in that
It is described to be stacked each to be formed PCB daughter boards, including：
Determine the lamination order of each PCB daughter board；
Each to be formed PCB daughter boards are laminated according to the lamination order so that corresponding in each described PCB daughter board
The center line of each via is located along the same line.
8. method according to claim 6, it is characterised in that
The material of the metal connecting piece includes：Any one in gold, silver, copper, iron, nickel.
9. PCB according to claim 6, it is characterised in that
It is described be stacked each to be formed PCB daughter boards before, also include：
Make at least one dielectric layer；
Then,
It is described to be stacked each to be formed PCB daughter boards, including：
It is stacked between each to be formed PCB daughter boards and each described dielectric layer, the adjacent PCB daughter boards of each two and sets
One dielectric layer.
10. according to any described method in claim 6 to 9, it is characterised in that
Described at least one metal connecting piece of making, further comprises：Set respectively in the outside of each metal connecting piece
One electro-magnetic shielding cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710262311.9A CN106961790A (en) | 2017-04-20 | 2017-04-20 | A kind of multi-layer PCB and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710262311.9A CN106961790A (en) | 2017-04-20 | 2017-04-20 | A kind of multi-layer PCB and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106961790A true CN106961790A (en) | 2017-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710262311.9A Pending CN106961790A (en) | 2017-04-20 | 2017-04-20 | A kind of multi-layer PCB and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101500376A (en) * | 2009-03-16 | 2009-08-05 | 深圳市深南电路有限公司 | Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin |
| CN101790289A (en) * | 2009-06-10 | 2010-07-28 | 华为技术有限公司 | PCB with interconnected blind holes and processing method thereof |
| CN104754886A (en) * | 2013-12-27 | 2015-07-01 | 中兴通讯股份有限公司 | Pcb processing method and pcb |
| CN104768326A (en) * | 2015-03-31 | 2015-07-08 | 华为技术有限公司 | Printed circuit board and printed circuit board manufacturing method |
-
2017
- 2017-04-20 CN CN201710262311.9A patent/CN106961790A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101500376A (en) * | 2009-03-16 | 2009-08-05 | 深圳市深南电路有限公司 | Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin |
| CN101790289A (en) * | 2009-06-10 | 2010-07-28 | 华为技术有限公司 | PCB with interconnected blind holes and processing method thereof |
| CN104754886A (en) * | 2013-12-27 | 2015-07-01 | 中兴通讯股份有限公司 | Pcb processing method and pcb |
| CN104768326A (en) * | 2015-03-31 | 2015-07-08 | 华为技术有限公司 | Printed circuit board and printed circuit board manufacturing method |
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Application publication date: 20170718 |
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