CN106937511A - Data center cooling system - Google Patents
Data center cooling system Download PDFInfo
- Publication number
- CN106937511A CN106937511A CN201511012992.0A CN201511012992A CN106937511A CN 106937511 A CN106937511 A CN 106937511A CN 201511012992 A CN201511012992 A CN 201511012992A CN 106937511 A CN106937511 A CN 106937511A
- Authority
- CN
- China
- Prior art keywords
- data center
- cooling system
- accommodation chamber
- thermal current
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
Abstract
A kind of data center cooling system, including an accommodation chamber for being used for placing some data centers, the accommodation chamber includes the cold air circulation road and a thermal current passway that are separated by an at least dividing plate, one air side of the data center connects with the thermal current passway, one inlet side of the data center is located in the cold air circulation road, the accommodation chamber also includes a chimney being located above the thermal current passway, air-flow in the cold air circulation road enters the data center by the air inlet of the data center, the thermal current passway is flowed into after the heat for taking away the data center, air-flow in the thermal current passway is discharged from the chimney.
Description
Technical field
The present invention relates to a kind of data center cooling system.
Background technology
Server in data center can operationally produce many heats, the operational efficiency of data center is influenceed in order to avoid heat, it is general that the temperature of the air of data center is cooled down by the conditioner in data center configuration conditioner, so as to give data center's cooling.Although conditioner can reduce the temperature of data center, its power consumption is larger, high cost.
The content of the invention
In view of the foregoing, it is necessary to which a kind of data center cooling system of low cost is provided.
A kind of data center cooling system, including an accommodation chamber for being used for placing some data centers, the accommodation chamber includes the cold air circulation road and a thermal current passway that are separated by an at least dividing plate, one air side of the data center connects with the thermal current passway, one inlet side of the data center is located in the cold air circulation road, the accommodation chamber also includes a chimney being located above the thermal current passway, air-flow in the cold air circulation road enters the data center by the air inlet of the data center, the thermal current passway is flowed into after the heat for taking away the data center, air-flow in the thermal current passway is discharged from the chimney.
Compared to prior art, the air-flow in above-mentioned data center cooling system flows naturally, and power consumption is less, and cost is relatively low.
Brief description of the drawings
Fig. 1 is a schematic diagram of data center cooling system of the present invention.
Fig. 2 is a stereogram of an accommodation chamber of the data center cooling system of Fig. 1.
Fig. 3 is a front view of the accommodation chamber of Fig. 2.
Fig. 4 is a stereogram of the accommodation chamber of Fig. 2.
Fig. 5 is another stereogram of the accommodation chamber of Fig. 2.
Main element symbol description
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
Refer to Fig. 1, a kind of data center cooling system 100 includes accommodation chamber 20, is arranged at some ponds 201 on the periphery of accommodation chamber 20 and is covered in the vegetation part 40 of the outer surface of accommodation chamber 20, some data centers (Container Data Center are placed in the accommodation chamber 20
CDC) 30, the data center cooling system 100 is used for cooling down these data centers 30, and in one embodiment, these data centers 30 are container data center.
Refer to Fig. 2 to Fig. 5,The accommodation chamber 20 includes the two parallel roofs 22 of side wall 21 and,Roof 22 is connected to the top edge of two side 21,An air inlet 211 is formed between the leading edge of two side 21,An air outlet 212 is formed between the back edge of two side 21,Some gas channels are formed by some separating to dividing plate 23 in accommodation chamber 20,Region between wherein two pairs dividing plates 23 or the region between a pair of dividing plates 23 and side wall 21 are cold air circulation road 231,Region between each pair dividing plate 23 is thermal current passway 232,And dividing plate 23 separates thermal current passway 232 and cold air circulation road 231,The opening 233 that some air sides 32 for data center 30 are alignd has been opened up on each dividing plate 23,The data center 30 also includes an inlet side 33,Inlet side 33 is relative with air side 32,Inlet side 33 is mounted with some air intake modules 331,Data center 30 is placed in accommodation chamber 20,The air side 32 of data center 30 is allowed to be alignd with the opening 233 of dividing plate 23,The inlet side 33 of data center 30 and air intake module 331 are positioned in cold air circulation road 231；The accommodation chamber 20 can also as needed be configured to multilayer, and in example is carried out, the accommodation chamber 20 is configured to two-layer, and each layer placed multi-column data center 30.
Downside of the upper end-face edge of dividing plate 23 directly with roof 22 connects, and roof 22 is opening up ventilation orifice with the corresponding position of thermal current passway 232（It is not shown）The top of roof 22 is mounted with chimney 25 in the position relative with ventilating opening, the chimney 25 includes the top of both sides 251 and one 252, both sides 251 are connected on side wall 22 mutual vertically, the top 252 is have a generally triangular shape, and cover between both sides 252, some ventilating openings 253 for air-out have been opened up on both sides 251.
Vegetation part 40 is covered in the outer surface of side wall 21, roof 22 and chimney 25, in this way, when accommodation chamber 20 is placed in hilly country, can be consistent with surrounding environment.In one embodiment, accommodation chamber 20 is processed using the hills in natural environment, and side wall 21, the material of roof 22 are soil, can so reduce heat absorption of the accommodation chamber 20 in the case where shining upon.
When the data center cooling system 100 works,Outer gas stream flows through the pond 201 of the front side of air inlet 211,The air-flow flowed through thereon by the evaporation cooling of the water in pond 201,Then air-flow enters in the cold air circulation road 231 of accommodation chamber 20 by air inlet 211,The air intake module 331 of data center 30 guides air-flow to enter in data center 30 from the inlet side 33 of data center 30,These air-flows are discharged in thermal current passway 232 after taking away the heat that electronic installation is produced in data center 30 from air side 32,These air-flows are flowed up in the presence of stack effect and arrived at 25 at chimney,And discharged by the ventilating opening 253 at chimney 25,And the convection current wind of the both sides of chimney 25 can blow away these air-flows,Can be lowered the temperature when same convection current wind is by pond 201,So as to the temperature for ensureing the periphery of accommodation chamber 20 is relatively low,The data center 30 allowed in accommodation chamber 20 can preferably radiate.
In the accommodation chamber 20 of above-mentioned data center cooling system 100, MOD can be installed at the two ends of thermal current passway 232, then can as needed control air inlet 211 toward air-supply in thermal current passway 232 or not blow.
Above-mentioned accommodation chamber 20 can also be placed the place that can obtain more natural winds according to landform, for example, accommodation chamber 20 is built at mountain pass, be that the data center 30 in accommodation chamber 20 can preferably radiate so as to obtain during more natural winds flow into air inlets 211.
Above-mentioned data center cooling system 100, for the data center 30 of accommodation chamber 20 radiates, has the advantages that low cost using natural wind.
Those skilled in the art will be appreciated that, implementation method above is intended merely to the explanation present invention, and be not used as limitation of the invention, as long as within spirit of the invention, the appropriate change and change made to above example all fall within the scope of disclosed in this invention.
Claims (10)
1. a kind of data center cooling system, including an accommodation chamber for being used for placing some data centers, it is characterised in that：The accommodation chamber includes the cold air circulation road and a thermal current passway that are separated by an at least dividing plate, one air side of the data center connects with the thermal current passway, one inlet side of the data center is located in the cold air circulation road, the accommodation chamber also includes a chimney being located above the thermal current passway, air-flow in the cold air circulation road enters the data center by the air inlet of the data center, the thermal current passway is flowed into after the heat for taking away the data center, the air-flow in the thermal current passway is discharged from the chimney.
2. data center cooling system as claimed in claim 1, it is characterised in that：The thermal current is discharged in the presence of stack effect from the chimney.
3. data center cooling system as claimed in claim 1, it is characterised in that：The dividing plate is provided with an opening, and the opening is relative with the air side of the data center.
4. data center cooling system as claimed in claim 1, it is characterised in that：An at least dividing plate includes a pair of dividing plates, and the thermal current passway is formed between this pair of dividing plate.
5. data center cooling system as claimed in claim 1, it is characterised in that：The side of the accommodation chamber is provided with the air inlet with the cold airflow channel connection.
6. data center cooling system as claimed in claim 5, it is characterised in that：Pond is provided with front side of the air inlet.
7. data center cooling system as claimed in claim 6, it is characterised in that：The opposite side of the accommodation chamber is provided with the air inlet relative with the air inlet.
8. data center cooling system as claimed in claim 1, it is characterised in that：The outer wall of the accommodation chamber covers vegetation part.
9. data center cooling system as claimed in claim 1, it is characterised in that：The accommodation chamber is configured to multilayer, and each layer can place data center.
10. data center cooling system as claimed in claim 1, it is characterised in that：The accommodation chamber is located at mountain pass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511012992.0A CN106937511A (en) | 2015-12-31 | 2015-12-31 | Data center cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511012992.0A CN106937511A (en) | 2015-12-31 | 2015-12-31 | Data center cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106937511A true CN106937511A (en) | 2017-07-07 |
Family
ID=59457927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511012992.0A Pending CN106937511A (en) | 2015-12-31 | 2015-12-31 | Data center cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106937511A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101453856A (en) * | 2007-12-03 | 2009-06-10 | 华为技术有限公司 | Communication equipment |
| US7872865B2 (en) * | 2008-04-28 | 2011-01-18 | Hitachi, Ltd. | Disk array device and electronic device |
| CN102455768A (en) * | 2010-11-03 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Container data center |
| CN203432017U (en) * | 2013-09-09 | 2014-02-12 | 中电莱克威（北京）通信设备有限公司 | Pollution-free natural wind environment-friendly air-conditioning system |
| US8917502B1 (en) * | 2012-08-29 | 2014-12-23 | Amazon Technologies, Inc. | Modular datacenter |
| CN104349642A (en) * | 2013-08-02 | 2015-02-11 | 马克·萨塔 | Water-cooling cooling device with continuous airflows |
| CN204518301U (en) * | 2015-04-13 | 2015-07-29 | 苏州安瑞可机柜系统有限公司 | With the server cabinet of chimney |
-
2015
- 2015-12-31 CN CN201511012992.0A patent/CN106937511A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101453856A (en) * | 2007-12-03 | 2009-06-10 | 华为技术有限公司 | Communication equipment |
| US7872865B2 (en) * | 2008-04-28 | 2011-01-18 | Hitachi, Ltd. | Disk array device and electronic device |
| CN102455768A (en) * | 2010-11-03 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Container data center |
| US8917502B1 (en) * | 2012-08-29 | 2014-12-23 | Amazon Technologies, Inc. | Modular datacenter |
| CN104349642A (en) * | 2013-08-02 | 2015-02-11 | 马克·萨塔 | Water-cooling cooling device with continuous airflows |
| CN203432017U (en) * | 2013-09-09 | 2014-02-12 | 中电莱克威（北京）通信设备有限公司 | Pollution-free natural wind environment-friendly air-conditioning system |
| CN204518301U (en) * | 2015-04-13 | 2015-07-29 | 苏州安瑞可机柜系统有限公司 | With the server cabinet of chimney |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180228 Address after: Haiyun economic and Technological Development Zone, Tianjin City, No. 80 300457 Street Applicant after: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Address before: Haiyun Binhai Economic and Technological Development Zone, Tianjin City, No. 80 300457 Street Applicant before: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
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| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |
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| RJ01 | Rejection of invention patent application after publication |