CN106909006A - Adhesive structure and the electricity conductive construction and liquid crystal display device using the adhesive structure - Google Patents
Adhesive structure and the electricity conductive construction and liquid crystal display device using the adhesive structure Download PDFInfo
- Publication number
- CN106909006A CN106909006A CN201710279200.9A CN201710279200A CN106909006A CN 106909006 A CN106909006 A CN 106909006A CN 201710279200 A CN201710279200 A CN 201710279200A CN 106909006 A CN106909006 A CN 106909006A
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- Prior art keywords
- anisotropic conductive
- insulating cement
- adhesive structure
- display panel
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133325—Assembling processes
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The present invention discloses a kind of adhesive structure and the electricity conductive construction and liquid crystal display device using the adhesive structure, is used to solve the problems, such as existing glued construction poor reliability.Adhesive structure includes anisotropic conductive and the insulating cement located at the anisotropic conductive periphery, and the composition of the insulating cement is identical with the viscose composition of the anisotropic conductive；Electricity conductive construction includes the first electronic device, the second electronic device and described adhesive structure, the insulating cement and the anisotropic conductive are folded between first electronic device and second electronic device, and first electronic device and second electronic device are turned on by the anisotropic conductive；The liquid crystal display device includes display panel, drives IC and circuit board, being sticked on the display panel has the adhesive structure, anisotropic conductive in the adhesive structure is attached in the second outer pin land, and the circuit board is turned on by the anisotropic conductive with the display panel.
Description
【Technical field】
The present invention relates to display technology field, and in particular to a kind of adhesive structure and the electricity conductive construction using the adhesive structure
And liquid crystal display device.
【Background technology】
Due to liquid crystal display device (Liquid Crystal Display, LCD) have power saving, lightweight, Low emissivity and
Portable the advantages of, traditional display is gradually replaced, the main flow as monitor market.In the manufacture of liquid crystal display device
During, after display panel technique comes to an end, next just enter module assembled (module assembly) technique, with
Assemble as final products.In module assembled technique, one of groundwork is that will drive IC and flexible circuit board
(Flexible Printed Circuit, FPC) is bonded to outer pin bonding land (the Outer Lead on display panel
Bonding, OLB) connecting on display panel preformed electrode or circuit.
Current flexible printed circuit board and driving IC are mainly conductive by anisotropy with the outer pin land of display panel
Glue (Anisotropic Conductive Film；ACF) bonded, to reach the purpose turned on display panel.But with
The development of narrow frame machine and high-res technology, the oblique distribution on display panel is more and more so that FPC and display panel
Outer pin land adhesion value it is less and less, cause the reduction of FPC and display panel bonding strength.Such as adhesion value is 0.6mm
When following, easily there is the problem that FPC comes off with display panel in folding notebook in user.
It is enhancing FPC bonding strengths, typically using following scheme in correlation technique：
1st, it is simple to expand ACF and FPC；
2nd, Tuffy glue is applied between IC and FPC is driven.
But scheme 1 easily turns on the outer pin bonding land of FPC and IC, and ACF easily hurts IC and FPC in the case of pressing
Outer pin bonding land oblique distribution, so as to cause FPC to be turned on oblique distribution；Scheme 2 mainly passes through manual application Tuffy
Glue, is easily caused the excessive height of Tuffy glue, the mylar film piece (Mylar) on display panel is attached and brings influence, easily causes electricity
Road plate side display panel thickness over dimensioning problem.
【The content of the invention】
Electricity conductive construction and liquid crystal display it is an object of the invention to provide a kind of adhesive structure and using the adhesive structure
Device.
Technical scheme is as follows：
A kind of adhesive structure for being electrically connected with includes anisotropic conductive and located at the anisotropic conductive periphery
Insulating cement, the insulating cement is located in the same horizontal plane with the anisotropic conductive, and the insulating cement composition and institute
The viscose composition for stating anisotropic conductive is identical.
Preferably, the anisotropic conductive include first side and positioned at the two ends of the first side and respectively with institute
Second side and the 3rd side of first side connection are stated, the insulating cement includes the first insulating cement located at the first side
Or/and at least it is located at second insulating cement of a wherein side of the second side and the 3rd side.
Preferably, the anisotropic conductive include first side and positioned at the two ends of the first side and respectively with institute
Second side and the 3rd side of first side connection are stated, the insulating cement includes the first insulation located at the first side
Glue, first insulating cement and the anisotropic conductive are structure as a whole.
Preferably, the anisotropic conductive include first side and positioned at the two ends of the first side and respectively with institute
Second side and the 3rd side of first side connection are stated, the insulating cement is included at least located at the second side and described the
Second insulating cement of a wherein side of three sides, second insulating cement and the anisotropic conductive are structure as a whole.
Preferably, integrative-structure cuts to be formed by coiled material, the coiled material include the Part I that is made up of insulating cement and
The Part II being made up of anisotropic conductive, the Part I and the Part II are set up in parallel.
The present invention also provides a kind of electricity conductive construction, the electricity conductive construction include the first electronic device, the second electronic device and
Adhesive structure any one of above-mentioned, is folded with described exhausted between first electronic device and second electronic device
Edge glue and the anisotropic conductive, and first electronic device and second electronic device are conductive by the anisotropy
Glue is turned on.
Preferably, to drive IC or FPC, second electronic device is PCB, FPC and panel to first electronic device
Any one in circuit.
The present invention also provides a kind of liquid crystal display device, and the liquid crystal display device includes display panel, drives IC and electricity
Road plate, the display panel includes the first outer pin land and the second outer pin land that are provided thereon, outside described first
An interval region is formed between pin land and the second outer pin land, the interval region is provided with distribution, described
Drive IC turned on by the first outer pin land and the display panel, be sticked on the display panel have it is above-mentioned in times
Adhesive structure described in one, the circuit board is attached at side of the adhesive structure away from the display panel, and described
Anisotropic conductive in adhesive structure is attached in the second outer pin land, and the circuit board passes through the anisotropy
Conducting resinl is turned on the display panel.
Preferably, the distribution is close to the side edge out of plumb of the second outer pin land with the display panel
And it is not parallel, the insulating cement is at least partly attached on the distribution.
Preferably, being also sticked on the display panel has another adhesive structure, and the driving IC is by another described
Adhesive structure is fixedly arranged on the display panel, and is electrically connected with the first outer pin land by another adhesive structure
Connect.
Compared with correlation technique, the beneficial effects of the present invention are：By on the anisotropic conductive periphery, institute is set
Insulating cement is stated to increase the adhesion value of the circuit board and the display panel, and the composition of the insulating cement and the anisotropy
The viscose composition of conducting resinl is identical, is not related to not only processing procedure to change, and can effectively improve the circuit board with the display
The bonding strength of panel, it is to avoid damage on the display panel that preformed panel circuit or board side are aobvious during bonding
Show plate thickness over dimensioning problem.
【Brief description of the drawings】
The top view of one preferred embodiment of the liquid crystal display device that Fig. 1 is provided for the present invention；
Fig. 2 is the schematic diagram of liquid crystal display device part-structure shown in Fig. 1；
Fig. 3 is the schematic diagram of display panel in liquid crystal display device shown in Fig. 1；
Fig. 4 is sectional view of the liquid crystal display device shown in Fig. 1 along A-A directions；
Fig. 5 is a kind of structural representation of coiled material；
Fig. 6 is the structural representation of another coiled material.
【Specific embodiment】
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only some embodiments of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 1 is referred to, the liquid crystal display device 100 includes display panel 1, drives IC3 and circuit board 5, the driving
IC3 and the circuit board 5 are turned on the display panel 1 respectively.
Please refer to Fig. 2 to Fig. 4, the display panel 1 includes the first outer pin land 11 being provided thereon and the
Two outer pin lands 13, form one and are spaced between the first outer pin land 11 and the second outer pin land 13
Region 15, the interval region 15 is provided with distribution 151, and the distribution 151 is with the display panel 1 near second outer pin
The side edge out of plumb of land 13 and not parallel.The first outer pin land 11, the second outer pin land
13 and located at the interval region 15 distribution constitute panel circuit.Dotted line frame inner region i.e. as shown in Figure 3 is respectively institute
State the first outer pin land 11, the second outer pin land 13 and the interval region 15.The panel circuit passes through
The first outer pin land 11 and the second outer pin land 13 respectively with the driving IC3 and the circuit board 5
Connection.In the present embodiment, the first outer pin land 11, the second outer pin land 13 and the interval region
15 quantity is two.
Anisotropic conductive 7 is pasted with the second outer pin land 13, is additionally provided with the display panel 1 and is located at
The insulating cement 8 on the periphery of the anisotropic conductive 7, the anisotropic conductive 7 and the insulating cement 8 are located at same level
It is interior, and the two constitutes adhesive structure.The usual anisotropic conductive 7 is mainly made up of conducting particles and resin glue, described exhausted
The composition of edge glue 8 is identical with the viscose composition of the anisotropic conductive 7, and specifically, the viscose composition can be thermosetting ring
Oxygen tree fat (for example, epoxy resin 6101, epoxy resin 634, novolac epoxy resin etc.), can also be pressure sensitive adhesive (for example, SBS
Hot melt glue, SIS hot melt glue etc.).The circuit board 5 be attached on the anisotropic conductive 7 and the insulating cement 8 and with
A gap is formed between the driving IC3, the circuit board 5 is led by the anisotropic conductive 7 with the display panel 1
It is logical.
When the circuit board 5 is assembled with the display panel 1, first the anisotropic conductive 7 and the insulating cement 8 are pasted
The display panel 1 is invested, then the circuit board 5 is attached on the anisotropic conductive 7 and the insulating cement 8, and then
To the anisotropic conductive 7 and the Pressurized-heated of the insulating cement 8 causing resin adhesive curing and the conducting particles of colloidal state
Relative position and deformation are shaped.Wherein, when the anisotropic conductive 7 and the insulating cement 8 are attached at the display panel 1,
Can (i.e. described anisotropic conductive 7 and the insulating cement 8 be attached at the display surface simultaneously by the way of disposable attaching
On plate 1), it is also possible to the anisotropic conductive 7 and the insulating cement 8 (i.e. described anisotropic conductive 7 and described are attached respectively
Insulating cement 8 is attached on the display panel 1 at twice).Increase by between the circuit board 5 and the display panel 1
The insulating cement 8, while increasing the width or length of the corresponding circuit board 5, can not only effectively improve the circuit
The bonding strength of plate 5 and the display panel 1, and avoid and apply Tuffy between IC3 and the circuit board 5 in the driving
The overdimensioned problem of thickness of display panel 1 described in the side of the circuit board 5 that glue is caused.Simultaneously as the anisotropic conductive 7
Can disposably be attached with the insulating cement 8, it is also possible to separately attach, therefore, 1 group of the circuit board 5 and the display panel
It is not related to processing procedure to change during dress；Because the insulating cement 8 is without conducting particles and without electric conductivity, therefore in the case of pressing not
With the damage distribution 151 so as to cause the risk of the circuit board 5 and the conducting of the distribution 151.
In this embodiment, the quantity of the circuit board 5 is one, and can be any one in PCB, FPC, described aobvious
Show that preformed panel circuit, adhesive structure and the circuit board 5 constitute an electricity conductive construction on panel 1.
In other implementations, the circuit board 5 can also be between two for being sequentially connected, and two circuit boards 5
Connected by the adhesive structure, such that it is able to strengthen the bonding strength between the circuit board 5.
The driving IC3 can (for example, welding, anisotropy be led by adhesive structure of the invention and prior art
The gluing knot of electricity) in any one realization turned on the display panel 1.In the present embodiment, the driving IC3 is by the present invention
Adhesive structure turned on the display panel 1.Preformed panel circuit and located at described on i.e. described display panel 1
Adhesive structure and the driving IC3 on display panel 1 constitute an electricity conductive construction.
The anisotropic conductive 7 is rectangular, and it is included towards the first side 71 of the driving IC3 and positioned at described
The two ends of one side 71 and the side 75 of second side 73 and the 3rd being connected with the first side 71 respectively.
The insulating cement 8 is included located at the first insulating cement 81 of the first side 71 and located at the second side 73
With second insulating cement 83 of a wherein side of the 3rd side 75.Wherein, first insulating cement 81 and second insulation
Glue 83 is Split type structure.In the present embodiment, a wherein side of first insulating cement 81 and second insulating cement 83 may be used also
To be arranged to be structure as a whole with the anisotropic conductive 7.Specifically, first insulating cement 81 and the anisotropy are conductive
The integrative-structure of glue 7 can be as shown in Figure 5 coiled material cut to be formed；Second insulating cement 83 and the anisotropic conductive 7
Integrative-structure can be as shown in Figure 6 coiled material cut to be formed.By by first insulating cement 83 and second insulating cement
A 83 wherein side is arranged to that with the integrative-structure of the anisotropic conductive 7 adhesion step can be reduced.
In other embodiments, it is also possible to which the wherein side in the second side 73 and the 3rd side 75 is not set
Second insulating cement 83, at the same time it can also a wherein side of first insulating cement 81 and second insulating cement 83 is set
It is set to and is structure as a whole with the anisotropic conductive 7；First insulating cement only can also be set in the first side 71
81, at the same time it can also first insulating cement 8 is arranged to be structure as a whole with the anisotropic conductive 7；Can also only exist
At least one of side of the second side 73 and the 3rd side 75 sets second insulating cement 83, at the same time it can also
Second insulating cement 83 is arranged to be structure as a whole with the anisotropic conductive 7.
In the above-described embodiments, when the first side 71 is provided with first insulating cement 81, first insulating cement
81 are at least partly attached on the distribution 151.
The beneficial effects of the present invention are：The insulating cement 8 is set to increase by the periphery of the anisotropic conductive 7
The adhesion value of the circuit board 5 and the display panel 1, and the composition of the insulating cement and the anisotropic conductive viscose
Composition is identical, and the composition of the insulating cement 8 is identical with the viscose composition of the anisotropic conductive 7, and processing procedure is not related to not only
Change, and can effectively improve the bonding strength of the circuit board 5 and the display panel 1, it is to avoid damage institute during bonding
State on display panel 1 preformed panel circuit or board side display panel thickness over dimensioning problem.
Above-described is only embodiments of the present invention, it should be noted here that for one of ordinary skill in the art
For, without departing from the concept of the premise of the invention, improvement can also be made, but these belong to protection model of the invention
Enclose.
Claims (10)
1. it is a kind of for be electrically connected with adhesive structure, it is characterised in that：Including anisotropic conductive and located at the anisotropy
The insulating cement on conducting resinl periphery, the insulating cement is located in the same horizontal plane with the anisotropic conductive, and the insulating cement
Composition it is identical with the viscose composition of the anisotropic conductive.
2. adhesive structure according to claim 1, it is characterised in that：The anisotropic conductive includes first side and position
The second side being connected in the two ends of the first side and with the first side respectively and the 3rd side, the insulating cement bag
Include located at the first insulating cement of the first side or/and at least located at wherein the one of the second side and the 3rd side
Second insulating cement of side.
3. adhesive structure according to claim 1, it is characterised in that：The anisotropic conductive includes first side and position
The second side being connected in the two ends of the first side and with the first side respectively and the 3rd side, the insulating cement bag
The first insulating cement located at the first side is included, first insulating cement and the anisotropic conductive are structure as a whole.
4. adhesive structure according to claim 1, it is characterised in that：The anisotropic conductive includes first side and position
The second side being connected in the two ends of the first side and with the first side respectively and the 3rd side, the insulating cement bag
Include second insulating cement of the wherein side for being at least located at the second side and the 3rd side, second insulating cement and institute
Anisotropic conductive is stated to be structure as a whole.
5. the adhesive structure according to claim 3 or 4, it is characterised in that：Integrative-structure cuts to be formed by coiled material, described
Coiled material includes the Part I being made up of insulating cement and the Part II being made up of anisotropic conductive, the Part I and institute
Part II is stated to be set up in parallel.
6. a kind of electricity conductive construction, it is characterised in that：Including the first electronic device, the second electronic device and as in claim 1-5
Adhesive structure described in any one, be folded between first electronic device and second electronic device insulating cement and
The anisotropic conductive, and first electronic device and second electronic device led by the anisotropic conductive
It is logical.
7. electricity conductive construction according to claim 6, it is characterised in that：First electronic device is driving IC or FPC, institute
It is any one in PCB, FPC and panel circuit to state the second electronic device.
8. a kind of liquid crystal display device, it is characterised in that：Including display panel, drive IC and circuit board, the display panel bag
Include the first outer pin land and the second outer pin land being provided thereon, the first outer pin land and described second
An interval region is formed between outer pin land, the interval region is provided with distribution, and the driving IC passes through outside described first
Pin land turns on the display panel, is sticked on the display panel just like any one of claim 1-5
Adhesive structure, the circuit board is attached at side of the adhesive structure away from the display panel, and in the adhesive structure
Anisotropic conductive be attached in the second outer pin land, the circuit board pass through the anisotropic conductive and institute
State display panel conducting.
9. liquid crystal display device according to claim 8, it is characterised in that：The distribution is with the display panel near institute
The side edge out of plumb of the second outer pin land and not parallel is stated, the insulating cement in the adhesive structure is at least partly sticked
In on the distribution.
10. liquid crystal display device according to claim 8, it is characterised in that：Also being sticked on the display panel has another
The adhesive structure, the driving IC is fixedly arranged on the display panel by another adhesive structure, and by another institute
Adhesive structure is stated to be electrically connected with the first outer pin land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710279200.9A CN106909006A (en) | 2017-04-25 | 2017-04-25 | Adhesive structure and the electricity conductive construction and liquid crystal display device using the adhesive structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710279200.9A CN106909006A (en) | 2017-04-25 | 2017-04-25 | Adhesive structure and the electricity conductive construction and liquid crystal display device using the adhesive structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106909006A true CN106909006A (en) | 2017-06-30 |
Family
ID=59211074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710279200.9A Pending CN106909006A (en) | 2017-04-25 | 2017-04-25 | Adhesive structure and the electricity conductive construction and liquid crystal display device using the adhesive structure |
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| CN (1) | CN106909006A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4420901A1 (en) * | 1994-06-15 | 1995-12-21 | Fraunhofer Ges Forschung | Liquid crystal cell |
| CN1233350A (en) * | 1996-08-08 | 1999-10-27 | 日东电工株式会社 | Anisotropic conductive film and method for manufacturing the same |
| TW503444B (en) * | 2000-03-08 | 2002-09-21 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| CN1929097A (en) * | 2005-09-05 | 2007-03-14 | 三星电子株式会社 | Anisotropic conductive flame and flat panel display using the same, and method for manufacturing the same |
| CN101105612A (en) * | 2006-07-10 | 2008-01-16 | Nec液晶技术株式会社 | Flexible wiring sheet, display apparatus and manufacturing method thereof |
| CN101574022A (en) * | 2007-02-22 | 2009-11-04 | 夏普株式会社 | Electronic circuit device, process for manufacturing the same and display apparatus |
-
2017
- 2017-04-25 CN CN201710279200.9A patent/CN106909006A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4420901A1 (en) * | 1994-06-15 | 1995-12-21 | Fraunhofer Ges Forschung | Liquid crystal cell |
| CN1233350A (en) * | 1996-08-08 | 1999-10-27 | 日东电工株式会社 | Anisotropic conductive film and method for manufacturing the same |
| TW503444B (en) * | 2000-03-08 | 2002-09-21 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| CN1929097A (en) * | 2005-09-05 | 2007-03-14 | 三星电子株式会社 | Anisotropic conductive flame and flat panel display using the same, and method for manufacturing the same |
| CN101105612A (en) * | 2006-07-10 | 2008-01-16 | Nec液晶技术株式会社 | Flexible wiring sheet, display apparatus and manufacturing method thereof |
| CN101574022A (en) * | 2007-02-22 | 2009-11-04 | 夏普株式会社 | Electronic circuit device, process for manufacturing the same and display apparatus |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Applicant after: Kunshan Longteng Au Optronics Co Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Applicant before: Kunshan Longteng Optronics Co., Ltd. |
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Application publication date: 20170630 |