CN106660190A - Polishing pad - Google Patents
Polishing pad Download PDFInfo
- Publication number
- CN106660190A CN106660190A CN201580045399.8A CN201580045399A CN106660190A CN 106660190 A CN106660190 A CN 106660190A CN 201580045399 A CN201580045399 A CN 201580045399A CN 106660190 A CN106660190 A CN 106660190A
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- China
- Prior art keywords
- grinding
- resin layer
- groove
- hard resin
- charge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Provided is a polishing pad capable of removing waviness on a resin-coated surface of an object to be polished having a curved surface. This polishing pad (10) is provided with a structure (40, 50) which has a polishing surface (30) made of a hard resin layer (40) and allows the polishing surface (30) to conform to the curved surface of the object to be polished (90).
Description
Technical field
The present invention relates to grinding pad.
Background technology
It is as the processing method of the car body coating face smoothing by the grinding charge with curved surface, such as automobile etc., known
There is polishing grinding processing (such as patent documentation 1).Polishing grinding processing (is thrown in the abrasive wheel made by fabric or other materials
Halo) around (surface) enclose various grinding agents etc. and rotate abrasive wheel, so as to the side being ground to grinding object thing
Method.
Prior art literature
Patent documentation
Patent documentation 1：Japanese Unexamined Patent Publication 2012-251099 publications
The content of the invention
Problems to be solved by the invention
But, the fluctuating on the surface of grinding charge cannot be removed using polishing grinding processing, it is difficult to realize beautiful surface
Polish.
The present invention problem be, there is provided a kind of grinding of the fluctuating on the surface that can remove the grinding charge with curved surface
Pad.
For solution to problem
In order to solve the problem, the grinding pad of a technical scheme of the present invention is with grinding for being formed by hard resin layer
Flour milling, and with the construction for making the abradant surface follow the curved surface of grinding charge.
The above-mentioned construction that abradant surface follows the curved surface of grinding charge is allow to be comprising hard resin layer and supporting hard
The double-layer structural of the soft resin layer of resin bed.
Groove can also be formed with abradant surface.Can also be that hard resin layer is divided into many parts by the groove.Additionally, also may be used
To be, the groove is also formed into soft resin layer.
The effect of invention
Using the present invention, the grinding pad of the fluctuating on the surface that can remove the grinding charge with curved surface can be realized.
The purpose of the present invention and advantage be key element for illustrating in usage right claim and combinations thereof embodied from
And reach.The simply simple illustration of above-mentioned usual description and both descriptions of greater detail below and explanation, should
It is interpreted as which and is not as claims limiting the present invention like that.
Description of the drawings
(a) of Fig. 1 is the axonometric chart of the grinding pad of the 1st embodiment of the present invention, and (b) of Fig. 1 is shown in Fig. 1 (a)
Grinding pad A-A sectional views.
(a) of Fig. 2 is the explanatory diagram of the surface configuration of the grinding charge before grinding, and (b) of Fig. 2 is the throwing as comparative example
The explanatory diagram of the surface configuration of the grinding charge after light attrition process, after (c) of Fig. 2 is the grinding pad grinding using Fig. 1 (a)
Grinding charge surface configuration explanatory diagram, (d) of Fig. 2 is the explanatory diagram of the surface configuration of the grinding charge after 2 grindings.
(a) of Fig. 3 is the top view of the grinding pad of the 2nd embodiment of the present invention, and (b) of Fig. 3 is shown in Fig. 3 (a)
Grinding pad A-A sectional views.
(a) of Fig. 4 is the sectional view of the 1st variation of the grinding pad shown in Fig. 3 (a), and (b) of Fig. 4 is Fig. 3 (a)
The sectional view of the 2nd variation of shown grinding pad.
(a) of Fig. 5 is the top view of the 3rd variation of the grinding pad shown in Fig. 3 (a), and (b) of Fig. 5 is Fig. 5 (a)
The A-A sectional views of shown grinding pad.
Fig. 6 is the figure of the configuration example of the automatic grinding device for representing the grinding pad using embodiments of the invention.
Specific embodiment
Hereinafter, embodiments of the present invention are described in detail with reference to accompanying drawings.
1. the 1st embodiment
In the 1st embodiment, using the grinding pad with the abradant surface formed by hard resin layer, to curved surface
The surface of grinding charge is ground.The grinding pad has to be made to follow grinding charge by the abradant surface that hard resin layer is formed
The construction of curved surface.Grinding charge can for example be the resin-coated face with curved surface.Resin-coated face can for example be vehicle etc.
Vehicle body application face.
The construction for making the curved surface that the abradant surface of grinding pad follows grinding charge can for example be comprising forming abradant surface
Hard resin layer and support the hard resin layer soft resin layer double-layer structural.Grinding charge is pressed against in abradant surface
In the case of curved surface, by making soft resin layer and curved surface adaptably deform so that hard resin layer bends, and then makes to grind
Flour milling follows the curved surface of grinding charge.
The construction for making the curved surface that the abradant surface of grinding pad follows grinding charge can also be constructed as below：By using bullet
Property member supporting hard resin layer, in the case of the curved surface of grinding charge is pressed against in abradant surface, becomes elastic component
Shape, so that the hard resin layer for forming abradant surface is adaptably bent with curved surface.
Hereinafter, the grinding pad for the 1st embodiment has comprising the hard resin layer and supporting for forming abradant surface that this is hard
The situation of the double-layer structural of the soft resin layer of matter resin bed is illustrated.In addition, in the following description, abradant surface will be formed
Hard resin layer be simply designated as " hard resin layer ", by supporting hard resin layer soft resin layer be simply designated as it is " soft
Matter resin bed ".
Hereinafter, explain the 1st embodiment.
1-1. is with regard to grinding pad
With reference to (a) and (b) of Fig. 1 of Fig. 1.Grinding pad 10 has comprising hard resin layer 40 and soft resin layer 50
Double-layer structural.Hard resin layer 40 forms the abradant surface 30 of grinding pad 10.Soft resin layer 50 supports hard resin layer 40, and
Adaptably deform with curved surface in the case where abradant surface 30 is pressed against the curved surface of grinding charge.Therefore, hard resin layer 40
Bend along curved surface, make abradant surface 30 follow the curved surface of grinding charge.
1-2. is with regard to hard resin layer
The A hardness that the hardness of hard resin layer 40 is defined to JIS K 6253 counting, preferably more than 50 degree, further
Preferably more than 60 degree.Further it is preferred that the hardness of hard resin layer 40 is less than 95 degree.For example, it is preferable that, hard
The hardness of resin bed 40 is more than 60 degree and less than 80 degree, or is preferably, the hardness of hard resin layer 40 for more than 85 degree and
Less than 95 degree.Using such scope, it is difficult to become contour grinding (day using grinding of the grinding pad 10 to the curved surface of grinding charge
Text：な ら い grind), the fluctuating on the surface of grinding charge can be removed.
The thickness of hard resin layer 40 is not particularly limited, but preferably below 3.0mm.Further it is preferred that hard tree
The thickness of lipid layer 40 is more than 0.5mm.Using such scope, make hard resin layer 40 easily abradant surface 30 be pressed against by
Curved surface in the case of the curved surface of abrasive material along grinding charge bends, it is possible to increase curved surface of the abradant surface 30 for grinding charge
Tracing ability.Therefore, it is possible to remove the fluctuating component of the surface configuration of grinding charge, and make connecing between abradant surface 30 and curved surface
Contacting surface product increases, and improves grinding efficiency.
The material of hard resin layer 40 is not particularly limited, as long as the material with above-mentioned hardness.Hard resin
The material of layer 40 can for example be polyurethane foaming body or non-woven fabrics.The material of hard resin layer 40 can also for example be A hardness
For more than 60 degree and less than 80 degree of non-woven fabrics, the polyurethane foaming body that A hardness is more than 85 degree and less than 95 degree is can also be.
1-3. is with regard to soft resin layer
Preferably, the E hardness that the hardness of soft resin layer 50 is defined to JIS K 6253 is being calculated as less than 30 degree.Adopt
Such scope is used, soft resin layer 50 is easily deformed in the case where abradant surface 30 is pressed against the curved surface of grinding charge.
As a result, hard resin layer 40 is bent readily along the curved surface of grinding charge, it is possible to increase abradant surface 30 is for grinding charge
The tracing ability of curved surface.Therefore, it is possible to remove the fluctuating component of the surface configuration of grinding charge, and make between abradant surface 30 and curved surface
Contact area increase, improve grinding efficiency.
The thickness of soft resin layer 50 is not particularly limited, but preferably more than 5.0mm.And, soft resin layer 50
Thickness is preferably below 50mm.Using such scope, can abradant surface 30 be pressed against grinding charge curved surface situation
Under, it is ensured that the deflection of soft resin layer 50 and the deflection of hard resin layer 40.
The material of soft resin layer 50 is not particularly limited, as long as the material with above-mentioned hardness.Soft resin
The material of layer 50 can for example be the foamed resins such as polyurethane foaming body or foam polyethylene.
Effects of the 1-4. with regard to the 1st embodiment
The grinding pad 10 of the 1st embodiment is with the abradant surface 30 formed by hard resin layer 40.Therefore, grind with soft
Flour milling is compared, and the grinding on the surface of grinding charge is difficult to become contour grinding.As a result, the surface shape of grinding charge can be removed
The fluctuating component of shape.
And, the grinding pad 10 of the 1st embodiment has the construction of the curved surface for making abradant surface 30 follow grinding charge.Cause
This, is as abradant surface 30 follows the curved surface of grinding charge, therefore, it is possible to remove the fluctuating component of the surface configuration of grinding charge,
And increase the contact area that abradant surface 30 is contacted with the grinding charge with curved surface such that it is able to improve grinding efficiency, and
The time required for the grinding to larger grinding charge can be shortened.
With reference to (d) of (a)～Fig. 2 of Fig. 2.(a) of Fig. 2 schematically shows the surface configuration of the grinding charge before grinding
Profile (Profile).The fluctuating relatively low with frequency of rough surface composition that surface configuration before grinding has frequency higher into
Point.
The profile of surface configuration of grinding charge after polishing grinding is processed by (b) of Fig. 2 is exemplified as comparing.Throwing
In light attrition process, the hardness of abrasive cloth becomes contour grinding than relatively low.Therefore, although rough surface composition can be removed, but
Fluctuating component can be also remained after grinding.
(c) of Fig. 2 schematically shows the surface shape of the grinding charge after grinding using the grinding pad 10 of the 1st embodiment
The profile of shape.Due to forming abradant surface 30 using hard resin layer 40, therefore the grinding on the surface of grinding charge is difficult to become imitative
Shape is ground.Therefore, it is possible to remove the fluctuating component of the surface configuration of grinding charge.
In the case of trickle rough surface composition will be removed after being ground using grinding pad 10, can utilize
After grinding pad 10 carries out 1 grinding, carry out 2 times for removing rough surface composition and grind.The schematic earth's surfaces of (d) of Fig. 2
Show the profile of the surface configuration of the grinding charge after 2 grindings.The grinding that carries out by using grinding pad 10 and ensuing 2 times
Grinding, can remove the rough surface on the surface of grinding charge and rise and fall both.
2. the 2nd embodiment
Then, illustrate the 2nd embodiment of the present invention.Groove is formed in the abradant surface of the grinding pad of the 2nd embodiment.Pass through
Groove is formed in abradant surface so that abradant surface follow in the case of the curved surface of grinding charge is easily pressed against in abradant surface by
The curved surface of abrasive material.
Can also be the groove for being formed at abradant surface with the depth that hard resin layer is divided into many parts.By using groove
Segmentation hard resin layer so that hard resin layer can in the case where abradant surface is pressed against the curved surface of grinding charge with song
Face is suitably along abutting direction displacement.Therefore, abradant surface easily follows the curved surface of grinding charge.
Such groove is not particularly limited, and for example, can be formed in the following way, i.e.,：Formed comprising hard resin
After the double-layer structural of layer and soft resin layer, the part resin bed formed by groove is removed by etching etc..In addition, can
Formed in the following way, i.e.,：After double-layer structural is formed, the cutting knife of the circle of rotation at a high speed is made to press with ormal weight
It is inswept in one edge pad surface of pad.
Can also be that the groove that hard resin layer is divided into many parts is also formed in into soft resin layer.By in soft resin
Layer also forms groove so that hard resin layer is easier the displacement in the case where abradant surface is pressed against the curved surface of grinding charge, makes
Abradant surface 30 easily follows the curved surface of grinding charge.
The form of 2-1. grooves
With reference to (a) and (b) of Fig. 3 of Fig. 3.To with the element mark identical with (a) of Fig. 1 identical function
Reference.The 1st groove 31 and the 2nd groove 32 are formed with the abradant surface 30 of grinding pad 10.1st groove 31 is along on abradant surface 30
1st direction extends, and the 2nd groove 32 extends along the 2nd direction orthogonal with the 1st direction on abradant surface 30.By in abradant surface 30
Multiple 1st grooves 31 and multiple 2nd grooves 32 are formed, so that groove is formed at abradant surface 30 in clathrate.
The depth of the 1st groove 31 and the 2nd groove 32 can be identical with the thickness of hard resin layer 40.I.e., it is possible to utilize the 1st groove
Hard resin layer 40 is divided into many parts by the 31 and the 2nd groove 32.And, the 1st groove 31 and the 2nd groove 32 are only formed at hard resin
Layer 40, is not formed at soft resin layer 50.
Preferably, the groove width of the 1st groove 31 and the 2nd groove 32 is such as more than 0.5mm.And, it is preferred that the 1st groove
The groove width of the 31 and the 2nd groove 32 is such as below 5.0mm.Using such scope, can be caused by suppressing by being formed of groove
While the reduction of the contact area between abradant surface 30 and grinding charge, it is ensured that be pressed against grinding charge in abradant surface 30
The displacement of the hard resin layer 40 in the case of curved surface simultaneously makes abradant surface 30 easily bend.
Preferably, the spacing of the spacing and the 2nd groove 32 of the 1st groove 31 is such as more than 5.0mm.Further it is preferred that
The spacing of the spacing and the 2nd groove 32 of the 1st groove 31 is such as below 50mm.
Using such scope, contact that can be caused by suppressing by being formed of groove between abradant surface 30 and grinding charge
While the reduction of area, it is ensured that 30 entirety of abradant surface in the case where abradant surface 30 is pressed against the curved surface of grinding charge
Deflection.
The size of above-mentioned groove width and spacing is adopted in the 1st variation～the 3rd variation of following explanation similarly.
2-2. is with regard to the 1st variation
With reference to (a) of Fig. 4.The depth of the 1st groove 31 and the 2nd groove 32 can also be more shallow than the thickness of hard resin layer 40.That is,
Do not utilize the 1st groove 31 and the 2nd groove 32 that hard resin layer 40 is divided into many parts, the part of the 1st groove 31 and the 2nd groove 32 it is hard
Thickness of thin of the thickness of matter resin bed 40 than other parts.As the rigidity of the part of the 1st groove 31 and the 2nd groove 32 is reduced, because
This hard resin layer 40 easily bends.Therefore, abradant surface 30 easily follows the curved surface of grinding charge.
2-3. is with regard to the 2nd variation
With reference to (b) of Fig. 4.The depth of the 1st groove 31 and the 2nd groove 32 can also be than the thickness depth of hard resin layer 40.That is,
1st groove 31 and the 2nd groove 32 can also be formed at hard resin layer 40 and soft resin layer 50.Therefore, support hard resin
The bearing-surface 51 of the soft resin layer 50 of layer 40 is also split by the 1st groove 31 and the 2nd groove 32.Many parts of hard resin layers being divided into
40 are supported respectively by many parts of bearing-surfaces 51 being divided into.
As the 1st groove 31 and the 2nd groove 32 are also formed under soft resin layer 50, therefore the rigidity of soft resin layer 50
Drop, makes soft resin layer 50 easily adaptably become with curved surface in the case where abradant surface 30 is pressed against the curved surface of grinding charge
Shape.The bearing-surface 51 for being additionally, since supporting hard resin layer 40 is divided, therefore the restraining forceies between bearing-surface 51 decline, point
The hard resin layer 40 being cut into easily independently displacement each other.Therefore, abut the displacement quantitative change of the hard resin layer 50 on direction
Greatly, abradant surface 30 easily follows the curved surface of grinding charge.
2-4. is with regard to the 3rd variation
With reference to (a) and (b) of Fig. 5 of Fig. 5.The 1st groove 31 is simply formed with abradant surface 30, without the 2nd groove 32 of formation.It is logical
Cross and multiple 1st grooves 31 are formed in abradant surface 30, so as to groove is formed at abradant surface 30 in striated.
The depth of the 1st groove 31 can be than the thickness depth of hard resin layer 40.That is, the 1st groove 31 can also be formed at hard tree
Lipid layer 40 and soft resin layer 50.Therefore, the bearing-surface 51 of soft resin layer 50 of hard resin layer 40 is supported also by the 1st groove
31 segmentations.Many parts of hard resin layers 40 being divided into are supported respectively by many parts of bearing-surfaces 51 being divided into.In addition, the 1st groove 31
Depth both can it is identical with the thickness of hard resin layer 40 can also be more shallow than the thickness of hard resin layer 40.
By omitting the 2nd groove 32 groove in the formation striated of abradant surface 30, it is possible to increase the intensity of abradant surface, and energy
It is enough to reduce forming the man-hour of groove and contributing to cost degradation.And, by also forming the 1st groove 31 in hard resin layer 40, so as to
The decline of the tracing ability due to not forming the caused abradant surface 30 of the 2nd groove 32 extended along the 2nd direction institute can be mitigated.
3. with regard to Ginding process
It is not particularly limited using the structure of the lapping device of grinding pad 10, Ginding process.For example, it is also possible to be to grind
Pad 10 is arranged on hand polish machine (Japanese：Ha Application De Port リ ッ シ ャ) top, grinding with curved surface grinding charge table
Used in the manual work in face.Moreover, it can be, grinding pad 10 is in grinding that the automatic grinding device using following explanation is carried out
Used in mill process.
The configuration example of 3-1. automatic grinding devices
With reference to Fig. 6.Automatic grinding device 1 has mechanical arm 2, grinding pad 10, milling tool 4, pressing detection portion 5 and control
Device processed 7.Reference 90 represents grinding charge.Grinding charge 90 can for example be surface by the car of resin-coated automobile etc.
Body.Mechanical arm 2 has multiple joints 20,21 and 22, can make to be provided with grinding pad 10, milling tool 4 and pressing detection
The top ends 23 in portion 5 are moved to multiple directions.
Milling tool 4 is installed on top ends 23 by pressing detection portion 5, can make grinding pad 10 using built-in driver part
To be rotated as rotation axiss direction perpendicular to the direction of abradant surface 30.The movement and utilization of 7 control machinery arm 2 of controller is ground
The rotation of the grinding pad 10 that grinder tool 4 is realized.From grinding agent feed mechanism (not shown) to grinding pad 10 with grinding charge 90 it
Between supply grinding agent.Grinding pad 10 is pressed against the surface of grinding charge 90 using mechanical arm 2 and revolves grinding pad 10 by controller 7
Turn, thus grind the surface of grinding charge 90.
Pressing force of the detection abradant surface 30 of pressing detection portion 5 for grinding charge 90.Can also be that controller 7 is according to pressing
The testing result of pressure test section 5 is adjusting the power that abradant surface 30 is pressed on grinding charge 90.Can also be, controller 7 with
By abradant surface 30 for grinding charge 90 pressing force remain it is constant in the state of make abradant surface 30 in the table of grinding charge 90
The mode control machinery arm 2 of face movement.
Can also be, in the case of trickle rough surface composition will be removed after being ground using grinding pad 10,
Carry out 2 times for removing rough surface composition to grind.In this case, after being ground using grinding pad 10, change
The grinding pad of milling tool 4 is installed on, is ground using the grinding pad with relatively low hardness compared with grinding pad 10 and is ground
The surface of thing 90.
3-2. is with regard to grinding agent
Illustrate for the example of the grinding agent used in above-mentioned Ginding process.
As grinding agent, the slurry containing abrasive particle can be used, the abrasive particle is chosen from following particles, i.e.,：
By the oxidation of the silicon such as silicon dioxide, aluminium oxide, cerium oxide, titanium dioxide, zirconium oxide, ferrum oxide and manganese oxide or metallic element
The particle that thing is formed, the organic filler formed by thermoplastic resin, or organo-mineral complexing particle etc..
Preferably, such as grinding agent is using the oxidation aluminium paste that can realize high grinding rate and easily can start with
Material.
For aluminium oxide, there is the crystal habits such as Alpha-alumina, beta-alumina, gama-alumina, θ-aluminium oxide
Different aluminium oxidies, and also there is the aluminium compound for being referred to as water and aluminium oxide.From from the viewpoint of grinding rate, with α-
Aluminium oxide for main constituent abrasive particle more preferably.
The mean diameter of abrasive particle is preferably more than 0.1 μm, more preferably more than 0.3 μm.As mean diameter becomes big, grinding
Speed is improved.Mean diameter within the above range in the case of, easily bring up to grinding rate special in actual use
Unsuitable level.
In addition, mean diameter is preferably less than 10.0 μm, more preferably less than 5.0 μm.As mean diameter diminishes, grinding
The dispersion stabilization of agent is improved, and can suppress to produce the scratch of abradant surface.
Mean diameter within the above range in the case of, easily make the table of the dispersion stabilization and abradant surface of grinding agent
Face precision brings up to level specially suitable in actual use.In addition, the mean diameter of abrasive particle can utilize pore electric-resistivity method
(measuring machine：Multisizer3 type Kurt grain size analyses calculating instrument BECKMAN COULTER companies manufacture) measure.
The amount of the abrasive particle in grinding agent is preferably more than 0.1 mass %, more than more preferably 0.2 mass %, enters one
Step is preferably more than 0.5 mass %.As abrasive particle is more containing quantitative change, grinding rate is improved.It is in the amount of abrasive particle
In the case of in the range of stating, grinding rate is easily made to bring up to level specially suitable in actual use.
And, the amount of abrasive particle is preferably below 50 mass %, below more preferably 25 mass %, more preferably
20 mass %.Abrasive particle amount within the above range in the case of, the cost of grinding agent can be suppressed.And, can
Further suppress to produce surface defect on the surface of grinding object thing after being ground using grinding agent.
Grinding agent can also contain lubricating oil, organic solvent, surface work in addition to above-mentioned abrasive particle as suitably desired
The other compositions such as property agent, thickening agent.
Lubricating oil can be artificial oil, mineral oil, vegetative grease or combinations thereof.
Organic solvent can be alcohol in addition to hydrocarbon series solvent, ether, glycols, glycerol etc..
Surfactant can be so-called anion surfactant, cationic surfactant, non-ionic surface work
Property agent, amphoteric surfactant.
It is thickening agent, cellulose-based thickeners or natural system's thickening agent that thickening agent can be synthesis.
3-3. is ground with regard to 2 times
The hardness of the grinding pad used in 2 grindings is preferably shorter than the hardness of hard resin layer 40.Make in 2 grindings
With grinding pad hardness for example by A hardness come in terms of be preferably less than 50 degree, more preferably less than 40 degree.And, grind at 2 times
Used in grinding pad hardness be preferably more than 30 degree.Using such scope, can remove grinding charge surface it is thin
Micro- rough surface composition.
The material of the grinding pad used in 2 grindings is not particularly limited, as long as the material with above-mentioned hardness is
Can.The material of the grinding pad used in 2 grindings can for example be non-woven fabrics or suede.For example, used in 2 grindings
The material of grinding pad can be being calculated as the suede of more than 30 degree and less than 40 degree with A hardness.
Grinding pad used in 2 grindings can also have double-layer structural in the same manner as grinding pad 10.I.e., it is also possible to
It is that the grinding pad used in 2 grindings has the ratio of the 1st layer comprising the comparison hard for forming abradant surface and the 1st layer of supporting
The double-layer structural of the 2nd layer of softer.
Preferably, hardness of the 1st layer of the hardness less than the hard resin layer 40 of grinding pad 10.1st layer of hardness is for example
By A hardness come in terms of be preferably less than 50 degree, more preferably less than 40 degree.And, the 1st layer of hardness is preferably more than 30 degree.
1st layer of thickness is preferably below 3.0mm.And, the 1st layer of thickness is preferably more than 0.5mm.Using such
Scope, bends the 1st layer of curved surface easily in the case where abradant surface is pressed against the curved surface of grinding charge along grinding charge,
The contact area between abradant surface and curved surface can be increased, grinding efficiency is improved.
1st layer of material is not particularly limited, as long as the material with above-mentioned hardness.1st layer of material is for example
Can be non-woven fabrics or suede.For example, the 1st layer of material can be being calculated as more than 30 degree and less than 40 degree with A hardness
Suede.
2nd layer of structure can be identical with the structure of the soft resin layer 50 of grinding pad 10.
Can also be that the abradant surface of the grinding pad used in 2 grindings is also same with the grinding pad 10 of the 2nd embodiment
Be formed with groove.
4. embodiment
By thickness be 1.5mm, material be that polyurethane foaming body and A hardness are 90 hard resin layer and thickness is
30.0mm, material are that the soft resin that polyurethane foaming body and E hardness are 20 is gathered into folds layer by layer so as to form grinding pad, are carried out
Grinding to resin-coated face.After double-layer structural is formed, by will the at a high speed circle of rotation cutting knife with ormal weight
Press on that one edge pad surface of pad is inswept, so that width 2.0mm, spacing 20.0mm, depth 3.0mm are formed in hard resin layer
Cancellate groove.And, alumina slurry has been used as grinding agent.
As a result, can realize arithmetic average rise and fall (Wa) be less than 0.05 μm, the maximum fluctuating (Wcm) of filtering be 0.3 μm
The polish of following flat glassy surface.
All of example and the purpose being intended on moral of conditionality term that here is recorded, with reader
Give a hand during the concept for understanding the present invention and the development for technology and being given by inventor, be construed that it is of the invention not
It is limited to the above-mentioned example and condition of concrete record and this theory related to the content of the priority and inferior quality property that represent the present invention
The structure of the example in bright book.Although being described in detail by embodiments of the invention, but it is understood that being without departing from the present invention
Spirit and scope on the premise of, which can be carried out various changes, displacement and amendment.
Description of reference numerals
1 automatic grinding device
2 mechanical arms
4 milling tools
5 pressing detection portions
7 controllers
10 grinding pads
30 abradant surfaces
31 the 1st grooves
32 the 2nd grooves
40 hard resin layers
50 soft resin layers
51 bearing-surfaces
Claims (5)
1. a kind of grinding pad, it is characterised in that
The grinding pad with the abradant surface formed by hard resin layer, and with the song for making the abradant surface follow grinding charge
The construction in face.
2. grinding pad according to claim 1, it is characterised in that
Make the construction that the abradant surface follows the curved surface of the grinding charge be comprising the hard resin layer and
Support the double-layer structural of the soft resin layer of the hard resin layer.
3. grinding pad according to claim 1 and 2, it is characterised in that
Groove is formed with the abradant surface.
4. grinding pad according to claim 3, it is characterised in that
The hard resin layer is divided into many parts by the groove.
5. grinding pad according to claim 4, it is characterised in that
The groove is also formed into the soft resin layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-172978 | 2014-08-27 | ||
| JP2014172978A JP2016047566A (en) | 2014-08-27 | 2014-08-27 | Polishing pad |
| PCT/JP2015/003854 WO2016031143A1 (en) | 2014-08-27 | 2015-07-30 | Polishing pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106660190A true CN106660190A (en) | 2017-05-10 |
Family
ID=55399064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580045399.8A Pending CN106660190A (en) | 2014-08-27 | 2015-07-30 | Polishing pad |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20170252892A1 (en) |
| EP (1) | EP3195979A4 (en) |
| JP (1) | JP2016047566A (en) |
| CN (1) | CN106660190A (en) |
| TW (1) | TW201628786A (en) |
| WO (1) | WO2016031143A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3421174B1 (en) | 2016-02-26 | 2023-08-09 | Fujimi Incorporated | Polishing method |
| US20210347007A1 (en) * | 2018-09-28 | 2021-11-11 | Fujimi Incorporated | Polishing pad and polishing method using same |
| USD1004393S1 (en) * | 2021-11-09 | 2023-11-14 | Ehwa Diamond Industrial Co., Ltd. | Grinding pad |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
| TW380078B (en) * | 1997-11-25 | 2000-01-21 | Speedfam Co Ltd | Surface polishing pad |
| CN1254441A (en) * | 1997-04-30 | 2000-05-24 | 美国3M公司 | Method of planarizing upper surface of semiconductor wafer |
| JP2002283220A (en) * | 2001-03-23 | 2002-10-03 | Nippon Electric Glass Co Ltd | Polishing device for glass articles |
| JP2005131720A (en) * | 2003-10-29 | 2005-05-26 | Toray Ind Inc | Method of manufacturing polishing pad |
| CN101080305A (en) * | 2004-12-16 | 2007-11-28 | 3M创新有限公司 | Resilient structured sanding article |
| JP5292958B2 (en) * | 2007-07-18 | 2013-09-18 | 東レ株式会社 | Polishing pad |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001038589A (en) * | 1999-08-03 | 2001-02-13 | Speedfam Co Ltd | Polishing device for outer peripheral part of work |
| TWI228768B (en) * | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
| JP2008062367A (en) * | 2006-09-11 | 2008-03-21 | Nec Electronics Corp | Polishing device, polishing pad, and polishing method |
| EP2732916A1 (en) * | 2011-07-15 | 2014-05-21 | Toray Industries, Inc. | Polishing pad |
| EP2757578A4 (en) * | 2011-09-15 | 2015-05-20 | Toray Industries | Polishing pad |
| JP6188286B2 (en) * | 2012-07-13 | 2017-08-30 | スリーエム イノベイティブ プロパティズ カンパニー | Polishing pad and glass, ceramics, and metal material polishing method |
| TWI516373B (en) * | 2014-01-17 | 2016-01-11 | 三芳化學工業股份有限公司 | Polishing pad, polishing apparatus and method for manufacturing polishing pad |
| JP2015150635A (en) * | 2014-02-13 | 2015-08-24 | 株式会社東芝 | Polishing cloth and method for manufacturing polishing cloth |
| TWI597125B (en) * | 2014-09-25 | 2017-09-01 | 三芳化學工業股份有限公司 | Polishing pad and method for making the same |
| US9630293B2 (en) * | 2015-06-26 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad composite polishing layer formulation |
-
2014
- 2014-08-27 JP JP2014172978A patent/JP2016047566A/en active Pending
-
2015
- 2015-07-30 EP EP15837016.3A patent/EP3195979A4/en not_active Withdrawn
- 2015-07-30 WO PCT/JP2015/003854 patent/WO2016031143A1/en active Application Filing
- 2015-07-30 US US15/504,793 patent/US20170252892A1/en not_active Abandoned
- 2015-07-30 CN CN201580045399.8A patent/CN106660190A/en active Pending
- 2015-08-20 TW TW104127178A patent/TW201628786A/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
| CN1254441A (en) * | 1997-04-30 | 2000-05-24 | 美国3M公司 | Method of planarizing upper surface of semiconductor wafer |
| TW380078B (en) * | 1997-11-25 | 2000-01-21 | Speedfam Co Ltd | Surface polishing pad |
| JP2002283220A (en) * | 2001-03-23 | 2002-10-03 | Nippon Electric Glass Co Ltd | Polishing device for glass articles |
| JP2005131720A (en) * | 2003-10-29 | 2005-05-26 | Toray Ind Inc | Method of manufacturing polishing pad |
| CN101080305A (en) * | 2004-12-16 | 2007-11-28 | 3M创新有限公司 | Resilient structured sanding article |
| JP5292958B2 (en) * | 2007-07-18 | 2013-09-18 | 東レ株式会社 | Polishing pad |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3195979A1 (en) | 2017-07-26 |
| TW201628786A (en) | 2016-08-16 |
| WO2016031143A1 (en) | 2016-03-03 |
| JP2016047566A (en) | 2016-04-07 |
| US20170252892A1 (en) | 2017-09-07 |
| EP3195979A4 (en) | 2017-09-20 |
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