CN106583942B - Wafer marking mechanism - Google Patents
Wafer marking mechanism Download PDFInfo
- Publication number
- CN106583942B CN106583942B CN201710031013.9A CN201710031013A CN106583942B CN 106583942 B CN106583942 B CN 106583942B CN 201710031013 A CN201710031013 A CN 201710031013A CN 106583942 B CN106583942 B CN 106583942B
- Authority
- CN
- China
- Prior art keywords
- bracket
- sliding
- mark
- sliding block
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of wafer marking mechanisms, including pedestal, bracket, feed intake box and grasping mechanism, the bracket is mounted on the base end, the pedestal upper end is equipped with the mark platform of multiple word orders, the box that feeds intake is set on described bracket one end and is mounted on the base, dressing plate is additionally provided between the bracket and the box that feeds intake, pedestal upper end side is additionally provided with to be set on first sliding rail with the bracket the first sliding rail disposed in parallel, the grasping mechanism.The wafer marking mechanism, mark can be carried out to various sizes of wafer by replacement support plate, and mark can be carried out to the different location of wafer and being sequentially placed on different mark platforms to larger-size wafer, the continuity of mark in this way is more preferable, it improves work efficiency, reduces production cost.
Description
Technical field
The present invention relates to wafer mark field more particularly to a kind of wafer marking mechanisms.
Background technique
Existing wafer mark is all to carry out mark to a product simultaneously by double excitation, and pass through manipulator to product
The seat that holds picked and placed, this mode is waiting for a long time, and low efficiency increases production cost.
Summary of the invention
In order to solve the problems in the prior art, the present invention provides a kind of wafer marking mechanisms.
The present invention provides a kind of wafer marking mechanism, including pedestal, bracket, feed intake box and grasping mechanism, the bracket
It is mounted on the base end, the pedestal upper end is equipped with the mark platform of multiple word orders, and the box that feeds intake is set to described
It bracket one end and is mounted on the base, is additionally provided with dressing plate between the bracket and the box that feeds intake, on the pedestal
End side is additionally provided with to be set on first sliding rail with the bracket the first sliding rail disposed in parallel, the grasping mechanism.
As a further improvement of the present invention, the pedestal upper end other side is additionally provided with and the bracket disposed in parallel
Two sliding rails are additionally provided with testing agency on second sliding rail.
As a further improvement of the present invention, the pedestal lower end is equipped with laser corresponding with the mark position of platform
And light path system.
As a further improvement of the present invention, the box lower end that feeds intake is equipped with elevating mechanism.
As a further improvement of the present invention, the grasping mechanism include the first sliding block on first sliding rail,
The second sliding block set on first upper end of slide block and the supporting plate set on second upper end of slide block, first sliding block being capable of edge
First sliding rail is mobile in X-direction, and second sliding block can be moved along first sliding block in Y direction, the support
Plate can move in the Z-axis direction along second sliding block.
As a further improvement of the present invention, the mark platform is equipped with support plate, the support plate and the mark
To be detachably connected between platform, the mark platform edges are equipped with positioning pin, and the support plate edge is equipped with and the positioning
Sell the location hole of adaptation.
As a further improvement of the present invention, pressing plate is additionally provided on the mark platform, the pedestal lower end is equipped with and is used for
The fixation cylinder of the fixed pressing plate.
As a further improvement of the present invention, the testing agency includes correction CCD and sliding equipment, described sliding machine
Structure is set to second sliding rail upper end, and the correction CCD is set on the sliding equipment.
As a further improvement of the present invention, the sliding equipment includes that can slide along the third that second sliding rail slides
Block and the Four-slider that can be slided along the third sliding block, the glide direction of the Four-slider and the third sliding block are mutual
Vertically.
The beneficial effects of the present invention are: the wafer marking mechanism, it can be by replacement support plate come to various sizes of crystalline substance
Circle carries out mark, and can to larger-size wafer and being sequentially placed on different mark platforms to the different positions of wafer
Carry out mark is set, the continuity of such mark is more preferable, improves work efficiency, and reduces production cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of wafer marking mechanism of the present invention；
Fig. 2 is the structural schematic diagram of another angle of wafer marking mechanism of the present invention；
Fig. 3 is the structural schematic diagram of the another angle of wafer marking mechanism of the present invention；
Fig. 4 is the structural schematic diagram of the mark platform of wafer marking mechanism of the present invention；
Fig. 5 is the structural schematic diagram of the box that feeds intake of wafer marking mechanism of the present invention；
Fig. 6 is the structural schematic diagram of the dressing plate of wafer marking mechanism of the present invention；
Fig. 7 is the structural schematic diagram of the grasping mechanism of wafer marking mechanism of the present invention；
Fig. 8 is the structural schematic diagram of the testing agency of wafer marking mechanism of the present invention.
Appended drawing reference: 1- pedestal 2- bracket 3- feeds intake box 4- grasping mechanism 5- dressing plate 6- testing agency 7-
One the second sliding rail of sliding rail 8- 9- elevating mechanism 11- light path system 12- fixes cylinder 21- mark platform 211- support plate
212- pressing plate.
Specific embodiment
As shown in Figures 1 to 8, the invention discloses a kind of wafer marking mechanism, including pedestal 1, bracket 2, feed intake box 3 and
Grasping mechanism 4, the bracket 2 are mounted on 1 upper end of pedestal, and the mark that 2 upper end of bracket is equipped with multiple word orders is flat
Platform 21 is four mark platforms 21 in the present embodiment, and the box 3 that feeds intake is set on described 2 one end of bracket and is mounted on the pedestal
On 1, it is used for feeding, dressing plate 5 is additionally provided between the bracket 2 and the box 3 that feeds intake, the dressing plate 5 is equipped with positioning
CCD is used for coarse positioning, and the 1 upper end side of pedestal is additionally provided with and the bracket 2 first sliding rail 7 disposed in parallel, the crawl
Mechanism 4 is set on first sliding rail 7, the product to feed intake in box 3 can be placed sequentially in mark sample platform, continuity is more
It is good, substantially increase production efficiency.
The 1 upper end other side of pedestal is additionally provided with and the bracket 2 second sliding rail 8 disposed in parallel, second sliding rail 8
On be additionally provided with testing agency 6, second testing agency 6 includes correction CCD and sliding equipment, and the sliding equipment is set to described
Second sliding rail, 8 upper end, the correction CCD are set on the sliding equipment, carry out fine positioning correction to product.
2 lower end of bracket be equipped with laser corresponding with 21 position of mark platform and light path system 11, for pair
Product on bracket 2 carries out mark.
3 lower end of box that feeds intake can be convenient the pick-and-place to product equipped with elevating mechanism 9.
The grasping mechanism 4 includes the first sliding block being set on first sliding rail 7, set on first upper end of slide block
Second sliding block and supporting plate set on second upper end of slide block, first sliding block can be along first sliding rails 7 in X-direction
Mobile, second sliding block can be moved along first sliding block in Y direction, and the supporting plate can exist along second sliding block
It moves in Z-direction, is carried out so as to make supporting plate take product to be then placed sequentially on multiple mark platforms 21 from the box 3 that feeds intake
Mark, entire mark process is more coherent, more efficient.
The mark platform 21 is equipped with support plate 211, is removable between the support plate 211 and the mark platform 21
Connection is unloaded, 21 edge of mark platform is equipped with positioning pin, and 211 edge of support plate is equipped with to be determined with what the positioning pin was adapted to
Position hole, the support plate 211 can be replaced, be adapted to various sizes of product wafer in this way, realize different marks
Position is replaced simple to operation.
Pressing plate 212 is additionally provided on the mark platform 21,2 lower end of bracket is equipped with for fixing the pressing plate 212
Fixed cylinder 12 can carry out product effectively fixed.
The sliding equipment include can along second sliding rail 8 slide third sliding block and can be along the third sliding block
The Four-slider of sliding, the glide direction of the Four-slider and the third sliding block are mutually perpendicular to.
When work, grasping mechanism 4, which is removed product out of feed intake box 3 and is then placed on dressing plate 5, carries out angle correction,
Then it is placed on mark platform 21 by grasping mechanism 4 again, takes out product after the completion of mark, then repeat the above steps and successively exist
Product is placed on each mark platform 21 and carries out mark simultaneously, and not only work efficiency is high, but also mechanism work continuity is more
It is good, it withouts waiting for, grasping mechanism 4 remains working condition.
The configuration of the present invention is simple carries out mark to various sizes of wafer by replacement support plate 211, and can be right
Larger-size wafer carries out mark, such mark to the different location of wafer and being sequentially placed on different mark platforms 21
Continuity it is more preferable, improve work efficiency, reduce production cost.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (8)
1. a kind of wafer marking mechanism, it is characterised in that: including pedestal, bracket, feed intake box and grasping mechanism, the bracket installation
It holds on the base, the pedestal upper end is equipped with the mark platform of multiple word orders, and the box that feeds intake is set on the bracket
It one end and is mounted on the base, dressing plate, the pedestal upper end one is additionally provided between the bracket and the box that feeds intake
Side is additionally provided with to be set on first sliding rail with the bracket the first sliding rail disposed in parallel, the grasping mechanism, the mark
Platform is equipped with support plate, is detachably connected between the support plate and the mark platform, the mark platform edges are set
There is positioning pin, the support plate edge is equipped with the location hole being adapted to the positioning pin.
2. wafer marking mechanism according to claim 1, it is characterised in that: the pedestal upper end other side is additionally provided with and institute
Bracket the second sliding rail disposed in parallel is stated, is additionally provided with testing agency on second sliding rail.
3. wafer marking mechanism according to claim 1, it is characterised in that: the pedestal lower end is equipped with flat with the mark
The corresponding laser in platform position and light path system.
4. wafer marking mechanism according to claim 1, it is characterised in that: the box lower end that feeds intake is equipped with elevating mechanism.
5. wafer marking mechanism according to claim 1, it is characterised in that: the grasping mechanism includes being set to described first
The first sliding block on sliding rail, the second sliding block set on first upper end of slide block and the supporting plate set on second upper end of slide block,
First sliding block can be moved along first sliding rail in X-direction, and second sliding block can be along first sliding block in Y
Axis direction is mobile, and the supporting plate can move in the Z-axis direction along second sliding block.
6. wafer marking mechanism according to claim 1, it is characterised in that: be additionally provided with pressing plate on the mark platform, institute
Pedestal lower end is stated equipped with the fixation cylinder for fixing the pressing plate.
7. wafer marking mechanism according to claim 2, it is characterised in that: the testing agency includes correction CCD and cunning
Motivation structure, the sliding equipment are set to second sliding rail upper end, and the correction CCD is set on the sliding equipment.
8. wafer marking mechanism according to claim 7, it is characterised in that: the sliding equipment includes can be along described the
The third sliding block of two sliding rails sliding and the Four-slider that can be slided along the third sliding block, the Four-slider and the third
The glide direction of sliding block is mutually perpendicular to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710031013.9A CN106583942B (en) | 2017-01-17 | 2017-01-17 | Wafer marking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710031013.9A CN106583942B (en) | 2017-01-17 | 2017-01-17 | Wafer marking mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106583942A CN106583942A (en) | 2017-04-26 |
| CN106583942B true CN106583942B (en) | 2019-02-26 |
Family
ID=58585925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710031013.9A Active CN106583942B (en) | 2017-01-17 | 2017-01-17 | Wafer marking mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106583942B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112526311A (en) * | 2020-12-15 | 2021-03-19 | 江苏卓玉智能科技有限公司 | Wafer detection mobile platform |
| CN113320298A (en) * | 2021-07-07 | 2021-08-31 | 哈尔滨奥瑞德光电技术有限公司 | Material transfer system of wafer laser marking equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6342912B1 (en) * | 1996-01-11 | 2002-01-29 | Micron Technology, Inc. | Laser marking techniques |
| CN1978210A (en) * | 2005-11-29 | 2007-06-13 | 武汉矽感科技有限公司 | Laser marking system and method for automatic production line |
| CN201075379Y (en) * | 2007-07-12 | 2008-06-18 | 格兰达技术（深圳）有限公司 | Wafer marking flat base apparatus of wafer back face marking machine |
| CN201084716Y (en) * | 2007-09-20 | 2008-07-09 | 格兰达技术（深圳）有限公司 | A transfer device of IC strip laser marking machine |
| DE102008000215A1 (en) * | 2008-02-01 | 2009-08-06 | Dr. Teschauer Ag | Laser marking device |
| CN104385786A (en) * | 2014-10-13 | 2015-03-04 | 龚传波 | Full-automatic wafer laser marking machine and method thereof |
| CN105312774A (en) * | 2014-07-30 | 2016-02-10 | 深圳市韵腾激光科技有限公司 | Full-automatic wafer cutting machine |
-
2017
- 2017-01-17 CN CN201710031013.9A patent/CN106583942B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6342912B1 (en) * | 1996-01-11 | 2002-01-29 | Micron Technology, Inc. | Laser marking techniques |
| CN1978210A (en) * | 2005-11-29 | 2007-06-13 | 武汉矽感科技有限公司 | Laser marking system and method for automatic production line |
| CN201075379Y (en) * | 2007-07-12 | 2008-06-18 | 格兰达技术（深圳）有限公司 | Wafer marking flat base apparatus of wafer back face marking machine |
| CN201084716Y (en) * | 2007-09-20 | 2008-07-09 | 格兰达技术（深圳）有限公司 | A transfer device of IC strip laser marking machine |
| DE102008000215A1 (en) * | 2008-02-01 | 2009-08-06 | Dr. Teschauer Ag | Laser marking device |
| CN105312774A (en) * | 2014-07-30 | 2016-02-10 | 深圳市韵腾激光科技有限公司 | Full-automatic wafer cutting machine |
| CN104385786A (en) * | 2014-10-13 | 2015-03-04 | 龚传波 | Full-automatic wafer laser marking machine and method thereof |
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| Publication number | Publication date |
|---|---|
| CN106583942A (en) | 2017-04-26 |
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| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Wafer marking mechanism Effective date of registration: 20200508 Granted publication date: 20190226 Pledgee: Bank of Jiangsu Limited by Share Ltd Shenzhen branch Pledgor: SHENZHEN INTE LASER TECHNOLOGY Co.,Ltd. Registration number: Y2020440020009 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210611 Granted publication date: 20190226 Pledgee: Bank of Jiangsu Limited by Share Ltd. Shenzhen branch Pledgor: SHENZHEN INTE LASER TECHNOLOGY Co.,Ltd. Registration number: Y2020440020009 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |