CN106505089B - Display device - Google Patents
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- CN106505089B CN106505089B CN201610931458.8A CN201610931458A CN106505089B CN 106505089 B CN106505089 B CN 106505089B CN 201610931458 A CN201610931458 A CN 201610931458A CN 106505089 B CN106505089 B CN 106505089B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of display device, include: first substrate, include viewing area and non-display area, the non-display area binding on the first substrate has integrated circuit, the non-display area of the first substrate is additionally provided with multiple connection pads, is electrically connected to the integrated circuit；Display element, in the viewing area on the first substrate, the display element is located at the ipsilateral of the first substrate with the integrated circuit；Sealant, the side of the first substrate is deviated from positioned at the display element, and the non-display area of the sealant is provided with multiple via holes；And touch control layer group, including being located at at least touch control electrode layer on the sealant, the touch control electrode layer is electrically connected by the via hole of the sealant with the connection pad.Display device provided by the invention can reduce cost.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of display devices.
Background technique
With the development of human-computer interaction technology, touch technology is increasingly used on various displays.Capacitive character touching
For control technology since its is wear-resistant, the service life is long, maintenance cost is low when user uses, and can support gesture identification and multi-point touch
The advantages of and be widely used.
Capacitive character touch technology can be divided into self-capacitance touch-control skill according to the detection mode of the capacitor between different objects
Art and mutual capacitance type touch control technology.Self-capacitance touch technology detects defeated according to the capacitance variations between input object and electrode
Enter presence, position and the movement of object on the touchscreen.Mutual capacitance type touch control technology is then between the electrode according to caused by input object
Capacitance variations detect presence, position and the movement of input object on the touchscreen.
In the prior art, OLED (Organic Light-Emitting Diode, the organic light emission of touch-control film are integrated
Diode) display panel, usually by two flexible circuit boards be separately connected array substrate and the touch-control film of display panel with
Display and touch function are realized respectively.The specific structure of display panel may refer to Fig. 1 and Fig. 2 in the prior art.
Fig. 1 shows a kind of display panel in the prior art.Display panel 100A from bottom to top successively includes array substrate
110, OLED element 120, packaging film 130, the second substrate 140 and touch-control film 150.First flexible circuit board 161 is located at battle array
110 upper surface of column substrate, the second flexible circuit board 162 are located at 140 upper surface of the second substrate.Film in array substrate 110 is brilliant
Body pipe is driven by the driving circuit bound with the first flexible circuit board 161, and then realizes display driving.Touch-control film 150
It is driven by the driving circuit bound with the second flexible circuit board 162, and then realizes touch-control driving.Display panel 100A's
In processing procedure, after needing first to bind the second flexible circuit board 162 with the second substrate 140, it could will be formed with touch-control film 150
The second substrate is bonded with display base plate (including array substrate 110, OLED element 120, packaging film 130), and attaching process is complicated,
Yield and low efficiency.
Fig. 2 shows a kind of display panels in the prior art.Display panel 100B from bottom to top successively includes array substrate
110, OLED element 120, packaging film 130, touch-control film 150 and the second substrate 140.First flexible circuit board 161 is located at battle array
110 upper surface of column substrate, the second flexible circuit board 162 are located at 140 lower surface of the second substrate.First flexible circuit board 161 is used for
Realize display driving.Second flexible circuit board 162 is for realizing touch-control driving.In display panel 100B, the first flexible circuit
Spacing between plate 161 and the second flexible circuit board 162 is larger, mechanical interferences easy to form.
For Fig. 1 and Fig. 2 shows two prior art display panels embodiment, due to need two flexible circuit boards
Display driving and touch-control driving are realized respectively, and cost of manufacture is higher, and manufacture craft is complex.
Summary of the invention
The present invention provides a kind of display device, can reach reduction to overcome the problems of the above-mentioned prior art
The effect of cost of manufacture and technique.
According to an aspect of the present invention, a kind of display device is provided, comprising: first substrate includes viewing area and non-aobvious
Show area, the non-display area binding on the first substrate has integrated circuit, and the non-display area of the first substrate is also
Multiple connection pads are provided with, the integrated circuit is electrically connected to；Display element, it is described aobvious on the first substrate
Show in area, the display element is located at the ipsilateral of the first substrate with the integrated circuit；Sealant is located at the display member
Part deviates from the side of the first substrate, and the non-display area of the sealant is provided with multiple via holes；And touch control layer group, including
An at least touch control electrode layer on the sealant, the touch control electrode layer by the via hole of the sealant with it is described
Connect pad electrical connection.
Compared with prior art, touch control layer group is connected on first substrate by the via hole on sealant and is connected by the present invention
Pad passes through a printed circuit to be tied on integrated circuit using the same printed circuit board on the first substrate with this
Plate realizes display driving and touch-control driving simultaneously, and then reduces the cost of manufacture of display device, and simplifies the processing procedure of display device
Technique.
Detailed description of the invention
Its example embodiment is described in detail by referring to accompanying drawing, above and other feature of the invention and advantage will become
It is more obvious.
Fig. 1 shows a kind of sectional view of the display panel of prior art.
Fig. 2 shows the sectional views of the display panel of another prior art.
Fig. 3 shows the sectional view of display device according to an embodiment of the invention.
Fig. 4 shows the top view of display device in Fig. 3.
Fig. 5 shows the sectional view of the display device of another embodiment according to the present invention.
Fig. 6 shows the sectional view of display device according to another embodiment of the present invention.
Fig. 7 shows the sectional view of display device according to yet another embodiment of the invention.
Fig. 8 shows the top view of display device in Fig. 7.
Fig. 9 shows the sectional view of display device according to yet another embodiment of the invention.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, thesing embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.It is identical attached in figure
Icon note indicates same or similar structure, thus will omit repetition thereof.
Described feature, structure or characteristic can be incorporated in one or more embodiments in any suitable manner
In.In the following description, many details are provided to provide and fully understand to embodiments of the present invention.However,
One of ordinary skill in the art would recognize that without one or more in specific detail, or using other methods, constituent element, material
Material etc., can also practice technical solution of the present invention.In some cases, be not shown in detail or describe known features, material or
Person operates to avoid the fuzzy present invention.
Attached drawing of the invention is only used for signal relative positional relationship, and the size of element does not represent actual size in attached drawing
Proportionate relationship.
In order to solve the problem of that the big complex manufacturing technology of processing procedure cost in the prior art, the present invention provide a kind of display
Part, comprising: first substrate includes viewing area and non-display area, and the non-display area binding on the first substrate has integrated circuit, the
The non-display area of one substrate is additionally provided with multiple connection pads, is electrically connected to the integrated circuit；Display element is located at first base
In viewing area on plate, which is located at the ipsilateral of first substrate with integrated circuit；Sealant is located at display element and carries on the back
Side from first substrate, the non-display area of the sealant are provided with multiple via holes；And touch control layer group, including be located at described close
An at least touch control electrode layer on sealing, the touch control electrode layer are electrically connected by the via hole of sealant with pad is connect.
Multiple embodiments provided by the invention are described with reference to the accompanying drawing.
The sectional view of display device 200 according to an embodiment of the invention is shown referring first to Fig. 3, Fig. 3.Display device
200 include first substrate 210, display element 220, sealant and touch control layer group.
Specifically, first substrate 210 includes viewing area A1 and non-display area A2.Viewing area A1 is non-for being shown
Viewing area A2 is for being arranged circuit trace.Non-display area A2 binding on first substrate 210 has integrated circuit.In the present embodiment
In, first substrate 210 binds integrated circuit by printed circuit board 260.Printed circuit board 260 is located on first substrate 210
The upper surface of non-display area A2.The non-display area A2 of first substrate 210 is additionally provided with multiple connection pads 250 (due to being section
Figure, therefore 1 connection pad 250 is only shown, actual quantity is multiple).It connects pad 250 and passes through 260 electricity of printed circuit board
It is connected to integrated circuit.Further, first substrate 210 is array substrate.Array substrate 210 includes flexible substrate and is located at soft
Thin film transistor (TFT) on property substrate.Thin film transistor (TFT) in flexible substrate is connected to printed circuit board 260 and by integrated electricity
Road drives.Optionally, flexible substrate can be by such as PI (Polyimide, polyimides) film, PET (Polyethylene
Glycol terephthalate, polyethylene terephthalate) film, PE (Polyethylene, polyethylene) film,
PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate)
The thin polymer film of film etc. is made.
Display element 220 is located in the viewing area A1 on first substrate 210.Display element 220 is located at integrated circuit
First substrate 210 it is ipsilateral.In other words, display element 220 is located at first with the printed circuit board 260 for being used to bind integrated circuit
Substrate 210 it is ipsilateral.Display element 220 is optionally OLED element.OLED element 220 by array substrate 210 film crystal
Pipe drives.OLED element 220 optionally includes anode electrode, hole injection layer, hole transmission layer, luminescent layer, electron-transport
Layer, electron injecting layer and cathode electrode.In OLED element 220, one or more layers of above-mentioned stepped construction be can be omitted, alternatively,
Other layers can also be increased.OLED element 220, which can be, pushes up luminous or bottom light emitting-type.
Sealant is located at the side that display element 220 deviates from first substrate 210.The non-display area A2 of sealant is provided with more
A via hole.In the present embodiment, sealant includes packaging film 230, between display element 220 and touch control layer group.Such as Fig. 3
Shown, packaging film 230 extends to non-display area A2 from viewing area A1.The non-display area A2 of packaging film 230 is provided with multiple
First via hole 231 (due to being sectional view, only showing 1 the first via hole 231, actual quantity is multiple).Specifically,
Packaging film 230 may include barrier layer and base film.Barrier layer is between base film and display element 220.Substrate
Film is as the substrate in the making technologies such as barrier layer sputtering, evaporation, deposition.Optionally, base film by such as PI, PET,
The flexible polymer materials such as PE, PEN are made.Optionally, barrier layer is barrier.In some embodiments, barrier layer by
Inorganic material layer and organic material layer are alternately stacked to be formed.Optionally, inorganic material layer is made of one of following material: nitrogen
SiClx；Silica；Silicon oxynitride；Or aluminium oxide.Inorganic material layer stops water oxygen intrusion display element to be mainly used for
220.Organic material layer is made of organosilicon series material or flexible polymer material.Organosilicon series material includes four ethoxies
Base silicon, hexamethyldisiloxane, hexamethyldisilazane, octamethylcy-clotetrasiloxane, silicon oxide carbide and carbonitride of silicium etc..It is flexible
Polymer material includes PI, PET, PE, PEN etc..Organic material layer is used to improve the flatness of base film, reduces mechanical damage
Wound.
Touch control layer group includes at least touch control electrode layer 241 on sealant.Touch control electrode layer 241 passes through sealing
The via hole of layer is electrically connected with pad 250 is connect.In the present embodiment, touch control electrode layer 241 is located on dress film 230, and touches
Electrode layer 241 is controlled to be electrically connected by the first via hole 231 and connection pad 250.Specifically, touch control layer group includes being located at thinner package
A touch control electrode layer 241 in viewing area A1 on film 230 and multiple conducting pads 242 positioned at non-display area A2.Touch-control
Electrode layer 241 includes multiple touch control electrodes.Each touch control electrode electrical connection conducting pad 242, conducting pad 242 pass through sealant
Via hole (the first via hole 231 in the present embodiment, that is, on packaging film 230) is electrically connected with pad 250 is connect.Further
Ground, conducting pad 242 can pass through the metal (metal is for example comprising silver, copper, aluminium) or metal at via hole (such as first via hole 231)
Slurry (metal pulp is for example comprising silver paste, copper slurry, aluminium paste) is connected to first substrate 210.
The top view of display device in Fig. 3 is shown with further reference to Fig. 4, Fig. 4.Specifically, the display shown in Fig. 4
Part uses self-tolerant touch technology.In Fig. 4, touch control electrode layer 241 is located in the viewing area A1 of first substrate 210, conducting weldering
Disk 242 is located in the non-display area A2 of first substrate 210.Optionally, conducting pad 242 and touch control electrode layer 241 are in same system
It is formed in journey processing step.Multiple touch control electrodes of touch control electrode layer 241 are arranged in a matrix, and each touch control electrode passes through touch-control lead
It is connected to conducting pad 242.Display device shown in Fig. 4 by measurement input object and touch control electrode between capacitance variations with
Determine the position that touch-control occurs.
It can be seen that touch control layer group is connected to the first base by the via hole on sealant by Fig. 3 and embodiment shown in Fig. 4
Pad 250 is connected on plate 210, to use the same printed circuit board 260 to be tied on integrated circuit on first substrate 210,
Display driving and touch-control driving are realized simultaneously by a printed circuit board 260 with this, and then reduce being fabricated to for display device
This, and simplify the making technology of display device.
Fig. 5 shows the sectional view of the display device of another embodiment according to the present invention.Display device 300 shown in Fig. 5
Also self-tolerant touch technology is used.In other words, the top view of display device 300 is similar with Fig. 4.It is similar with Fig. 3, display device
300 successively include first substrate 310, display element 320, sealant and touch control layer group from the bottom to top.
Unlike Fig. 3, sealant includes packaging film 330 and glue-line 370.Glue-line 370 is further sealed and is protected
Packaging film 330 and display device 300.Packaging film 330 is between display element 320 and touch control layer group.Glue-line 370 is at least
In non-display area A2 between first substrate 210 and touch control layer group.Glue-line 370 be provided with multiple second via holes 371 (due to
It is sectional view, therefore 1 the second via hole 371 is only shown, actual quantity is multiple), touch control electrode layer 341 passes through the second via hole
371 are electrically connected with pad 350 is connect, and then are connected to the printed circuit board 360 of 310 upper surface of first substrate.Specifically, with
The conducting pad 342 of 341 same layer of touch control electrode layer can pass through the metal at the second via hole 371 (metal is for example comprising silver, copper, aluminium)
Or metal pulp (metal pulp is for example comprising silver paste, copper slurry, aluminium paste) is connected to connection pad 350, and touch control electrode layer 341 is connected
To first substrate 310.
Fig. 6 shows the sectional view of display device according to another embodiment of the present invention.Display device 400 shown in Fig. 6
Also self-tolerant touch technology is used.In other words, the top view of display device 400 is similar with Fig. 4.Display device 400 is from the bottom to top
It successively include first substrate 410, display element 420, sealant (in the present embodiment, sealant includes packaging film 430), second
Substrate 480 and touch control layer group.The setting of touch control electrode layer 441 of at least the one of touch control layer group deviates from first in the second substrate 480
The side of substrate 410.By in this present embodiment, display device 400 uses self-tolerant touch technology, and therefore, touch control layer group is only wrapped
Include one layer of touch control electrode layer 441 and the conducting pad 442 with 441 same layer of touch control electrode layer.
The non-display area A2 of the second substrate 480 is provided with multiple third via holes 481 and (due to being sectional view, only shows 1
A third via hole 481, actual quantity are multiple).The via hole of third via hole 481 and sealant (in the present embodiment, that is, encapsulates
First via hole 431 of film 430) connect.In some change case, third via hole 481 can also on glue-line (such as Fig. 5-370)
Second via hole (such as Fig. 5-371) connects.In this way, the conducting pad 442 of touch control electrode layer 441 can pass through 481 He of third via hole
The via hole of sealant is electrically connected to the connection pad 450 on first substrate 410, and then is connected to 410 upper surface of first substrate
Printed circuit board 460.Optionally, the second substrate 480 can be by such as PI (Polyimide, polyimides) film, PET
(Polyethylene glycol terephthalate, polyethylene terephthalate) film, PE (Polyethylene,
Polyethylene) film, PEN (Polyethylene naphthalate two formic acid glycol ester, poly- naphthalene two
Formic acid glycol ester) thin polymer film of film etc. is made.
Fig. 7 shows the sectional view of display device 500 according to yet another embodiment of the invention.Display device 500 and display
Device 200 is similar, including first substrate 510, display element 520, sealant and touch control layer group.It is different from display device 200
It is that display device 500 uses mutual capacitance type touch technology.Touch control layer group includes the first touch control electrode layer 541, second touch control electrode layer
542 and positioned at non-display area A2 multiple conducting pads 540.In the present embodiment, encapsulation of the pad 540 by sealant is connected
The first via hole 531 on film 530 is electrically connected to the connection pad 550 on first substrate 510, and then is electrically connected to printed circuit
Plate 560.In some change case, sealant further includes glue-line, the second via hole on glue-line that conducting pad 540 passes through sealant
The connection pad 550 being electrically connected on first substrate 510.In other change case, display device 200 further includes being located at sealing
The second substrate between layer and touch control layer group, conducting pad 540 pass through the third via hole in the second substrate and the mistake on sealant
Hole is electrically connected to the connection pad 550 on first substrate 510.
Display device 500 is described further combined with Fig. 8.Fig. 8 shows the top view of display device 500 in Fig. 7.In Fig. 8
In, the first touch control electrode layer 541 and second touch control electrode layer 542 are located in the viewing area A1 of first substrate 410.First touch-control electricity
Pole layer 541 includes multiple first touch control electrodes extended in a first direction.Second touch control electrode layer 542 includes prolonging in a second direction
The second touch control electrode stretched.Each first touch control electrode and each second touch control electrode mutually insulated.
Conducting pad (such as Fig. 7-540) in the non-display area A2 of first substrate 510 includes connection the first touch-control electricity
First conducting pad 543 of pole layer 541 and the second conducting pad 544 for connecting second touch control electrode layer 542.Optionally, each
One touch control electrode and second touch control electrode are respectively connected to the first conducting pad 543 and two by touch-control lead and pads 544 are connected.
Corresponding, the connection pad (such as Fig. 7-550) on first substrate 510 includes the first connection connecting with the first conducting pad 543
Pad and the second connection pad being connect with the second conducting pad 544.First conducting pad 543 and the first connection pad are first
Projection overlapping on substrate 510.The projection overlapping of second conducting pad 544 and the second connection pad on the first substrate 510.Figure
Display device shown in 8 is by the first touch control electrode of measurement and the capacitance variations of second touch control electrode overlapping region to determine touch-control
The position of generation.
Fig. 9 shows the sectional view of display device according to yet another embodiment of the invention.Display device 600 uses mutual capacitance type
Touch technology.In other words, the top view of display device 600 is similar with Fig. 8.The structure and display device of display device 600 in Fig. 9
500 is similar, including first substrate 610, display element 620, sealant and touch control layer group.
Unlike display device 600, display device 600 further includes separation layer 670.In the present embodiment, separation layer
670 any one for flexible base board, in inorganic insulation layer.Separation layer 670 is located at the first touch control electrode layer 641 and the second touch-control
Between electrode layer 642.The non-display area A2 of separation layer 670 is provided with multiple 4th via holes 671 (due to being sectional view, only
1 the 4th via hole 671 is shown, actual quantity is multiple).The via hole of 4th via hole 671 and sealant is (in the present embodiment,
That is the first via hole 631 of packaging film 630) connect.In some change case, the 4th via hole 671 can also be with glue-line (such as Fig. 5-
370) the second via hole (such as Fig. 5-371) on connects.
In the present embodiment, the first conducting pad 643 and the first touch control electrode layer of the first touch control electrode layer 641 are connected
641 same layers；Connect the second conducting pad 644 and 641 same layer of the first touch control electrode layer of second touch control electrode layer 642.In other words,
First conducting pad 643 is between packaging film 630 and separation layer 670；Second conducting pad 644 be located at separation layer 670 it
On.
Specifically, the first conducting pad 643 passes through via hole (in the present embodiment, i.e. the first via hole of packaging film 630
631) the first connection of electrical connection pad 651.Second conducting pad 644 passes through via hole (in the present embodiment, i.e. packaging film 630
The first via hole 631) and the 4th via hole 671 electrical connection second connection pad 652.In this way, the first touch control electrode layer 641 and second
Touch control electrode layer 642 is connected to the printed circuit board 660 of 610 upper surface of first substrate.
In a change case of the present embodiment, the first touch control electrode layer 641 is integrated in sealant.Second touch control electrode
Layer 642 is located at the side that separation layer 670 deviates from sealant.Specifically, sealant includes packaging film 630, packaging film 630
As previously mentioned, may include base film, organic material layer and inorganic material layer.First touch control electrode layer 641 can be substrate
Between any side surface of film, organic material layer and inorganic material layer or between packaging film 630 and display element,
To be integrated in sealant.
In a change case of the present embodiment, separation layer 670 is optical thin film, and second touch control electrode layer 642 is integrated in
In optical thin film 670.Optical thin film 670 includes one or more of line polarisation piece, 1/4 phase difference film and 1/2 phase difference film
Optical element.Second touch control electrode layer 642 can be located in optical thin film between two optical elements or be located at optical thin film
670 any side surface, to be integrated in optical thin film 670.
Above-mentioned each attached drawing is only to schematically show display device provided by the invention.For the sake of clarity, simplify
Component shape, number of elements in above-mentioned each figure and clipped element, those skilled in the art can according to actual needs into
Row variation, these variations are all within the scope of the present invention, and it will not be described here.
Compared with prior art, touch control layer group is connected on first substrate by the via hole on sealant and is connected by the present invention
Pad passes through a printed circuit to be tied on integrated circuit using the same printed circuit board on the first substrate with this
Plate realizes display driving and touch-control driving simultaneously, and then reduces the cost of manufacture of display device, and simplifies the processing procedure of display device
Technique.
It is particularly shown and described exemplary embodiments of the present invention above.It should be understood that the present invention is not limited to institute
Disclosed embodiment, on the contrary, it is intended to cover comprising various modifications within the scope of the appended claims and equivalent set
It changes.
Claims (10)
1. a kind of display device characterized by comprising
First substrate includes viewing area and non-display area, and the non-display area binding on the first substrate has integrated circuit,
The non-display area of the first substrate is additionally provided with multiple connection pads, is electrically connected to the integrated circuit；
Display element, in the viewing area on the first substrate, the display element and the integrated circuit position
In the ipsilateral of the first substrate, the display element is OLED element；
Sealant, the side of the first substrate is deviated from positioned at the display element, and the non-display area of the sealant is provided with
Multiple first via holes, the sealant include: packaging film, between the display element and touch control layer group, the encapsulation
Film includes that the barrier layer formed is alternately stacked by organic film inorganic thin film, and the packaging film is extended to from the viewing area
The non-display area, the packaging film in packaging film and the non-display area in the viewing area is continuous film layer；And
Touch control layer group, including being located at at least touch control electrode layer on the sealant, the touch control electrode layer passes through described
First via hole of sealant is electrically connected with the connection pad, wherein the touch control electrode layer is to be located at it towards the display
The film layer of element side is formed for substrate, and the packaging film covers the connection pad, and the packaging film is non-display
Area is provided with multiple first via holes, and the touch control electrode layer is electrically connected by first via hole and the connection pad,
Wherein, the touch control electrode layer includes the first touch control electrode layer and second touch control electrode layer, and the touch control layer group further includes
Positioned at multiple conducting pads of the non-display area, the conducting pad is located on the packaging film and covers first mistake
Hole, the conducting pad and the same material of touch control electrode layer same layer, the conducting pad include connecting the first touch-control electricity
First conducting pad of pole layer and the second conducting pad of the connection second touch control electrode layer, the connection pad include and institute
The the second connection pad stating the first connection pad of the first conducting pad connection and being connect with the second conducting pad.
2. display device as described in claim 1, which is characterized in that further include:
Separation layer, between first touch control electrode layer and second touch control electrode layer, the separation layer it is described non-display
Area is provided with multiple 4th via holes, and the 4th via hole connects with first via hole,
Wherein, the first conducting pad is electrically connected the first connection pad, second conducting by first via hole
Pad is electrically connected the second connection pad by first via hole and the 4th via hole.
3. display device as claimed in claim 2, which is characterized in that first touch control electrode layer is integrated in the sealant
In, the second touch control electrode layer is located at the side that the separation layer deviates from the sealant.
4. display device as claimed in claim 3, which is characterized in that the separation layer is optical thin film, second touch-control
Electrode layer is integrated in the optical thin film.
5. display device as claimed in claim 4, which is characterized in that the optical thin film includes line polarisation piece, 1/4 phase difference
One or more optical elements in film and 1/2 phase difference film.
6. display device as claimed in claim 2, which is characterized in that first touch control electrode layer includes prolonging along first direction
Multiple first touch control electrodes stretched, the second touch control electrode layer include the second touch control electrode extended in a second direction.
7. display device as claimed in claim 2, which is characterized in that the separation layer is flexible base board, in inorganic insulation layer
Any one.
8. display device as described in claim 1, which is characterized in that the conducting pad is connected to by metal or metal pulp
The first substrate；
The metal includes silver, copper, aluminium, and the metal pulp includes silver paste, copper slurry, aluminium paste.
9. display device as described in claim 1, which is characterized in that the first substrate is array substrate, including flexible liner
Bottom and the thin film transistor (TFT) in the flexible substrate, the thin film transistor (TFT) are driven by the integrated circuit.
10. display device as claimed in claim 9, which is characterized in that the integrated circuit is bundled in by printed circuit board
On the first substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610931458.8A CN106505089B (en) | 2016-10-31 | 2016-10-31 | Display device |
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|---|---|---|---|
| CN201610931458.8A CN106505089B (en) | 2016-10-31 | 2016-10-31 | Display device |
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| CN106505089B true CN106505089B (en) | 2019-11-05 |
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Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI665596B (en) * | 2017-05-03 | 2019-07-11 | 瑞鼎科技股份有限公司 | Capacitive touch panel |
| CN106973496B (en) * | 2017-05-09 | 2019-06-11 | 上海天马微电子有限公司 | A kind of flexible circuit board and display device |
| CN107275379A (en) * | 2017-07-28 | 2017-10-20 | 武汉华星光电半导体显示技术有限公司 | Touch oled display panel and display device |
| CN107807753A (en) * | 2017-10-31 | 2018-03-16 | 武汉华星光电技术有限公司 | Touch oled display panel and display device |
| KR102406966B1 (en) * | 2017-11-28 | 2022-06-08 | 엘지디스플레이 주식회사 | Light apparatus for organic light emitting device |
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