CN106494107A - A kind of laser index carving method for microelectronic package - Google Patents
A kind of laser index carving method for microelectronic package Download PDFInfo
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- CN106494107A CN106494107A CN201611103350.6A CN201611103350A CN106494107A CN 106494107 A CN106494107 A CN 106494107A CN 201611103350 A CN201611103350 A CN 201611103350A CN 106494107 A CN106494107 A CN 106494107A
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- laser
- index carving
- base material
- microelectronic package
- copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
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- Laser Beam Processing (AREA)
Abstract
The present invention is a kind of laser index carving method for microelectronic package, and the method comprises the steps：1）Software is carried with AutoCAD or equipment edlin and storage are entered to the content of laser index carving；2）According to the suitable laser instrument of the type selecting of base material, the preparation of start, equipment Alignment, frock clamp and consumptive material is completed；3）Technological parameter is set；4）Step 1 is cut out on base material with the launched laser of laser instrument）Middle edited content；5）Plating forms intermediate deposit；7）Base material is assembled, shell is formed；8）Plating shell coating on shell, forms finished product；9）Carry out end properties Indexs measure.Beneficial effects of the present invention：1）The figure of laser index carving, character, bar code clearly, forever do not fall off, and meet the operation index requirement such as Shell, salt spray resistance；2）For contactless automatic processing, have the advantages that flexible operation, speed fast, without abrasion.
Description
Technical field
The present invention relates to a kind of laser index carving method for microelectronic package, belongs to microelectronic manufacturing technology neck
Domain.
Background technology
With the development and the raising of automatization level of the industries such as communication, Aero-Space, automobile and consumer electronicses, to institute
With the size of electronic circuit and device, function and stability requirement more and more higher；Finished product local circuit disconnects, unique identification
Etc. being the important method of realizing local function, information gathering, tracking and management；The modes such as conventionally employed serigraphy, printing are fitted
For uniformity preferably, the product of same template, technological flexibility is low, be unable to serial number, following process and easy using process
Come off；Laser cutting be using high-energy-density laser beam to interacting goals, make target surface occur physically or chemically change,
So as to obtain the processing mode of layout, clearly, forever do not fall off with figure, character, bar code；Contactless automatically plus
Work, flexible operation, speed is fast, without the features such as abrasion, but as base material feature itself, base material are to the absorption of laser, subsequently add
The differences such as work use condition, the depth of cut that laser is formed on material are different, so as to cause product appearance, air-tightness, insulation
The performances such as resistance, salt fog, mechanical shock reduce.
The material such as beryllium oxide, AlN, Cu, Mo, W, steel, kovar alloy and Cu/W and Cu/Mo is because of thermal coefficient of expansion and chip
Close；Excellent pyroconductivity；Stable chemical nature, extraordinary electric property；Good EMI/RFI screening abilities；Heat is swollen
Swollen coefficient and close, the relatively low density of chip, enough intensity and hardness；Good processing or forming property；Plating, can
Weldering property and excellent corrosion resistance, are usually used in realizing to chip support, electrical connection, heat absorption and diverging；With communication, Aero-Space,
The development of the industry such as automobile and consumer electronicses and the raising of automatization level, to the function of electronic circuit used and device, chi
Very little, air-tightness, insulaion resistance, salt fog, mechanical shock equistability require that more and more higher, finished product local circuit disconnect, uniqueness
Mark etc. is the important method for realizing local function, information gathering, tracking and management.
Laser cutting is under control of the computer, and there is certain power, frequency by pulse laser output of discharging
Pulse laser beam, the pulse laser beam are focused on the surface of processing base material through light path conduction, reflection and focus lens group, shape
Into trickle, high-energy-density a hot spot, focal spot produce near material surface to be processed instantaneous high-temperature fusing, vaporization and
Airflow makes material surface form pit, and under computer precise control, laser beam is pressed pre-set with machined material
Route, speed, time delay etc. carry out relative motion and reach, so as to obtain the figure for designing, character, bar code etc., as needed through centre
The techniques such as layer plating, assembling, welding and plating are processed into the microelectronic package with certain function and purposes.
Content of the invention
Proposed by the present invention is a kind of laser index carving method for microelectronic package, according to substrate sizes feature and
The laser instrument of suitable type, power output, centre wavelength is selected to the absorption characteristic of laser, first to the figure of design, character
Suitably edited with bar code etc., then adopted suitable working process parameter, cleaved, intermediate layer plating, assembling, weld and
The techniques such as plating, its purpose are intended to make the performance such as the outward appearance of product and air-tightness, insulaion resistance, salt fog, mechanical shock obtain greatly
Width is improved.
The technical solution of the present invention：Proposed by the present invention is a kind of laser index carving side for microelectronic package
Method, the method comprise the steps：
1）Software is carried with AutoCAD or equipment edlin and storage are entered to the content of laser index carving；
2）According to the suitable laser instrument of the type selecting of base material, the preparation of start, equipment Alignment, frock clamp and consumptive material is completed；
3）Technological parameter is set；
4）Step 1 is cut out on base material with the launched laser of laser instrument）Middle edited content；
5）Plating forms protective intermediate deposit；
7）Base material is assembled, shell is formed；
8）Plating functional coating on shell, forms finished product；
9）Carry out end properties Indexs measure.
Beneficial effects of the present invention：
1）Using power output in 0.5W～1000W, optical fiber laser, semiconductor laser of the centre wavelength in 100nm～2 μm
Or CO2Laser instrument is in base materials such as beryllium oxide, aluminium nitride, copper, molybdenum, tungsten, steel, kovar alloy, copper-tungsten, copper molybdenum alloy, potteries
On cut out figure, character and bar code that depth is 0.1～200 μm etc., plated formation intermediate deposit layer, assembling, weld and
The techniques such as shell plating, make that the figure of laser index carving, character, bar code are clear, forever do not fall off, and performance indications meet shell examination
Require；
2）The present invention is contactless automatic processing, have the advantages that flexible operation, speed fast, without abrasion.
Specific embodiment
A kind of laser index carving method for microelectronic package, the method comprise the steps:
1）Software is carried with AutoCAD or equipment edlin and storage are entered to the content of laser index carving；
2）According to the suitable laser instrument of the type selecting of base material, the preparation of start, equipment Alignment, frock clamp and consumptive material is completed；
3）Technological parameter is set；
4）Step 1 is cut out on base material with the launched laser of laser instrument）Middle edited content；
5）Plating forms protective intermediate deposit；
7）Base material is assembled, shell is formed；Can be welded with conventional soldering processes during assembling；
8）Plating functional coating on shell, forms finished product；
9）Carry out end properties Indexs measure.
The content of the laser index carving is figure and/or character and/or bar code.
Described base material is beryllium oxide, aluminium nitride, copper, molybdenum, tungsten, steel, kovar alloy, copper-tungsten, copper molybdenum alloy, pottery
In one kind.
Described laser instrument is optical fiber laser, semiconductor laser, CO2One kind in laser instrument；
The power output of the laser instrument is 0.5 W～1000W, and the centre wavelength of the launched laser of laser instrument is 100nm～2 μ
m；Described technological parameter includes rated output power, the cutting number of turns, cutting speed, time delay；Wherein rated output power is
It is 10～1000 μ s for 10 mm～1000mm/s, time delay that 0.5 W～1000W, the cutting number of turns are 1～100, cutting speed.
On the finished product, the depth of figure and/or character and/or bar code is 0.1 μm～100 μm.
The intervening guard coating is silver layer, layers of copper, tin layers, nickel dam, layers of chrome, the one kind in layer gold, and thickness of coating is
0.1 μm～20 μm；The case function coating is silver layer, layers of copper, tin layers, nickel dam, layers of chrome, the one kind in layer gold, plates thickness
Spend for 0.1 μm～20 μm；By coating, the figure of marking, character, bar code are clear, forever can not fall off, and meet shell airtight
Property, the operation index such as salt spray resistance requires.
The suitable laser instrument of the type selecting according to base material, can specially adopt carbon dioxide laser, UV to swash
Light device cutting beryllium oxide, aluminium nitride, aluminium oxide ceramics etc.；Using Nd:YAG laser, UV laser instruments cutting copper, molybdenum, tungsten, steel,
Kovar alloy, copper-tungsten, copper molybdenum alloy.
The intermediate deposit plays protective, feature and ornamental effect.
Embodiment 1
A kind of laser index carving method for microelectronic package, the method comprise the steps：
A) figure and character editing are carried out with AutoCAD, using the Song typeface, character height 2.0mm；
B) UV laser instruments, carbon dioxide laser cutting beryllium oxide, aluminium nitride, aluminium oxide ceramics etc. are selected, and laser instrument is specified defeated
Go out power in 10W, the centre wavelength of the launched laser of laser instrument is 355nm, 10.6um；Complete to start shooting, workbench, camera and
Focal length calibration, selects the frock clamp being suitable for and consumptive material to prepare；
C) technological parameter is arranged, 5 W of power output, the cutting number of turns 2, speed 120mm/s, 500 μ s of time delay；
D) figure, character and bar code of design etc. is cut on base material with laser and complete necessary Indexs measure；
E) nickel plating on base material, thickness is at 2 μm；
F) assembling parts, are welded with conventional soldering processes；
G) protective, feature and ornamental layer gold plating, thickness of coating is at 2 μm；
H) end properties Indexs measure.
Embodiment 2
A kind of laser index carving method for microelectronic package, the method comprise the steps：
A) carrying software with equipment carries out figure and character editing, using the Song typeface, character height 2.0mm；
B) UV laser instruments, Nd are selected:YAG laser cutting copper, molybdenum, tungsten, steel, kovar alloy, copper-tungsten, copper molybdenum alloy etc.,
, in 20 W, the centre wavelength of the launched laser of laser instrument is in 355nm, 1064nm for laser instrument rated output power；Complete to start shooting,
Workbench, camera and focal length calibration, select the frock clamp being suitable for and consumptive material to prepare；
C) technological parameter is arranged, 12 W of power output, the cutting number of turns 5, speed 300mm/s, 500 μ s of time delay；
D) figure, character and bar code of design etc. is cut on base material with laser and complete necessary Indexs measure；
E) nickel plating on base material, thickness is at 5 μm；
F) assembling parts, are welded with conventional soldering processes；
G) protective, feature and ornamental layer gold plating, thickness of coating is at 10 μm；
H) end properties Indexs measure.
Embodiment 3
A kind of laser index carving method for microelectronic package, the method comprise the steps：
A) figure and character editing are carried out with AutoCAD, using the Song typeface, character height 2.0mm；
B) UV laser instruments cutting beryllium oxide, aluminium nitride, aluminium oxide ceramics are selected, and laser instrument rated output power is in 10W, laser instrument
The centre wavelength of launched laser is 355nm, 10.6um；Complete to start shooting, workbench, camera and focal length calibration select to be suitable for
Frock clamp and consumptive material prepare；
C) technological parameter is arranged, 5 W of power output, the cutting number of turns 2, speed 120mm/s, 500 μ s of time delay；
D) figure, character and bar code of design etc. is cut on base material with laser and complete necessary Indexs measure；
E) nickel plating on base material, thickness is at 2 μm；
F) assembling parts, are welded with conventional soldering processes；
G) protective, feature and ornamental layer gold plating, thickness of coating is at 2 μm；
H) end properties Indexs measure.
Embodiment 4
A kind of laser index carving method for microelectronic package, the method comprise the steps：
A) figure and character editing are carried out with AutoCAD, using the Song typeface, character height 2.0mm；
B) select carbon dioxide laser cutting beryllium oxide, aluminium nitride, aluminium oxide ceramics, laser instrument rated output power in 10W,
The centre wavelength of the launched laser of laser instrument is 355nm, 10.6um；Complete to start shooting, workbench, camera and focal length calibration, choosing
Select suitable frock clamp and consumptive material prepares；
C) technological parameter is arranged, 5 W of power output, the cutting number of turns 2, speed 120mm/s, 500 μ s of time delay；
D) figure, character and bar code of design etc. is cut on base material with laser and complete necessary Indexs measure；
E) nickel plating on base material, thickness is at 2 μm；
F) assembling parts, are welded with conventional soldering processes；
G) protective, feature and ornamental layer gold plating, thickness of coating is at 2 μm；
H) end properties Indexs measure.
Embodiment 5
A kind of laser index carving method for microelectronic package, the method comprise the steps：
A) carrying software with equipment carries out figure and character editing, using the Song typeface, character height 2.0mm；
B) UV laser instruments cutting copper, molybdenum, tungsten, steel, kovar alloy, copper-tungsten, copper molybdenum alloy, laser instrument rated output work(are selected
, in 20 W, the centre wavelength of the launched laser of laser instrument is in 355nm, 1064nm for rate；Complete to start shooting, workbench, camera and Jiao
Away from calibration, the frock clamp being suitable for and consumptive material is selected to prepare；
C) technological parameter is arranged, 12 W of power output, the cutting number of turns 5, speed 300mm/s, 500 μ s of time delay；
D) figure, character and bar code of design etc. is cut on base material with laser and complete necessary Indexs measure；
E) nickel plating on base material, thickness is at 5 μm；
F) assembling parts, are welded with conventional soldering processes；
G) protective, feature and ornamental layer gold plating, thickness of coating is at 10 μm；
H) end properties Indexs measure.
Embodiment 6
A kind of laser index carving method for microelectronic package, the method comprise the steps：
A) carrying software with equipment carries out figure and character editing, using the Song typeface, character height 2.0mm；
B) Nd is selected:YAG laser cutting copper, molybdenum, tungsten, steel, kovar alloy, copper-tungsten, copper molybdenum alloy, laser instrument are specified defeated
Go out power in 20 W, the centre wavelength of the launched laser of laser instrument is in 355nm, 1064nm；Complete to start shooting, workbench, camera
And focal length calibration, select the frock clamp being suitable for and consumptive material to prepare；
C) technological parameter is arranged, 12 W of power output, the cutting number of turns 5, speed 300mm/s, 500 μ s of time delay；
D) figure, character and bar code of design etc. is cut on base material with laser and complete necessary Indexs measure；
E) nickel plating on base material, thickness is at 5 μm；
F) assembling parts, are welded with conventional soldering processes；
G) protective, feature and ornamental layer gold plating, thickness of coating is at 10 μm；
H) end properties Indexs measure.
Claims (7)
1. a kind of laser index carving method for microelectronic package, is characterized in that comprising the steps:
1）Software is carried with AutoCAD or equipment edlin and storage are entered to the content of laser index carving；
2）According to the suitable laser instrument of the type selecting of base material, the preparation of start, equipment Alignment, frock clamp and consumptive material is completed；
3）Technological parameter is set；
4）Step 1 is cut out on base material with the launched laser of laser instrument）Middle edited content；
5）Plating forms intervening guard coating；
7）Base material is assembled, shell is formed；
8）Plating functional coating on shell, forms finished product；
9）Carry out end properties Indexs measure.
2. a kind of laser index carving method for microelectronic package according to claim 1, is characterized in that described sharp
The content of light marking is figure and/or character and/or bar code.
3. a kind of laser index carving method for microelectronic package according to claim 1, is characterized in that described
Base material can be beryllium oxide, aluminium nitride, copper, molybdenum, tungsten, steel, kovar alloy, copper-tungsten, copper molybdenum alloy, pottery in one kind.
4. a kind of laser index carving method for microelectronic package according to claim 1, is characterized in that described
Laser instrument is optical fiber laser, semiconductor laser, CO2One kind in laser instrument；The power output of the laser instrument is 0.5 W
～1000W, the centre wavelength of the launched laser of laser instrument is 100nm～2 μm.
5. a kind of laser index carving method for microelectronic package according to claim 1, is characterized in that
Described technological parameter includes rated output power, the cutting number of turns, cutting speed, time delay；Wherein rated output power is
It is 10～1000 μ s for 10 mm～1000mm/s, time delay that 0.5 W～1000W, the cutting number of turns are 1～100, cutting speed.
6. a kind of laser index carving method for microelectronic package according to claim 1, it is characterized in that described into
On product, the depth of figure and/or character and/or bar code is 0.1 μm～100 μm.
7. a kind of laser index carving method for microelectronic package according to claim 1, it is characterized in that described in
Between protective coating be silver layer, layers of copper, tin layers, nickel dam, layers of chrome, the one kind in layer gold, thickness of coating is 0.1 μm～20 μm, work(
Can property coating be silver layer, layers of copper, tin layers, nickel dam, layers of chrome, the one kind in layer gold, thickness of coating is 0.1 μm～20 μm.
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| CN201611103350.6A CN106494107A (en) | 2016-12-05 | 2016-12-05 | A kind of laser index carving method for microelectronic package |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108688321A (en) * | 2017-04-11 | 2018-10-23 | 细美事有限公司 | Utilize the printing process of the printing equipment with ink jet head unit |
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| US20110088924A1 (en) * | 2009-10-16 | 2011-04-21 | Michael Nashner | Sub-surface marking of product housings |
| CN102310658A (en) * | 2010-06-29 | 2012-01-11 | 吴华 | Marker for integrated circuit packaged chip |
| CN102242334A (en) * | 2011-07-06 | 2011-11-16 | 中国科学院上海技术物理研究所 | Processing method of local laser blackening for coating metalwork |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108688321A (en) * | 2017-04-11 | 2018-10-23 | 细美事有限公司 | Utilize the printing process of the printing equipment with ink jet head unit |
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Application publication date: 20170315 |
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