CN106454660A - Electret sound production device and electronic equipment - Google Patents
Electret sound production device and electronic equipment Download PDFInfo
- Publication number
- CN106454660A CN106454660A CN201610941640.1A CN201610941640A CN106454660A CN 106454660 A CN106454660 A CN 106454660A CN 201610941640 A CN201610941640 A CN 201610941640A CN 106454660 A CN106454660 A CN 106454660A
- Authority
- CN
- China
- Prior art keywords
- electret
- conductive layer
- substrate
- vibrating diaphragm
- producing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 230000008021 deposition Effects 0.000 claims abstract description 9
- 230000005684 electric field Effects 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 7
- 230000000737 periodic effect Effects 0.000 description 4
- -1 Ethylene, propylene Chemical group 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 210000004508 polar body Anatomy 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229950000845 politef Drugs 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Abstract
The invention discloses an electret sound production device and electronic equipment. A substrate possessing a hollow inner chamber and a vibrating diaphragm which is formed above the substrate through a deposition mode are included. The vibrating diaphragm comprises at least one layer of conducting layer where an alternating current signal passes. A first electret electrode which is opposite to the conducting layer on the vibrating diaphragm is also included. The first electret electrode and the conducting layer are configured. The conducting layer where the alternating current signal passes generates a driving force which is vertical to the vibrating diaphragm under an effect of a first electret electrode field. The sound production device of the invention can be applied to a receiver or a loudspeaker and breaks through installation structures of a traditional coil and a magnet. The size is smaller and a MEMS technology can be adopted to carry out manufacturing.
Description
Technical field
The present invention relates to field of transducer, more precisely, the present invention relates to a kind of electret sound-producing device；The present invention is also
It is related to a kind of electronic equipment.
Background technology
Sound-producing device is the important acoustic element in electronic equipment, is changed into the transducing of acoustical signal as a kind of signal of telecommunication
Device, it has been commonly utilized on the electronic products such as mobile phone, notebook computer.Existing speaker module, including shell, with
And it is arranged on the vibrational system of inside the shell, magnetic circuit system, wherein vibrational system includes vibrating diaphragm and is arranged on vibrating diaphragm and is used for driving
The voice coil loudspeaker voice coil of dynamic vibrating diaphragm sounding, magnetic circuit system includes Magnet, washer etc..One end of coil is connected on vibrating diaphragm, and the other end stretches to
In the magnetic gap of magnetic circuit system.
The structure of this sound-producing device is complex so that the volume of sound-producing device is larger, and mostly artificial streamline
Assembling, automaticity is not high, far can not meet the growth requirement of modernization.
Content of the invention
It is an object of the present invention to provide a kind of new solution of electret sound-producing device.
According to the first aspect of the invention, there is provided a kind of electret sound-producing device, including the substrate with hollow cavity
And it is formed at vibrating diaphragm above substrate by way of deposition, described vibrating diaphragm includes at least one of which and is used for being passed through ac signal
Conductive layer；
Also include the first electret electrode just to setting with conductive layer on vibrating diaphragm；Described first electret electrode, conduction
Layer is configured：Being passed through the conductive layer of ac signal, to produce direction in the presence of the first electret Electrode Field vertical with vibrating diaphragm
Driving force.
Alternatively, described vibrating diaphragm is integrally made up of conductive layer, is additionally provided with insulating barrier between described conductive layer and substrate.
Alternatively, described vibrating diaphragm includes the non-conductive layer being deposited on substrate, and described conductive layer is arranged on non-conductive layer
Lower section, top or inside.
Alternatively, described vibrating diaphragm includes being used for connecting the connecting portion of substrate positioned at edge, and is located at shaking of medium position
Dynamic portion, described conductive layer is distributed on the vibration section of vibrating diaphragm.
Alternatively, described conductive layer by deposition, printing, spraying, plating or chemical plating by way of with non-conductive layer knot
It is combined.
Alternatively, the housing also including substrate and constituting encapsulating structure with substrate, described substrate is located in encapsulating structure
And be arranged on substrate, described first electret electrode is arranged on position corresponding with conductive layer on substrate；In described housing
On be provided with sound hole.
Alternatively, on the housing with the first electret electrode just to position be additionally provided with the second electret electrode,
Described first electret electrode and the opposite charge of the second electret electrode, the two constitutes parallel planar electric field.
Alternatively, described substrate is circuit board.
Alternatively, described electret sound-producing device is speaker or receiver.
According to a further aspect in the invention, additionally provide a kind of electronic equipment, it includes above-mentioned electret sound-producing device.
The electret sound-producing device of the present invention, the first electret electrode works as conductive layer together with being correspondingly arranged with conductive layer
After being passed through ac signal, conductive layer is acted on generation periodic vibration in the electric field that the first electret produces by electric field force, from
And allow conductive layer to produce the driving force driving vibrating diaphragm periodic vibration it is achieved that the sounding of vibrating diaphragm.
This sound-producing device of the present invention, may apply in the middle of receiver or speaker, its breach conventional coil,
The mounting structure of Magnet is so as to volume is less, and can be manufactured using MEMS technology.
It was found by the inventors of the present invention that in the prior art, the structure of sound-producing device is complex, and its volume is larger, and
And mostly artificial streamline assembling, automaticity is high, far can not meet the growth requirement of modernization.Therefore, the present invention
Technical assignment to be realized or technical problem to be solved are that those skilled in the art never expect or not pre-
Phase arrives, therefore the present invention is a kind of new technical scheme.
By the detailed description to the exemplary embodiment of the present invention referring to the drawings, the further feature of the present invention and its
Advantage will be made apparent from.
Brief description
Combined in the description and the accompanying drawing of the part that constitutes description shows embodiments of the invention, and even
It is used for together explaining the principle of the present invention with its explanation.
Fig. 1 is the structural representation of sound-producing device of the present invention.
Fig. 2 is a kind of structural representation of preferred implementation of vibrating diaphragm of the present invention.
Fig. 3 is the structural representation of sound-producing device another embodiment of the present invention.
Specific embodiment
To describe the various exemplary embodiments of the present invention now with reference to accompanying drawing in detail.It should be noted that：Unless other have
Body illustrates, the positioned opposite, numerical expression of the part otherwise illustrating in these embodiments and step and numerical value do not limit this
The scope of invention.
Description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its application or any restriction using.
May be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
When in the case of, described technology, method and apparatus should be considered a part for description.
In all examples with discussion shown here, any occurrence should be construed as merely exemplary, and not
It is as restriction.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represent similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then do not need it is further discussed in subsequent accompanying drawing.
With reference to Fig. 1, the invention provides a kind of electret sound-producing device, it includes substrate 2, vibrating diaphragm 4, coil 3 etc..This
Bright substrate 2 can adopt silicon substrate, and the material of this silicon substrate belongs to the common knowledge of those skilled in the art.Described vibrating diaphragm
4 can include the connecting portion positioned at marginal position, and the vibration section positioned at medium position, in certain embodiments, also include
Ring portion between vibration section and connecting portion.It is formed with the cavity volume of hollow, the connection of described vibrating diaphragm 4 at the middle part of substrate 2
Portion carries on the substrate 2, and the vibration section of vibrating diaphragm 4 central region can be suspended at the top of substrate 2 cavity volume.This structure of vibrating diaphragm
And its position relationship and substrate between belongs to the common knowledge of those skilled in the art, here no longer illustrates.
The vibrating diaphragm 4 of the present invention forms on the substrate 2 by way of deposition, etching, for example, can deposit vibrating diaphragm on the substrate 2
Layer, forms the pattern of vibrating diaphragm 4 afterwards by way of etching.In order to ensure the insulating properties between substrate 2 and vibrating diaphragm 4, described
The region contacting between substrate 2 and vibrating diaphragm 4 can arrange insulating barrier 5, and this insulating barrier 5 can adopt the people in the art such as silicon oxide
Insulant known to member.It is also to be noted that described insulating barrier can apply other in sound-producing device needs absolutely
Between the device of edge, here no longer illustrates.
The vibrating diaphragm 4 of the present invention includes at least one of which for being passed through the conductive layer of ac signal, such as conducting metal, conduction
Conductive material well-known to those skilled in the art such as silicon materials etc..In one specific embodiment of the present invention, described shake
Film 4 generally conductive layer is that is to say, that vibrating diaphragm 4 is only made up of conductive layer；This conductive layer can be set by way of deposition, etching
Put on the substrate 2 so that the overall vibrating diaphragm as sound-producing device of this conductive layer uses, ac signal is passed through to this conductive layer
Afterwards so that whole vibrating diaphragm is powered.Insulating barrier 3 is arranged between described conductive layer and substrate 2, to ensure insulation therebetween.
In another specific embodiment of the present invention, with reference to Fig. 2, described vibrating diaphragm 4 includes conductive layer 41 and non-leads
Electric layer 40, this non-conductive layer 40 for example can adopt diaphragm materials well-known to those skilled in the art.Non-conductive layer 40 passes through
MEMS technology deposits on the substrate 2, and described conductive layer 41 may be provided at lower section, top or the inside of non-conductive layer 40.Preferably
, according to the material of the relation between conductive layer 41 and non-conductive layer 40 and conductive layer 41, described conductive layer 41 can select
Select and be combined together with non-conductive layer 40 by way of deposition, printing, spraying, plating or chemical plating.
For example when making, can depositing insulating layer on the substrate 2 first, in the disposed thereon conductive layer of insulating barrier
41, in the disposed thereon non-conductive layer 40 of conductive layer 41, thus obtain conductive layer 41 under, non-conductive layer 40 ties in upper vibrating diaphragm
Structure.
Or, in the disposed thereon non-conductive layer 40 of insulating barrier, the disposed thereon of non-conductive layer 40, printing, spraying,
Plating or the mode of chemical plating form conductive layer 41, thus obtain conductive layer 41 upper, non-conductive layer 40 under vibrating diaphragm knot
Structure.
Or, first in one layer of non-conductive layer 40 of disposed thereon of insulating barrier, in disposed thereon, the print of non-conductive layer 40
Brush, the mode of spraying, plating or chemical plating form conductive layer 41, continue one layer of non-conductive layer 40 of deposition on conductive layer 41,
Thus defining sandwich multiple structure.
The vibrating diaphragm 4 of the present invention it is preferred that conductive layer 41 be smaller in size than non-conductive layer 40, and conductive layer 41 is distributed in
The vibration section region of vibrating diaphragm, this allows for not having annexation between conductive layer 41 and substrate 2, such that it is able to make conductive layer 41 more
Drive vibrating diaphragm well, this improves the sensitivity of vibrating diaphragm.
The electret sound-producing device of the present invention, also includes the first electret electrode 3 just to setting with described conductive layer 41；
This first electret electrode 3 for example can adopt Merlon well-known to those skilled in the art, politef, poly- perfluor
Ethylene, propylene, polypropylene, polyethylene or other electret.In one specific embodiment of invention, also include substrate
1, this substrate 1 can preferably employ circuit board.Substrate 2 is arranged on the upper end of substrate 1 so that substrate 1 closes the appearance of substrate 2
Chamber.First electret electrode 3 for example can be arranged on substrate 1 on position corresponding with conductive layer 41 by way of attachment, example
As being arranged on the underface of conductive layer 41.
The first electret electrode 3 of the present invention, conductive layer are configured to：The conductive layer being passed through ac signal is stayed first
The direction driving force vertical with vibrating diaphragm 4 is produced in the presence of polar body Electrode Field.That is, the first electret electrode and conduction
Layer is correspondingly arranged together, and after conductive layer is passed through ac signal, conductive layer is acted on the first electret by electric field force and produces
Produce periodic vibration in raw electric field so that conductive layer can produce the driving force driving vibrating diaphragm periodic vibration it is achieved that
The sounding of vibrating diaphragm.
This sound-producing device of the present invention, may apply in the middle of receiver or speaker, its breach conventional coil,
The mounting structure of Magnet is so as to volume is less, and can be manufactured using MEMS technology.
The sound-producing device of the present invention, can also include arranging housing 6 on substrate 1, and described housing 6 is fixed on substrate 1
After upper, define encapsulating structure.The structures such as substrate 2, vibrating diaphragm 4 are arranged at the inside of encapsulating structure.Described housing 6 also sets
It is equipped with sound hole 7, so that the sound that vibrating diaphragm 4 sends can flow out.Wherein, can arrange on position corresponding with vibrating diaphragm 4 on substrate 1
Relief hole 9, can equalize the air pressure in the operatic tunes after sound-producing device, to improve the vibrating effect of vibrating diaphragm 4 by this relief hole 9.
In one preferred embodiment of the invention, on described housing 6 with the first electret electrode 3 just to position
It is additionally provided with the second electret electrode 8, with reference to Fig. 3.The structure of this second electret electrode 8 can be with the first electret electrode 3
Structure consistent, and the opposite charge of described first electret electrode 3 and the second electret electrode 8, the two constitutes tabular
Electric field structure.The negative charge from the positive charge of an electret to another electret for the electric field terminates, and stays when being in two
When vibrating diaphragm between polar body is passed through AC signal voltage, vibrating diaphragm is acted on by electric field force produces week in the electric field that electret produces
Phase is vibrated, and produces sound.First electret electrode, the structure of the second electret electrode improve electric field intensity, so that shaking
Vibration of membrane amplitude is bigger, and output acoustic pressure is higher.
The sound-producing device of the present invention may apply in each electronic equipment, for this present invention also offers a kind of electronics sets
Standby, it includes above-mentioned electret sound-producing device.
Although being described in detail to some specific embodiments of the present invention by example, the skill of this area
Art personnel it should be understood that example above is merely to illustrate, rather than in order to limit the scope of the present invention.The skill of this area
Art personnel are it should be understood that can modify to above example without departing from the scope and spirit of the present invention.This
Bright scope is defined by the following claims.
Claims (10)
1. a kind of electret sound-producing device it is characterised in that：Side including the substrate (2) with hollow cavity and by deposition
Formula is formed at the vibrating diaphragm (4) above substrate (2), and described vibrating diaphragm (4) includes at least one of which and is used for being passed through the conduction of ac signal
Layer；
Also include the first electret electrode (3) just to setting for the upper conductive layer with vibrating diaphragm (4)；Described first electret electrode (3),
Conductive layer is configured：Be passed through ac signal conductive layer produce in the presence of the first electret electrode (3) electric field direction with
The vertical driving force of vibrating diaphragm (4).
2. electret sound-producing device according to claim 1 it is characterised in that：Described vibrating diaphragm (4) entirety is by conductive layer structure
Become, be additionally provided with insulating barrier (3) between described conductive layer and substrate (2).
3. electret sound-producing device according to claim 1 it is characterised in that：Described vibrating diaphragm (4) includes being deposited on substrate
(2) non-conductive layer (40) on, described conductive layer (41) is arranged on lower section, top or the inside of non-conductive layer (40).
4. electret sound-producing device according to claim 3 it is characterised in that：Described vibrating diaphragm (4) includes using positioned at edge
In the connecting portion connecting substrate (2), and it is located at the vibration section of medium position, described conductive layer (41) is distributed in vibrating diaphragm (4)
On vibration section.
5. electret sound-producing device according to claim 3 it is characterised in that：Described conductive layer (41) passes through deposition, print
Brush, spraying, plating or the mode of chemical plating and non-conductive layer (40) are combined together.
6. electret sound-producing device according to claim 1 it is characterised in that：Also include substrate (1) and with substrate (1)
Constitute the housing (6) of encapsulating structure, described substrate (2) is located in encapsulating structure and is arranged on substrate (1), described first electret
Body electrode (3) is arranged on the upper position corresponding with conductive layer (41) of substrate (1)；Described housing (6) is provided with sound hole
(7).
7. electret sound-producing device according to claim 6 it is characterised in that：With the first electret on described housing (6)
Body electrode (3) just to position be additionally provided with the second electret electrode (8), described first electret electrode (3) and the second electret
The opposite charge of body electrode (8), the two constitutes parallel planar electric field.
8. electret sound-producing device according to claim 7 it is characterised in that：Described substrate (1) is circuit board.
9. the electret sound-producing device according to any one of claim 1 to 8 it is characterised in that：Described electret sounding dress
It is set to speaker or receiver.
10. a kind of electronic equipment it is characterised in that：Including the electret sound-producing device as described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610941640.1A CN106454660A (en) | 2016-10-31 | 2016-10-31 | Electret sound production device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610941640.1A CN106454660A (en) | 2016-10-31 | 2016-10-31 | Electret sound production device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106454660A true CN106454660A (en) | 2017-02-22 |
Family
ID=58178793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610941640.1A Pending CN106454660A (en) | 2016-10-31 | 2016-10-31 | Electret sound production device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106454660A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021164087A1 (en) * | 2020-02-22 | 2021-08-26 | 瑞声声学科技(深圳)有限公司 | Miniature loudspeaker |
| WO2022067975A1 (en) * | 2020-09-29 | 2022-04-07 | 瑞声声学科技(深圳)有限公司 | Mems loudspeaker |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010033670A1 (en) * | 1996-04-18 | 2001-10-25 | California Institute Of Technology A California Institute Of Technology | Thin film electret microphone |
| CN1909747A (en) * | 2005-08-03 | 2007-02-07 | 精工爱普生株式会社 | Electrostatic ultrasonic transducer, ultrasonic speaker, and electrode manufacturing method for use in ultrasonic transducer |
| CN101426165A (en) * | 2007-10-29 | 2009-05-06 | 财团法人工业技术研究院 | Single body construction for loudspeaker |
| US20110255721A1 (en) * | 2007-09-04 | 2011-10-20 | Industrial Technology Research Institute | Flat speaker unit and speaker device therewith |
| TW201338570A (en) * | 2012-03-09 | 2013-09-16 | Taiwan Electrets Electronics Co Ltd | Double-layered electret electroacoustic transducers and electronic devices containing the same |
| CN103313174A (en) * | 2012-03-09 | 2013-09-18 | 台湾驻极体电子股份有限公司 | Double-layered electret electroacoustic conversion device, and electronic device with electret loudspeaker |
| CN104768111A (en) * | 2015-03-31 | 2015-07-08 | 歌尔声学股份有限公司 | Loudspeaker device for restraining polarization and method for adjusting vibrating diaphragm balance position and paraelectric performance |
| WO2015178760A1 (en) * | 2014-05-20 | 2015-11-26 | Universiti Kebangsaan Malaysia | Electrodynamics (mems) micro speaker |
| CN206226705U (en) * | 2016-10-31 | 2017-06-06 | 歌尔股份有限公司 | A kind of electret sound-producing device and electronic equipment |
-
2016
- 2016-10-31 CN CN201610941640.1A patent/CN106454660A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010033670A1 (en) * | 1996-04-18 | 2001-10-25 | California Institute Of Technology A California Institute Of Technology | Thin film electret microphone |
| CN1909747A (en) * | 2005-08-03 | 2007-02-07 | 精工爱普生株式会社 | Electrostatic ultrasonic transducer, ultrasonic speaker, and electrode manufacturing method for use in ultrasonic transducer |
| US20110255721A1 (en) * | 2007-09-04 | 2011-10-20 | Industrial Technology Research Institute | Flat speaker unit and speaker device therewith |
| CN101426165A (en) * | 2007-10-29 | 2009-05-06 | 财团法人工业技术研究院 | Single body construction for loudspeaker |
| TW201338570A (en) * | 2012-03-09 | 2013-09-16 | Taiwan Electrets Electronics Co Ltd | Double-layered electret electroacoustic transducers and electronic devices containing the same |
| CN103313174A (en) * | 2012-03-09 | 2013-09-18 | 台湾驻极体电子股份有限公司 | Double-layered electret electroacoustic conversion device, and electronic device with electret loudspeaker |
| WO2015178760A1 (en) * | 2014-05-20 | 2015-11-26 | Universiti Kebangsaan Malaysia | Electrodynamics (mems) micro speaker |
| CN104768111A (en) * | 2015-03-31 | 2015-07-08 | 歌尔声学股份有限公司 | Loudspeaker device for restraining polarization and method for adjusting vibrating diaphragm balance position and paraelectric performance |
| WO2016155341A1 (en) * | 2015-03-31 | 2016-10-06 | 歌尔声学股份有限公司 | Polarization-suppressing speaker apparatus and method for adjusting balancing position and compliance of diaphragm |
| CN206226705U (en) * | 2016-10-31 | 2017-06-06 | 歌尔股份有限公司 | A kind of electret sound-producing device and electronic equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021164087A1 (en) * | 2020-02-22 | 2021-08-26 | 瑞声声学科技(深圳)有限公司 | Miniature loudspeaker |
| WO2022067975A1 (en) * | 2020-09-29 | 2022-04-07 | 瑞声声学科技(深圳)有限公司 | Mems loudspeaker |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5099605B2 (en) | Electronic device and electroacoustic transducer | |
| CN106454668A (en) | MEMS sound production apparatus and electronic device | |
| CN102939768B (en) | Substrate with electro-acoustic conversion element mounted thereon, microphone unit, and manufacturing methods therefor | |
| EP1216602A2 (en) | Mems digital-to-acoustic transducer with error cancellation | |
| KR101112130B1 (en) | Slim type micro-speaker having diaphragm module unifying suspension with diaphragm | |
| US9820067B2 (en) | Micro speaker with capacitors formed by conductive segmented cover and segmented diaphram | |
| JP3180969U (en) | Electret condenser microphone | |
| CN106454659A (en) | Sound production apparatus and manufacturing method thereof | |
| CN102783182A (en) | Electro acoustic transducer | |
| CN106911990A (en) | MEMS sonic transducers and its manufacture method | |
| KR20100122350A (en) | Multi-function micro-speaker | |
| CN104969574A (en) | Silicon microphone | |
| CN106658317A (en) | MEMS sound generating device and electronic equipment | |
| CN101656906B (en) | Speaker monomer structure | |
| TWI463882B (en) | Speaker | |
| CN106488369A (en) | A kind of pair of backplane MEMS sound-producing device and electronic equipment | |
| CN106454660A (en) | Electret sound production device and electronic equipment | |
| US20110158449A1 (en) | Microphone Unit | |
| CN205510390U (en) | Single loudspeaker | |
| WO2011055929A2 (en) | Microspeaker | |
| CN206226706U (en) | A kind of sound-producing device | |
| JP5097603B2 (en) | Microphone unit | |
| CN103313174B (en) | Double-deck electret electro-acoustic transduction device and there is the electronic installation of electret speakers | |
| KR102201583B1 (en) | Condenser microphone | |
| CN101729972B (en) | Methods of making speakers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200603 Address after: 266101 room 103, No. 396, Songling Road, Laoshan District, Qingdao, Shandong Province Applicant after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |