CN106450043A - Manufacturing method for organic illuminating display panel - Google Patents
Manufacturing method for organic illuminating display panel Download PDFInfo
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- CN106450043A CN106450043A CN201610996998.4A CN201610996998A CN106450043A CN 106450043 A CN106450043 A CN 106450043A CN 201610996998 A CN201610996998 A CN 201610996998A CN 106450043 A CN106450043 A CN 106450043A
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- Prior art keywords
- glue
- line
- manufacturing
- protecting film
- substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Abstract
The invention discloses a manufacturing method for an organic illuminating display panel. The manufacturing method comprises the following steps: forming a plurality of sub-panel units on a substrate and isolating the sub-panel units from each other, thereby forming isolated areas, wherein each of the sub-panel units comprises a thin film transistor array layer and an organic illuminating layer which are successively formed on the substrate; forming a thin film packaging layer on one side of the organic illuminating layer, away from the substrate, and covering the organic illuminating layer of each of the sub-panel units with the thin film packaging layer; attaching a protecting film to the thin film packaging layer, wherein the step of attaching the protecting film to the thin film packaging layer further comprises the following steps: forming a first glue layer between the protecting film and the thin film packaging layer, locating the projection of the first glue layer on the substrate in the area of the projection of the isolated area on the substrate and attaching the protecting film to the thin film packaging layer through the first glue layer.
Description
Technical field
The present invention relates to display technology field, particularly to the manufacturing method thereof of organic electroluminescence display panel.
Background technology
Compared with many display floaters, organic electroluminescence display panel has actively luminous, high-contrast, no visual angle restriction etc.
Plurality of advantages.Organic electroluminescence display panel is not only more frivolous in volume, also below original device in power consumption, contributes to being lifted
The endurance of equipment, therefore, organic electroluminescence display panel has been widely used in display technology field, will become aobvious from now on
Show the main flow of device consumption.
During organic electroluminescence display panel processing procedure, when evaporation organic luminous layer carry out thin-film package on completing substrate
Afterwards it will usually a protecting film with weak adhesion be attached on thin-film encapsulation layer interim protection is carried out to its surface, and,
Need to remove this protecting film after whole large substrates are carried out with cutting each single display floater of formation, and it is inclined again to attach one
Mating plate.
For the ease of the removal of follow-up protecting film, at present, during attaching said protection film, typically utilize a suction
After adsorption device adsorbs this protecting film, then the side of the glue-line of weak adhesion will be had on this protecting film towards thin-film encapsulation layer, general
Protecting film is attached in thin-film encapsulation layer.However, because the glue-line viscous force of protecting film side is weaker, in the actual mistake being attached
Cheng Zhong, protecting film often cannot be attached in thin-film encapsulation layer, and is still adsorbed on adsorbent equipment.Therefore, this guarantor can be made
Cuticula cannot play the effect that organic electroluminescence display panel is protected, and then, lead to the finished product of organic electroluminescence display panel
Rate declines.
Content of the invention
For defect of the prior art, it is an object of the invention to provide a kind of processing procedure side of organic electroluminescence display panel
Method, can effectively guarantee during organic electroluminescence display panel processing procedure, protecting film to be attached in thin-film encapsulation layer, make this
Protecting film plays the effect of due protection display floater, and then, improve the yield rate of organic electroluminescence display panel.
A kind of manufacturing method thereof of organic electroluminescence display panel, described manufacturing method thereof bag are provided according to an aspect of the present invention
Include following steps：Form multiple sub-panel units on a substrate, spaced, between formation between multiple described sub-panel units
Septal area；Described sub-panel unit includes thin film transistor array layer, the organic luminous layer being sequentially formed on described substrate；Institute
State the side formation thin-film encapsulation layer that organic luminous layer deviates from described substrate, described thin-film encapsulation layer covers the plurality of sub-panel
The described organic luminous layer of unit；One protecting film is attached in described thin-film encapsulation layer, wherein, attaches the step of described protecting film
Also comprise the steps in rapid：Form the first glue-line, described first glue-line between described protecting film and described thin-film encapsulation layer
Projection on the substrate is located at the region that the projection on the substrate of described spacer is located, and described protecting film passes through institute
State the first glue-line to be attached in described thin-film encapsulation layer.
Alternatively, also comprise the steps in the step forming described first glue-line：Described first glue-line is coated
Behind the side of described protecting film, described protecting film is attached in described thin-film encapsulation layer.
Alternatively, also comprise the steps in the step forming described first glue-line：Described first glue-line is coated on
After described thin-film encapsulation layer deviates from the side of described substrate, described protecting film is attached in described thin-film encapsulation layer.
Alternatively, described manufacturing method thereof also comprises the steps：Before forming described first glue-line, in described protecting film
The same side surface of described first glue-line of formation form the second glue-line, wherein, described second glue-line at least covers the plurality of
Sub-panel unit, and the viscous force of described second glue-line is less than the viscous force of described first glue-line.
Alternatively, described second glue-line is formed at the whole surface of described protecting film, and described first glue-line is formed at described
Second glue-line deviates from the side of described protecting film.
Alternatively, described second glue-line is formed at the surface of described protecting film, and the throwing on the substrate of the second glue-line
Shadow is located at the region that the projection on the substrate of described sub-panel unit is located.
Alternatively, arranged in arrays being formed on described substrate of the plurality of sub-panel unit makes described spacer be in grid
Shape.
Alternatively, described first glue-line corresponding with described spacer in latticed.
Alternatively, described manufacturing method thereof comprises the steps：After completing the step of protecting film attaching, described spacer is entered
Row cutting, meanwhile, removes described first glue-line at spacer.
Alternatively, described manufacturing method thereof comprises the steps：After cutting described spacer, organic light emission each described is shown
Show that the protecting film on unit is removed.
Alternatively, described manufacturing method thereof comprises the steps：After removing described protecting film, described thin-film encapsulation layer is pasted
Attached polaroid.
Compared to prior art, due to protecting in the manufacturing method thereof of organic electroluminescence display panel provided in an embodiment of the present invention
Form the first stronger glue-line of viscous force, this first glue-line can ensure that and for protecting film to be attached at thin film between cuticula and thin-film encapsulation layer
On encapsulated layer, therefore, this protecting film can be made to play the effect of due protection display floater, and then, improve organic light emitting display
The yield rate of panel.And, and because spacer between the projection on substrate is positioned at sub-panel unit for first glue-line is in base
The region that projection on plate is located, and the region that this spacer projects place on substrate needs be subsequently formed each display
Cut during panel, this first glue-line can be removed while cutting, therefore, remove the first glue-line after protecting film still
So can easily remove from thin-film encapsulation layer, thus, optimize whole organic electroluminescence display panel makes step.
Brief description
The detailed description with reference to the following drawings, non-limiting example made by reading, the further feature of the present invention,
Objects and advantages will become more apparent upon：
Fig. 1 is a kind of flow chart of the manufacturing method thereof of organic electroluminescence display panel of the present invention；
Fig. 2 is for forming the base after multiple sub-panel units in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
Plate top view；
Fig. 3 is for forming the base after multiple sub-panel units in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
The cross section structure schematic diagram of plate；
Fig. 4 is for forming the substrate after thin-film encapsulation layer in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
Cross section structure schematic diagram；
The flow chart for attaching protecting film in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention for the Fig. 5；
Fig. 6 be the present invention a kind of manufacturing method thereof of organic electroluminescence display panel between protecting film and thin-film encapsulation layer
The flow chart forming the first glue-line；
Fig. 7 is for forming the protecting film after the first glue-line in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
Structural representation；
Fig. 8 is for attaching the first glue-line and son after protecting film in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
Structural representation between panel unit；
Fig. 9 is the cross section structure schematic diagram of protecting film in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention；
Figure 10 is for attaching the organic light emission after polaroid in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
The cross section structure schematic diagram of display floater；
Figure 11 forms the first glue-line and the second glue in the manufacturing method thereof of another kind of organic electroluminescence display panel of the present invention
The structural representation of the protecting film after layer；
Figure 12 be the present invention the manufacturing method thereof of another kind of organic electroluminescence display panel in protecting film and thin-film encapsulation layer
Between form the flow chart of the first glue-line.
Specific embodiment
It is described more fully with example embodiment referring now to accompanying drawing.However, example embodiment can be with multiple shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, these embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment comprehensively convey to those skilled in the art.Attached in figure identical
Icon note represents same or similar structure, thus will omit repetition thereof.
Described feature, structure or characteristic can combine in one or more embodiments in any suitable manner
In.In the following description, many details are provided thus being given, embodiments of the present invention to be fully understood.However,
One of ordinary skill in the art would recognize that, there is no one of specific detail or more, or adopt other methods, constituent element, material
Material etc. is it is also possible to put into practice technical scheme.In some cases, be not shown in detail or describe known features, material or
Person's operation is to avoid the fuzzy present invention.
According to present subject matter design, the manufacturing method thereof of the organic electroluminescence display panel of the present invention comprises the steps：?
Multiple sub-panel units are formed on one substrate, spaced between multiple sub-panel units, form spacer；Sub-panel unit bag
Include the thin film transistor array layer being sequentially formed on substrate, organic luminous layer；Deviate from the side shape of substrate in organic luminous layer
Become thin-film encapsulation layer, thin-film encapsulation layer covers the organic luminous layer of multiple sub-panel units；One protecting film is attached at thin film envelope
On dress layer, wherein, also comprise the steps in the step attaching protecting film：Form first between protecting film and thin-film encapsulation layer
Glue-line, the first glue-line is located at, in the projection on substrate, the region that projection on substrate for the spacer is located, and protecting film passes through first
Glue-line is attached in thin-film encapsulation layer.
With reference to the accompanying drawings and examples the technology contents of the present invention are described further.
Refer to Fig. 1, the flow chart that it illustrates a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention.As figure
Shown in 1, in an embodiment of the present invention, the manufacturing method thereof of this organic electroluminescence display panel comprises the steps：
Step S10：Form multiple sub-panel units on a substrate, spaced between multiple sub-panel units, formed
Spacer.Please also refer to Fig. 2 and Fig. 3, which respectively show a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
The top view of substrate after the multiple sub-panel units of middle formation and cross section structure schematic diagram.Wherein, Fig. 3 is at A-A in Fig. 2
Cross section structure schematic diagram.As shown in Fig. 2 the side surface that multiple sub-panel units 2 are formed at substrate 1 is (real shown in Fig. 2 and Fig. 3
Apply the upper surface for substrate 1 in example).Specifically, in the embodiment shown in Figure 2, multiple sub-panel units 2 are arranged in arrays
It is formed on substrate 1, and spaced between multiple sub-panel unit 2, form spacer 3.And then, due to multiple sub-panel lists
Unit 2 is arranged in arrays, therefore, makes spacer 3 be in latticed.It should be noted that only with square in the embodiment shown in Fig. 2
Illustrate as a example the sub-panel unit of battle array arrangement, but in actual making technology, the arrangement mode of sub-panel unit is not
It is limited to this, it can be changed according to actual process requirements, will not be described here.
As shown in figure 3, each sub-panel unit 2 at least includes the thin film transistor array layer being sequentially formed on substrate 1
21 and organic luminous layer 22.Specifically, thin film transistor array layer 21 is formed on substrate 1.Wherein, thin film transistor (TFT) array
Layer 21 can be any one structure in existing display floater, for example, can include multiple TFTs, a plurality of
Data wire and a plurality of gate line etc., will not be described here.Organic luminous layer 22 is formed at thin film transistor array layer 21
Deviate from the side (in Fig. 3, organic luminous layer 22 is formed above thin film transistor array layer 21) of substrate 1.Wherein, organic light emission
Layer 22 can be any one structure in existing organic electroluminescence display panel, for example, can include anode layer, organic luminous layer
And cathode layer etc., will not be described here.
Step S20：The side deviating from substrate in organic luminous layer forms thin-film encapsulation layer, and thin-film encapsulation layer covers many height
The organic luminous layer of panel unit.Refer to Fig. 4, it illustrates a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
The cross section structure schematic diagram of the substrate after middle formation thin-film encapsulation layer.Specifically, thin-film encapsulation layer 4 is formed at organic luminous layer
22 sides deviating from substrate 1.In the embodiment shown in fig. 4, thin-film encapsulation layer 4 is formed at thin film transistor array layer 21 and has
On machine luminescent layer 22, it covers the organic luminous layer 22 of each sub-panel unit 2, in order to after avoiding extraneous water oxygen to invade with organic
Luminescent layer 22 contacts, thus ensureing display performance and the service life of organic electroluminescence display panel.It should be noted that thin film
Encapsulated layer 4 is completely covered organic luminescent layer 22, and spacer can be covered (as shown in Figure 4) by thin-film encapsulation layer 4 completely, also may be used
Not exclusively to be covered by thin-film encapsulation layer, it is determined on a case-by-case basis.
Step S30：One protecting film is attached in thin-film encapsulation layer.It should be noted that protecting film in this step
It is for interim protection being carried out to it during organic electroluminescence display panel processing procedure, generally needing in existing making technology
It is removed.Specifically, refer to Fig. 5, it illustrates a kind of processing procedure of organic electroluminescence display panel of the present invention
The flow chart attaching protecting film in method.Also include in as shown in figure 5, above-mentioned steps S30 (step attaching protecting film) as
Lower step：
Step S301：Form the first glue-line between protecting film and thin-film encapsulation layer.Projection on substrate for first glue-line
The region being located positioned at projection on substrate for the spacer, protecting film is attached in thin-film encapsulation layer by the first glue-line.Wherein,
The viscous force of the first glue-line is enough to avoid the viscous force being mutually disengaged between protecting film and thin-film encapsulation layer, existing such that it is able to avoid
The problems such as protecting film occurring in making technology cannot be pasted on organic electroluminescence display panel.Further, since the first glue-line exists
Projection on substrate is located at the region that projection on substrate for the spacer is located, therefore, when subsequently cut to spacer
During, the first glue-line together can be removed, such that it is able to be easy to be removed protecting film by organic electroluminescence display panel.
Further, refer to Fig. 6, it illustrates in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention
The flow chart forming the first glue-line between protecting film and thin-film encapsulation layer.As shown in fig. 6, (forming the first glue in step S301
Layer step) in also comprise the steps：
Step S3011：First glue-line is coated the side of a protecting film.Refer to Fig. 7, it illustrates the one of the present invention
Form the structural representation of the protecting film after the first glue-line in the manufacturing method thereof planting organic electroluminescence display panel.Specifically, exist
In embodiment shown in Fig. 7, the size of protecting film 5 is identical with the size (i.e. length and width) of substrate 1, and the first glue-line 6 is formed
Side in protecting film 5.Because spacer 3 is in latticed (can be found in Fig. 2), therefore, in order that protecting film 5 is pasted to thin film envelope
Rear on dress layer 4, the first glue-line 6 projection on substrate 1 is located at the region that spacer 3 projection on substrate 1 is located, therefore,
First glue-line 6 is in accordingly latticed with spacer 3.It should be noted that in other embodiments of the invention, ensureing
While the projection on substrate 1 of first glue-line 6 is located at the region that spacer 3 projection on substrate 1 is located, the first glue-line 6
Can also be other shapes, for example, the first glue-line 6 can be formed only at latticed point of intersection in Fig. 7；Or the first glue
Layer 6 can be formed only in Fig. 7 in latticed multirow or multiple row, and these embodiments can saved used by the first glue-line 6
While material, play similar attaching effect, will not be described here.
Step S3012：Protecting film is attached in thin-film encapsulation layer.Refer to Fig. 8, the one kind that it illustrates the present invention has
Structural representation between first glue-line and sub-panel unit after attaching protecting film in the manufacturing method thereof of machine light emitting display panel.Tool
For body, after forming the protecting film 5 shown in Fig. 7, the side that protecting film 5 is formed with the first glue-line 6 is sealed towards thin film
Dress layer 4 is simultaneously attached at the surface of thin-film encapsulation layer 4, and then form structure as shown in Figure 8, it should be noted that in Fig. 8 in order to
More clearly the position relationship between antithetical phrase panel unit 2 and the first glue-line 6 illustrates, and therefore, eliminates substrate 1.
Further, in the embodiment shown in fig. 5, before step S301 (step forming the first glue-line), should
Manufacturing method thereof also includes step S300：Same side surface in formation first glue-line of protecting film forms the second glue-line.Wherein,
Two glue-lines at least cover multiple sub-panel units, and the viscous force of the second glue-line is less than the viscous force of the first glue-line.Refer to Fig. 9, its
Show the cross section structure schematic diagram of protecting film in a kind of manufacturing method thereof of organic electroluminescence display panel of the present invention.Wherein, Fig. 9
Can be understood as the cross section structure schematic diagram at B-B in above-mentioned Fig. 7.As shown in figure 9, the second glue-line 7 is formed at the whole of protecting film 5
Individual surface, the first glue-line 6 is formed at the side that the second glue-line 7 deviates from protecting film 5.Specifically, the embodiment shown in Fig. 9
In, the second glue-line 7 is formed at the whole upper surface of protecting film 5, and the first glue-line 6 is formed at the upper surface of the second glue-line 7.First glue
The shape of layer 6 can be found in Fig. 7, and the formation of the second glue-line 7 can play after avoiding the first glue-line 6 to remove protecting film 5 directly from having
The effect coming off on machine light emitting display panel, will not be described here.
Further, in the embodiment shown in fig. 1, this manufacturing method thereof includes step S40：Complete the step of protecting film attaching
After rapid, spacer is cut, meanwhile, remove the first glue-line at spacer.Specifically, because the first glue-line is in substrate
On projection be located at spacer on substrate projection be located region, therefore, while spacer is cut, first
Glue-line together can remove with spacer.
Further, in the embodiment shown in fig. 1, this manufacturing method thereof includes step S50：Behind cutting spacer, to every
Protecting film on individual organic luminescence display unit is removed.Specifically, due to there is the first glue-line of stronger viscous force upper
State in step S40 and be removed, therefore, protecting film can remove from thin-film encapsulation layer more conveniently.
Further, in the embodiment shown in fig. 1, this manufacturing method thereof comprises the steps S60：After removing protecting film,
Polaroid is attached on thin-film encapsulation layer.Refer to Figure 10, it illustrates a kind of system of organic electroluminescence display panel of the present invention
The cross section structure schematic diagram of the organic electroluminescence display panel after polaroid is attached in Cheng Fangfa.It is formed with list with after cutting in Figure 10
Illustrate as a example the organic electroluminescence display panel of individual sub- panel unit.As shown in Figure 10, polaroid 8 is attached at thin-film encapsulation layer
On 4, the surface of organic electroluminescence display panel is protected and is improved optical effect.The organic light emitting display face being formed in Figure 10
Plate is as applied to the display floater in various terminals electronic equipment.
In conjunction with above-mentioned Fig. 1 to embodiment illustrated in fig. 10, in the manufacturing method thereof of the organic electroluminescence display panel of the present invention due to
Form the first stronger glue-line of viscous force between protecting film and thin-film encapsulation layer, this first glue-line can ensure that and is attached at protecting film
In thin-film encapsulation layer, therefore, this protecting film can be made to play the effect of due protection display floater, and then, improve organic light emission
The yield rate of display floater.And, again because the first glue-line is located at the spacer between sub-panel unit in the projection on substrate
The region that projection on substrate is located, and the region that this spacer projects place on substrate needs be subsequently formed each
Cut during display floater, this first glue-line can be removed while cutting, therefore, protected after removing the first glue-line
Film still can easily remove from thin-film encapsulation layer, thus, optimize whole organic electroluminescence display panel makes step.
Figure 11 is another embodiment of the manufacturing method thereof of organic electroluminescence display panel of the present invention, refers to figure
11, after forming the first glue-line and the second glue-line in the manufacturing method thereof of another kind of organic electroluminescence display panel that it illustrates the present invention
Protecting film structural representation.In this embodiment, the second glue-line 7 is formed at the surface of protecting film.With above-mentioned Fig. 7 to Fig. 9
Unlike shown protecting film, the second glue-line is located at what projection on substrate for the sub-panel unit was located in the projection on substrate
Region, projection on substrate for first glue-line 6 is located at the region that spacer 3 projection on substrate 1 is located.Specifically, such as
Shown in Figure 11, the second glue-line 7 is not the whole surface being formed at protecting film 5 in embodiment as shown in Figure 7 to 9, but
Surface in protecting film 5 arranged in arrays, wherein, each the second glue-line 7 projection on substrate 1 is located at sub-panel unit 2
The region that 1 projection is located on substrate.In the embodiment shown in fig. 11, the size of the second glue-line 7 is more than sub-panel unit 2
Size, it equally can play what protecting film 5 after avoiding the first basic unit 6 to remove directly came off from organic electroluminescence display panel
Effect, will not be described here.
Figure 12 is another embodiment of the manufacturing method thereof of organic electroluminescence display panel of the present invention, refers to figure
12, it illustrates in the manufacturing method thereof of another kind of organic electroluminescence display panel of the present invention between protecting film and thin-film encapsulation layer
The flow chart forming the first glue-line.From unlike above-mentioned embodiment illustrated in fig. 6, the first glue-line be formed thin-film encapsulation layer it
Afterwards, be coated on sub-panel unit, between spacer.Specifically, as shown in figure 12, (form the first glue in step S301
Layer step) in comprise the steps：
Step S3011 '：First glue-line is coated on the side that thin-film encapsulation layer deviates from substrate.Wherein, the first glue-line is in base
Projection on plate is still located on the region that projection on substrate for the spacer is located.
Step S3011 '：Protecting film is attached in thin-film encapsulation layer.Wherein, protecting film can be as in above-described embodiment
One side surface is formed with the protecting film of the second glue-line or the protecting film containing only the second glue-line, can be wherein whole face
It is coated with the protecting film of the second glue-line, or the second glue-line is located at projection institute on substrate for the sub-panel unit in the projection on substrate
Protecting film in region.
This embodiment can realize the effect similar with the first embodiment shown in above-mentioned Fig. 6, will not be described here.
In sum, in the manufacturing method thereof of organic electroluminescence display panel provided in an embodiment of the present invention due in protecting film and
Form the first stronger glue-line of viscous force, this first glue-line can ensure that and for protecting film to be attached at thin-film encapsulation layer between thin-film encapsulation layer
On, therefore, this protecting film can be made to play the effect of due protection display floater, and then, improve organic electroluminescence display panel
Yield rate.And, and because spacer between the projection on substrate is positioned at sub-panel unit for first glue-line is on substrate
The region that projection is located, and the region that this spacer projects place on substrate needs be subsequently formed each display floater
During cut, this first glue-line can be removed while cutting, therefore, remove the first glue-line after protecting film still can be just
Prompt ground removes from thin-film encapsulation layer, thus, optimize whole organic electroluminescence display panel makes step.
Although the present invention is disclosed as above with alternative embodiment, but it is not limited to the present invention.Belonging to the present invention
Those skilled in the art, without departing from the spirit and scope of the present invention, when can make various changes and modification.Therefore,
Protection scope of the present invention ought be defined depending on the scope that claims are defined.
Claims (11)
1. a kind of manufacturing method thereof of organic electroluminescence display panel is it is characterised in that described manufacturing method thereof comprises the steps：
Form multiple sub-panel units on a substrate, spaced between multiple described sub-panel units, form spacer；
Described sub-panel unit includes thin film transistor array layer, the organic luminous layer being sequentially formed on described substrate；
The side deviating from described substrate in described organic luminous layer forms thin-film encapsulation layer, and described thin-film encapsulation layer covers described many
The described organic luminous layer of individual sub- panel unit；
One protecting film is attached in described thin-film encapsulation layer, wherein, also includes walking as follows in the step attaching described protecting film
Suddenly：
Form the first glue-line, the throwing on the substrate of described first glue-line between described protecting film and described thin-film encapsulation layer
Shadow is located at the region that the projection on the substrate of described spacer is located, and described protecting film is attached at by described first glue-line
In described thin-film encapsulation layer.
2. manufacturing method thereof as claimed in claim 1 it is characterised in that formed described first glue-line step in also include as
Lower step：Described first glue-line is coated behind the side of described protecting film, described protecting film is attached at described thin-film package
On layer.
3. manufacturing method thereof as claimed in claim 1 it is characterised in that formed described first glue-line step in also include as
Lower step：Described first glue-line is coated on behind the side that described thin-film encapsulation layer deviates from described substrate, described protecting film is pasted
Invest in described thin-film encapsulation layer.
4. manufacturing method thereof as claimed any one in claims 1 to 3 it is characterised in that described manufacturing method thereof also include as follows
Step：Before forming described first glue-line, the same side surface in described first glue-line of formation of described protecting film forms the
Two glue-lines, wherein, described second glue-line at least covers the plurality of sub-panel unit, and the viscous force of described second glue-line is less than institute
State the viscous force of the first glue-line.
5. manufacturing method thereof as claimed in claim 4 is it is characterised in that described second glue-line is formed at the whole of described protecting film
Surface, described first glue-line is formed at the side that described second glue-line deviates from described protecting film.
6. manufacturing method thereof as claimed in claim 4 is it is characterised in that described second glue-line is formed at the table of described protecting film
Face, and the projection on the substrate of the second glue-line is located at the area that the projection on the substrate of described sub-panel unit is located
Domain.
7. manufacturing method thereof as claimed any one in claims 1 to 3 is it is characterised in that the plurality of sub-panel unit is in square
It is in latticed that battle array arrangement form makes described spacer on described substrate.
8. manufacturing method thereof as claimed in claim 7 it is characterised in that described first glue-line corresponding with described spacer in net
Trellis.
9. manufacturing method thereof as claimed any one in claims 1 to 3 is it is characterised in that described manufacturing method thereof includes walking as follows
Suddenly：After completing the step of protecting film attaching, described spacer is cut, meanwhile, remove described first glue at spacer
Layer.
10. manufacturing method thereof as claimed in claim 9 is it is characterised in that described manufacturing method thereof comprises the steps：Cutting is described
Behind spacer, the protecting film on organic luminescence display unit each described is removed.
11. manufacturing method thereofs as claimed in claim 10 are it is characterised in that described manufacturing method thereof comprises the steps：Remove institute
After stating protecting film, polaroid is attached on described thin-film encapsulation layer.
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| CN201610996998.4A CN106450043B (en) | 2016-11-11 | 2016-11-11 | A kind of manufacturing method thereof of organic light emitting display panel |
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| CN201610996998.4A CN106450043B (en) | 2016-11-11 | 2016-11-11 | A kind of manufacturing method thereof of organic light emitting display panel |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054142A (en) * | 2017-12-14 | 2018-05-18 | 京东方科技集团股份有限公司 | The production method and display base plate of display base plate |
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