CN106413245A - Anti-EMI (Electro Magnetic Interference) circuit board with magnetic isolation, electric isolation and antenna - Google Patents
Anti-EMI (Electro Magnetic Interference) circuit board with magnetic isolation, electric isolation and antenna Download PDFInfo
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- CN106413245A CN106413245A CN201611003437.6A CN201611003437A CN106413245A CN 106413245 A CN106413245 A CN 106413245A CN 201611003437 A CN201611003437 A CN 201611003437A CN 106413245 A CN106413245 A CN 106413245A
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
One side or two sides of a circuit board is or are provided with an electromagnetic isolation layer(s); the electromagnetic isolation layer comprises a magnetic isolation layer and an electric isolation layer; the electromagnetic isolation layer is formed by a single layer, double layers and multiple layers of magnetic isolation films and non-magnetic films and the electric isolation layer through gluing or thermocompression bonding; the electric isolation layer is formed by a conductive film; the antenna can be directly printed on a copper layer of the circuit board; and the electromagnetic isolation layer and the printed circuit board form a whole anti-EMI circuit board with magnetic isolation, electric isolation and the antenna through gluing or compression bonding. Thus, problems of magnetic field interference and electric field interference in EMC (Electro Magnetic Compatibility) and the EMI can be solved. Further, the magnetic isolation layer supports a printing technology. The anti-EMI circuit board with magnetic isolation, electric isolation and the antenna comprises magnetic isolation glue, conductive glue, a self-adhesive magnetic isolation film and a self-adhesive conductive film. Design of a circuit board of a wearable device with wireless charging is particularly facilitated.
Description
Technical field
The present invention relates to areas of information technology, especially relate to electronic circuit board and manufacture and design field, particularly integrated belt
There is the novel electron wiring board of Magnetic isolation function and antenna.
Background technology
Although it is a more ripe industry that electronics prints circuit board industrial, the development of IT technology always leads
With promote manufacturing innovation, be allowed to keep up with the paces of IT innovation.As Electro Magnetic Compatibility EMC（Electro Magnetic
Compatibility）With electromagnetic interference EMI（Electro Magnetic Interference）Problem, in printed wiring board row
In industry although early be exactly a concern emphasis, but, wireless charging technology in recent years and the development of wearable device, existing
Some printed wiring board EMC, EMI state-of-the-art technologies, still do not catch up with requirement.Topmost reason is to do for stronger magnetic field
Disturb, not yet have preferable screen method at present.
First, hermetically sealed waterproofing design is called in market, calls IP67 protection.
As wearable device, the problem into water, such as intelligent watch, Intelligent bracelet, mobile phone, motion phase to be run into unavoidably
The wearable smart machine such as machine is although now with various local water-proof function, but due to current charging, substantially still adopts
Use wired charging modes, even up-to-date Samsung and i Phone, again without thoroughly removing wired charging.Although can lead to
Cross painting water-proof adhesive to solve so-called life waterproof problem, but do not reach just genuine IP67 standard after all, " prevent foreign object and ash
Dirt, entirely prevents foreign object and dust to invade ", " immersion of water when preventing from soaking, electrical equipment soaks certain time or hydraulic pressure in water one
Fixed below the mark it can be ensured that not causing because of immersion to damage ".Want to accomplish this point it is necessary to using hermetically sealed shell it is necessary to
Eliminate wired charging, use wireless charging instead.
Secondly, wireless charging be unable to do without high-intensity magnetic field it is necessary to accomplish that high-intensity magnetic field protects.
Wireless charging technology has 4 kinds at present, is magnetic field induction, magnetic resonance, electric field induction and electromagnetic wave respectively, wherein,
Magnetic field induction mode industrialization is more successful, and it is using the principle similar to transformer, by transmitting terminal（Primary）'s
Coil is to receiving terminal（Transformer secondary output）Transmitting alternating magnetic field, by the coil-induced generation alternating current of receiving terminal, thus complete
Electric energy transmission.Here, wave frequency magnetic field induction is typically, about 100KHz to 250KHz, to belong to the strong magnetic of low frequency
, magnetic resonance scheme is generally in 6.78MHz, and existing EMC, EMI protection, mainly protect high-frequency electric field, specifically arrange
Apply is to adopt metallic shield.It is known that metal, in addition to ferromagnetic metalloid, it is all paramagnetic meterial, electric field can only be shielded,
Cannot armoured magnetic field.That is, existing EMC, EMI technology, the shielding problem in magnetic field cannot be solved at all.
Existing low-power（10W, 2A order of magnitude）Wireless charging standard, such as Qi, PMA, A4WP are substantially and adopt magnetic field
Principle of induction, the wireless charging of the Apple in proposal will be using near field mr techniques, and they are all high-intensity magnetic field transmission,
In current application, they are all to isolate high-intensity magnetic field using ferromagnetic material.
3rd, existing ferromagnetic material, there are sheet material and film material, they are as an independent component, are placed in printing
Outside wiring board, install cumbersome, volume is also than larger.
The following is the Patents of the electromagnetic protection with regard to electronic circuit board field retrieving and application, they are：
1st, electric field shielding mode
These patents and application below, whole-colored is entirely the solution adopting the conductive film of non-magnetic material to be grounded, this
It is current EMC, EMI Isolated Shield mode for electric field, non-magnetic material is Isolated Shield not strong alternating magnetic field, so,
These technology cannot solve the problems, such as Magnetic isolation and the magnetic screen of wiring board.
CN201520303253.6, a kind of high-effect Low-cost electric magnetic shield film；CN201420180068.8, electromagnetic shielding
Film and the FPC including this electromagnetic shielding film；CN201520577090.0, a kind of connection line plate and electronic equipment；
CN201420309593.5, a kind of cover layer with electro-magnetic screen function；CN201320119907.0, has electromagnetic shielding effect
The composite copper clad laminate answered；CN201510415476.6 is it is adaptable to the electromagnetic screen of FPC；
CN201410016769.2, electromagnetic shielding film and comprise screened film wiring board manufacture method；
CN201310327748.8, flexible PCB and its manufacture method；CN201510640980.6, a kind of electromagnetic shielding film, contains
There are the printed wiring board of this screened film and the preparation method of this wiring board；CN201180066680.1, electromagnetic coupling structure, multilayer
The manufacture method of transmission line plate, the manufacture method of electromagnetic coupling structure and multilayer transmission wiring board；
CN200820125206.7, a kind of FPC；CN200510022031.8, a kind of flexibility with electromagnetic wave screening structure
Wiring board.
2nd, magnet films/sheets mode
These patents and application below, is all using magnet films/sheets mode, solves the problems, such as the Magnetic isolation of antenna, have plenty of in sky
Magnetic sheet or magnetic thin film are sticked in the side of line coil, and the one side having plenty of assist side sticks magnetic thin film, and structure is not and circuit
Plate integration, installs inconvenient.
CN201520855081.3, novel radio charging transmitter；CN201120117589.5, a kind of near-field communication sky
Line；CN201320312727.4, wiring board；CN201320212282.2, a kind of wireless charger with FPC connects
Receiving end；CN201521038574.4, a kind of carry magnet wiring board；CN201310158321.X, soft magnetism laminated film and manufacturer
Method and its application in the electronic device.
3rd, carry Magnetic isolation layer separate antenna mode
Following patent and application are a kind of schemes of stand-alone antenna, and with Magnetic isolation, but it is not and wiring board integration
Products scheme.
CN201020281407.3, a kind of wireless power transmission coil；CN201020281407.3, a kind of wireless power passes
Sending coil；
4th, magnetic field isolation sandwich like way
" CN201510014389.X, the embedded magnetic material circuit plate for wireless charging and processing method " and
" CN201520020415.5, for the embedded magnetic material circuit plate of wireless charging ", be same invention patent of invention and
Two kinds of applications of patent of invention, its invention thinking is in the interlayer of assist side, adds Magnetic isolation layer, and this Magnetic isolation layer can only
Enough isolation magnetic field, it is impossible to enough isolate static and alternating electric field, can not isolate electric field and magnetic field simultaneously.
" CN201521129691.1, a kind of anti-electromagnetic interference printed substrate ", is folder one in the middle of two-layer PCB
Individual ferrite wave-absorbing material；" CN201420022753.8, printed substrate electromagnetic shielding film and the printing comprising screened film
Wiring board ", presss from both sides last layer screen layer in the interlayer being assist side, is mainly made up of metal, to shield electric field.
Content of the invention
The technical problem to be solved be for above-mentioned prior art provide a kind of band Magnetic isolation and electric isolution and
The anti-EMI filter wiring board of antenna.
The present invention the adopted technical scheme that solves the above problems is：A kind of anti-with Magnetic isolation and electric isolution and antenna
EMI wiring board, it includes at least：Antenna stack, Magnetic isolation layer, electricity isolated layer, ground plane and common layer, each layer passes through glued or hot
It is overall that pressing is manufactured into a wiring board with electromagnetic isolation function；Described electromagnetic isolation comprises independent isolating mode, mixing
Isolation method, independent electrical shielding mode and ground plane shielding mode.
For example, electromagnetic isolation layer can arrange the two sides of assist side or simultaneously it is also possible to arrange the folder of assist side
In layer.Described antenna is used for launching with receipt signal the reception antenna it is also possible to as wireless charger.
Described gluing, is to be integrated layer bonding with glue, adhesive force and peel strength reach wiring board industry requirement, for example
Test must be by the adhesive force test of 3M adhesive tape；Described hot pressing, be by heating and physical compression power so that laminated is one
Body, adhesive force and peel strength reach wiring board industry requirement, and such as test must be by the adhesive force test of 3M adhesive tape；Described every
From piece, it is to be made up of the material being electrically insulated, for isolating each layer of wiring board, support glued or hot pressing, material includes at least tree
Lipid；Described antenna stack, comprises directly to print or install the layer that the conductive material of antenna manufactures；Described Magnetic isolation layer, can be every
From static and alternating magnetic field, including but not limited to the layer being manufactured in itself by soft magnetic materials and soft magnetic materials and glue-bondable hot pressing
The layer that condensation material is manufactured into；Described electricity isolated layer, can isolate alternating electric field, manufacture including but not limited to by conductive material itself
The layer becoming and the layer that is manufactured into glue-bondable hot pressing condensation material of conductive material；Described ground plane, is that the power supply in wiring board connects
Stratum；Described common layer, buries layer including but not limited to bus plane, signals layer, wiring layer, pad layer, components and parts in wiring board；
Described independent isolating mode, refers to that Magnetic isolation layer and electricity isolated layer are separated by described spacer, and Magnetic isolation layer is soft by be electrically insulated
Magnetic material and glue-bondable hot pressing condensation material manufacture complete, and electricity isolated layer is by conductive material and glue-bondable hot pressing condensation material system
Make and complete, and be grounded；Described mixing isolation method, is that Magnetic isolation layer and electricity isolated layer are mixed into same layer, magnetic now
Separation layer is completed by conductive soft magnetic materials and glue-bondable hot pressing condensation material manufacture, and is grounded；Described independent electrical shield side
Formula, refers to that electricity isolated layer and ground plane are individually present, and electricity isolated layer ground connection；Described ground plane shielding mode, refers to cancel
Electricity isolated layer, replaces electricity isolated layer by ground plane；Described ground connection, refers to this layer or electricity are electrically connected with the ground plane of wiring board
Logical；The relative permeability of described Magnetic isolation layer is more than 20, Curie temperature and is more than 50 degrees Celsius；Described conductive material comprises but does not limit
In argent, copper, gold, aluminium, receive, molybdenum, tungsten, zinc, nickel, iron, platinum, tin, lead itself and their alloy, including but not limited to it
Composition metal, comprise carbon and Carbon fibe, composite conducting material, conductive plastics, conductive rubber, conductive fibers, conduction
Coating, conductive adhesive and transparent conductive film, nanometer conductive material；Described soft magnetic materials including but not limited to：Iron, cobalt,
Nickel, permalloy, amorphous and nanocrystalline, magnetically soft alloy, Fe-based amorphous alloy, iron are Ni-based, cobalt base amorphous alloy, iron based nano crystal
Alloy, ferrite, cobalt base amorphous, nanocrystalline, silicon steel, iron powder zinc, iron sial, manganese-zinc ferrite；Described conductive soft magnetic materials
Including but not limited to iron, cobalt, nickel, permalloy, magnetically soft alloy, Fe-based amorphous alloy, iron is Ni-based, cobalt base amorphous alloy, iron-based
Nanometer crystal alloy, silicon steel, iron powder zinc, iron sial, the amorphous mixed with electrically conductive particles and nanocrystalline, ferrite, cobalt base amorphous, nanometer
Brilliant, manganese-zinc ferrite；The soft magnetic materials of described electric insulation including but not limited to amorphous and nanocrystalline, Fe-based amorphous, iron is Ni-based, cobalt
Base amorphous, iron based nano crystal, ferrite, cobalt base amorphous, nanocrystalline, manganese-zinc ferrite；
Described Magnetic isolation layer effect is to stop stationary magnetic field and alternating magnetic field from transmitting from the lateral other side of Magnetic isolation layer one.Described
Electricity isolated layer effect is to stop static and alternating electric field from transmitting from the lateral other side of electricity isolated layer one.
Described electromagnetic isolation layer and wiring board, using glued or hot pressing, form an entirety.Described Magnetic isolation layer
Relative permeability is more than 20, Curie temperature and is more than 50 degrees Celsius.In fact, relative permeability is in the case of material permission, should
This is to be the bigger the better, and Curie temperature also should be the bigger the better.
Preferably, it is contemplated that material cost, the manufacture of wiring board and wiring board later stage are applied in actual design, magnetic conductance
The suggestion that rate is selected is between 100 to 10000；And the selection of Curie temperature is more than 300 degrees Celsius, to prevent assist side
Because temperature is too high during welding, exceed Curie temperature and make Magnetic isolation layer lose isolating power.
The selection gist of soft magnetic substance is that magnetic conductivity is high, saturation flux density is high, stability is high, coercivity is low, magnetic loss
Low, electrical loss is low.
Preferably, described Magnetic isolation layer and electricity isolated layer are manufactured into film shape, and its structure comprises single layer structure and multilayer
Structure；Described single layer structure, is to be made up of one layer of thin magnetic film or conductive film, and both sides comprise to apply spacer and do not apply isolation
Piece；Described sandwich construction, comprises two-layer and above thin magnetic film or conductive film, between thin magnetic film or conductive film, folder
There is spacer, constituted by glued or hot pressing；Described thin magnetic film comprise be by soft magnetic materials powder as filler,
Uniformly mix, with nonmagnetics, the film being manufactured into, comprise the film that the simple material of magnetisable material is made in itself；Described conductive thin
Film is the film being constructed from a material that be electrically conducting.
Preferably, described namagnetic substance can select high temperature-resistant polymer material, based on the welding of wiring board later stage
It is also contemplated that, more than 300 degrees Celsius of the resistance to temperature of this macromolecular material.
Preferably, described wiring board is including but not limited to ground plane；The size and shape of described electromagnetic isolation layer, comprise with
The size shape of wiring board is identical and differs.Described electricity isolated layer is laminated including but not limited to independent isolating layer mode and ground connection
And mode, described independent isolating mode is one conductive membrane layer of setting, and does circuit with the ground plane of wiring board and be connected, its
Size and shape, more than or equal to the size and shape of described Magnetic isolation layer.Described ground plane merges mode, is to borrow in wiring board
Ground plane realize, now ground plane is positioned against Magnetic isolation layer.
That is, Magnetic isolation layer can greater than, equal to, be less than circuit board size, shape is not necessarily bound by wiring board, every
The size and shape of absciss layer, depending on being the work according to this isolation to be done.
Preferably, described electromagnetically film layer is supported to print etch process, in order to change the shape of Magnetic isolation layer.Described print
Etch process processed is including but not limited to the coating in traditional printed wiring board production, photographic exposure, development, etching, scavenger
Skill procedure Procedure, to meet the requirement for Magnetic isolation shape for the user.
That is, can print in the circuit board and etch, process isolation according to similar to printed wiring board technique
The shapes and sizes of layer.
Preferably, described electromagnetic isolation layer comprises drilled, punching and depicts other shapes, and being capable of cutting in hole
Deposition and electroplated conductive layer on face, it would be preferable to support the blind hole of wiring board, buried via hole and through hole manufacture.Described deposition and plated conductive
Layer is additionally it is possible to carry out in Magnetic isolation layer surface.
Preferably, described Magnetic isolation layer, in same wiring board, comprises same layer polylith pattern and different layers polylith pattern.
Described same layer polylith pattern, refers in the plane of a layer of assist side, arranges polylith unconnected Magnetic isolation layer each other.Institute
State different layers polylith pattern, refer to the different layer of assist side, arrange multiple Magnetic isolation layers.
By same layer multi-module mode, in order to complete the magnetic of different magnetic field, different frequency is completed on same wiring board
Isolation；By different layers multi-mode, the such as the upper and lower of wiring board, complete the Magnetic isolation of different magnetic field, different frequency.
Preferably, the side of described Magnetic isolation layer is antenna side, other side electricity isolated layer before this, then is universal circuit
Side；Electromagnetic isolation layer does magnetic field and electric field isolation antenna side and universal circuit side, to meet EMC/EMI standard.
Preferably, there is conductive membrane layer in described antenna side, by making process of circuit board, conductive film itself is manufactured
Become antenna and connect circuit.The species of described antenna include but is not limited to wireless charging operation, RFID antenna, NFC antenna,
Bluetooth antenna, WIFI antenna, microwave antenna and other wireless aerial.They are used for receiving and launch corresponding electromagnetism
Signal, especially, can be also used for completing wireless charging.The structure of described antenna is including but not limited to coil antenna, coil sky
Linear array, microstrip antenna, micro-strip antenna array and other antenna.The composition of described antenna is including but not limited to by conductive film
Printing technology generates antenna, external enamel-covered wire coiling forms antenna and other antenna element.The material of described conductive film comprises
Described conductive material.
Preferably, described universal circuit side is common circuit plate part, including but not limited to ground plane, bus plane, letter
Number floor, electronic devices and components bury floor, electronic devices and components weld layer and electronic devices and components floor, can also be that other of wiring board is appointed
The layer what can adopt.Described electronic devices and components bury layer, refer to, in multilayer circuit board, a part of electronic devices and components be buried
Layer in the interlayer of wiring board.
Preferably, on the both sides of described wiring board, all comprise electromagnetic isolation layer, including but not limited in described electromagnetic isolation
The each independent antenna of exterior measuring of layer.
Preferably, the present invention comprises annex, described annex including but not limited to Magnetic isolation glue, electric isolution glue, from glutinous
Paste Magnetic isolation film and certainly paste electric isolution film；Described Magnetic isolation glue is uniformly to be mixed with described soft magnetic substance particulate, can be every
Glue from magnetic field.Described electric isolution glue is the conductive glue being uniformly mixed with described conductive materials.It is described that oneself pastes
Magnetic isolation film, is to coat gum by described magnetic isolation layer to constitute.Described oneself pastes electric isolution film, is to be applied by conductive materials film
Upper gum is constituted.If in antenna side in addition to antenna, it is also equipped with other electronics and device, then in these electronic devices and components
Surface, coats Magnetic isolation glue or sticks from pasting Magnetic isolation film, to protect magnetic field for the interference of these electronic devices and components.
Electric isolution glue can also be coated or stick electric isolution film, to prevent electric field for the interference of these electronic components.
Preferably, described wiring board comprises traditional wiring board mode and SoC mode；Described traditional wiring board mode,
Refer to realize using traditional circuit board machining process；Described SoC mode, is integrated circuit production and processing technology, final products
It is SoC IC chip and integrated circuit modules.
Preferably, described wiring board comprises inflexible hardboard, flexible soft board and FPC.
Compared with prior art, it is an advantage of the current invention that：
1st, realize filming and be effectively isolated high-intensity magnetic field and electric field, comprise magnetostatic field and alternating magnetic field, comprise electrostatic field and alternation electricity
, further enhance EMC, EMI performance.
2nd, existing printed wiring board no magnetic-field and anti-electric field function, it is antimagnetic and anti-electric that the present invention realizes printed wiring board
Field function, and improve wiring board integrated level, be conducive to reducing volume.
3rd, existing thick film SoC circuit does not have antimagnetic function, and the present invention realizes integrated with thick film SoC for Magnetic isolation electrical shielding
Together, be conducive to reducing volume, increase integrated level.
4th, realize printing and the etching of anti-magnetic area and shape, be conducive to flexible design and the application of whole machine.
5th, portable set is conducive to realize IP67 protection.
Brief description
Fig. 1 is the left view of one side Magnetic isolation circuit board structure figure；
Fig. 2 is the sectional view of one side Magnetic isolation circuit board structure figure；
Fig. 3 is the left view that double-side magnetic isolates the hardened composition of circuit；
Fig. 4 is the sectional view that double-side magnetic isolates the hardened composition of circuit；
Fig. 5 is the right view that double-side magnetic isolates the hardened composition of circuit；
Fig. 6 is the sectional view of individual layer Magnetic isolation layer；
Fig. 7 is the sectional view of double-layer magnetic separation layer；
Fig. 8 is the sectional view of multilayer Magnetic isolation layer；
Fig. 9 is the cut away left side view of embodiment；
Figure 10 is the sectional view of embodiment；
Figure 11 is the right side cross-sectional view of embodiment；
Figure 12 is the sectional view of the multilayer Magnetic isolation layer with electricity isolated layer.
Wherein Fig. 1：
1.1：Semi-solid preparation film
1.2：Antenna, circuit and pad
1.3：Electronic component
Wherein Fig. 2：
2.1：Antenna, circuit and pad layer
2.2：Semi-solid preparation film
2.3：Magnetic isolation layer
2.4：Ground plane
2.5：Substrate
2.6：Bus plane
2.7：Signal and pad layer
2.8：Electronic component
Wherein Fig. 3：
3.1：Semi-solid preparation film
3.1：Antenna, circuit and pad layer
3.3：Electronic component
Wherein Fig. 4：
4.1：Antenna, circuit and pad layer
4.2：Semi-solid preparation film
4.3：Magnetic isolation layer
4.4：Ground plane
4.5：Substrate
4.6：Bus plane
4.7：Signals layer
4.8：Magnetic isolation layer
4.9：Antenna, circuit and pad layer
4.10：Electronic component
Wherein Fig. 5：
5.1：Semi-solid preparation film
5.2：Antenna, circuit and pad layer
5.3：Electronic component
Wherein Fig. 6：
6.1：Nonmagnetic film
6.2：Thin magnetic film
6.3：Nonmagnetic film
Wherein Fig. 7：
7.1：Nonmagnetic film
7.2：Thin magnetic film
7.3：Nonmagnetic film
7.4：Thin magnetic film
7.5：Nonmagnetic film
Wherein Fig. 8：
8.1：Nonmagnetic film
8.2：Thin magnetic film
8.3：Nonmagnetic film
8.4：Thin magnetic film
8.5：Nonmagnetic film
8.n：Thin magnetic film
8.n+1：Nonmagnetic film
Wherein Fig. 9：
9.1：Shell
9.2：Wireless charging operation coil
9.3：Polymer battery
Wherein Figure 10：
10.1：Shell
10.2：Polymer battery
10.3：Wireless charging operation coil, circuit and pad layer
10.4：Wiring board
10.5：RFID/NFC aerial coil, circuit and pad layer
10.6：Electronic component
10.7：Bluetooth antenna
10.8：Display
Wherein Figure 11：
11.1：Shell
11.2：RFID/NFC aerial coil
11.3：Bluetooth antenna
11.4：Display
Wherein Figure 12：
12.1：Nonmagnetic film
12.2：Thin magnetic film
12.3：Nonmagnetic film
12.4：Thin magnetic film
12.5：Nonmagnetic film
12.n：Thin magnetic film
12.n+1：Nonmagnetic film
12.n+2：Conductive film
12.n+3：Nonmagnetic film.
Specific embodiment
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
Specific embodiment one, one side Magnetic isolation and the wiring board with wireless charging receiving coil for the electric isolution
General introduction
This embodiment is a tool of present invention wiring board with wireless charging receiving coil towards one side Magnetic isolation and electric isolution
Body embodiment, specifically, it is a kind of wiring board design of the intelligent watch with wireless charging.
System explanation
As depicted in figs. 1 and 2, this wiring board comprises 1 Magnetic isolation layer, 4 layers of copper, 1 laminar substrate and 4 semi-solid preparation films.Successively
According to the order arrangement of Fig. 1, by making process of circuit board, by printed circuit, boring, the heavy correlation step such as copper, hot pressing,
Create a wiring board overall.Wherein, each layer is respectively：Antenna stack 2.1, semi-solid preparation film 2.2, Magnetic isolation layer 2.3, half solid
Change film 2.2, ground plane 2.4, substrate 2.5,2.6,2 layers of semi-solid preparation film 2.2 of bus plane, signal and pad layer 2.7, wherein, in sky
In line layer 2.1, also it is welded with electronic component 1.3, signal and pad layer 2.7, is welded with electronic component 2.8.Wherein electricity isolated layer
Shared ground plane 2.4.
The wiring board of Fig. 1 and Fig. 2, is the wiring board of an intelligent watch carrying wireless charging function.Wherein, antenna stack
2.1, it is a copper foil layer on wiring board, is provided with the receiving coil antenna 1.2 of wireless charging above, also comprise part print
Circuit processed, to weld electronic component 1.3.
The present invention, on the wiring board of Fig. 1 and Fig. 2, is provided with Magnetic isolation layer 2.3, to stop magnetic field from the Magnetic isolation layer left side one
The side transmission of lateral the right；Described Magnetic isolation layer, is to be made up of ferromagnetic material, and the present embodiment is the left side being arranged in wiring board
Surface.Meanwhile, share electricity isolated layer with ground plane 2.4.
Magnetic isolation layer and wiring board adopt hot pressing, form a wiring board overall.Here the relative magnetic permeability of Magnetic isolation layer
Rate elects 710 as, and Curie temperature selects 510 degrees Celsius.To prevent during assist side welding because temperature is too high（Generally take the photograph 250
About family name's degree）And make Magnetic isolation layer lose isolating power.
If Fig. 6, Fig. 7 and Fig. 8 are the structural representations of Magnetic isolation layer.Wherein, Fig. 6 is single layer magnetic film structure, and Fig. 7 is double
Layer magnetic film structure, Fig. 8 multi-layered magnetic membrane structure.The material of thin magnetic film, comprises the metal magnetic substance film of conduction
With nonconducting soft magnetic substance film.During manufacture, nonmagnetic film to be sticked on the both sides of thin magnetic film.By hot pressing, make
Become a Magnetic isolation layer film.
For example, in Fig. 6, Fig. 7 and Fig. 8：
Single layer magnetic film, comprises nonmagnetic film 6.1, thin magnetic film 6.2 and nonmagnetic film 6.3；
Double-layer magnetic film, comprises nonmagnetic film 7.1, thin magnetic film 7.2, nonmagnetic film 7.3, thin magnetic film 7.4, non-magnetic
Property film 7.5.Here it should be noted that thin magnetic film 7.2 and 7.4, the magnetic material of identical magnetic conductivity both can be selected
Material is it is also possible to select the different magnetic material manufacture of magnetic conductivity, to meet different requiring every magnetic.
Multi-layered magnetic film, comprises nonmagnetic film 8.1, thin magnetic film 8.2, nonmagnetic film 8.3, thin magnetic film 8.4,
Nonmagnetic film 8.5, until thin magnetic film 8.n, nonmagnetic film 8.n+1.Here it should be noted that the magnetic of each layer
Property film, both can select the magnetic material of identical magnetic conductivity it is also possible to select the different magnetic material manufacture of magnetic conductivity, with full
Different the requiring every magnetic of foot.For stronger magnetic field isolation requirement, the Magnetic isolation layer that the thin magnetic film of multilayer is constituted can be selected.
Magnetic membrane material, can select various magnetisable material manufactures, can select the magnetic metallic film and not of conduction
Conductive magnetisable material film.Can by ferromagnetic material particulate, crystal, noncrystal constitute it is also possible to micro- by ferromagnetic material
Grain, crystal, noncrystal as filler, and nonmagnetics uniformly mixing is manufactured into.The present embodiment selects amorphous and nanocrystalline
Soft magnetic materials, magnetic conductivity is 500 to 1000 adjustable, selects two kinds here, that is, 500 and 1000, material thickness selects 0.1mm, material
Resistivity select 130 μ Ω cm.
Electromagnetic isolation layer can also comprise electricity isolated layer, and as shown in Figure 10 bis-, the 12.n+2 of in figure is a conductive film,
It is arranged in the right of multiple Magnetic isolation layers, plays the effect of electric isolution.In actual use, this conductive film must and circuit
The ground plane of plate electrically connects, for example, pass through blind hole or buried via hole is connected with the ground plane of wiring board.
In the present embodiment, select the Magnetic isolation layer that double-layer magnetic film is constituted, the magnetic conductivity of two-layer is 500 Hes respectively
1000.
Described namagnetic substance can select high temperature-resistant polymer material, based on equally examining of wiring board later stage welding
Consider, more than 300 degrees Celsius of the resistance to temperature of this macromolecular material.
The size and shape of Magnetic isolation layer, can identical with the size shape of wiring board it is also possible to differ.The present embodiment
For the size and shape of Magnetic isolation layer, identical with wiring board.
Laminated magnetic film passes through to adjust production technology, can support to print etch process, in order to change the shape of Magnetic isolation layer
Shape, described printing etch process produce including but not limited to similar traditional printed wiring board in coating, photographic exposure, aobvious
Shadow, etching, cleaning process flow, to meet the requirement for Magnetic isolation shape for the user.
That is, can print in the circuit board and etch, process isolation according to similar to printed wiring board technique
The shapes and sizes of layer.
Because the resistivity of magnetic material is very high, 130 μ Ω cm, almost electrical insulator, so, Magnetic isolation layer can be by
Boring, and can deposit and copper electroplating layer on the tangent plane in hole, it would be preferable to support the blind hole of wiring board, buried via hole and through hole manufacture；
Described deposition and electroplated conductive layer are it is also possible to carry out in Magnetic isolation layer surface.
Magnetic isolation layer, in same wiring board, comprises same layer polylith pattern and different layers polylith pattern；Described same layer is many
Block pattern, refers in the plane of a layer of assist side, arranges polylith unconnected Magnetic isolation layer each other；Described different layers are many
Block pattern, refers to the different layer of assist side, arranges multiple Magnetic isolation layers.
By same layer multi-module mode, in order to complete the magnetic of different magnetic field, different frequency is completed on same wiring board
Isolation；By different layers multi-mode, the such as the upper and lower of wiring board, complete the Magnetic isolation of different magnetic field, different frequency.
The present embodiment is from layer monolithic pattern, i.e. Magnetic isolation layer 2.3 as shown in Fig. 1 Fig. 2.
As shown in Fig. 1 Fig. 2, the left side of Magnetic isolation layer 2.3, is antenna stack 2.1, on the right side of Magnetic isolation layer 2.3, is general
Magnetic field isolation is done in circuit side, 2.3 antenna side of Magnetic isolation layer and universal circuit side, accomplishes that the magnetic field coming from left side does not affect magnetic
The circuit work of the circuit side on separation layer 2.3 right side.
On the two sides of same wiring board, each different Magnetic isolation layers and antenna side can be comprised.
In antenna side, and the left side of Magnetic isolation layer 2.3, by semi-solid preparation film 2.2, Copper Foil 2.1 on hot pressing, by circuit
Plate manufacturing process, is manufactured into antenna in itself Copper Foil and connects circuit；The antenna of the present embodiment is the coil for wireless charging,
It is designed to helix shape antenna 1.2, together with the connection circuit of the electronic component 1.3 of wireless charging circuit, is directly printed
Make on Copper Foil, i.e. the antenna of antenna side, circuit and pad layer 2.1.
In universal circuit side, it is provided with ground plane 2.4, bus plane 2.6 and signals layer 2.7, in signals layer except being provided with circuit
Outside the printed circuit of plate, also include the pad of electronic component 2.8, wherein, electronic component 2.8 is except wireless in whole circuit
Electronic component outside charging.System uses polymer Li-ion battery, and it is placed on the inner ring of antenna 1.2.
Said structure makes together with aerial coil is integrated into together with wiring board, electronic component.
The species of described antenna including but not limited to wireless charging operation, RFID dual-mode antenna, NFC dual-mode antenna,
Bluetooth dual-mode antenna, WIFI dual-mode antenna, microwave transmitting and receiving antenna, for receiving and launching corresponding electromagnetic signal；Described
The structure of antenna is including but not limited to coil antenna, coil antenna array, microstrip antenna, micro-strip antenna array；Described antenna
Constitute and form with external enamel-covered wire coiling including but not limited to being generated by conductive film printing technology.The material of described conductive film
Including but not limited to conductive metal film and conductive non-metals film, comprise Copper Foil.
Described universal circuit side is common circuit plate part, including but not limited to ground plane, bus plane, signals layer, electricity
Sub- components and parts weld layer and electronic devices and components layer.
In the circuit board structure of described universal circuit side, can also be including but not limited to Magnetic isolation layer and antenna, now
Magnetic isolation layer region is less than described wiring board region, in the antenna side of Magnetic isolation layer, arranges antenna.That is, assist side
Two sides, antenna and Magnetic isolation layer can be arranged.
The present invention comprises annex, and described annex pastes Magnetic isolation film including but not limited to Magnetic isolation glue and certainly, described magnetic
Isolation glue is uniformly to be mixed with ferromagnetic material particulate, crystal, non-crystal, can isolate the glue in magnetic field；Described certainly glutinous
Patch Magnetic isolation film, is to coat gum by described magnetic isolation layer to constitute；If in Fig. 1 Fig. 2 antenna side except antenna 1.2 it
Outward, it is also equipped with other electronics and device 1.3 and polymer battery, then on the surface of these electronic devices and components and battery, uniformly
Coat Magnetic isolation glue or stick from pasting Magnetic isolation film, to protect magnetic field for the interference of these electronic devices and components.
The Magnetic isolation layer of the present embodiment is electrically insulating material.Why select electrically insulating material, be to consider in printed wiring
In plate, do not affect the circuit design between each metal level.
In other example, Magnetic isolation layer choosing selects conductive material, and this layer does grounding.Why from electricity absolutely
Edge material, is to consider, in printed wiring board, Magnetic isolation and electric isolution to be united two into one.
In the universal circuit side of described Magnetic isolation layer, comprise shield layer, described shield layer comprises to be not limited to independence
Screen layer mode and ground plane merge mode, and described individual screen mode is one metal film layer of setting, and and wiring board
Ground plane electrically connect, its size and shape, more than or equal to the size and shape of described Magnetic isolation layer；Described ground plane merges
Mode, is that the ground plane borrowing in wiring board is realized, now ground plane is positioned against Magnetic isolation layer.
In the present embodiment, as shown in Fig. 1 Fig. 2, against Magnetic isolation layer 2.3 is ground plane 2.4, and the design of ground plane is
Using large-area Copper Foil, while ground connection, complete electrical shielding function.Certainly, if higher for electrical shielding requirements, here
Individually one layer of Copper Foil can be increased, and allow it to connect with ground plane in close proximity to Magnetic isolation layer 2.3.
Embodiments of the present invention, in addition to comprising traditional wiring board mode, also comprise SoC mode.Described SoC side
Formula, is integrated circuit production and processing technology, and final products are SoC IC chip and integrated circuit modules.
Certainly, wiring board of the present invention comprise inflexible hardboard and flexible soft board that is to say, that this
Bright can be embodied in completely in FPC.
It is emphasized that the Magnetic isolation layer 2.3 of the present embodiment adopts the Magnetic isolation layer of electrically insulating material, in order to avoid wiring board
The short circuit that upper plated through-hole causes.
Specific embodiment two, double-side magnetic isolate the road plate of tape two-sided antenna
General introduction
This embodiment is the present invention towards two-sided Magnetic isolation and the illustrative example with two-sided antenna wiring board.Its left hand side antenna
For receiving wireless charging, right side antenna is used for NFC/RFID and receives and dispatches.
System level gray correlation alienation explanation
Fig. 3, Fig. 4 and Fig. 5 are the circuit board structures of the present embodiment, and, compared with embodiment one, something in common is not multiple for the present embodiment
State, be in place of difference：
1st, in addition to comprising a Magnetic isolation layer 4.3 in left side, also comprise the Magnetic isolation layer 4.8 on right side.Wherein, Magnetic isolation layer
4.3 is the magnetic field in order to isolate the wireless charging transmitter from left side, prevents it to be transmitted to the right side of Magnetic isolation layer 4.3；Magnetic
Separation layer 4.8 is used for the magnetic field of isolated antennas 5.2 transmitting and the magnetic field coming from the transmitting of NFC/RFID card reader, prevents them from passing
Lead the left side of Magnetic isolation layer 4.8.Secondly as aerial coil 3.2/4.1 is for wireless charging, in order to isolate electricity further
, ground plane is designed into from the nearest position of aerial coil 4.1 4.4, allows it also serve as the function of electricity isolated layer.
2nd, wiring board increases a layers of copper, i.e. antenna and pad layer 4.9, on this layer, by printed wiring technique, spiral shell
The NFC/RFID antenna 5.2 of spiral form arranges, simultaneously the pad design of electronic component 5.3 in the inner ring of antenna 5.2,
And with circuit board blind hole technique, antenna 5.2 and electronic component 5.3 are introduced signals layer 4.7, by signals layer 4.7, complete to remove
The connection of the whole electronic components outside wireless charging.
3rd, on antenna and pad layer 4.9, on electronic component 5.3 surface in antenna 5.2 inner ring, it is uniformly coated with institute
State Magnetic isolation glue, to isolate the magnetic field coming from antenna 5.2 and coming from the transmitting of NFC/RFID card reader.
4th, it is emphasized that the Magnetic isolation layer 4.3 and 4.8 of the present embodiment is all using the Magnetic isolation layer of electrically insulating material,
In order to avoid the short circuit that on wiring board, plated through-hole causes.
Specific embodiment three, integrated wireless charging, the IP67 Intelligent bracelet of NFC/RFID, Bluetooth
General introduction
This embodiment is the IP67 Intelligent bracelet wiring board towards integrated wireless charging, NFC/RFID, Bluetooth for the present invention
Illustrative example.Its left hand side antenna is used for receiving wireless charging, right side comprise one for NFC/RFID transmitting-receiving antenna and
One Bluetooth antenna.
System level gray correlation alienation explanation
Fig. 9, Figure 10 and Figure 11 are the complete machine structures of the present embodiment, and Fig. 2 is its circuit board structure, wherein comprises：
Shell 9.1,10.1,11.1, this is hermetically sealed outer box, supports IP67 standard.
Charging aerial coil 9.2,10.3, supports Qi wireless charging standard.
Polymer battery 9.3,10.2, selecting here is 4.2V/200mAH polymer Li-ion battery.
Wiring board 10.4
Display 10.8,11.4, select here is 1 inch of OLED display.
Electronic component 10.6
NFC/RFID antenna 10.5,11.2, select here is the Antenna Design of 13.56MHz standard.
Bluetooth antenna 11.3, selects the ceramic antenna of 2.4GHz frequency range here.
As shown in Fig. 2 wherein Magnetic isolation layer is 2.3, electricity isolated layer and ground plane share 2.4 to the concrete structure of wiring board,.
The present embodiment compared with embodiment two, refuse to repeat, and is in place of difference by something in common：
1st, during NFC/RFID Antenna Operation, either transmitting or reception, its magnetic field radiation power will for comparing wireless charging
Much lower, so the impact for electronic component 10.6 and display 10.8,11.4 is much smaller.
2nd, Bluetooth adopts the ceramic antenna element of 2.4GHz frequency range, is welded direct on wiring board, notes at this
On original paper, Magnetic isolation glue must not be applied.
3rd, on the surface of electronic component 10.6, it is uniformly coated with Magnetic isolation glue, come from NFC/RFID to reduce as far as possible
The magnetic field impact of the transmitting of antenna 10.5,11.2 its own transmission and its card reader.
4th, in order to not affect the display effect of display 10.8,11.4, Magnetic isolation glue is only smeared outside display window.
5th, the present embodiment adopts Magnetic isolation layer 2.3 and the double isolation of electricity isolated layer, and wherein electricity isolated layer is to share with ground plane
2.4.
Summarize
Non-limitative illustration
Above-described embodiment is several illustrative example of the claims in the present invention, is not offered as the restriction for claim.
Specifically：
Three embodiments listed by the application are not completely covered the present invention, are not the restriction for the present invention yet, and it is only
It is the example that the present invention is implemented on respective product.
The figure of the figure of described embodiment, especially antenna stack and the figure of electromagnetic isolation layer, simply a kind of schematic diagram and principle
Figure, does not comprise circuit connecting relation, does not comprise in the wiring board design such as blind hole on wiring board, buried via hole, through hole and pad yet
Other necessary key elements, do not comprise geomery and its ratio yet.
The block diagram of described embodiment, simply according to habit of painting sanctified by usage in the industry, actually can also have other
The technique of painting；The content of block diagram unit is not the division of teaching contents that in figure is limited, only a kind of division of logic function, actual real
Can there is other dividing mode now, recombinant after being mutually combined and/or each splitting and/or split, described combination
And/or fractionation is desirably integrated into another system, some features can be ignored, or does not execute.
Noun in described accompanying drawing, a kind of simply custom title, actually also other naming methods, are not specific
Restriction.
The principle diagram of described embodiment, same is according to habit of painting sanctified by usage in the industry, simply a kind of
Schematic diagram, actually can also have other techniques of painting.The lines of in figure are straight line or curve, are dotted line or solid line, unless
Special declaration in figure or comment, does not otherwise have particular meaning.
The pictorial diagram of described embodiment, only example, can be according to explanation general in the industry, from other similar material objects
Figure.
The noun of described embodiment, same is to name according to custom sanctified by usage in the industry, and unless specifically stated otherwise is no
Other agreement nouns then can also be had to replace, and do not affect to describe.
The pattern of described embodiment, same is to name according to custom sanctified by usage in the industry, and unless specifically stated otherwise is no
Other nouns then can also be had to replace, and do not affect to describe.
It will be recognized by those of skill in the art that：
As long as those skilled in the art implement the wiring board that the embodiment of the present application is adopted, broadly fall into the application and be intended to protect
Scope.The present invention is with reference to method according to embodiments of the present invention, equipment（System）And/or schematic diagram is describing.Ying Li
Solve and supported by conventional manufacturing procedures and design cycle, should not be construed as the restriction for this invention.Especially described enforcement
The figure of example, the especially figure of antenna stack, a kind of simply schematic diagram, do not comprise circuit connecting relation, do not comprise on wiring board yet
The necessary key element of other in the wiring board design such as blind hole, buried via hole, through hole and pad.
Those skilled in the art once know basic creative concept, then these embodiments can be made other
Change and modification.So, claims are intended to be construed to including preferred embodiment and fall into all of the scope of the invention
Change and modification.Noun in described accompanying drawing, a kind of simply custom title, actually also other naming methods, be not
Specific restriction.
Those skilled in the art can be understood that, for convenience and simplicity of description, is only come with above-mentioned schematic diagram
It is illustrated, in actual applications, above-mentioned functions and shape can be distributed by different functional configurations as desired
Complete, the internal structure of device will be divided into different functional configurations, to complete all or part of function described above.
Those skilled in the art can carry out various change and modification is without deviating from the spirit of the present invention and model to the present invention
Enclose.So, if these modifications of the present invention and modification belong within the scope of the claims in the present invention and its equivalent technologies, then
The present invention is also intended to comprise these changes and modification.The specific work process of the device of foregoing description, may be referred to aforementioned
Corresponding process in embodiment of the method, will not be described here.
It will be understood by those skilled in the art that embodiments of the invention can be provided as method, system and product.Therefore, this
Bright using different wiring board design manufacturing process, either rigidity, inflexible wiring board, or flexibility, can
The wiring board of bending, both falls within the scope of the invention.
Last it should be noted that：Various embodiments above only in order to technical scheme to be described, is not intended to limit；
Although being described in detail to the present invention with reference to foregoing embodiments, it will be understood by those within the art that：Its
Still the technical scheme described in foregoing embodiments can be modified, or to wherein some or all of technical characteristic
Carry out equivalent；And these modifications or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention skill
The scope of art scheme, both falls within the scope of the invention.
Claims (11)
1. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna it is characterised in that：It includes at least antenna stack, magnetic
Separation layer, electricity isolated layer, ground plane and common layer, each layer is manufactured into one and is had electromagnetic isolation function by glued or hot pressing
Wiring board overall；Described electromagnetic isolation comprises independent isolating mode, mixing isolation method, independent electrical shielding mode and ground plane
Shielding mode.
2. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna according to claim 1 it is characterised in that：
Described wiring board comprises the spacer being formed of an electrically insulating material, and for isolating each layer of wiring board, supports glued or hot pressing, material
Material includes at least resinae；Described antenna stack, comprises directly to print or install the layer that the conductive material of antenna manufactures；Described magnetic every
Absciss layer can isolate static and alternating magnetic field, comprise layer in itself that be manufactured into by soft magnetic materials and soft magnetic materials with glue-bondable can heat
The layer that pressing material manufacture becomes；Described electricity isolated layer can isolate alternating electric field, comprises the layer being manufactured in itself by conductive material
The layer being manufactured into glue-bondable hot pressing condensation material with conductive material；Described ground plane is the power ground layer in wiring board；Institute
State common layer and include at least the embedded layer of bus plane, signals layer, wiring layer, pad layer and components and parts in wiring board；Described independence every
From mode, refer to that Magnetic isolation layer and electricity isolated layer are separated by described spacer, Magnetic isolation layer is by the soft magnetic materials being electrically insulated and can
Glued hot pressing condensation material manufacture completes, and electricity isolated layer is to be completed by conductive material and glue-bondable hot pressing condensation material manufacture, and
And be grounded；Described mixing isolation method, is that Magnetic isolation layer and electricity isolated layer are mixed into same layer, and Magnetic isolation layer now is by leading
The soft magnetic materials of electricity and glue-bondable hot pressing condensation material manufacture complete, and are grounded；Described independent electrical shielding mode, refer to electricity every
Absciss layer and ground plane are individually present, and electricity isolated layer ground connection；Described ground plane shielding mode, refers to cancel electricity isolated layer, by
Ground plane replaces electricity isolated layer；Described ground connection, refers to this layer or electricity are electrically connected with the ground plane of wiring board；Described Magnetic isolation
The relative permeability of layer is more than 20, Curie temperature and is more than 50 degrees Celsius；Described conductive material comprise argent, copper, gold, aluminium, receive,
Molybdenum, tungsten, zinc, nickel, iron, platinum, tin, lead itself and their alloy, comprise their composition metal, comprise carbon and Carbon fibe,
Composite conducting material, conductive plastics, conductive rubber, conductive fibers, electrically-conducting paint, conductive adhesive and electrically conducting transparent are thin
Film or nanometer conductive material；Described soft magnetic materials comprises：Iron, cobalt, nickel, permalloy, amorphous and nanocrystalline, magnetically soft alloy, iron
Base noncrystal alloy, iron are Ni-based, cobalt base amorphous alloy, iron-base nanometer crystal alloy, ferrite, cobalt base amorphous, nanocrystalline, silicon steel, iron
Powder zinc, iron sial or manganese-zinc ferrite；Described conductive soft magnetic materials comprises iron, cobalt, nickel, permalloy, magnetically soft alloy, iron-based
Non-crystaline amorphous metal, iron are Ni-based, cobalt base amorphous alloy, iron-base nanometer crystal alloy, silicon steel, iron powder zinc, iron sial, mixed with electrically conductive particles
Amorphous and nanocrystalline, ferrite, cobalt base amorphous, nanocrystalline or manganese-zinc ferrite；The soft magnetic materials of described electric insulation comprises amorphous
And nanocrystalline, Fe-based amorphous, iron is Ni-based, cobalt base amorphous, iron based nano crystal, ferrite, cobalt base amorphous, nanocrystalline or manganese-zinc ferrite
Body.
3. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna according to claim 2 it is characterised in that：
Described Magnetic isolation layer and electricity isolated layer are manufactured into film shape, and they all comprise single layer structure or sandwich construction；Described individual layer knot
Structure is to be made up of one layer of thin magnetic film or conductive film, and both sides apply spacer or do not apply spacer；Described sandwich construction, comprises
Two-layer and above thin magnetic film or conductive film, between thin magnetic film or conductive film, accompany spacer, by glued or
Hot pressing is constituted；Described thin magnetic film comprise be by soft magnetic materials powder as filler, and nonmagnetics uniformly mixes system
The film causing, comprises the film that the simple material of magnetisable material is made in itself；Described conductive film is constructed from a material that be electrically conducting
Film.
4. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna according to claim 3 it is characterised in that
Described thin magnetic film and conductive film support to print etch process, in order to change the shape of Magnetic isolation layer and electricity isolated layer, described
Print the coating that etch process comprises during traditional printed wiring board produces, photographic exposure, development, etching, cleaning process flow
Flow process, to meet the requirement for Magnetic isolation shape for the user.
5. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna according to claim 3 it is characterised in that
Described Magnetic isolation layer can drilled punching processing, and can deposit and electroplated conductive layer on the tangent plane in hole, it would be preferable to support line
The blind hole of road plate, buried via hole and through hole manufacture；Described deposition and electroplated conductive layer, can be carried out in Magnetic isolation layer surface.
6. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna according to claim 1 and/or 5 and/or 6,
It is characterized in that, described Magnetic isolation layer, in same wiring board, comprises same layer polylith pattern and different layers polylith pattern；Described
With layer polylith pattern, refer in the plane of a layer of assist side, arrange polylith unconnected Magnetic isolation layer each other；Described not
With layer polylith pattern, refer to the different layer of assist side, arrange multiple Magnetic isolation layers.
7. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna according to claim 6 it is characterised in that
There is conductive membrane layer in described antenna stack, by making process of circuit board, conductive film is manufactured into antenna in itself and connects electricity
Road；The species of described antenna includes wireless charging operation, RFID antenna, NFC antenna, Bluetooth antenna, WIFI antenna, micro-
Wave antenna, they are used for receiving and launch corresponding electromagnetic signal, are used for completing wireless charging；The structure of described antenna is at least wrapped
Containing coil antenna, coil antenna array, microstrip antenna, micro-strip antenna array；The composition of described antenna comprises to be printed by conductive film
Process Production antenna processed, external enamel-covered wire coiling form antenna and antenna element；The material of described conductive film is led described in comprising
Electric material.
8. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna according to claim 7 it is characterised in that
On the both sides of described wiring board, all comprise Magnetic isolation layer and/or electricity isolated layer, be included in the exterior measuring of described electromagnetic isolation layer each
Independent antenna.
9. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna according to claim 1 it is characterised in that
Described wiring board comprises annex, and described annex includes at least Magnetic isolation glue, electric isolution glue, certainly pastes Magnetic isolation film and certainly stick
Patch electric isolution film；Described Magnetic isolation glue is uniformly to be mixed with described soft magnetic substance particulate, can isolate the glue in magnetic field；Described
Electric isolution glue is the conductive glue being uniformly mixed with described conductive materials；Described oneself pastes Magnetic isolation film, is by described
Magnetic isolation layer is coated gum and is constituted；Described oneself pastes electric isolution film, is to coat gum by conductive materials film to constitute；If
Described antenna side, in addition to antenna, is also equipped with other electronics and device, then on these electronic devices and components surfaces, comprise to coat
Magnetic isolation glue or stick from pasting Magnetic isolation film, to protect magnetic field for the interference of these electronic devices and components；Comprise to coat
Electrically insulate glue or stick electric isolution film, to prevent electric field for the interference of these electronic components.
10. a kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna described according to Claim 8 with 9, its feature exists
In described wiring board comprises traditional wiring board mode and SoC mode；Described traditional wiring board mode, refers to using tradition
Circuit board machining process realize；Described SoC mode, is integrated circuit production and processing technology, and final products are SoC integrated circuits
Chip and integrated circuit modules.
A kind of anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna described in 11. according to Claim 8 with 9, its feature exists
In described wiring board comprises inflexible hardboard, flexible soft board and FPC.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611003437.6A CN106413245A (en) | 2016-11-15 | 2016-11-15 | Anti-EMI (Electro Magnetic Interference) circuit board with magnetic isolation, electric isolation and antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611003437.6A CN106413245A (en) | 2016-11-15 | 2016-11-15 | Anti-EMI (Electro Magnetic Interference) circuit board with magnetic isolation, electric isolation and antenna |
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| CN106413245A true CN106413245A (en) | 2017-02-15 |
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ID=59230740
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|---|---|---|---|
| CN201611003437.6A Pending CN106413245A (en) | 2016-11-15 | 2016-11-15 | Anti-EMI (Electro Magnetic Interference) circuit board with magnetic isolation, electric isolation and antenna |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106685489A (en) * | 2017-02-28 | 2017-05-17 | 努比亚技术有限公司 | Communication terminal and near-field communication antenna module |
| CN108281787A (en) * | 2018-01-17 | 2018-07-13 | 广东欧珀移动通信有限公司 | Electronic device |
| CN108597793A (en) * | 2018-04-27 | 2018-09-28 | 苏州威斯东山电子技术有限公司 | A kind of composite magnetic of the high-performance high-frequency rate responsiveness with stepped construction |
| CN108987078A (en) * | 2017-06-01 | 2018-12-11 | 上海光线新材料科技有限公司 | A kind of wireless charging magnetic conduction sheet and preparation method thereof |
| CN109752578A (en) * | 2019-03-15 | 2019-05-14 | 江苏多维科技有限公司 | A kind of Magnetic isolation device |
| CN110383965A (en) * | 2017-03-28 | 2019-10-25 | 三星电子株式会社 | Electronic equipment |
| CN111935967A (en) * | 2020-08-18 | 2020-11-13 | 无锡华测电子系统有限公司 | Electromagnetic shielding structure of multi-channel tile type transceiving component and installation method |
| CN112418376A (en) * | 2020-12-03 | 2021-02-26 | 谢晓佳 | Security type electronic tag with strong shielding property |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN203722915U (en) * | 2014-01-14 | 2014-07-16 | 广州方邦电子有限公司 | Electromagnetic wave shielding film used for printed circuit board and printed circuit board containing shielding film |
| TWM496324U (en) * | 2014-06-06 | 2015-02-21 | Shine Feng Entpr Co Ltd | Electromagnetic shielding type circuit board structure |
| CN206332903U (en) * | 2016-11-15 | 2017-07-14 | 丁贤根 | Anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna |
-
2016
- 2016-11-15 CN CN201611003437.6A patent/CN106413245A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN203722915U (en) * | 2014-01-14 | 2014-07-16 | 广州方邦电子有限公司 | Electromagnetic wave shielding film used for printed circuit board and printed circuit board containing shielding film |
| TWM496324U (en) * | 2014-06-06 | 2015-02-21 | Shine Feng Entpr Co Ltd | Electromagnetic shielding type circuit board structure |
| CN206332903U (en) * | 2016-11-15 | 2017-07-14 | 丁贤根 | Anti-EMI filter wiring board with Magnetic isolation and electric isolution and antenna |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106685489A (en) * | 2017-02-28 | 2017-05-17 | 努比亚技术有限公司 | Communication terminal and near-field communication antenna module |
| CN110383965A (en) * | 2017-03-28 | 2019-10-25 | 三星电子株式会社 | Electronic equipment |
| CN108987078A (en) * | 2017-06-01 | 2018-12-11 | 上海光线新材料科技有限公司 | A kind of wireless charging magnetic conduction sheet and preparation method thereof |
| CN108281787A (en) * | 2018-01-17 | 2018-07-13 | 广东欧珀移动通信有限公司 | Electronic device |
| CN108597793A (en) * | 2018-04-27 | 2018-09-28 | 苏州威斯东山电子技术有限公司 | A kind of composite magnetic of the high-performance high-frequency rate responsiveness with stepped construction |
| CN109752578A (en) * | 2019-03-15 | 2019-05-14 | 江苏多维科技有限公司 | A kind of Magnetic isolation device |
| CN111935967A (en) * | 2020-08-18 | 2020-11-13 | 无锡华测电子系统有限公司 | Electromagnetic shielding structure of multi-channel tile type transceiving component and installation method |
| CN111935967B (en) * | 2020-08-18 | 2024-02-20 | 无锡华测电子系统有限公司 | Method for installing electromagnetic shielding structure of multichannel tile type transceiver component |
| CN112418376A (en) * | 2020-12-03 | 2021-02-26 | 谢晓佳 | Security type electronic tag with strong shielding property |
| CN112418376B (en) * | 2020-12-03 | 2022-07-08 | 深圳市宝兰德斯科技有限公司 | Secret type electronic tags of strong shielding nature |
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