CN106350769B - A kind of metal shadow mask and preparation method thereof - Google Patents

A kind of metal shadow mask and preparation method thereof Download PDF

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Publication number
CN106350769B
CN106350769B CN201610844430.0A CN201610844430A CN106350769B CN 106350769 B CN106350769 B CN 106350769B CN 201610844430 A CN201610844430 A CN 201610844430A CN 106350769 B CN106350769 B CN 106350769B
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electroforming
shadow mask
metal shadow
light
sensitive surface
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CN106350769A (en
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潘仲光
陈霞玲
童圣智
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Changzhou Optoled Aircraft Technology Co Ltd
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Changzhou Optoled Aircraft Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The embodiment of the present invention provides a kind of metal shadow mask and preparation method thereof, which comprises at 100-110 DEG C, light-sensitive surface is covered on the smooth electroforming substrate of surface cleaning with the pressure of 0.3-0.4MPa, forms the electroforming substrate with photosensitive layer；With 5-30mj/cm2Light exposure, the predeterminable area of the photosensitive layer is exposed；By the electroforming substrate with photosensitive layer after exposure, is developed, baked and embathed processing, obtain electroforming cathode；Electroforming process is carried out using the electroforming cathode, is obtained with the metal shadow mask with the predeterminable area pattern match.Metal shadow mask provided in an embodiment of the present invention and preparation method thereof, temperature and pressure by changing film increases adhesive force of the light-sensitive surface on substrate, and pass through optimization exposure intensity, as low as 3 μm of pore openings of figure is produced in realization on light-sensitive surface, so that production obtains metal shadow mask of the opening size at 3-40 μm.

Description

A kind of metal shadow mask and preparation method thereof
Technical field
The present embodiments relate to field of display technology more particularly to a kind of high-precision metal shadow mask and preparation method thereof.
Background technique
Organic Light Emitting Diode (organic light-emitting diode, OLED) use organic polymer materials as Semiconductor (semiconductor) material in light emitting diode.In the technique of production OLED, by will be well prepared in advance Metal shadow mask with opening is covered on substrate, is put into vacuum cavity, and the organic polymer materials in vacuum cavity are evaporated And agglomerate on the substrate, to form luminescence display unit corresponding with the metal shadow mask pattern on the substrate.
There is self luminous characteristic using the display screen of OLED, and visible angle is big, can save electric energy, at present It is used widely.With the increase of application field, the requirement to display resolution is higher and higher, the ruler of luminescence display unit Very little size directly affects the height of resolution ratio, thus needs a kind of metal shadow mask with small opening, to produce small size Luminescence display unit, to meet the use demand increasingly increased.
Summary of the invention
The embodiment of the present invention provides a kind of metal shadow mask and preparation method thereof, shady to provide the metal with small opening Cover.
The embodiment of the present invention provides a kind of preparation method of metal shadow mask, comprising:
At 100-110 DEG C, light-sensitive surface is covered in by the smooth electroforming substrate of surface cleaning with the pressure of 0.3-0.4MPa On, form the electroforming substrate with photosensitive layer；
With 5-30mj/cm2Light exposure, the predeterminable area of the photosensitive layer is exposed；
By the electroforming substrate with photosensitive layer after exposure, is developed, baked and embathed processing, obtain electroforming cathode；
Electroforming process is carried out using the electroforming cathode, is obtained shady with the metal with the predeterminable area pattern match Cover.
Wherein, electroforming process is carried out using the electroforming cathode, obtained with the gold with the predeterminable area pattern match Belong to shadow mask, comprising:
Using the nickel block of sulfur-bearing as electroforming anode, the electroforming anode and the electroforming cathode are placed at a distance of 20-50cm In the electroforming tank for filling electroforming solution；
Under conditions of electroforming solution pH value is 4.0-4.5, temperature is 45-55 DEG C, with 5-25A/ft2Current density electroforming 18-25min obtains the coating of preset thickness on the electroforming cathode；
Electroforming cathode after taking out electroforming, washes off remaining electroforming solution and extra light-sensitive surface；
Coating is torn from substrate, is obtained with the metal shadow mask with the predeterminable area pattern match.
Wherein, described with 5-25A/ft2Current density electroforming 18-25min, default thickness is obtained on the electroforming cathode The coating of degree, comprising:
Use 5-10A/ft2Low current plate 3-5min, then increase current density to 20-25A/ft215-20min is plated, Until thickness of coating is 5-15 μm.
Specifically, the photographic film thickness is 10-15 μm.
The method also includes:
The obtained electroforming metal shadow mask is immersed in move back in film liquid at least after twenty minutes matched with the light-sensitive surface It takes out, is put into temperature more than or equal to being cleaned by ultrasonic in 70 DEG C, the strong base solution that mass concentration is 1-5%, then takes out and use clear water It dries up, is reused containing CF after flushing4Plasma gas further clean until remove remaining sense on the metal shadow mask Light film.
Specifically, the electroforming solution includes:
320-640g/L dithiocarbamic acid nickel, 20-40g/L nickelous bromide, 35-45g/L boric acid, 1-2g/L wetting agent, 0.5-1g/L Brightener, 0.7-1.4g/L leveling agent.
Specifically, by the electroforming substrate with photosensitive layer after exposure, develop, comprising:
Use the K that temperature is 20-30 DEG C, pressure 0.15-0.35MPa, mass concentration are 0.2-1%2CO3Solution carries out Spray development.
The embodiment of the invention also provides a kind of electroforming mask plates prepared by the above method.
The opening size of the metal shadow mask is 3-40 μm；
The metal shadow mask with a thickness of 5-15 μm.
Electroforming mask plate provided in an embodiment of the present invention and preparation method thereof, the temperature and pressure by changing film increase Adhesive force of the light-sensitive surface on substrate, and by changing light exposure, as low as 3 μm of pore openings of figure is produced in realization on light-sensitive surface Shape, so that production obtains electroforming metal shadow mask of the opening size at 3-40 μm；By changing electroforming process and shadow mask cleaning process, Make metal shadow mask obtained with a thickness of 5-15 μm, and be open in cavity and mask surface noresidue light-sensitive surface.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root Other attached drawings are obtained according to these attached drawings.
Fig. 1 is electroforming metal shadow mask partial schematic diagram provided in an embodiment of the present invention；
Fig. 2 is precision measurement method schematic diagram in position provided in an embodiment of the present invention；
Fig. 3 is a kind of form of expression of precision measurement data in position provided in an embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
Conventional reagent and instrument used in the embodiment of the present invention are commercial products.
The embodiment of the invention provides a kind of preparation methods of metal shadow mask, comprising:
Step 1: at 100-110 DEG C, light-sensitive surface being covered in by the smooth electroforming of surface cleaning with 0.3-0.4MPa pressure On substrate, the electroforming substrate with photosensitive layer is formed；
Preferred surface roughness is the metal substrate of Nano grade in the embodiment of the present invention, to improve the table of mask board finished product Face brightness, the preferred stainless steel substrate of metal substrate；
The embodiment of the present invention pastes light-sensitive surface by laminating machine, is adjusted by the temperature sensor on the laminating machine Temperature when control pastes light-sensitive surface pastes to control pressure when light-sensitive surface by the pressure gauge on laminating machine；It is covered in base Photosensitive layer on plate is without wrinkle, bubble-free, zero defect.
For guarantee substrate surface cleaning, substrate can be cleaned in advance, specifically included:
First using the organic pollutant on the organic solvents cleaning base plates such as acetone, isopropanol, then it is using mass fraction The acid solution (such as nitric acid, sulfuric acid etc.) of 5-30% is cleaned, and is finally made wash with distilled water, until the entire substrate surface after cleaning Cleaning, without pollutant；
The days such as the preferred Dupont of light-sensitive surface used in the embodiment of the present invention (Du Pont), Asahi (rising sun metal) or Ordyl This producer production light-sensitive surface, such as Asahi company production model ATP-103 light-sensitive surface；To ensure on light-sensitive surface The small opening of 3-40 μm of formation, preferred 10-15 μm of the thickness of the light-sensitive surface.
Step 2: with 5-30mj/cm2Light exposure, the predeterminable area of the photosensitive layer is exposed；
Specifically, electroforming substrate about 1 hour with photosensitive layer is stood after pad pasting, stablizes light-sensitive surface；It uses in advance Designed graphic making goes out high-precision chromium plate, after light-sensitive surface stablize after, using the high-precision chromium plate and exposure machine produced into Row projection accurate exposure, will be on the graph exposure to light-sensitive surface on chromium plate；In the embodiment of the present invention, the designed figure For round micropore, pore openings diameter is at 3-40 μm, and the designed figure can also include pros in other embodiments Shape, opening size are opening side length；Light source optimal wavelength is 405nm or 365nm light when exposure；Exposure sources preferred light source light intensity Degree be greater than 1000w high-power high-accuracy exposure machine, such as Suss MicroTec company production model DSC500 it is high-precision Spend exposure machine；
The embodiment of the present invention increases adhesive force of the light-sensitive surface on substrate by changing the temperature and pressure of film, and passes through Optimize light exposure, as low as 3 μm of pore openings of figure is produced in realization on light-sensitive surface；
Step 3: by the electroforming substrate with photosensitive layer after exposure, being developed, baked and embathed processing, obtain electroforming Cathode；
Wherein, at a temperature of 20-30 DEG C, developed with the hydrojet of 0.15-0.35MPa pressure, the hydrojet uses matter Measure the K that concentration is 0.2-1%2CO3Solution；
After development, the electroforming substrate with photosensitive layer is put into oven, bakes 5-15min at 110-130 DEG C, to increase Adhesive force of the light-sensitive surface on substrate after adding development, to guarantee that the light-sensitive surface after development will not fall off in electroforming solution；
Electroforming is carried out after baking to embathe, and in the embodiment of the present invention, first uses mass concentration for the dithiocarbamic acid solution of 5-30% Remaining developer solution and floating dust are washed away, then counter-flow water is washed again, the electroforming cathode for the residual impurity that is removed.
Step 4: carrying out electroforming process using the electroforming cathode, obtain with the electricity with the predeterminable area pattern match Ingot metal shadow mask.
The step specifically includes the following steps:
Step 401: using the nickel block of sulfur-bearing as electroforming anode, by the electroforming anode and the electroforming cathode at a distance of 20- 50cm is placed in the electroforming tank for filling electroforming solution；
Specifically, the aperture position precision to guarantee mask plate that electroforming obtains, therefore, to assure that two-sided after mask sheet metal forming It is bright and unstressed, in the embodiment of the present invention, in order to eliminate the stress for the metal shadow mask that electroforming obtains, the electroforming as far as possible Liquid is composed of the following components: dithiocarbamic acid nickel, nickelous bromide, boric acid, wetting agent, brightener, leveling agent and water, in which: dithiocarbamic acid nickel 320-640g/L, nickelous bromide 20-40g/L, boric acid 35-45g/L, wetting agent 1-2g/L, brightener 0.5-1g/L, leveling agent 0.7- 1.4g/L, surplus are water.
In the embodiment of the present invention, wetting agent for example may include lauryl sodium sulfate, and brightener may include saccharin, whole Flat agent may include cumarin, and above-mentioned chemical reagent is commercial products；
In the embodiment of the present invention, the preferred 0.01%-0.04% of the mass fraction of sulfur-bearing in sulfur-bearing nickel block, to prevent sulfur-bearing nickel Impurities enter electroforming solution when block dissolves, and electroforming anode is placed in the anode of titanium alloy production, are cased with outside anode micro- The filter bag of the other aperture of meter level；
Step 402: under conditions of electroforming solution pH value is 4.0-4.5, temperature is 45-55 DEG C, with 5-25A/ft2Electric current Density electroforming 18-25min obtains the coating of preset thickness on the electroforming cathode；
In the embodiment of the present invention, plating speed is 15-20 μm/h；Electroforming solution is stirred using mechanical pump during electroforming, to protect Demonstrate,prove electroforming solution even concentration；
In order to which the nickel plated can adhere to well on electroforming cathode, it will not fall off, in the embodiment of the present invention, just open halfway Begin to use 5-10A/ft2Low current plate 3-5min slowly, careful crystallization, to increase the adhesive force of plated nickel and electroforming cathode, Then increase current density to 20-25A/ft215-20min is plated, until thickness of coating is 5-15 μm；
Step 403: the electroforming cathode after taking out electroforming washes off remaining electroforming solution and extra light-sensitive surface；
Remaining light-sensitive surface on electroforming cathodic coating can not quickly be removed after electroforming process using Conventional cleaning method, especially It is remaining light-sensitive surface in the hole of small opening, light-sensitive surface especially preferable in the embodiment of the present invention, because of its physicochemical property Particularity is even more that can not thoroughly remove using traditional handicraft, and in order to quickly and thoroughly remove light-sensitive surface, the embodiment of the present invention is adopted With following cleaning method:
Electroforming cathode after electroforming is immersed in move back in film liquid matched with the light-sensitive surface at least to take out after twenty minutes, is put Enter temperature more than or equal to being cleaned by ultrasonic in 70 DEG C, the strong base solution that mass concentration is 1-5%, then takes out and rinse after-blow with clear water It is dry, it reuses containing CF4Plasma gas further clean until remove remaining light-sensitive surface on the metal shadow mask；
By taking the light-sensitive surface of the model ATP-103 of Asahi company production as an example, the electroforming cathode after electroforming is immersed in It takes out, is put into appropriate low dense after the moving back at least 20 in film liquid of model XP-DMT matched with ATP-103 of Asahi company sale Ultrasonic cleaning for some period in strong base solution is spent, dries up, is reused containing CF after then being rinsed with clear water4Plasma gas It further cleans up to removing on the metal shadow mask, especially remaining light-sensitive surface in the opening hole of metal shadow mask；
It is clear that the potassium hydroxide solution that preferable temperature is 70 DEG C in the embodiment of the present invention, mass concentration is 3% carries out ultrasonic wave It washes；
Step 404: coating being torn from substrate, obtains electroforming metal shadow mask.
In the embodiment of the present invention, preferably mechanical mode is torn coating from substrate.
The embodiment of the invention also provides a kind of electroforming metal shadow mask prepared by the above method, the electroforming metal is shady Preferred 3-40 μm of the opening size of cover, preferred 5-15 μm of thickness, wherein the opening size both may include opening for circular open Mouth diameter also may include the side length or the corresponding opening size of other shapes opening of square aperture, and the present invention is without limitation.
Table 1 is the technological parameter list of specific embodiments of the present invention 1-6 and comparative example 1,2:
Note: the design pore openings diameter of embodiment 1-3 is 3 μm；The design pore openings diameter of embodiment 5-6 is 10 μ m；Comparative example 1 is therefore, micro- since electroforming metal shadow mask can not successfully be made when designing pore openings diameter less than 50 μm Hole opening diameter is 50 μm；It is 3 μm that comparative example 2, which designs pore openings diameter,.Embodiment 1-3 is all made of the production of Asahi company The light-sensitive surface of model ATP-103；Embodiment 4-6 is all made of the light-sensitive surface of the model FX930 of Dupont company production；Comparison The light-sensitive surface for the model FX930 that example 1 is produced using Dupont company；The model that comparative example 2 is produced using Asahi company The light-sensitive surface of ATP-103；Comparative example 1 and 2 is all made of Conventional cleaning method cleaning residual light-sensitive surface, i.e., moves back film using only matched Liquid cleaning, scavenging period are identical as embodiment 1-6；
The size of metal shadow mask made from 1-6 of the embodiment of the present invention is 360*360-400*400mm, the metal shadow mask system Cheng Hou can be used screen-tensioning machine and be soldered on smaller metal frame, then using accurate alignment machine by numerous metal frames thrown the net It is soldered on larger metal frame, forms OLED vapor deposition metal shadow mask finished product.Fig. 1 is metal shadow mask provided in an embodiment of the present invention Partial schematic diagram, region shown in Fig. 1 are centered on OLED vapor deposition aperture point corresponding with alignment apertures are stretched, having a size of 200* The square range of 200mm.
The performance of 1-6 of the embodiment of the present invention and comparative example 1,2 the electroforming metal shadow mask provided is measured:
1, the thickness that the metal shadow mask of 1-6 of the embodiment of the present invention and the offer of comparative example 1,2 is measured using surface profiler, is surveyed Amount method includes:
11 points for choosing shadow mask measure, and after measurement, (maximum gauge-minimum thickness)/average thickness=thickness is flat Equal error；
2, the circular open diameter of the electroforming metal shadow mask of 1-6 of the embodiment of the present invention and the offer of comparative example 1,2, measurement are provided Method includes:
Within the scope of the square sample of 200*200mm, it is big to randomly select 9 point measurement opening diameters as shown in Figure 1 It is small, the opening diameter of x-axis direction and the opening diameter in y-axis direction are measured respectively, and calculate separately x-axis and y-axis direction opening directly The mean error and average variance of diameter, in which:
(measured diameter-preset diameters)/preset diameters=opening diameter error, the opening diameter error of 9 points are averaged Value is opening diameter mean error, and similarly, the average value of the opening diameter variance of 9 points is opening diameter average variance；
It is illustrated so that the size of preset diameters in design configuration is 10 μm of embodiment 4 as an example:
Table 2 is opening diameter measurement data and error information table:
The opening diameter mean error for the metal shadow mask that then embodiment 4 provides is 2%, average variance 3.15%.
3, the precision of the electroforming metal shadow mask upper opening position of 1-6 of the embodiment of the present invention and the offer of comparative example 1,2 is provided, Measurement method includes:
Fig. 2 is precision measurement method schematic diagram in position provided in an embodiment of the present invention, as shown in Fig. 2, choosing 18 points Measure their location error, in which:
Measurement method: evenly dispersed 18 point close to metal shadow mask outer rim is selected, when this 18 points are preferably thrown the net Alignment point, using bidimensional image measuring device measure each point physical location (x, y-coordinate) and they on design drawing Position deviation；
Fig. 3 is a kind of form of expression of precision measurement data in position provided in an embodiment of the present invention.
Table 3 is the prepared electroforming metal shadow mask of specific embodiment of the invention 1-6 and the electroforming that comparative example 1,2 provides The parameters table of metal shadow mask:
Conclusion: the opening diameter of electroforming metal shadow mask provided in an embodiment of the present invention is much smaller than on the market at 3-40 μm There is the opening diameter of metal shadow mask, can satisfy requirement of the display screen to high-resolution (PPI > 1000)；The embodiment of the present invention mentions The electroforming metal shadow mask of confession with a thickness of 5-15 μm because in OLED evaporation process, evaporation source is far smaller than the base being deposited Plate, so need to sweep evaporation source during vapor deposition, thus vapor deposition does not carry out vertically upward completely, due to evaporation source and shade There are angles between the opening of cover, and vapor deposition face can generate edge shadow in OLED vapor deposition, and vapor deposition shadow mask is thinner, and same angle produces The edge shadow in raw vapor deposition face is smaller, thus is deposited using ultra-thin electroforming metal shadow mask provided in an embodiment of the present invention When, the edge shadow in steaming degree face can be reduced；The thickness of electroforming metal shadow mask provided in an embodiment of the present invention is up to 10 μm hereinafter, simultaneously And thickness offset is lower than 6%, far superior to existing similar vapor deposition shadow mask；Electroforming metal shadow mask provided in an embodiment of the present invention Small opening, the accurate thin shadow masks of lattice site can be made, and comparative example 1 cannot make small opening；Comparative example 2 can not make table Face is smooth, stressless metal shadow mask, is unable to satisfy the pinpoint accuracy requirement needed for OLED vapor deposition for lattice site, this hair The Aperture precision for the electroforming metal shadow mask that bright embodiment provides is much higher than comparative example 2 and existing similar vapor deposition shadow mask.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features； And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and Range.

Claims (10)

1. a kind of preparation method of metal shadow mask characterized by comprising
At 100-110 DEG C, light-sensitive surface is covered on the smooth electroforming substrate of surface cleaning with the pressure of 0.3-0.4MPa, shape At the electroforming substrate with photosensitive layer；
With the light exposure of 5-30mj/cm2, the predeterminable area of the photosensitive layer is exposed；
By the electroforming substrate with photosensitive layer after exposure, is developed, baked and embathed processing, obtain electroforming cathode；
Electroforming process is carried out using the electroforming cathode, the electroforming process is with 5-25A/ft2Current density electroforming 18- 25min, wherein with 5-10A/ft2Low current plate 3-5min slowly, then increase current density to 20-25A/ft2Plate 15- 20min is obtained with the metal shadow mask with the predeterminable area pattern match.
2. being obtained the method according to claim 1, wherein described carry out electroforming process using the electroforming cathode To the metal shadow mask having with the predeterminable area pattern match, comprising:
Using the nickel block of sulfur-bearing as electroforming anode, the electroforming anode and the electroforming cathode are placed on Sheng at a distance of 20-50cm Have in the electroforming tank of electroforming solution；
Under conditions of electroforming solution pH value is 4.0-4.5, temperature is 45-55 DEG C, with 5-25A/ft2Current density electroforming 18- 25min obtains the coating of preset thickness on the electroforming cathode；
Electroforming cathode after taking out electroforming, washes off remaining electroforming solution and extra light-sensitive surface；
Coating is torn from substrate, is obtained with the metal shadow mask with the predeterminable area pattern match.
3. according to the method described in claim 2, it is characterized in that, described with 5-25A/ft2Current density electroforming 18- 25min obtains the coating of preset thickness on the electroforming cathode, comprising:
Use 5-10A/ft2Low current plate 3-5min, then increase current density to 20-25A/ft215-20min is plated, until Thickness of coating is 5-15 μm.
4. method according to claim 1-3, which is characterized in that the photographic film thickness is 10-15 μm.
5. according to the method described in claim 4, it is characterized by further comprising:
Electroforming cathode after electroforming is immersed in move back in film liquid matched with the light-sensitive surface at least to take out after twenty minutes, is put into temperature It is cleaned by ultrasonic in the strong base solution that degree is more than or equal to 70 DEG C, mass concentration is 1-5%, then takes out and dried up after being rinsed with clear water, It reuses containing CF4Plasma gas further clean until remove remaining light-sensitive surface on the metal shadow mask.
6. according to the method described in claim 2, it is characterized in that, the electroforming solution includes:
320-640g/L dithiocarbamic acid nickel, 20-40g/L nickelous bromide, 35-45g/L boric acid, 1-2g/L wetting agent, 0.5-1g/L are bright Agent, 0.7-1.4g/L leveling agent.
7. the method according to claim 1, wherein the electroforming substrate with photosensitive layer by after exposure, Develop, comprising:
Use the K that temperature is 20-30 DEG C, pressure 0.15-0.35MPa, mass concentration are 0.2-1%2CO3Solution is sprayed Development.
8. the metal shadow mask of any one of -7 the method preparations according to claim 1.
9. metal shadow mask according to claim 8, which is characterized in that the opening size of the metal shadow mask is 3-40 μm.
10. metal shadow mask according to claim 8, which is characterized in that the metal shadow mask with a thickness of 5-15 μm.
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CN103203964A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for an electroformed stencil
CN103388121A (en) * 2012-05-08 2013-11-13 昆山允升吉光电科技有限公司 Hybrid preparation process of high-precision metal mask plate

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