CN106312567A - Laser-assisted orthogonal micro-cutting device and method having automatic laser focus following function - Google Patents
Laser-assisted orthogonal micro-cutting device and method having automatic laser focus following function Download PDFInfo
- Publication number
- CN106312567A CN106312567A CN201610739003.6A CN201610739003A CN106312567A CN 106312567 A CN106312567 A CN 106312567A CN 201610739003 A CN201610739003 A CN 201610739003A CN 106312567 A CN106312567 A CN 106312567A
- Authority
- CN
- China
- Prior art keywords
- laser
- slide unit
- lens
- work surface
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
Abstract
The invention discloses a laser-assisted orthogonal micro-cutting device and method having an automatic laser focus following function, belongs to the technical field of machining equipment and aims to solve the problem that height changes of to-be-machined surfaces cannot be monitored in real time in laser-assisted micro-cutting processes in the prior art. A motion unit and a laser-assisted machining unit of the device are mounted on a shock-absorbing platform; an optical automatic following unit is arranged on the laser-assisted machining unit and comprises a lens A, a lens B and a linear array charge coupled device (CCD) sensor; laser emitted by a laser light source of the laser-assisted machining unit irradiates a to-be-machined surface via the lens A, and a laser beam reflected by the to-be-machined surface is focused on the linear array CCD sensor via the lens B; and the to-be-machined surface is mounted on the motion unit, and a computer control unit adjusts displacement of the to-be-machined surface in the direction X, the direction Y and the direction Z in real time by the aid of the motion unit according to the laser action range fed back by the linear array CCD sensor.
Description
Technical field
The invention belongs to machining equipment technical field, be specifically related to a kind of there is the laser that laser spot is followed automatically
Assist orthogonal micro-cutting device and method.
Background technology
Along with Aero-Space, national defense industry, the development of microelectronics industry, the demand to precision three-dimensional complexity micro-structure part
Day by day urgent, more and more higher in the requirement using the aspects such as function, material behavior, planform, reliability, interchangeability；For
Guarantee system at high overload, high safety reliability at high speed, under the harsh and unforgiving environments such as high rotation, widely apply have intensity high,
The complexity such as material (MMC) processing microminiature thin walled cavity, the curved body of lightweight, high tenacity, high ductibility and resistant to damage characteristic,
Abnormity, integrated morphology, but difficulty of processing increases, and laser assisted micro-cutting technology is the one solving difficult-to-machine material processing at present
Efficient processing method.Laser-assisted machining is the interaction by laser facula Yu material, at material by micro-cutting cutter
Change its performance before removing so that it is yield limit is reduced to below fracture toughness, under micro-cutting cutter effect, produce visco-plasticity
Flowing.Thus reduce cutting force, improve tool life and life-span, change Chip Morphology, reduce vibration, reduce face crack,
Improve suface processing quality.
Jonathan A.Shelton et al. [14,15] with 100 μ m diameter slotting cutters to Ti6Al4V, AISI 422, AISI
The materials such as 316 and Inconel 718 carry out the micro-milling test of laser assisted, analyze the micro-milling of laser assisted to finished surface light
Cleanliness and the impact of burrs on edges.In terms of laser assisted micro-cutting verification experimental verification, Ramesh Singh et al. [16,37,38]
The method of applied statistics analysis milling process micro-to laser assisted minute groove is optimized research, and the statistical model of improvement is effective
Eliminate the heat affecting to machined surface, and make cutting force reduce, experiment results proved can by laser auxiliary heating
Improve the accuracy of cutting groove depth.Melkote et al. [39] uses TiAlN coated carbides slotting cutter to be 62HRC to hardness
Hardening A2 tool steel has carried out laser assisted micro-milling fluting test experiments, test result indicate that: the application micro-milling of laser assisted
Tool wear and surface roughness, raising cutting speed and groove depth accuracy can be reduced.
The most comprehensively in view of the impact of material microstructure in above-mentioned laser assisted micro-cutting is tested, and micro-cutting cuts
Thickness is between 0.1-200 μm, and reinforcement and matrix grain size are typically at the yardstick of 0.1-100 μm, and the blunt circle of cutting edge roundness
Radius is suitable dimensionally, and the formation mechenism of chip and material deformation mechanism are inevitable brilliant with laser temperature field, reinforcement and matrix
Grain size, be distributed and be orientated closely related.Therefore, for difficult-to-machine material laser assisted micro-cutting process, should be by dividing
Analysis laser temperature field, reinforcement and matrix grain size, it is distributed, is orientated and reinforcement-matrix grain boundary effect is micro-to laser assisted
The impact that in working angles, surface layer microdefect is formed, research surface layer microdefect is formed and mechanism of Evolution, could go deep into,
Analyze difficult-to-machine material laser assisted Micro cutting Process physical essence comprehensively.In Milling Processes, the removal process ratio of material
The process of orthogonal cutting is increasingly complex.When studying difficult-to-machine material laser assisted micro-cutting mechanism, apply orthogonal micro-cutting real
Complicated milling process can be optimized for simple one-dimensional orthogonal working angles by proved recipe method, and research worker can be set up and actual cut
The cutting Model that process is close.Shadow produced by the operating distance of consideration laser and material is needed due to laser assisted in processing
Ring, especially in the micro-cutting course of processing, processing capacity at 0.1-200 μ m, workpiece be cut actual cut thickness with
The thickness of cutting that Machining Instruction is given there are differences, so needing the operating distance to laser accurately to measure and controlling.Mesh
Before, major part research worker is all directly to be combined with traditional milling machine or lathe by LASER Light Source, in whole system of processing
In, it is impossible to monitor the height change of work surface in real time.
Summary of the invention
It is an object of the invention to propose a kind of there is the laser assisted orthogonal micro-cutting device that laser spot is followed automatically
And method, solve the laser assisted Micro cutting Process that prior art exists can not be monitored in real time the height change of work surface
Problem, it is achieved work surface follows the laser action distance set in real time.
For achieving the above object, the present invention's has the laser assisted orthogonal micro-cutting device bag that laser spot is followed automatically
Include damped platform, moving cell, laser assisted machining cell, optics follow unit and computer control unit automatically；
Described moving cell is arranged on described damped platform, and gantry bracing frame of laser assisted machining cell is fixed on institute
Stating on damped platform, described optics is automatically followed unit and is arranged on gantry bracing frame of described laser assisted machining cell；
Described optics is automatically followed unit and is included lens A, lens B and linear CCD sensor；In laser assisted machining cell
The laser that sends of LASER Light Source be irradiated to work surface through lens A and fix a cutting tool along the front end of direction of feed, through table to be processed
The laser beam of face reflection focuses on linear CCD sensor, described linear CCD sensor and described computer control through lens B
Unit processed connects；
Described work surface is arranged on moving cell, and computer control unit feeds back according to linear CCD sensor
Laser action distance regulates work surface in real time at X to, Y-direction and the displacement of Z-direction by moving cell.
Described moving cell includes that X is to slide unit, Y-direction slide unit, Z-direction slide unit and work piece holder；Described Z-direction slide unit is fixed on and subtracts
On shake platform, described Y-direction slide unit is fixed on Z-direction slide unit；X is fixed on Y-direction slide unit to slide unit, work piece holder be fixed on X to
On slide unit；Described X uses linear electric motors to drive to slide unit, and described Y-direction slide unit and Z-direction slide unit use driven by servomotor；Z-direction is sliding
Platform is big stroke slide unit, and computer control unit controls X and moves to slide unit, Y-direction slide unit and Z-direction slide unit.
Described laser assisted machining cell also includes mounting bracket, cutting tool and force transducer；LASER Light Source is by peace
Dress support is arranged on gantry bracing frame beam top；LASER Light Source axis is arranged on cutting tool and along the front end of direction of feed and hangs down
Directly being arranged on force transducer to slide unit table top, described cutting tool in X, the main cutting edge of cutting tool is perpendicular to table to be processed
Face direction of feed.
Described LASER Light Source axis is consistent with lens A axis.
Include following based on the micro-cutting method with the laser assisted orthogonal micro-cutting device that laser spot is followed automatically
Step:
Step one: adjust micro-cutting device, work surface is clamped by work piece holder；
Step 2: the operating distance adjusting lens A and work surface is L；
Step 3: computer control unit controls moving cell and drives work surface to carry out doing orthogonal motion, it is achieved just
Meet is cut；
Step 4: the laser beam that LASER Light Source sends is irradiated to work surface through lens A, reflects through work surface
Laser beam focus on linear CCD sensor through lens B；
Step 5, whether real-time judge laser has displacement in the image planes of linear CCD sensor, the most then perform step
Six, if it is not, then perform step 8；
Step 6, the displacement d ＇ that computer control unit is formed in the image planes of linear CCD sensor according to laser passes through
Formula (1) is calculated work surface move distance d in the Y direction:
Wherein: a is the intersection point distance to lens B front principal plane of laser light incident optical axis and reflection optical axis；
B be after lens B interarea to the distance of linear CCD sensor image plane center point；
θ1For laser light incident optical axis and the angle of reflection optical axis；
θ2For laser-bounce optical axis and the angle of linear CCD sensor image planes；
Arrange and obtain work surface move distance d in the Y direction:
Step 7: computer control unit drives according to the work surface of acquisition move distance d in the Y direction in step 6
Dynamic Y-direction slide unit motion, making work surface is L with the distance of lens A；
Step 8: cutting tool continues to be processed work surface；
Step 9: repeat step 5 to step 8 until machining.
The invention have the benefit that the present invention has the laser assisted orthogonal micro-cutting dress that laser spot is followed automatically
Put and method, by the interaction of laser Yu material, before material is removed by micro-cutting cutter, change its performance so that it is surrender
The limit is reduced to below fracture toughness, produces viscoplastic flow under micro-cutting cutter effect.Thus reduce cutting force, improve cutter
Tool durability and life-span, change Chip Morphology, reduce vibration, reduces face crack, improves suface processing quality.It addition, this
Bright optics is automatically followed unit and is simultaneously used for by laser in location of workpiece feedback, and the height of monitoring work surface becomes in real time
Change.Laser, except playing the heat effect to workpiece, also acts as location of workpiece feedback effect, and the optics of the present invention follows list automatically
Unit directly uses the LASER Light Source in the processing of existing laser assisted as light source, provides cost savings, it addition, more high-precision in order to realize
The micro-cutting processing of degree, needs the theoretical cutting-in considering different materials and the difference existing for real cutting depth, and this difference is permissible
Obtain by the change of processing rear surface height is measured, and this difference is compensated the accurate micro-cutting of realization.By
The characteristic that LASER Light Source itself in existing laser assisted is processed is installed, the optical path of the present invention is perpendicular to finished surface peace
Dress, will not interfere with processing unit (plant) while accurately measuring, highly integrated measurement and processing unit (plant).Ensure that position is anti-
The precision of feedback；The invention provides a kind of the most accurate method and realize automatically following of surface of the work, solve laser assisted
In working angles, the problem that surface of the work height can not accurately be measured, improve machining accuracy.
Accompanying drawing explanation
Fig. 1 be the present invention there is the laser assisted orthogonal micro-cutting apparatus structure schematic diagram that laser spot is followed automatically；
Fig. 2 be the present invention have in the laser assisted orthogonal micro-cutting device that laser spot is followed automatically optics automatically with
With index path；
Fig. 3 be the present invention have in the laser assisted orthogonal micro-cutting device that laser spot is followed automatically optics automatically with
With schematic diagram；
Fig. 4 be the present invention there is the laser assisted orthogonal micro-cutting method flow diagram that laser spot is followed automatically；
Wherein: 1, damped platform, 2, Z-direction slide unit, 3, Y-direction slide unit, 4, X to slide unit, 5, work piece holder, 6, cutting tool,
7, force transducer, 8, LASER Light Source, 9, mounting bracket, 10, lens A, 11, linear CCD sensor, 12, lens B, 13, gantry props up
Support.
Detailed description of the invention
Below in conjunction with the accompanying drawings embodiments of the present invention are described further.
Seeing accompanying drawing 1, the laser assisted orthogonal micro-cutting device that laser spot follows automatically that has of the present invention includes subtracting
Shake platform 1, moving cell, laser assisted machining cell, optics follow unit and computer control unit automatically；
Described moving cell is arranged on described damped platform 1, and gantry bracing frame 13 of laser assisted machining cell is fixed
On described damped platform 1, described optics is automatically followed unit and is arranged on gantry bracing frame of described laser assisted machining cell
On 13；
Described optics is automatically followed unit and is included lens A10, lens B12 and linear CCD sensor 11；Laser assisted is processed
The laser that LASER Light Source 8 in unit sends is irradiated to work surface through lens A10 and fixes a cutting tool along the front end of direction of feed, warp
The laser beam of work surface reflection focuses on linear CCD sensor 11, described linear CCD sensor 11 through lens B12
Connect with described computer control unit；
Described work surface is arranged on moving cell, and computer control unit feeds back according to linear CCD sensor 11
Laser action distance regulated work surface in real time by moving cell at X to, Y-direction and the displacement of Z-direction.
Described moving cell includes that X is to slide unit 4, Y-direction slide unit 3, Z-direction slide unit 2 and work piece holder 5；Described Z-direction slide unit 2 is solid
Being scheduled on damped platform 1, described Y-direction slide unit 3 is fixed on Z-direction slide unit 2；X is fixed on Y-direction slide unit 3 to slide unit 4, workpiece clamp
Tool 5 is fixed on X on slide unit 4；Described X uses linear electric motors to drive to slide unit 4, and described Y-direction slide unit 3 and Z-direction slide unit 2 use to be watched
Take motor to drive；Z-direction slide unit 2 is big stroke slide unit, and computer control unit controls X to slide unit 4, Y-direction slide unit 3 and Z-direction slide unit 2
Motion.Owing to static load is minimum, use straight line slide unit can realize the high speed feed in orthogonal cutting；Use work piece holder 5
It is easy to the quick despatch of workpiece.
Described laser assisted machining cell also includes mounting bracket 9, cutting tool 6 and force transducer 7；LASER Light Source 8 leads to
Cross mounting bracket 9 and be arranged on gantry bracing frame 13 beam top；LASER Light Source 8 axis is arranged on cutting tool 6 along direction of feed
Front end and be perpendicular to X and be arranged on force transducer 7 to slide unit 4 table top, described cutting tool 6, the main cutting edge of cutting tool 6
Being perpendicular to work surface direction of feed, described laser assisted machining cell position is fixed, moving cell drive workpiece complete into
Give, it is achieved laser assisted orthogonal cutting.
Described LASER Light Source 8 axis is consistent with lens A10 axis, LASER Light Source 8 vertical incidence lens forming superlaser
Bundle acts on work surface.
Seeing accompanying drawing 2, optics is automatically followed unit light path and is used the LASER Light Source 8 in laser assisted machining cell, passes through
Linear CCD sensor 11 gathers the laser position of surface of the work return and calculates optical path difference variable quantity in light path, and laser assisted is just
Handing in Micro cutting Process, before workpiece cut by cutting tool 6, LASER Light Source 8 acts on work surface by lens A10, cuts
Cutting knife tool 6 cutting edge is constant with the distance of LASER Light Source 8 optical axis, sets complete before processing, depends on cutting action time
The distance of cutter 6 cutting edge and LASER Light Source 8 optical axis and the feed speed of workpiece, follow unit by optics anti-simultaneously automatically
The optical path difference variable quantity of feedback, i.e. the change of laser action distance, adjust the height of workpiece, it is ensured that workpiece is all the time at the laser set
Under operating distance processed；The feeding that described computer control unit controls moving cell by digital control system reaches with laser action
To synchronizing.
See accompanying drawing 3 and accompanying drawing 4, based on having the micro-of laser assisted orthogonal micro-cutting device that laser spot follows automatically
Cutting process comprises the following steps:
Step one: adjust micro-cutting device, is clamped work surface by work piece holder 5；
Step 2: the operating distance adjusting lens A10 and work surface is L；
Step 3: computer control unit controls moving cell and drives work surface to carry out doing orthogonal motion, it is achieved just
Meet is cut；
Step 4: the laser beam that LASER Light Source 8 sends is irradiated to work surface through lens A10, through work surface
The laser beam of reflection focuses on linear CCD sensor 11 through lens B12；
Step 5, whether real-time judge laser has displacement in the image planes of linear CCD sensor 11, the most then perform step
Rapid six, if it is not, then perform step 8；
Step 6, the displacement d ＇ that computer control unit is formed in the image planes of linear CCD sensor 11 according to laser leads to
Cross formula (1) and be calculated work surface move distance d in the Y direction:
Wherein: a is the intersection point distance to lens B12 front principal plane of laser light incident optical axis and reflection optical axis；
B be after lens B12 interarea to the distance of linear CCD sensor 11 image plane center point；
θ1For laser light incident optical axis and the angle of reflection optical axis；
θ2For laser-bounce optical axis and the angle of linear CCD sensor 11 image planes；
Arrange and obtain work surface move distance d in the Y direction:
Step 7: computer control unit drives according to the work surface of acquisition move distance d in the Y direction in step 6
Dynamic Y-direction slide unit 3 moves, and making work surface is L with the distance of lens A10；
Step 8: cutting tool 6 continues to be processed work surface；
Step 9: repeat step 5 to step 8 until machining.
Claims (5)
1. there is the laser assisted orthogonal micro-cutting device that laser spot is followed automatically, including damped platform (1), moving cell,
Laser assisted machining cell and computer control unit；
Described moving cell is arranged on described damped platform (1), and gantry bracing frame (13) of laser assisted machining cell is fixed
On described damped platform (1)；It is characterized in that,
Also including that optics follows unit automatically, described optics is automatically followed unit and is arranged on the dragon of described laser assisted machining cell
On door bracing frame (13)；Described optics is automatically followed unit and is included lens A (10), lens B (12) and linear CCD sensor
(11)；The laser that LASER Light Source (8) in laser assisted machining cell sends is irradiated to work surface upper slitter through lens A (10)
Having the front end along direction of feed, the laser beam reflected through work surface focuses on linear CCD sensor through lens B (12)
(11), described linear CCD sensor (11) and described computer control unit connect；
Described work surface is arranged on moving cell, and computer control unit feeds back according to linear CCD sensor (11)
Laser action distance regulates work surface in real time at X to, Y-direction and the displacement of Z-direction by moving cell.
The most according to claim 1 have the laser assisted orthogonal micro-cutting device that laser spot is followed automatically, its feature
Being, described moving cell includes that X is to slide unit (4), Y-direction slide unit (3), Z-direction slide unit (2) and work piece holder (5)；Described Z-direction is sliding
Platform (2) is fixed on damped platform (1), and described Y-direction slide unit (3) is fixed on Z-direction slide unit (2)；X is fixed on Y-direction to slide unit (4)
On slide unit (3), work piece holder (5) is fixed on X on slide unit (4)；Described X uses linear electric motors to drive to slide unit (4), described Y
Driven by servomotor is used to slide unit (3) and Z-direction slide unit (2)；Z-direction slide unit (2) is big stroke slide unit, computer control unit control
X processed moves to slide unit (4), Y-direction slide unit (3) and Z-direction slide unit (2).
The most according to claim 2 have the laser assisted orthogonal micro-cutting device that laser spot is followed automatically, its feature
Being, described laser assisted machining cell also includes mounting bracket (9), cutting tool (6) and force transducer (7)；LASER Light Source
(8) it is arranged on gantry bracing frame (13) beam top by mounting bracket (9)；LASER Light Source (8) axis is arranged on cutting tool
(6) along the front end of direction of feed and be perpendicular to X to slide unit (4) table top, described cutting tool (6) is arranged on force transducer (7),
The main cutting edge of cutting tool (6) is perpendicular to work surface direction of feed.
4. according to described in one claim of any of the above, there is the orthogonal micro-cutting of laser assisted that laser spot is followed automatically
Device, it is characterised in that described LASER Light Source (8) axis is consistent with lens A (10) axis.
The micro-cutting with the laser assisted orthogonal micro-cutting device that laser spot is followed automatically the most according to claim 1
Method, it is characterised in that comprise the following steps:
Step one: adjust micro-cutting device, is clamped work surface by work piece holder (5)；
Step 2: the operating distance adjusting lens A (10) and work surface is L；
Step 3: computer control unit controls moving cell and drives work surface to carry out doing orthogonal motion, it is achieved positive meet
Cut；
Step 4: the laser beam that LASER Light Source (8) sends is irradiated to work surface, through work surface through lens A (10)
The laser beam of reflection focuses on linear CCD sensor (11) through lens B (12)；
Step 5, whether real-time judge laser has displacement in the image planes of linear CCD sensor (11), the most then perform step
Six, if it is not, then perform step 8；
Step 6, the displacement d ＇ that computer control unit is formed in the image planes of linear CCD sensor (11) according to laser passes through
Formula (1) is calculated work surface move distance d in the Y direction:
Wherein: a is the intersection point distance to lens B (12) front principal plane of laser light incident optical axis and reflection optical axis；
B is lens B (12) the interarea afterwards distance to linear CCD sensor (11) image plane center point；
θ1For laser light incident optical axis and the angle of reflection optical axis；
θ2For laser-bounce optical axis and the angle of linear CCD sensor (11) image planes；
Arrange and obtain work surface move distance d in the Y direction:
Step 7: computer control unit drives Y according to the work surface of acquisition move distance d in the Y direction in step 6
Moving to slide unit (3), making work surface is L with the distance of lens A (10)；
Step 8: cutting tool (6) continues to be processed work surface；
Step 9: repeat step 5 to step 8 until machining.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610739003.6A CN106312567B (en) | 2016-08-26 | 2016-08-26 | The orthogonal micro-cutting device and method of laser assisted followed automatically with laser spot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610739003.6A CN106312567B (en) | 2016-08-26 | 2016-08-26 | The orthogonal micro-cutting device and method of laser assisted followed automatically with laser spot |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106312567A true CN106312567A (en) | 2017-01-11 |
| CN106312567B CN106312567B (en) | 2019-04-12 |
Family
ID=57791527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610739003.6A Active CN106312567B (en) | 2016-08-26 | 2016-08-26 | The orthogonal micro-cutting device and method of laser assisted followed automatically with laser spot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106312567B (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107014323A (en) * | 2017-06-06 | 2017-08-04 | 富加宜连接器（东莞）有限公司 | A kind of dot laser coplane degree test device and its method |
| CN107181931A (en) * | 2017-05-15 | 2017-09-19 | 华中科技大学 | A kind of camera system for orthogonal turning and milling process high speed imaging |
| CN107363552A (en) * | 2017-07-04 | 2017-11-21 | 南京航空航天大学 | A kind of induced with laser oxidation assist turning machining device and its method |
| CN108287067A (en) * | 2018-01-15 | 2018-07-17 | 大连交通大学 | A kind of vibrocutting impact roll setting experimental rig and its working method |
| CN108838889A (en) * | 2018-06-25 | 2018-11-20 | 广东工贸职业技术学院 | A kind of crisp Free Surface Grinding device and method for grinding firmly |
| CN109500604A (en) * | 2018-12-06 | 2019-03-22 | 哈尔滨工业大学 | The adjustment method of five dimension manual displacement platforms, the turning auxiliary system containing five dimension manual displacement platforms and turning auxiliary system |
| CN110421351A (en) * | 2019-08-27 | 2019-11-08 | 哈尔滨理工大学 | Laser for complex milling machine tool heats automatic monitoring system and monitoring method |
| CN110651218A (en) * | 2017-04-04 | 2020-01-03 | 恩耐公司 | Optical reference generation for galvanometer scanner calibration |
| CN112041651A (en) * | 2018-03-27 | 2020-12-04 | 深圳市柔宇科技股份有限公司 | Detection platform, system and method for laser beam focus |
| CN112317963A (en) * | 2020-10-21 | 2021-02-05 | 长春理工大学 | Femtosecond laser composite rapid cutter servo orthogonal cutting device and method |
| CN113305571A (en) * | 2021-06-24 | 2021-08-27 | 长春理工大学 | Ultrasonic vibration assisted laser regulation and control grinding and online finishing device and method |
| CN113618242A (en) * | 2021-08-23 | 2021-11-09 | 东风柳州汽车有限公司 | Automatic laser focusing area welding device for standard test board or sample |
| US11179807B2 (en) | 2015-11-23 | 2021-11-23 | Nlight, Inc. | Fine-scale temporal control for laser material processing |
| CN113857653A (en) * | 2021-12-03 | 2021-12-31 | 太原理工大学 | Surface modification device of ultrasonic-assisted laser |
| US11331756B2 (en) | 2015-11-23 | 2022-05-17 | Nlight, Inc. | Fine-scale temporal control for laser material processing |
| US11465232B2 (en) | 2014-06-05 | 2022-10-11 | Nlight, Inc. | Laser patterning skew correction |
| US11886052B2 (en) | 2016-09-29 | 2024-01-30 | Nlight, Inc | Adjustable beam characteristics |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202240152U (en) * | 2011-09-05 | 2012-05-30 | 中科中涵激光设备（福建）股份有限公司 | Device for real time monitoring to focal position during laser processing |
| CN202726319U (en) * | 2012-08-21 | 2013-02-13 | 武汉先河激光技术有限公司 | Silver paste laser etching machine |
| CN203751530U (en) * | 2013-12-25 | 2014-08-06 | 武汉高能激光设备制造有限公司 | Laser cutting assembly capable of automatically following focus |
| CN203778968U (en) * | 2014-04-02 | 2014-08-20 | 温州大学 | Laser etching processing light path system with rotary focusing lens |
| CN104907704B (en) * | 2014-04-02 | 2016-10-05 | 温州大学 | A kind of zoom laser precision machining deep trouth device for Deep Hole |
| CN105252144B (en) * | 2014-07-17 | 2017-11-03 | 大族激光科技产业集团股份有限公司 | A kind of high-precision laser is servo-actuated cutting head and its monitoring and automatic focus searching method |
-
2016
- 2016-08-26 CN CN201610739003.6A patent/CN106312567B/en active Active
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11465232B2 (en) | 2014-06-05 | 2022-10-11 | Nlight, Inc. | Laser patterning skew correction |
| US11331756B2 (en) | 2015-11-23 | 2022-05-17 | Nlight, Inc. | Fine-scale temporal control for laser material processing |
| US11179807B2 (en) | 2015-11-23 | 2021-11-23 | Nlight, Inc. | Fine-scale temporal control for laser material processing |
| US11794282B2 (en) | 2015-11-23 | 2023-10-24 | Nlight, Inc. | Fine-scale temporal control for laser material processing |
| US11886052B2 (en) | 2016-09-29 | 2024-01-30 | Nlight, Inc | Adjustable beam characteristics |
| US11173548B2 (en) | 2017-04-04 | 2021-11-16 | Nlight, Inc. | Optical fiducial generation for galvanometric scanner calibration |
| CN110651218A (en) * | 2017-04-04 | 2020-01-03 | 恩耐公司 | Optical reference generation for galvanometer scanner calibration |
| CN107181931A (en) * | 2017-05-15 | 2017-09-19 | 华中科技大学 | A kind of camera system for orthogonal turning and milling process high speed imaging |
| CN107014323B (en) * | 2017-06-06 | 2023-02-03 | 富加宜连接器（东莞）有限公司 | Point laser coplanarity testing device and method thereof |
| CN107014323A (en) * | 2017-06-06 | 2017-08-04 | 富加宜连接器（东莞）有限公司 | A kind of dot laser coplane degree test device and its method |
| CN107363552A (en) * | 2017-07-04 | 2017-11-21 | 南京航空航天大学 | A kind of induced with laser oxidation assist turning machining device and its method |
| CN108287067A (en) * | 2018-01-15 | 2018-07-17 | 大连交通大学 | A kind of vibrocutting impact roll setting experimental rig and its working method |
| CN112041651A (en) * | 2018-03-27 | 2020-12-04 | 深圳市柔宇科技股份有限公司 | Detection platform, system and method for laser beam focus |
| CN108838889A (en) * | 2018-06-25 | 2018-11-20 | 广东工贸职业技术学院 | A kind of crisp Free Surface Grinding device and method for grinding firmly |
| CN109500604B (en) * | 2018-12-06 | 2020-08-11 | 哈尔滨工业大学 | Five-dimensional manual displacement platform, turning auxiliary system comprising five-dimensional manual displacement platform and debugging method of turning auxiliary system |
| CN109500604A (en) * | 2018-12-06 | 2019-03-22 | 哈尔滨工业大学 | The adjustment method of five dimension manual displacement platforms, the turning auxiliary system containing five dimension manual displacement platforms and turning auxiliary system |
| CN110421351A (en) * | 2019-08-27 | 2019-11-08 | 哈尔滨理工大学 | Laser for complex milling machine tool heats automatic monitoring system and monitoring method |
| CN112317963A (en) * | 2020-10-21 | 2021-02-05 | 长春理工大学 | Femtosecond laser composite rapid cutter servo orthogonal cutting device and method |
| CN113305571A (en) * | 2021-06-24 | 2021-08-27 | 长春理工大学 | Ultrasonic vibration assisted laser regulation and control grinding and online finishing device and method |
| CN113618242A (en) * | 2021-08-23 | 2021-11-09 | 东风柳州汽车有限公司 | Automatic laser focusing area welding device for standard test board or sample |
| CN113857653B (en) * | 2021-12-03 | 2022-02-18 | 太原理工大学 | Surface modification device of ultrasonic-assisted laser |
| CN113857653A (en) * | 2021-12-03 | 2021-12-31 | 太原理工大学 | Surface modification device of ultrasonic-assisted laser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106312567B (en) | 2019-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106312567A (en) | Laser-assisted orthogonal micro-cutting device and method having automatic laser focus following function | |
| US10052726B2 (en) | Method for creating machining data for use in hybrid ultraprecision machining device, and hybrid ultraprecision machining device | |
| EP2070616A1 (en) | Processing apparatus | |
| WO2014109120A1 (en) | Three-dimensional laser processing machine | |
| KR20130118985A (en) | Ultraprecision composite processing device and ultraprecision composite processing method | |
| CN106216745A (en) | A kind of LASER HEATING auxiliary milling attachment that can monitor tool wear in real time | |
| TW201016358A (en) | Method and apparatus for machining V grooves | |
| Lin et al. | Development of a non-resonant 3D elliptical vibration cutting apparatus for diamond turning | |
| Kurniawan et al. | A study of surface texturing using piezoelectric tool holder actuator on conventional CNC turning | |
| CN101131470A (en) | Diaphragm ultraviolet laser micromachining system used for scanning electron microscope and method thereof | |
| JP6008487B2 (en) | Machine Tools | |
| CN210387968U (en) | Laser cutting equipment | |
| CN111702555B (en) | Device and method for precisely adjusting height of turning tool nose on machine | |
| Kirschner et al. | In situ chip formation analyses in micro single-lip and twist deep hole drilling | |
| Zhang et al. | Investigation on surface integrity in laser-assisted machining of Inconel 718 based on in-situ observation | |
| Zeilmann et al. | Effects of cutting power, speed and assist gas pressure parameters on the surface integrity cut by laser | |
| CN211331676U (en) | Aviation blade puncher installs gas film hole site aperture on-line measuring's device additional | |
| CN116833693A (en) | Intelligent compounding method and device for preparing diamond micro milling cutter | |
| CN105855699A (en) | Parameter changeable type laser machining device | |
| CN112519016B (en) | Cutting device and using method thereof | |
| Checchi et al. | Offline tool trajectory compensation for cutting forces induced errors in a portable machine tool | |
| JPH06206145A (en) | Cutting work device | |
| Ohzeki et al. | Drilling of carbon fiber reinforced plastic composites with feedback control based on cutting force | |
| RU2601362C2 (en) | Method of making parts made from mica by laser cutting | |
| CN103644960A (en) | Ultrasound-assisted grinding machining dynamic amplitude measuring tool and measuring method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |