CN106197249A - Copper layer thickness on-line measurement system and control method thereof during CMP - Google Patents

Copper layer thickness on-line measurement system and control method thereof during CMP Download PDF

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Publication number
CN106197249A
CN106197249A CN201610875030.6A CN201610875030A CN106197249A CN 106197249 A CN106197249 A CN 106197249A CN 201610875030 A CN201610875030 A CN 201610875030A CN 106197249 A CN106197249 A CN 106197249A
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CN
China
Prior art keywords
signal
output signal
layer thickness
vortex sensor
copper layer
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CN201610875030.6A
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Chinese (zh)
Inventor
李弘恺
靳富
田芳馨
王同庆
李昆
路新春
雒建斌
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TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.)
Tsinghua University
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Tianjin Hwatsing Technology Co Ltd (hwatsing Co Ltd)
Tsinghua University
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Application filed by Tianjin Hwatsing Technology Co Ltd (hwatsing Co Ltd), Tsinghua University filed Critical Tianjin Hwatsing Technology Co Ltd (hwatsing Co Ltd)
Priority to CN201610875030.6A priority Critical patent/CN106197249A/en
Publication of CN106197249A publication Critical patent/CN106197249A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G01B7/10Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D5/00Control of dimensions of material
    • G05D5/02Control of dimensions of material of thickness, e.g. of rolled material
    • G05D5/03Control of dimensions of material of thickness, e.g. of rolled material characterised by the use of electric means

Abstract

The present invention proposes copper layer thickness on-line measurement system and control method thereof during a kind of CMP, and this system includes: current vortex sensor;Bipolar Hall switch, is used for judging to pop one's head in whether enter measured zone;Data acquisition module, including first input end, the second input and outfan, first input end is connected with current vortex sensor, to obtain the output signal of current vortex sensor, second input is connected with bipolar Hall switch, to obtain the output signal of bipolar Hall switch;Control module, it is connected with the outfan of data acquisition module, for receiving output signal and the output signal of bipolar Hall switch of current vortex sensor, and calculate when pre-test average and current zero point average according to the output signal of current vortex sensor, and according to when pre-test average and current zero point mean value computation copper layer thickness.The present invention is real copper layer thickness change during can calculating CMP fast and efficiently.

Description

Copper layer thickness on-line measurement system and control method thereof during CMP
Technical field
The present invention relates to chemical-mechanical planarization technical field, survey online particularly to copper layer thickness during a kind of CMP Amount system and control method thereof.
Background technology
Chemical-mechanical planarization (Chemical Mechanical Planarization, CMP) technology is the most most effective Global planarizartion method.It utilizes the synergism of chemical attack and mechanical grinding, can effectively take into account wafer local with complete Office's flatness, and be widely applied in super large-scale integration manufacture.During CMP, need accurately to control The removal amount of material.If can not realize effectively monitoring, will be unable to avoid the appearance of the situations such as wafer " throwing excessively " or " owing to throw ". But, process environments harsh for CMP make on-line measurement realize extremely difficult.
Currently for copper CMP technique, on-line measurement module based on eddy current detection method has occurred in copper CMP system In, can be used for the layers of copper in the range of monitoring certain thickness and remove situation, it is judged that technique has reached to expect terminal the most, with the most eventually Only technical process.But, during CMP, the probe of current vortex sensor rotates with polishing disk, and periodically fortune Moving to wafer, in current measuring method, after being polished process stabilization, it is defeated that on-line measurement system starts to read sensor Go out signal and carry out correlation computations.But due to the technical process that CMP is special, during on-line measurement, the factors of CMP is equal Meeting produces certain impact to sensor output signal, and such as, rubbing head is around Pivot Point Center and polishing disk rotating Vortex while, along footpath To reciprocally swinging, so the signal of effectively measuring that sensor is collected is only probe movement to part time below wafer, and The sampling number of this part is not fixed.Additionally, due to the special substance of finishing head, the restoring on line process of polishing pad can be given whole Individual data acquisition signal introduces interference, and then adds the difficulty that online data processes and analyzes.
Summary of the invention
It is contemplated that at least solve one of above-mentioned technical problem.
To this end, it is an object of the present invention to propose copper layer thickness on-line measurement system during a kind of CMP, this system Real copper layer thickness change during can calculating CMP succinctly, fast and efficiently, and result of calculation degree of accuracy is high.
Further object is that and propose the controlling party of copper layer thickness on-line measurement system during a kind of CMP Method.
To achieve these goals, during the embodiment of first aspect present invention proposes a kind of CMP, copper layer thickness exists System measured by line, including: current vortex sensor;Bipolar Hall switch, is used for judging whether described current vortex sensor probe enters Enter measured zone;Data acquisition module, described data acquisition module includes first input end, the second input and outfan, institute State first input end to be connected with the outfan of described current vortex sensor, to obtain the output signal of described current vortex sensor, Described second input is connected with the outfan of described bipolar Hall switch, to obtain the output letter of described bipolar Hall switch Number;Control module, described control module is connected with the outfan of described data acquisition module, is used for receiving described current vortex sensing The output signal of device and the output signal of described bipolar Hall switch, and calculate according to the output signal of described current vortex sensor When pre-test average and current zero point average, and according to described when layers of copper thickness described in pre-test average and current zero point mean value computation Degree.
Copper layer thickness on-line measurement system during CMP according to embodiments of the present invention, during effectively can eliminating measurement Interference signal and the impact of part abnormal signal, it is possible to mass data extracted technologist efficiently need from collecting The real copper layer thickness real-time change information wanted.This system structure is simple, it is easy to accomplish, and computational accuracy is high, can be Real-time copper layer thickness during line is measured calculates the solution providing good, and then the computational efficiency of raising on-line measurement, Preferably meet the process requirements of on-line measurement.
It addition, during CMP according to the above embodiment of the present invention copper layer thickness on-line measurement system can also have as Lower additional technical characteristic:
In some instances, described control module is used for: sampled according to the output signal of described current vortex sensor Signal, and judge whether described sampled signal is in preset range, if described sampled signal is in described preset range, Then judge that described sampled signal, as useful signal, otherwise, abandons described sampled signal;Judge the output of described bipolar Hall switch The situation of change of signal, and the fixed position of the trigger point according to bipolar Hall switch, defeated when at described bipolar Hall switch Go out signal from high level become low level time, it is determined that described probe enters measured zone, and opens from the rear t of current time Begin, preserve w continuously1Individual sampled signal using as measure signal segment, and by sampled signals whole in described measurement signal segment putting down Average as described when pre-test average, wherein, w1For measuring signals collecting width, t is the delay sampling time;When described bipolar The output signal of Hall switch from low level become high level time, it is determined that described probe leaves described measured zone, and with currently The rear t in moment starts, and preserves w continuously2Individual sampled signal is as zero signal section, and calculates in described zero signal section complete The meansigma methods of portion's sampled signal is as described current zero point average, wherein, w2Collection width for zero signal;Calculate described working as Pre-test average and the difference of current zero point average, and from the calibration scale prestored, search the interval at described difference place, then Described copper layer thickness is calculated according to described interval corresponding demarcation relation.
In some instances, also including: zeroing module, described zeroing module is used for before each measurement cycle starts, to Described current vortex sensor sends zeroing instruction, to revise the offset output skew of described current vortex sensor.
In some instances, the trigger point that enters of described bipolar Hall switch is fixed on to measure path length survey the most in short-term At amount start point signal predeterminable range in measured zone.
In some instances, wherein, during measuring, when the probe of described current vortex sensor is in crystal column surface layers of copper During the moving region of lower section, define the output signal of the most described current vortex sensor for measurement signal;When described current vortex passes During the probe of sensor not moving region below crystal column surface layers of copper, the output signal defining the most described current sensor is Zero signal.
To achieve these goals, the embodiment of second aspect present invention proposes a kind of first aspect as above-mentioned in the present invention The control method of copper layer thickness on-line measurement system during CMP described in embodiment, comprises the following steps: described data acquisition Module obtains output signal and the output signal of described bipolar Hall switch of described current vortex sensor;Described data acquisition module The output signal of described current vortex sensor and the output signal of described bipolar Hall switch are transmitted to described control module by block; Described control module calculates work as according to the output signal of described current vortex sensor and the output signal of described bipolar Hall switch Pre-test average and current zero point average;Described control module according to described when pre-test average with the difference of current zero point average Calculate described copper layer thickness.
The control method of copper layer thickness on-line measurement system during CMP according to embodiments of the present invention, can effectively eliminate Interference signal during measurement and the impact of part abnormal signal, it is possible to extract efficiently from collecting mass data The real copper layer thickness real-time change information that technologist needs.The method is the most succinct, it is easy to accomplish, and computational accuracy Height, can be that the real-time copper layer thickness during on-line measurement calculates the solution providing good, and then improve on-line measurement Computational efficiency, preferably meet the process requirements of on-line measurement.
It addition, during CMP according to the above embodiment of the present invention the control method of copper layer thickness on-line measurement system is also Can have a following additional technical characteristic:
In some instances, the described output signal according to described current vortex sensor and described bipolar Hall switch is defeated Go out signal to calculate when pre-test average and current zero point average, farther include: believe according to the output of described current vortex sensor Number obtain sampled signal, and judge whether described sampled signal is in preset range, if described sampled signal is in described In preset range, then judge that described sampled signal, as useful signal, otherwise, abandons described sampled signal;Judge described bipolar suddenly The situation of change of the output signal of your switch, and the fixed position of the trigger point according to described bipolar Hall switch, when described The output signal of bipolar Hall switch from high level become low level time, it is determined that described probe enters measured zone, and from currently The rear t in moment starts, and preserves w continuously1Individual sampled signal is using as measuring signal segment, and by complete in described measurement signal segment The meansigma methods of portion's sampled signal as described when pre-test average, wherein, w1For measuring signals collecting width, t is delay sampling Time;When the output signal of described bipolar Hall switch is become high level from low level, it is determined that described probe leaves described survey Amount region, and start with the rear t of current time, preserve w continuously2Individual sampled signal is as zero signal section, and calculates institute In stating zero signal section, the meansigma methods of whole sampled signals is as described current zero point average, wherein, w2Adopting for zero signal Collection width.
In some instances, when copper layer thickness described in pre-test average and current zero point mean value computation described in described basis, Farther include: calculate described when pre-test average and the difference of current zero point average, and from the calibration scale prestored, search institute State the interval at difference place, then calculate described copper layer thickness according to described interval corresponding demarcation relation.
In some instances, also include: before each measurement cycle starts, send zeroing to described current vortex sensor and refer to Order, to revise the offset output skew of described current vortex sensor.
The additional aspect of the present invention and advantage will part be given in the following description, and part will become from the following description Obtain substantially, or recognized by the practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage are from combining the accompanying drawings below description to embodiment and will become Substantially with easy to understand, wherein:
Fig. 1 is the structural representation of copper layer thickness on-line measurement system during CMP according to embodiments of the present invention;
Fig. 2 is that the workflow of copper layer thickness on-line measurement system is shown during CMP according to an embodiment of the invention It is intended to;
Fig. 3 is the probe of the most bipolar Hall switch output signal and current vortex sensor The relation schematic diagram of measured zone;And
Fig. 4 is according to the flow process of the control method of copper layer thickness on-line measurement system during one CMP executing example of the present invention Figure.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached The embodiment that figure describes is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In describing the invention, it is to be understood that term " " center ", " longitudinally ", " laterally ", " on ", D score, Orientation or the position relationship of the instruction such as "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward " are Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description rather than instruction or dark The device or the element that show indication must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that right The restriction of the present invention.Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relatively Importance.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " phase Even ", " connection " should be interpreted broadly, for example, it may be fixing connection, it is also possible to be to removably connect, or be integrally connected;Can To be mechanical connection, it is also possible to be electrical connection;Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, Ke Yishi The connection of two element internals.For the ordinary skill in the art, can understand that above-mentioned term is at this with concrete condition Concrete meaning in invention.
Below in conjunction with copper layer thickness on-line measurement system and control thereof during accompanying drawing description CMP according to embodiments of the present invention Method processed.
Fig. 1 is the structural representation of copper layer thickness on-line measurement system during CMP according to an embodiment of the invention. Fig. 2 is the workflow schematic diagram of copper layer thickness on-line measurement system during CMP in accordance with another embodiment of the present invention.As Shown in Fig. 1, and combining Fig. 2, this system includes: current vortex sensor 110, bipolar Hall switch 120, data acquisition module 130 With control module 140.
Wherein, current vortex sensor 110 has probe.Probe is such as arranged in polishing card (under polishing pad), passes through The lead-in wire of conducting slip ring is connected with the signal processing circuit being fixed in board.
In one embodiment of the invention, such as, during measuring, when the probe of current vortex sensor 110 is at crystalline substance During moving region below circular surfaces layers of copper, define this region as measured zone, the now output letter of current vortex sensor 110 Number for measure signal;When the probe not moving region below crystal column surface layers of copper of current vortex sensor 110, i.e. pop one's head in from Having opened measured zone, now the output signal of definition current sensor 110 is zero signal.
Bipolar Hall switch 120 is connected with current vortex sensor 110, is used for judging to pop one's head in whether enter measured zone, from And can accurately intercept the measurement signal that probe measurement arrives.Specifically, in technical process, probe rotates with polishing disk, And cycle movement is to below wafer, after polished process stabilization, starts to read sensor and exports and carry out correlation computations.Due to The technical process that CMP is special, during on-line measurement, the factors of CMP all can produce certain impact to measuring signal.Example Such as, rubbing head around Pivot Point Center with polishing disk rotating Vortex simultaneously, radially reciprocally swinging, so the survey that sensor is collected Amount signal is only probe movement to part time below wafer, and this fractional-sample is counted and do not fixed.Additionally, due to finishing head Special substance, the restoring on line process of polishing pad is introduced interference can to whole data acquisition signal, and then be added online number According to the difficulty processed with analyze.Therefore, in order to accurately intercept the measurement signal that probe measurement arrives, the system of the embodiment of the present invention 100 use bipolar Hall switch 120 to limit the surveying range of probe.
In one embodiment of the invention, the trigger point that enters of bipolar Hall switch 120 is fixed on to measure path length At measurement start point signal predeterminable range in measured zone the most in short-term.Specifically, due to wafer in technical process with Rubbing head is along polishing disk radial reciprocating-oscillation, so the measurement that the probe of current vortex sensor 110 is below crystal column surface layers of copper Path length is not unique, and then causes the sampling number measuring signal not fixed.Therefore, embodiments of the invention are double in installation During the Hall switch 120 of pole with measure path length measurement start point signal the most in short-term in measured zone 5mm (predeterminable range, Can take the circumstances into consideration to adjust according to practical situation) the magnetic pole location A of fixing bipolar Hall switch 120, and then avoid current vortex sensor The output signal of 110 is affected by crystal round fringes layers of copper.Additionally, suitably increase the distance between two poles triggering hall signal, it is ensured that magnetic Probe the most fully out measured zone when pole B triggers bipolar Hall switch 120.
More specifically, as it is shown on figure 3, when the probe movement of current vortex sensor 110 is to measured zone (A point), double The output level of pole Hall switch 120 is from high to low;When the probe of current vortex sensor 110 leaves measured zone (B point), double The output level of pole Hall switch 120 is from low to high.
Data acquisition module 130 includes first input end, the second input and outfan, first input end (such as AI end Mouthful) be connected with the outfan of current vortex sensor 110, to obtain the output signal of current vortex sensor 110, the second input (such as DI port) is connected with the outfan of bipolar Hall switch 120, to obtain the output signal of bipolar Hall switch 120, enters And know the most into or out measured zone of probe.
Control module 140 is connected with the outfan of data acquisition module 130, for Quick Acquisition current vortex sensor 110 Output signal and the output signal of bipolar Hall switch 120, and calculate current according to the output signal of current vortex sensor 110 Measure average and current zero point average, and according to when pre-test average and current zero point mean value computation copper layer thickness.
In one embodiment of the invention, control module 140 is used for: according to the output signal of current vortex sensor 110 Obtain sampled signal, and judge whether sampled signal is in preset range, if sampled signal is in preset range, then sentence Determining sampled signal is useful signal, otherwise, abandons sampled signal;Further, it is judged that the output signal of bipolar Hall switch 120 Situation of change, and when the output signal of bipolar Hall switch 120 is become low level from high level, it is determined that probe enters to be measured Region, and from the beginning of the rear t of current time, preserve w continuously1Individual sampled signal is as measuring signal segment, and measurement is believed In number section all the meansigma methods of sampled signals as when pre-test average, wherein, w1For measuring signals collecting width, t is for postponing Sampling time;Further, when the output signal of bipolar Hall switch 120 is become high level from low level, it is determined that pop one's head in from Open measured zone, and start with the rear t of current time, preserve w continuously2Individual sampled signal is as zero signal section, and counts In calculating zero signal section, the meansigma methods of whole sampled signals is as current zero point average, wherein, w2Collection width for zero signal Degree;Calculate when pre-test average and the difference of current zero point average, and the interval at lookup difference place from the calibration scale prestored, Then copper layer thickness is calculated according to interval corresponding demarcation relation.
In above process, data acquisition module 130 is such as connected with control module 140 by USB port.Control module 140 quickly read, for example with the mode of asynchronous buffer, the signal that data acquisition module 130 is fed back, and sample rate is for example, 20KHz.It addition, in order to the fluctuation of the output signal self that reduces current vortex sensor 110 is to reduce measurement error, controller The 140 data block average treatment in data acquisition, data acquisition module 130 returned each time, and with calculated Meansigma methods is as current sample values.That is, the output signal of current vortex sensor 110 is carried out piecemeal average treatment, to obtain Sampled signal, such that it is able to the measurement error that reduction causes due to the fluctuation of the output signal self of current vortex sensor 110.
Specifically, shown in Fig. 3, copper layer thickness on-line measurement system 100 during the CMP of the embodiment of the present invention Main calculation process is summarized as follows:
1) Signal Pretreatment process is gathered: in copper CMP technique, top level control system (i.e. control module 140) is according to work The sampling instant of skill personnel setting controls beginning and the end of gatherer process.During on-line measurement at a high speed, system is passed through Data collecting card (i.e. data acquisition module 130) reads the output signal of current vortex sensor 110 in real time.In order to prevent abnormal adopting The appearance of sampling point, system first determines whether whether current sample values (sampled signal) is in normal range (i.e. preset range).If Sampled value is in normal variation scope, then assert that this sampled value is effective, and preserve;Otherwise, current sample values should be abandoned.
2) signal extraction process: top level control system is reading data collecting card AI signal (i.e. current vortex sensor 110 Output signal) while, the strict change monitoring data collecting card DI signal (output signal of the most bipolar Hall switch 120). In this step data processing procedure, signals collecting width w is measured in definition1With two variablees of delay sampling time t.Work as top level control When the data collecting card DI signal that system is read is by 1 to 0 (output signal of corresponding bipolar Hall switch 120 is from high to low), then Think that sensor probe has been enter into measured zone.Now, start with the rear t of current time, preserve w continuously1Individual sampled point, And with this measurement signal segment (w1The measurement signal segment that individual sampled point is constituted) in the meansigma methods of whole sampled signals survey as current Amount average.In concrete example, measure signals collecting width w1For example, 15, delay sampling time t for example, 5 milliseconds.
3) zero point value calculates process: getting when after pre-test average, when the data acquisition that top level control system is read Card DI signal by 0 to 1 (output signal of corresponding bipolar Hall switch 120 is from low to high) time, then it is assumed that sensor probe from Open measured zone.Now, definition zero signal gathers width is w2, and start with the rear t of current time, preserve w continuously2 Individual sampled point, and with this w2In the zero signal section that individual sampled point is constituted, all the meansigma methods of sampled signal is equal as current zero point Value.In some instances, zero signal gathers width w2For example, 15.
4) one-tenth-value thickness 1/10 calculate process: in current measurement cycle, by acquired when pre-test average and current zero point equal It is poor to be worth, and using this difference as non-calibration value.The calibration scale preserved according to top level control system, searches this non-calibration value institute In interval, then utilizing this section of corresponding demarcation relation to calculate respective thickness value, i.e. copper layer thickness, finally showing and preserve should Value of calculation.
Further, after completing the on-line measurement of this cycle, carry out the online survey in next cycle with identical processing method Amount calculates.Until after system receives end measurement instruction, top level control system (i.e. control module 140) stops sampling, and closes Read functions, discharges related system resource, recovers each intermediate variable initial value.So far, this algorithm has completed this technical process In the online treatment work of whole measurement data.
In one embodiment of the invention, this system 100 the most also includes the module that returns to zero.Zeroing module is for each Before the measurement cycle starts, send zeroing instruction to current vortex sensor 110, to revise the offset output of current vortex sensor 110 Skew, makes offset output recover to normal level.Especially for continuous process, before in next time, technical process starts, adjust Zero module sends zeroing instruction to current vortex sensor 110, to revise the offset output skew of current vortex sensor 110, makes zero Point output recovers to normal level, to ensure the certainty of measurement in next measurement cycle.
To sum up, copper layer thickness on-line measurement system during CMP according to embodiments of the present invention, can effectively eliminate and measure Interference signal in journey and the impact of part abnormal signal, it is possible to extract technique people mass data efficiently from collecting The real copper layer thickness real-time change information that member needs.This system structure is simple, it is easy to accomplish, and computational accuracy is high, permissible Calculate the solution providing good for the real-time copper layer thickness during on-line measurement, and then improve the calculating effect of on-line measurement Rate, preferably meets the process requirements of on-line measurement.
Further embodiment of the present invention also proposed the controlling party of copper layer thickness on-line measurement system during a kind of CMP Method.Layers of copper during CMP described by copper layer thickness on-line measurement system for example, the above embodiment of the present invention during this CMP Thickness on-line measurement system, retouches in detail about the concrete of copper layer thickness on-line measurement system during the CMP related in this method State and refer to the above embodiment of the present invention to the description part of copper layer thickness on-line measurement system during CMP.Based on this, such as figure Shown in 4, the control method of copper layer thickness on-line measurement system during CMP according to embodiments of the present invention, comprise the following steps:
Step S1: data acquisition module obtains the output signal of current vortex sensor and the output letter of bipolar Hall switch Number.
Step S2: the output signal of current vortex sensor and the output signal of bipolar Hall switch are passed by data acquisition module Transport to control module.
Step S3: control module calculates according to the output signal of current vortex sensor and the output signal of bipolar Hall switch When pre-test average and current zero point average.
In one embodiment of the invention, in step s3, according to the output signal of current vortex sensor and bipolar suddenly The output signal of your switch calculates when pre-test average and current zero point average, farther includes: according to current vortex sensor Output signal obtains sampled signal, and judges whether sampled signal is in preset range, if sampled signal is in default model In enclosing, then judge that sampled signal, as useful signal, otherwise, abandons sampled signal;Judge the output signal of bipolar Hall switch Situation of change, and when the output signal of bipolar Hall switch is become low level from high level, it is determined that probe enters measured zone, And from the beginning of the rear t of current time, preserve w continuously1Individual sampled signal will be as measuring signal segment, and will measure signal segment The meansigma methods of interior all sampled signals is as when pre-test average, wherein, w1For measuring signals collecting width, t is delay sampling Time;When the output signal of bipolar Hall switch is become high level from low level, it is determined that probe leaves measured zone, and to work as The rear t in front moment starts, and preserves w continuously2Individual sampled signal is as zero signal section, and calculates in zero signal section all The meansigma methods of sampled signal is as current zero point average, wherein, w2Collection width for zero signal.
Step S4: control module is according to when pre-test average and current zero point mean value computation copper layer thickness.
In one embodiment of the invention, in step s 4, according to when pre-test average and current zero point mean value computation Copper layer thickness, farther includes: calculates when pre-test average and the difference of current zero point average, and looks into from the calibration scale prestored Look for the interval at difference place, then calculate copper layer thickness according to interval corresponding demarcation relation.
Further, in one embodiment of the invention, the method also includes: before each measurement cycle starts, to Current vortex sensor sends zeroing instruction, to revise the offset output skew of current vortex sensor, makes offset output recover to just Ordinary water is put down, to ensure the certainty of measurement in next measurement cycle.
It should be noted that the control method of copper layer thickness on-line measurement system during the CMP of the embodiment of the present invention Specific implementation is similar with the specific implementation of copper layer thickness on-line measurement system during the CMP of the embodiment of the present invention, Specifically referring to the description of components of system as directed, in order to reduce redundancy, here is omitted.
To sum up, the control method of copper layer thickness on-line measurement system during CMP according to embodiments of the present invention, can be effective Eliminate the interference signal during measuring and the impact of part abnormal signal, it is possible to carry efficiently from collecting mass data Get the real copper layer thickness real-time change information that technologist needs.The method is the most succinct, it is easy to accomplish, and calculate essence Degree height, can be that the real-time copper layer thickness during on-line measurement calculates the solution providing good, and then improve online survey The computational efficiency of amount, preferably meets the process requirements of on-line measurement.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or spy Point is contained at least one embodiment or the example of the present invention.In this manual, to the schematic representation of above-mentioned term not Necessarily refer to identical embodiment or example.And, the specific features of description, structure, material or feature can be any One or more embodiments or example in combine in an appropriate manner.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not These embodiments can be carried out multiple change in the case of departing from the principle of the present invention and objective, revise, replace and modification, this The scope of invention is limited by claim and equivalent thereof.

Claims (9)

1. copper layer thickness on-line measurement system during a CMP, it is characterised in that including:
Current vortex sensor;
Bipolar Hall switch, is used for judging whether described probe enters measured zone;
Data acquisition module, described data acquisition module includes first input end, the second input and outfan, described first defeated Enter end to be connected with the outfan of described current vortex sensor, to obtain the output signal of described current vortex sensor, described second Input is connected with the outfan of described bipolar Hall switch, to obtain the output signal of described bipolar Hall switch;
Control module, described control module is connected with the outfan of described data acquisition module, is used for receiving described current vortex and passes The output signal of sensor and the output signal of described bipolar Hall switch, and according to the output signal meter of described current vortex sensor Calculate when pre-test average and current zero point average, and according to described when layers of copper described in pre-test average and current zero point mean value computation Thickness.
Copper layer thickness on-line measurement system during CMP the most according to claim 1, it is characterised in that described control mould Block is used for:
Output signal according to described current vortex sensor obtains sampled signal, and it is default to judge whether described sampled signal is in In the range of, if described sampled signal is in described preset range, then judge described sampled signal as useful signal, otherwise, Abandon described sampled signal;
Judge the situation of change of the output signal of described bipolar Hall switch, and described bipolar Hall switch output signal by When high level becomes low level, it is determined that described probe enters measured zone, and from the beginning of the rear t of current time, protects continuously Deposit w1Individual sampled signal is as measuring signal segment, and using the meansigma methods of sampled signals whole in described measurement signal segment as described When pre-test average, wherein, w1For measuring signals collecting width, t is the delay sampling time;
When the output signal of described bipolar Hall switch is become high level from low level, it is determined that described probe leaves described measurement Region, and start with the rear t of current time, preserve w continuously2Individual sampled signal is as zero signal section, and calculates described In zero signal section, the meansigma methods of whole sampled signals is as described current zero point average, wherein, w2Collection for zero signal Width;
Calculate described when pre-test average and the difference of current zero point average, and from the calibration scale prestored, search described difference institute Interval, then calculate described copper layer thickness according to described interval corresponding calibration curve.
Copper layer thickness on-line measurement system during CMP the most according to claim 1, it is characterised in that also include:
Zeroing module, described zeroing module, for before each measurement cycle starts, sends zeroing to described current vortex sensor Instruction, to revise the offset output skew of described current vortex sensor.
Copper layer thickness on-line measurement system during CMP the most according to claim 2, it is characterised in that
The trigger point that enters of described bipolar Hall switch is fixed on to measure path length measurement start point signal the most in short-term to measurement At predeterminable range in region.
5. according to copper layer thickness on-line measurement system during the CMP described in claim 1-4, it is characterised in that wherein,
During measuring, when the probe moving region below crystal column surface layers of copper of described current vortex sensor, definition The output signal of the most described current vortex sensor is for measuring signal;
When the probe not moving region below crystal column surface layers of copper of described current vortex sensor, define the most described electric current The output signal of sensor is zero signal.
6. a control method for copper layer thickness on-line measurement system during CMP as claimed in claim 1, its feature exists In, comprise the following steps:
Described data acquisition module obtains the output signal of described current vortex sensor and the output letter of described bipolar Hall switch Number;
Described data acquisition module is by the output signal of described current vortex sensor and the output signal of described bipolar Hall switch Transmission is to described control module;
Described control module is according to the output signal of described current vortex sensor and the output signal meter of described bipolar Hall switch Calculate when pre-test average and current zero point average;
Described control module according to described when copper layer thickness described in the mathematic interpolation of pre-test average and current zero point average.
The control method of copper layer thickness on-line measurement system during CMP the most according to claim 6, it is characterised in that The output signal of the described output signal according to described current vortex sensor and described bipolar Hall switch calculates when pre-test is equal Value and current zero point average, farther include:
Output signal according to described current vortex sensor obtains sampled signal, and it is default to judge whether described sampled signal is in In the range of, if described sampled signal is in described preset range, then judge described sampled signal as useful signal, otherwise, Abandon described sampled signal;
Judge the situation of change of the output signal of described bipolar Hall switch, and described bipolar Hall switch output signal by When high level becomes low level, it is determined that described probe enters measured zone, and from the beginning of the rear t of current time, protects continuously Deposit w1Individual sampled signal is using as measuring signal segment, and using the meansigma methods of sampled signals whole in described measurement signal segment as institute State when pre-test average, wherein, w1For measuring signals collecting width, t is the delay sampling time;
When the output signal of described bipolar Hall switch is become high level from low level, it is determined that described probe leaves described measurement Region, and start with the rear t of current time, preserve w continuously2Individual sampled signal is as zero signal section, and calculates described In zero signal section, the meansigma methods of whole sampled signals is as described current zero point average, wherein, w2Collection for zero signal Width.
The control method of copper layer thickness on-line measurement system during CMP the most according to claim 7, it is characterised in that When copper layer thickness described in pre-test average and current zero point mean value computation described in described basis, farther include:
Calculate described when pre-test average and the difference of current zero point average, and from the calibration scale prestored, search described difference institute Interval, then calculate described copper layer thickness according to described interval corresponding demarcation relation.
The control method of copper layer thickness on-line measurement system during CMP the most according to claim 6, it is characterised in that Also include:
Before each measurement cycle starts, send zeroing instruction to described current vortex sensor, to revise described current vortex sensing The offset output skew of device.
CN201610875030.6A 2016-09-30 2016-09-30 Copper layer thickness on-line measurement system and control method thereof during CMP Pending CN106197249A (en)

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