CN106102334A - A kind of manufacture method of circular polarisation satellite antenna circuit board - Google Patents
A kind of manufacture method of circular polarisation satellite antenna circuit board Download PDFInfo
- Publication number
- CN106102334A CN106102334A CN201610451490.6A CN201610451490A CN106102334A CN 106102334 A CN106102334 A CN 106102334A CN 201610451490 A CN201610451490 A CN 201610451490A CN 106102334 A CN106102334 A CN 106102334A
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- CN
- China
- Prior art keywords
- substrate
- circuit board
- antenna circuit
- copper sheathing
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
Abstract
The invention belongs to circuit board production techniques field, be specifically related to the manufacture method of a kind of circular polarisation satellite antenna circuit board, comprise the steps: to weigh raw material components ABS resin 40～60% by weight, PC resin 40～60%, mixing；Raw material is toasted 2～4 hours temperature 75～80 degree；By melting sources, being molded into the substrate of antenna circuit plate shape, wherein injection temperature controls at 150～180 degree；Substrate after injection is holed, and fills in copper sheathing in hole；Substrate and copper sheathing carry out Precision Machining, make substrate smooth and copper sheathing and substrate highly consistent；Laser carving activation is carried out by needing metallized surface on substrate；Substrate after laser carving activation carries out electroless plating, and the circuit copper making substrate surface is thick at 20～40 microns.New material is used to make the baseplate material of antenna circuit board, and replace the mode of traditional fabrication circuit board line, on the premise of meeting the electric properties such as the low-loss of antenna circuit board, high-gain, high/low temperature reliability, cost of manufacture can be reduced, reduce pollutant emission.
Description
Technical field
The invention belongs to circuit board production techniques field, be specifically related to the making of a kind of circular polarisation satellite antenna circuit board
Method, the antenna circuit board of making can be widely applied to satellite positioning antennas, Beidou antenna, surveys and draws antenna, RFID antenna and
WIFI antenna etc..
Prior art
The applying frequency of circular polarisation satellite antenna circuit board is high, generally higher than 433 megahertzs, the such as frequency of navigation type antenna
Rate, at 1200 megahertzs～2400 megahertzs, uses the copper-clad plate of common glass fibre epoxy class can not meet requirement, needs choosing
Select and can meet the high-frequency copper-clad plate material in high frequency applications, and feature is that dielectric constant is stable, is lost little, but existing high frequency
Copper-clad plate material price is expensive.
Traditional antenna circuit board is all to select double-sided copper-clad panel material, and circuit board needs through a lot of operations, including boring,
The techniques such as heavy copper, electroplates, etching, welding resistance, word, molding.The light of circuit board paints chemical etching long flow path and not environmentally；Efficiency
Low, during produce and include dust, the height pollutant effulent such as noise and chemical waste fluid, and long flow path, hand over the phase slow.Additionally, due to
Antenna circuit board is all to apply in altofrequency, and etching precision affects electric property；General satellite navigation class antenna circuit board sets
Meter thickness is more than 2.54mm, and this kind of antenna circuit board is due to thickness paranormal circuit board fabrication thickness, in the fabrication process
Circuit board surface can be produced serious wiping flower and pit, affect outward appearance, affect electric property.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of circular polarisation satellite antenna circuit board, use new material to make
The baseplate material of antenna circuit board, and replace the mode of traditional fabrication circuit board line, meeting the low damage of antenna circuit board
On the premise of the electric properties such as consumption, high-gain, high/low temperature reliability, cost of manufacture can be reduced, reduce pollutant emission.
The present invention is achieved by the following technical solutions.
Thering is provided the manufacture method of a kind of circular polarisation satellite antenna circuit board, this method uses LDS active material to carry out laser
Carrying out electroless plating again after laser carving activation baseplate material, directly on medium, the mode of generative circuit makes antenna circuit board, step
Rapid as follows:
Select ABS resin (acrylonitrile-butadiene-styrene copolymer) and PC (Merlon) resin particle material, press
Weight meter raw material components ABS resin 40～60%, PC resin 40～60%, selected spillage of material is little, meets antenna circuit
The high-gain requirement of plate, is suitably applied in high frequency environment, meets the characteristic of follow-up laser carving electroless plating；
Raw material is toasted 2～4 hours temperature 75～80 degree；Melting sources, is molded into the substrate of antenna circuit plate shape,
Wherein injection temperature controls at 150～180 degree；
Substrate after injection is holed, and fills in copper sheathing in hole, and the wall thickness control of copper sheathing is at 0.5mm～0.8mm, copper
Set uses pyrite copper sheathing；
Substrate and copper sheathing carry out Precision Machining, make substrate smooth and copper sheathing and substrate highly consistent, it is ensured that dimensional accuracy
And the smooth property on surface；
Laser carving activation is carried out by needing metallized surface on the substrate after Precision Machining；
Substrate after laser carving activation carries out the layers of copper of 5 microns of electroless plating generation, then carries out plating thickening, makes base
The circuit copper on plate surface is thick at 20～40 microns；
Substrate after plating carries out surface process, and surface processes and includes that electronickelling is golden, tin plating and oxidation-resistant film.
Technical scheme, it has technical effect that, uses modified ABS to electroplate flow process with PC plastic injection laser carving,
Need not the horizontal line technique of oversampling circuit plate processing, the defect such as cut and pit will not be produced；Use metal copper sheathing mosaic mode,
Eliminate heavy copper plating flow process complicated in circuit board fabrication, and the thickness evenness of copper sheathing, shielding character, conductive characteristic geometric ratio
Traditional heavy copper electro-coppering can be more preferably.
Detailed description of the invention
Below in conjunction with being embodied as technical scheme is described in detail, in order to the clearest, complete
Understand the innovation and creation essence of the present invention.
The present embodiment provides the manufacture method of a kind of circular polarisation satellite antenna circuit board, and its concrete enforcement step is as follows:
Material choice: select ABS and the PC raw material (black particle) of SABIC sand BIC Corp, mixing, raw material dielectric constant
Stable, it is lost little, and the technique that laser carving electroless plating can be met.
Selecting copper sheathing: select suitable copper sheathing as requested, copper sheathing selects brass material, meets requirement of strength, copper sheathing
Wall thickness control is at 0.5mm～0.8mm.Copper sheathing internal diameter is according to design requirement, and general control is at 1.2mm～4.5mm.
Mold injection: being molded according to antenna circuit board product structure, physical dimension is typically big than finished size, injection is all day long
The substrate of line circuit board shape, generally circular in cross section or square.Before injection, the raw material of black particle needs, low temperature 80 degree, to toast 2
～4 hours, then it is molded.The when of injection, injection temperature controls at 150 degree～180 degree.Injection pressure is unsuitable excessive,
Make the even density of substrate.
NC super machining: use CNC numerical control machine machining center first to hole, the substrate being molded out then by copper
Set is filled in, then carries out the Precision Machining of entirety, and Precision Machining is progressively carried out, and finally reaches final structure size, inlays after processing
Embedding copper sheathing keeps consistent with the height of material, and the product processed is smooth, operation manufacture requirements after meeting.
Laser carving activates: according to circuit layout-design requirement on substrate, it would be desirable to metallized surface, i.e. circuit pack are carried out
Laser laser carving activates, and needs the energy adjusting laser and the direction strafed, and makes energy be suitable for, and direction is consistent.
Electroless plating: the substrate after laser carving activation carries out the layers of copper of 5 microns of electroless plating generation, then electroplates
Thickening, the circuit copper making substrate surface is thick at 25 microns.
Copper surface processes: according to surface treatment requirement, selects plating nickel gold or tin plating, oxidation-resistant film, and the purpose of coating is to protect
Protect copper face not aoxidize, and meet surface soldered technique.
Substantially completing of the most a antenna circuit board.Follow-up to product appearance inspection/packaging, according to circuit board
IPC standard, checks and packs shipment.
Claims (4)
1. a manufacture method for circular polarisation satellite antenna circuit board, comprises the steps:
Weigh raw material components ABS resin 40～60%, PC resin 40～60%, mixing by weight；
Raw material is toasted 2～4 hours temperature 75～80 degree；
By melting sources, being molded into the substrate of antenna circuit plate shape, wherein injection temperature controls at 150～180 degree；
Substrate after injection is holed, and fills in copper sheathing in hole；
Substrate and copper sheathing carry out Precision Machining, make substrate smooth and copper sheathing and substrate highly consistent；
Laser carving activation is carried out by needing metallized surface on substrate；
Substrate after laser carving activation carries out electroless plating, and the circuit copper making substrate surface is thick at 20～40 microns.
The manufacture method of circular polarisation satellite antenna circuit board the most according to claim 1, it is characterised in that described copper sheathing
Wall thickness control uses pyrite copper sheathing at 0.5mm～0.8mm, copper sheathing.
The manufacture method of circular polarisation satellite antenna circuit board the most according to claim 1, it is characterised in that also include step,
Substrate after plating carries out surface process, and surface processes and includes that electronickelling is golden, tin plating and oxidation-resistant film.
4. the antenna circuit board using the method for claim 1 to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610451490.6A CN106102334A (en) | 2016-06-21 | 2016-06-21 | A kind of manufacture method of circular polarisation satellite antenna circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610451490.6A CN106102334A (en) | 2016-06-21 | 2016-06-21 | A kind of manufacture method of circular polarisation satellite antenna circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106102334A true CN106102334A (en) | 2016-11-09 |
Family
ID=57238587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610451490.6A Pending CN106102334A (en) | 2016-06-21 | 2016-06-21 | A kind of manufacture method of circular polarisation satellite antenna circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102334A (en) |
Citations (10)
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|---|---|---|---|---|
| DE19721731C1 (en) * | 1997-05-24 | 1999-04-08 | Wendisch Karl Heinz | Joining plastic film with a release agent on the surface to a metal foil and resulting multilayer material |
| CN1238899A (en) * | 1996-09-17 | 1999-12-15 | 恩索恩Omi公司 | Method for adding layers to PWB which yields high levels of copper to dielectric adhesion |
| US20070203270A1 (en) * | 2003-03-05 | 2007-08-30 | Clariant Gmbh | Flame retardant dispersion |
| CN101640972A (en) * | 2008-07-28 | 2010-02-03 | 欣兴电子股份有限公司 | Circuit board structure |
| CN101646305A (en) * | 2008-08-04 | 2010-02-10 | 欣兴电子股份有限公司 | Method for manufacturing lead on non-conductor substrate |
| CN105073893A (en) * | 2013-04-01 | 2015-11-18 | 沙特基础全球技术有限公司 | High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window and methods for the manufacture and use thereof |
| TW201601607A (en) * | 2014-06-16 | 2016-01-01 | 啟碁科技股份有限公司 | Method of forming metallic pattern on polymer substrate |
| CN105338736A (en) * | 2014-08-08 | 2016-02-17 | 深南电路有限公司 | HDI (high density interconnect) circuit board and processing method thereof |
| TWI528878B (en) * | 2014-12-26 | 2016-04-01 | 啟碁科技股份有限公司 | Patterned conductive structure and method for forming the same |
| US20160128188A1 (en) * | 2013-09-27 | 2016-05-05 | Lg Chem, Ltd. | Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon |
-
2016
- 2016-06-21 CN CN201610451490.6A patent/CN106102334A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1238899A (en) * | 1996-09-17 | 1999-12-15 | 恩索恩Omi公司 | Method for adding layers to PWB which yields high levels of copper to dielectric adhesion |
| DE19721731C1 (en) * | 1997-05-24 | 1999-04-08 | Wendisch Karl Heinz | Joining plastic film with a release agent on the surface to a metal foil and resulting multilayer material |
| US20070203270A1 (en) * | 2003-03-05 | 2007-08-30 | Clariant Gmbh | Flame retardant dispersion |
| CN101640972A (en) * | 2008-07-28 | 2010-02-03 | 欣兴电子股份有限公司 | Circuit board structure |
| CN101646305A (en) * | 2008-08-04 | 2010-02-10 | 欣兴电子股份有限公司 | Method for manufacturing lead on non-conductor substrate |
| CN105073893A (en) * | 2013-04-01 | 2015-11-18 | 沙特基础全球技术有限公司 | High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window and methods for the manufacture and use thereof |
| US20160128188A1 (en) * | 2013-09-27 | 2016-05-05 | Lg Chem, Ltd. | Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon |
| TW201601607A (en) * | 2014-06-16 | 2016-01-01 | 啟碁科技股份有限公司 | Method of forming metallic pattern on polymer substrate |
| CN105338736A (en) * | 2014-08-08 | 2016-02-17 | 深南电路有限公司 | HDI (high density interconnect) circuit board and processing method thereof |
| TWI528878B (en) * | 2014-12-26 | 2016-04-01 | 啟碁科技股份有限公司 | Patterned conductive structure and method for forming the same |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161109 |