CN106028645A - High-speed hard-soft combining plate with soft areas of different lengths and manufacturing method thereof - Google Patents
High-speed hard-soft combining plate with soft areas of different lengths and manufacturing method thereof Download PDFInfo
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- CN106028645A CN106028645A CN201610576245.8A CN201610576245A CN106028645A CN 106028645 A CN106028645 A CN 106028645A CN 201610576245 A CN201610576245 A CN 201610576245A CN 106028645 A CN106028645 A CN 106028645A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000005452 bending Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000013461 design Methods 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- ZOMSMJKLGFBRBS-UHFFFAOYSA-N bentazone Chemical compound C1=CC=C2NS(=O)(=O)N(C(C)C)C(=O)C2=C1 ZOMSMJKLGFBRBS-UHFFFAOYSA-N 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 25
- 239000011229 interlayer Substances 0.000 abstract description 5
- 239000004642 Polyimide Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000004899 motility Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a high-speed hard-soft combining plate with soft areas of different lengths and a manufacturing method thereof. Soft plates of different layers are designed into structures with bending areas, of which the lengths are gradient. When soft areas are bent, pulling and extruding may not occur to ensure same interlayer gaps and further eliminate severe influence on impedance due to change of a referential plane. Signal integrity of the hard-soft combining plate is improved.
Description
Technical field
The present invention relates to Rigid Flex field, particularly relate to a kind of soft zone Length discrepancy high speed Rigid Flex and making thereof
Method.
Background technology
Rigid Flex than ordinary circuit board gentlier, more save space.Rigid Flex is used in the application such as Aero-Space
It it is very good solution.The motility of this circuit board is embodied in it and can fold, bends, squeeze into the least sky
Between.It is suitable for any equipment, it is possible to improve the ability of product miniaturization.Rigid Flex also can reduce being manufactured into of equipment
This, because its volume is little so the size of packaging can be reduced, thus reduce the material cost needed for producing.Additionally, soft or hard combines
The flexible circuit of plate decreases the demand of interconnection wiring and solder connector.Make whole system circuit relatively reliable, resistance to
With.Rigid Flex is flexible PCB plate with hard circuit board after pressing working procedure, by related process requirements combination one
Rise.Hardboard is conventional rigid printed circuit plate, and adagio is that polyimides (PI) flexible substrate two sides is covered with after Copper Foil again at Copper Foil
The coverlay being made up of PI material and adhesive glue is sticked on layer.The rigid region of Rigid Flex has the highly reliable of rigid plate
Property, flexible region has the bendable folding endurance of flexible board and three-dimensional installation.Rigid Flex has been widely used in consumption electricity
In the products such as son, communication, Industry Control and defence and military.In recent years, along with chip clock frequency reach hundreds of MHz or even
GHz, data rate reaches more than Gbps, the rise/fall of corresponding pulse signal along more precipitous, pulsewidth up to ps magnitude,
Interconnection line on PCB starts gradually to present " transmission line " effect, has been not to be regarded as simple connecting line, inevitably to signal
Transmission line proposes the requirement of impedance matching.Impedance control requirement is there is in the case of high-frequency signal.
Design currently for the Rigid Flex under high frequency situations, hard area and soft zone separate computations impedance, respectively according to hard
Property region and flexible region lamination calculate meet the live width of resistance requirements, distance between centers of tracks, soft or hard transitional region implement modified line width,
Become the mode of spacing.Although this mode ensure that rigid and flexible region impedance matching, but and does not takes into account flexible region
The impact that during bending, between soft board monolithic, the change in gap brings.Owing to the application scenario of Rigid Flex usually bends installation
Or dynamic bending, bending can cause the impedance mismatch of flexible region, and the impact on signal transmission performance is bigger.Relative to
For common hardboard, there is certain gap between each soft board monolithic in the Rigid Flex comprising multiple flexible monolithic, therefore
The signal line impedance of soft zone is according to interlayer spacings when not bending and Structure Calculation, and generally micro-strip line impedance calculates mould
Formula.But when soft board bends to same direction, if each soft board monolithic length is equal, due to thickness of slab and interlayer spacings because of
Element, the crooked process radius of different soft boards is different, causes outermost layer soft board to be stretched, and innermost layer soft board is squeezed, this stretching
Soft board depression can be caused to swell even internal layer soft board with extruding tightly to fit outer layer adagio, as it is shown in figure 1, it is flexible single to comprise multiple
Causing reference plane to change after the Rigid Flex bending of sheet, situation about tightly fitting from microstrip line patten transformation is especially
Strip line pattern, therefore bending inevitably results in the impedance of flexible region and does not mates.
Summary of the invention
It is an object of the invention to by a kind of soft zone Length discrepancy high speed Rigid Flex and preparation method thereof, solve with
The problem that upper background section is mentioned.
For reaching this purpose, the present invention by the following technical solutions:
A kind of soft zone Length discrepancy high speed Rigid Flex, it is characterised in that include Rigid Flex body；Described soft or hard is tied
In plywood body there is length gradient in the bending region of different layers soft board.
The invention also discloses the manufacture method of a kind of soft zone Length discrepancy high speed Rigid Flex, it comprises the steps:
S101, determine PCB (printed circuit board) number of plies, thickness of slab, soft or hard district base material, stacked relationship and impedance desired control
Value；
S102, determine soft or hard region layer stacked structure and each connect up parameter；
S103, according to layer stack stack structure and wiring parameter constraint is set, carry out layout design；
S104, determine overbending direction and bending angle according to the concrete installation requirements of soft board；
S105, determine benchmark soft board length according to soft board overbending direction；
S106, thick, between coverlay thickness and hard area soft board monolithic according to bending angle, flexible board substrate thickness, copper
Prepreg thickness calculates each layer soft board length successively, obtains Length discrepancy processing request；
S107, PCB domain design completed are processed according to Length discrepancy processing request, enter the PCB machined
Row testing impedance is verified.
Especially, described step S106 specifically includes: assume that equivalence crooked process radius is the length to each layer of centrage, etc.
The length of the effect a length of each layer of centrage of soft board；If soft board A, B, C a length of La, Lb, Lc centrage, coverlay thickness is
CL, individual soft board thickness is T, and between soft board monolithic, PP sheet thickness is P, and bending angle is θ, wherein, T=PI core thickness+2 ×
Thick+2 × CL of copper, adagio on the basis of the shortest inner side soft board C, soft board B, A length lengthens successively, and concrete reckoning process is as follows:
Basic arc length L0:
Soft board C effective radius rc:
Soft board C effective length Lc:
Lc=rcθ
Soft board B effective radius rb:
rb=rc+[T+(P-2*CL)]
Soft board B effective length Lb:
Lb=rbθ={ rc+ [T+ (P-2*CL)] } * θ=Lc+[T+(P-2*CL)]*θ
Soft board A effective radius ra:
ra=rc+2*[T+(P-2*CL)]
Soft board A effective length La:
La=raθ={ rc+ 2* [T+ (P-2*CL)] } * θ=Lc+2*[T+(P-2*CL)]*θ
Therefore, by that analogy, if software board has n to open soft board, then soft board length LnFor
Ln=Lc+(n-1)*[T+(P-2*CL)]*θ
The most any one layer of soft board with the length difference of datum layer soft board is
Δ L=(n-1) * [T+ (P-2*CL)] * θ.
Different layers soft board is designed embayment by soft zone Length discrepancy high speed Rigid Flex that the present invention proposes and preparation method thereof
There is the structure of length gradient in territory, folding area, does not haves when soft zone bends and pulls and extruding situation, it is ensured that interlayer spacings is not
Become, thus eliminate because impedance is had a strong impact on by reference plane change, improve the signal integrity of Rigid Flex.
Accompanying drawing explanation
Fig. 1 is structural representation after the Rigid Flex bending comprising multiple flexible monolithic；
Schematic diagram before the soft zone Length discrepancy high speed Rigid Flex bending that Fig. 2 provides for the embodiment of the present invention；
Schematic diagram after the soft zone Length discrepancy high speed Rigid Flex bending that Fig. 3 provides for the embodiment of the present invention；
The soft zone Length discrepancy high speed Rigid Flex manufacture method flow chart that Fig. 4 provides for the embodiment of the present invention.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.In accompanying drawing
Give presently preferred embodiments of the present invention.But, the present invention can realize in many different forms, however it is not limited to institute herein
The embodiment described.On the contrary, provide the purpose of these embodiments be make to the disclosure understand more thorough
Comprehensively.It should be noted that unless otherwise defined, all of technology used herein and scientific terminology with belong to the present invention's
The implication that those skilled in the art are generally understood that is identical.The term used the most in the description of the invention is simply
In order to describe the purpose of specific embodiment, it is not intended that in limiting the present invention.
In the present embodiment, soft zone Length discrepancy high speed Rigid Flex specifically includes Rigid Flex body；Described soft or hard combines
In plate body there is length gradient in the bending region of different layers soft board.As in figure 2 it is shown, Fig. 2 for the embodiment of the present invention provide soft
Schematic diagram before district's Length discrepancy high speed Rigid Flex bending, A in figure, B, C represent soft board A, soft board B, soft board C respectively.Such as Fig. 3 institute
Show, schematic diagram after the soft zone Length discrepancy high speed Rigid Flex bending that Fig. 3 provides for the embodiment of the present invention.
As shown in Figure 4, the soft zone Length discrepancy high speed Rigid Flex manufacture method flow process that Fig. 4 provides for the embodiment of the present invention
Figure.
In the present embodiment, the manufacture method of soft zone Length discrepancy high speed Rigid Flex specifically includes following steps:
S101, determine PCB layer number, thickness of slab, soft or hard district base material, stacked relationship and impedance desired control value.
S102, utilize impedance computation software to assist, determine soft or hard region layer stacked structure and each connect up parameter.
S103, utilize PCB design software, constraint is set according to layer stack stack structure and wiring parameter, carries out layout design.
S104, determine overbending direction and bending angle according to the concrete installation requirements of soft board.
S105, determine benchmark soft board length according to soft board overbending direction.
S106, thick, between coverlay thickness and hard area soft board monolithic according to bending angle, flexible board substrate thickness, copper
Prepreg thickness calculates each layer soft board length successively, obtains Length discrepancy processing request.
Concrete, it is assumed that equivalence crooked process radius is the length to each layer of centrage, in the equivalence a length of each layer of soft board
The length of heart line；As a example by Rigid Flex shown in Fig. 2, if soft board A, B, C a length of La, Lb, Lc centrage, coverlay thickness
For CL, individual soft board thickness is T, and between soft board monolithic, PP sheet thickness is P, and bending angle is θ, wherein, and T=PI core thickness+2
Thick+2 × CL, the PI core thickness of × copper refers to the thickness of the medium of individual soft board own, adagio on the basis of the shortest inner side soft board C,
Soft board B, A length lengthens successively, and concrete reckoning process is as follows:
Basic arc length L0:
Soft board C effective radius rc:
Soft board C effective length Lc:
Lc=rcθ
Soft board B effective radius rb:
rb=rc+[T+(P-2*CL)]
Soft board B effective length Lb:
Lb=rbθ={ rc+ [T+ (P-2*CL)] } * θ=Lc+[T+(P-2*CL)]*θ
Soft board A effective radius ra:
ra=rc+2*[T+(P-2*CL)]
Soft board A effective length La:
La=raθ={ rc+ 2* [T+ (P-2*CL)] } * θ=Lc+2*[T+(P-2*CL)]*θ
Therefore, by that analogy, if software board has n to open soft board, then soft board length LnFor
Ln=Lc+(n-1)*[T+(P-2*CL)]*θ
The most any one layer of soft board with the length difference of datum layer soft board is
Δ L=(n-1) * [T+ (P-2*CL)] * θ.
S107, PCB domain design completed are processed according to Length discrepancy processing request, enter the PCB machined
Row testing impedance is verified.
Different layers soft board is designed to bend region by technical scheme the structure of length gradient, bends in soft zone
Time do not have and pull and extruding situation, it is ensured that interlayer spacings is constant, thus eliminates because reference plane change impedance
Have a strong impact on, improve the signal integrity of Rigid Flex.
One of ordinary skill in the art will appreciate that all or part of flow process realizing in above-described embodiment method, be permissible
Instructing relevant hardware by computer program to complete, described program can be stored in a computer read/write memory medium
In, this program is upon execution, it may include such as the flow process of the embodiment of above-mentioned each method.Wherein, described storage medium can be magnetic
Dish, CD, read-only store-memory body (Read-Only Memory, ROM) or random store-memory body (Random Access
Memory, RAM) etc..
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious change,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although by above example, the present invention is carried out
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other Equivalent embodiments more can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (3)
1. a soft zone Length discrepancy high speed Rigid Flex, it is characterised in that include Rigid Flex body；Described soft or hard combines
In plate body there is length gradient in the bending region of different layers soft board.
2. the manufacture method of the soft zone Length discrepancy high speed Rigid Flex described in a claim 1, it is characterised in that include as
Lower step:
S101, determine PCB layer number, thickness of slab, soft or hard district base material, stacked relationship and impedance desired control value；
S102, determine soft or hard region layer stacked structure and each connect up parameter；
S103, according to layer stack stack structure and wiring parameter constraint is set, carry out layout design；
S104, determine overbending direction and bending angle according to the concrete installation requirements of soft board；
S105, determine benchmark soft board length according to soft board overbending direction；
S106, half solid coverlay thickness and hard area soft board monolithic between thick according to bending angle, flexible board substrate thickness, copper
Change sheet thickness and calculate each layer soft board length successively, obtain Length discrepancy processing request；
S107, PCB domain design completed are processed according to Length discrepancy processing request, hinder the PCB machined
Anti-test checking.
The manufacture method of soft zone Length discrepancy high speed Rigid Flex the most according to claim 1, it is characterised in that described step
Rapid S106 specifically includes: assume that equivalence crooked process radius is the length to each layer of centrage, in the equivalence a length of each layer of soft board
The length of heart line；If soft board A, B, C a length of La, Lb, Lc centrage, coverlay thickness is CL, and individual soft board thickness is T, soft
Between plate monolithic, PP sheet thickness is P, and bending angle is θ, and wherein, thick+2 × CL of T=PI core thickness+2 × copper, in the shortest
Adagio on the basis of the soft board C of side, soft board B, A length lengthens successively, and concrete reckoning process is as follows:
Basic arc length L0:
Soft board C effective radius rc:
Soft board C effective length Lc:
Lc=rcθ
Soft board B effective radius rb:
rb=rc+[T+(P-2*CL)]
Soft board B effective length Lb:
Lb=rbθ={ rc+ [T+ (P-2*CL)] } * θ=Lc+[T+(P-2*CL)]*θ
Soft board A effective radius ra:
ra=rc+2*[T+(P-2*CL)]
Soft board A effective length La:
La=raθ={ rc+ 2* [T+ (P-2*CL)] } * θ=Lc+ 2* [T+ (P-2*CL)] * θ therefore, by that analogy, if software combine
Plate has n to open soft board, then soft board length LnFor
Ln=Lc+(n-1)*[T+(P-2*CL)]*θ
The most any one layer of soft board with the length difference of datum layer soft board is
Δ L=(n-1) * [T+ (P-2*CL)] * θ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610576245.8A CN106028645B (en) | 2016-07-19 | 2016-07-19 | A kind of soft zone Length discrepancy high speed Rigid Flex and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610576245.8A CN106028645B (en) | 2016-07-19 | 2016-07-19 | A kind of soft zone Length discrepancy high speed Rigid Flex and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106028645A true CN106028645A (en) | 2016-10-12 |
| CN106028645B CN106028645B (en) | 2018-11-02 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106961799A (en) * | 2017-04-28 | 2017-07-18 | 无锡市同步电子科技有限公司 | A kind of high speed Rigid Flex method for designing |
| CN109688734A (en) * | 2018-12-06 | 2019-04-26 | 高德（无锡）电子有限公司 | A kind of processing technology preventing Rigid Flex bending tearing soft board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280201B1 (en) * | 2000-01-21 | 2001-08-28 | Hewlett-Packard Company | Laminated 90-degree connector |
| JP2006270023A (en) * | 2005-02-23 | 2006-10-05 | Fujikura Ltd | Flexible multi-layer printed wiring board |
| CN203136330U (en) * | 2013-03-23 | 2013-08-14 | 广州安费诺诚信软性电路有限公司 | Book clip type softness and hardness combined circuit board |
-
2016
- 2016-07-19 CN CN201610576245.8A patent/CN106028645B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280201B1 (en) * | 2000-01-21 | 2001-08-28 | Hewlett-Packard Company | Laminated 90-degree connector |
| JP2006270023A (en) * | 2005-02-23 | 2006-10-05 | Fujikura Ltd | Flexible multi-layer printed wiring board |
| CN203136330U (en) * | 2013-03-23 | 2013-08-14 | 广州安费诺诚信软性电路有限公司 | Book clip type softness and hardness combined circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106961799A (en) * | 2017-04-28 | 2017-07-18 | 无锡市同步电子科技有限公司 | A kind of high speed Rigid Flex method for designing |
| CN106961799B (en) * | 2017-04-28 | 2019-05-21 | 无锡市同步电子科技有限公司 | A kind of high speed Rigid Flex design method |
| CN109688734A (en) * | 2018-12-06 | 2019-04-26 | 高德（无锡）电子有限公司 | A kind of processing technology preventing Rigid Flex bending tearing soft board |
| CN109688734B (en) * | 2018-12-06 | 2021-07-13 | 高德（无锡）电子有限公司 | Processing technology for preventing soft and hard combined plate from being bent and torn |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106028645B (en) | 2018-11-02 |
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Denomination of invention: A high speed soft hard bonding board with unequal length in soft area and its manufacturing method Effective date of registration: 20210325 Granted publication date: 20181102 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: P.C.B.A. ELECTRONIC (WUXI) Ltd. Registration number: Y2021320010110 |
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Address after: No. 11-3 Hongyi Road, Xinwu District, Wuxi City, Jiangsu Province, 214028 Patentee after: Wuxi Synchronous Electronic Technology Co.,Ltd. Country or region after: China Address before: Room C508, No. 18 Qingyuan Road, Wuxi National High tech Industrial Development Zone, Wuxi City, Jiangsu Province, 214135 Patentee before: P.C.B.A. ELECTRONIC (WUXI) LTD. Country or region before: China |
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Change date: 20240327 Registration number: Y2021320010110 Pledgor after: Wuxi Synchronous Electronic Technology Co.,Ltd. Pledgor before: P.C.B.A. ELECTRONIC (WUXI) LTD. |
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Granted publication date: 20181102 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: Wuxi Synchronous Electronic Technology Co.,Ltd. Registration number: Y2021320010110 |