CN106022253A - Mobile terminal and fingerprint module group thereof - Google Patents
Mobile terminal and fingerprint module group thereof Download PDFInfo
- Publication number
- CN106022253A CN106022253A CN201610327175.2A CN201610327175A CN106022253A CN 106022253 A CN106022253 A CN 106022253A CN 201610327175 A CN201610327175 A CN 201610327175A CN 106022253 A CN106022253 A CN 106022253A
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- Prior art keywords
- fingerprint
- becket
- fingerprint chip
- chip
- fingerprint module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Telephone Set Structure (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
Abstract
The invention relates to a mobile terminal and a fingerprint module group thereof. The fingerprint module group comprises a metal ring, a fingerprint chip, a flexible circuit board, and a reinforcing plate. The fingerprint chip is disposed in the metal ring. The flexible circuit board is disposed below the fingerprint chip. The reinforcing plate is disposed below the flexible circuit board. The fingerprint chip is electrically connected with the flexible circuit board, and an underlay layer is disposed below the fingerprint chip and is used for lifting the fingerprint chip. The fingerprint module group enables the structure design to be high in freedom degree because of the arrangement of the underlay layer, can effectively solve a problem, caused by the limiting of the thickness of the fingerprint chip, of hand feel of a fingerprint key, and improves the user experience.
Description
Technical field
The present invention relates to technical field of mobile terminals, specifically refer to a kind of mobile terminal and fingerprint mould thereof
Group.
Background technology
Along with the fast development of intelligent terminal, fingerprint module is with its mode of operation and the strongest easily
Security performance be more and more applied on intelligent terminal.When cause is limited to the thickness of fingerprint chip
Degree, the structure design freedom of fingerprint module is low, and the existing design feel of fingerprint module is bad, fall
Low finger and the contact surface of fingerprint chip, affect overall customer experience.
Referring to Fig. 1, Fig. 1 is the structural representation of a kind of fingerprint module in prior art.
As it is shown in figure 1, fingerprint module 100 is by becket 110, fingerprint chip 120, flexible wires
Several parts compositions such as road plate 130 and stiffening plate 140.Becket main body 111 outer surface is to becket
The height of shirt rim 112 is A, and the thickness of becket shirt rim 112 is B, the thickness of fingerprint chip 120
Degree is C, and the distance on fingerprint chip 120 surface to becket main body 111 outer surface is D, thus
A=C+D-B can be obtained；Ordinary circumstance, the thickness B a size of 0.3mm of becket shirt rim 112,
The thickness C of fingerprint chip is 0.7mm, and in reality, the cover sheet thickness of touch screen is also 0.7mm, if
Becket 110 outer surface is concordant with touch screen cover plate, then becket main body 111 outer surface is to metal
The height A of ring shirt rim 112 is greater than or equal to 0.7mm, fingerprint chip 120 surface is to becket
Distance D of main body 111 outer surface is greater than or equal to 0.3mm, otherwise will result in fingerprint button
Sinking, feel is bad, and reduces the contact surface of finger and fingerprint chip, the overall user's body of impact
Test.
Summary of the invention
The present invention provides a kind of fingerprint module, to solve the structure design of fingerprint module in prior art
The technical problem that degree of freedom is low.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide one to refer to
Stricture of vagina module, described fingerprint module includes:
Becket；
Fingerprint chip, is located at the inside of described becket；
Flexible PCB, is located at the lower section of described fingerprint chip；And
Stiffening plate, is located at the lower section of described flexible PCB；
Wherein, described fingerprint chip electrically connects with described flexible PCB, described fingerprint beneath chips
It is provided with pad level, is used for raising described fingerprint chip.
According to one preferred embodiment of the present invention, described pad level is formed on described flexible PCB.
According to one preferred embodiment of the present invention, the size dimension of described pad level is more than or equal to described
The size of fingerprint chip and the internal diameter less than described becket.
According to one preferred embodiment of the present invention, the gauge scope of described pad level is 0.05mm
To 0.5mm.
According to one preferred embodiment of the present invention, described becket includes becket main body and becket skirt
Limit, the thickness of described becket main body is equal or for unequal with the thickness of becket shirt rim.
Another technical solution used in the present invention is: provide a kind of mobile end with fingerprint module
End, described mobile terminal includes:
Mainboard；
Display module, electrically connects with described mainboard；
Above-mentioned fingerprint module, electrically connects with described mainboard；Wherein, described fingerprint module includes:
Becket；
Fingerprint chip, is located at the inside of described becket；
Flexible PCB, is located at the lower section of described fingerprint chip；And
Stiffening plate, is located at the lower section of described flexible PCB；
Wherein, described flexible PCB electrically connects with described fingerprint chip, described mainboard respectively, institute
State fingerprint beneath chips and be provided with pad level, be used for raising described fingerprint chip.
The invention has the beneficial effects as follows: be different from the situation of prior art, the fingerprint that the present invention provides
Module is owing to being provided with pad level so that the structure design freedom of fingerprint module is high, can be with efficient solution
The fingerprint handfeel of keys problem certainly caused because fingerprint chip thickness is limited, promotes Consumer's Experience.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, embodiment will be retouched below
In stating, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below
It is only some embodiments of the present invention, for those of ordinary skill in the art, is not paying
On the premise of creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a kind of fingerprint module in prior art；
Fig. 2 is the structural representation of fingerprint module one embodiment of the present invention；
Fig. 3 is the partial structurtes schematic diagram of fingerprint module shown in Fig. 2；
Fig. 4 be the present invention have mobile terminal one embodiment of fingerprint module circuit signal
Figure.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, to the technical scheme in the embodiment of the present invention
It is clearly and completely described, it is clear that described embodiment is only that the part of the present invention is real
Execute example rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under not making creative work premise, broadly falls into this
The scope of invention protection.
Refer to the structural representation that Fig. 2, Fig. 2 are fingerprint module one embodiments of the present invention.
As in figure 2 it is shown, the present invention provides a kind of fingerprint module, this fingerprint module 200 includes metal
Ring 210, fingerprint chip 220, flexible PCB 230 and stiffening plate 240.
Wherein, fingerprint chip 220 is located at the inside of described becket 210；Flexible PCB 230
It is located at the lower section of described fingerprint chip 220；And stiffening plate 240 is located at described flexible PCB 230
Lower section；Wherein, fingerprint chip 220 electrically connects with flexible PCB 230, fingerprint chip 220
Lower section is provided with pad level 231, is used for raising fingerprint chip 220.
Seeing also Fig. 3, wherein, becket main body 211 outer surface is to becket shirt rim 212
Height be A, the thickness of becket shirt rim 212 is B, and the thickness of fingerprint chip 220 is C,
Fingerprint chip 220 surface is D to the distance of becket main body 211 outer surface, pad level 231
Thickness is E, thus can obtain A=C+D-B+E.Assume that B, C fix, by regulation E, can obtain
To preferred A and D, thus it is not only restricted to the thickness of fingerprint chip 220, effectively solves owing to referring to
Stricture of vagina chip 220 thickness is limited the various design problems caused.
The fingerprint module 200 that the present invention provides is owing to being provided with pad level 231 so that fingerprint module 200
Structure design freedom high, can effectively solve to be caused because fingerprint chip 220 thickness is limited
Fingerprint handfeel of keys problem, promotes Consumer's Experience.
The pad level 231 of the present invention is formed on flexible PCB 230, the shape of pad level 231
Can be rectangle, circle, ellipse or track type, flexible PCB 230 and fingerprint chip 220
Being electrically connected by mounting technology, stiffening plate 240 can be metal reinforcement plate, including steel
Sheet stiffening plate, aluminium foil stiffening plate, it is also possible to be rustless steel stiffening plate or high-temperature resistance plastice stiffening plate.
Wherein, the size dimension of pad level 231 more than or equal to fingerprint chip 220 size and
Less than the internal diameter of becket 210, pad level 231 can be inlayed in becket 220.
Further, the gauge scope of pad level 231 is 0.05mm to 0.5mm, preferably
Scope is 0.1mm to 0.3mm.
Wherein, becket 210 includes becket main body 211 and becket shirt rim 212, becket
The thickness of main body 211 is equal or for unequal with the thickness of becket shirt rim 212.
Referring to Fig. 4, Fig. 4 is mobile terminal one embodiment that the present invention has fingerprint module
Circuit diagram.
As shown in Figure 4, the present invention also provides for a kind of mobile terminal with fingerprint module, and this moves
Terminal 10 includes mainboard 400, display module 300 and above-mentioned fingerprint module 200.
Wherein, display module 300 electrically connects with mainboard 400；Fingerprint module 200 and mainboard 400
Electrical connection.
Wherein, the structure of fingerprint module 200 sees above described, and it is no longer repeated herein.
In sum, it should be readily apparent to one skilled in the art that fingerprint module that the present invention provides due to
It is provided with pad level so that the structure design freedom of fingerprint module is high, can effectively solve because of fingerprint
The fingerprint handfeel of keys problem that chip thickness is limited and causes, promotes Consumer's Experience.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention,
Every equivalent structure utilizing description of the invention and accompanying drawing content to be made or equivalence flow process conversion, or
Directly or indirectly being used in other relevant technical fields, the patent being the most in like manner included in the present invention is protected
In the range of protecting.
Claims (10)
1. a fingerprint module, it is characterised in that described fingerprint module includes:
Becket；
Fingerprint chip, is located at the inside of described becket；
Flexible PCB, is located at the lower section of described fingerprint chip；And
Stiffening plate, is located at the lower section of described flexible PCB；
Wherein, described fingerprint chip electrically connects with described flexible PCB, described fingerprint beneath chips
It is provided with pad level, is used for raising described fingerprint chip.
Fingerprint module the most according to claim 1, it is characterised in that described pad level shape
On flexible PCB described in Cheng Yu.
Fingerprint module the most according to claim 1, it is characterised in that described pad level
The size dimension size more than or equal to described fingerprint chip and the internal diameter less than described becket.
Fingerprint module the most according to claim 3, it is characterised in that described pad level
Gauge scope is 0.05mm to 0.5mm.
Fingerprint module the most according to claim 1, it is characterised in that described becket bag
Include becket main body and becket shirt rim, the thickness of described becket main body and the thickness of becket shirt rim
Degree is equal or is unequal.
6. a mobile terminal with fingerprint module, it is characterised in that described mobile terminal bag
Include:
Mainboard；
Display module, electrically connects with described mainboard；
Fingerprint module, electrically connects with described mainboard；Wherein, described fingerprint module includes:
Becket；
Fingerprint chip, is located at the inside of described becket；
Flexible PCB, is located at the lower section of described fingerprint chip；And
Stiffening plate, is located at the lower section of described flexible PCB；
Wherein, described flexible PCB electrically connects with described fingerprint chip, described mainboard respectively, institute
State fingerprint beneath chips and be provided with pad level, be used for raising described fingerprint chip.
Mobile terminal the most according to claim 6, it is characterised in that described pad level shape
On flexible PCB described in Cheng Yu.
Mobile terminal the most according to claim 6, it is characterised in that described pad level
The size dimension size more than or equal to described fingerprint chip and the internal diameter less than described becket.
Mobile terminal the most according to claim 8, it is characterised in that described pad level
Gauge scope is 0.05mm to 0.5mm.
Mobile terminal the most according to claim 6, it is characterised in that described becket bag
Include becket main body and becket shirt rim, the thickness of described becket main body and the thickness of becket shirt rim
Degree is equal or is unequal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610327175.2A CN106022253A (en) | 2016-05-17 | 2016-05-17 | Mobile terminal and fingerprint module group thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610327175.2A CN106022253A (en) | 2016-05-17 | 2016-05-17 | Mobile terminal and fingerprint module group thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106022253A true CN106022253A (en) | 2016-10-12 |
Family
ID=57097570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610327175.2A Withdrawn CN106022253A (en) | 2016-05-17 | 2016-05-17 | Mobile terminal and fingerprint module group thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106022253A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106778513A (en) * | 2016-11-15 | 2017-05-31 | 深圳天珑无线科技有限公司 | The automatic assembly method and system of a kind of fingerprint module becket |
| CN106850886A (en) * | 2017-01-20 | 2017-06-13 | 广东欧珀移动通信有限公司 | A kind of mobile terminal |
| CN106886256A (en) * | 2017-03-13 | 2017-06-23 | 广东欧珀移动通信有限公司 | display module and terminal device |
| WO2018133763A1 (en) * | 2017-01-20 | 2018-07-26 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and mobile terminal |
| WO2018148901A1 (en) * | 2017-02-16 | 2018-08-23 | 深圳市汇顶科技股份有限公司 | Fingerprint button structure, button pressure detection method and electronic device |
| US11157718B2 (en) | 2017-09-18 | 2021-10-26 | Vivo Mobile Communication Co., Ltd. | Fingerprint identification module and terminal device |
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| CN104156710A (en) * | 2014-08-26 | 2014-11-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device and terminal device |
| CN204650546U (en) * | 2015-06-03 | 2015-09-16 | 江西合力泰科技有限公司 | A kind of fingerprint recognition module |
| CN105046244A (en) * | 2015-08-28 | 2015-11-11 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and preparation method therefor as well as electronic equipment provided with fingerprint identification module group |
| CN204808363U (en) * | 2012-11-20 | 2015-11-25 | 韩国科泰高科株式会社 | Fingerprint sensor module, has this portable electronic equipment |
| CN105304575A (en) * | 2015-10-23 | 2016-02-03 | 华天科技（西安）有限公司 | Packaging structure adopting cushion block to prevent inclination of fingerprint sensing chip and manufacturing method |
| CN105373778A (en) * | 2015-11-02 | 2016-03-02 | 魅族科技（中国）有限公司 | Fingerprint module and terminal |
| CN105512645A (en) * | 2016-01-19 | 2016-04-20 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN205862339U (en) * | 2016-05-17 | 2017-01-04 | 深圳天珑无线科技有限公司 | Mobile terminal and fingerprint module thereof |
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| CN204808363U (en) * | 2012-11-20 | 2015-11-25 | 韩国科泰高科株式会社 | Fingerprint sensor module, has this portable electronic equipment |
| CN104156710A (en) * | 2014-08-26 | 2014-11-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device and terminal device |
| CN204650546U (en) * | 2015-06-03 | 2015-09-16 | 江西合力泰科技有限公司 | A kind of fingerprint recognition module |
| CN105046244A (en) * | 2015-08-28 | 2015-11-11 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and preparation method therefor as well as electronic equipment provided with fingerprint identification module group |
| CN105304575A (en) * | 2015-10-23 | 2016-02-03 | 华天科技（西安）有限公司 | Packaging structure adopting cushion block to prevent inclination of fingerprint sensing chip and manufacturing method |
| CN105373778A (en) * | 2015-11-02 | 2016-03-02 | 魅族科技（中国）有限公司 | Fingerprint module and terminal |
| CN105512645A (en) * | 2016-01-19 | 2016-04-20 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN205862339U (en) * | 2016-05-17 | 2017-01-04 | 深圳天珑无线科技有限公司 | Mobile terminal and fingerprint module thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106778513A (en) * | 2016-11-15 | 2017-05-31 | 深圳天珑无线科技有限公司 | The automatic assembly method and system of a kind of fingerprint module becket |
| CN106850886A (en) * | 2017-01-20 | 2017-06-13 | 广东欧珀移动通信有限公司 | A kind of mobile terminal |
| WO2018133763A1 (en) * | 2017-01-20 | 2018-07-26 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and mobile terminal |
| WO2018148901A1 (en) * | 2017-02-16 | 2018-08-23 | 深圳市汇顶科技股份有限公司 | Fingerprint button structure, button pressure detection method and electronic device |
| CN106886256A (en) * | 2017-03-13 | 2017-06-23 | 广东欧珀移动通信有限公司 | display module and terminal device |
| US11157718B2 (en) | 2017-09-18 | 2021-10-26 | Vivo Mobile Communication Co., Ltd. | Fingerprint identification module and terminal device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161012 |
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| WW01 | Invention patent application withdrawn after publication |