CN105983739B - Solder paste welding device and method - Google Patents
Solder paste welding device and method Download PDFInfo
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- CN105983739B CN105983739B CN201510041588.XA CN201510041588A CN105983739B CN 105983739 B CN105983739 B CN 105983739B CN 201510041588 A CN201510041588 A CN 201510041588A CN 105983739 B CN105983739 B CN 105983739B
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Abstract
A solder paste welding device and method thereof, the device includes a dispenser for applying a welding material to a jointed board component; the jig body is used for heating the jointed board component so as to weld a module on the jointed board component; the jig body is provided with a limiting groove which is suitable for limiting the jointed board part; the jig body comprises at least one heating platform which is arranged in the limiting groove.
Description
Technical Field
The invention relates to a solder paste welding device and a solder paste welding method, in particular to a solder paste welding device and a solder paste welding method applied to the camera module industry.
Background
In the module trade of making a video recording, along with the continuous improvement to image quality, also higher and higher to the performance requirement of the module of making a video recording.
The performance of the camera module mainly depends on the performance of each component element, that is, the performance of the camera module can be improved by updating the element, however, from a certain point of view, under the existing technology highly developed in the camera module industry, because the technology tends to be mature, if it is difficult to completely update the element, the performance of the existing element can be fully utilized under more conditions, and the performance of the camera module can be improved.
Another aspect affecting the performance of the camera module from the whole production flow is the assembly process of the components. That is, the selection of superior components requires that these components be properly mounted in place, which is more demanding for the fixing process of the components on the core components of the camera module, such as the pcb (printed Circuit board).
As is well known, the PCB belongs to the precision component, and in the module of making a video recording simultaneously, the mounted position and the installation angle of module all can influence the effect that the module played in the use, for example influence the light inlet quantity of module, optical axis position etc. to influence the holistic optical property of the module of making a video recording. It is seen that achieving high quality component mounting on the PCB of the image module is also extremely important to the overall performance of the image module, and that improvements in detail are becoming more and more important from the development direction.
Further, the fixing process of the module motor on the PCB in the prior art is known. In the prior art, a module motor is connected to a PCB (printed circuit board) in a welding mode, and the whole process is completed through pure manual operation, so that the traditional process mode brings many problems.
The conventional welding process is as follows: placing a jig → manual welding → full inspection of appearance → module extraction.
It can be seen that in the conventional welding process, firstly, workers need to put jigs and weld, and in the process, due to high process precision requirements, the workers need to be personnel with certain corresponding skills and need to have skilled skills, and long-period training is needed to meet the requirements. Therefore, training workers in the first place is a factor limiting production efficiency, and is labor-intensive, resource-intensive and long-lasting.
Secondly, manual operation means great instability, and the working conditions of each worker may be different in different working time periods, so that the quality of the obtained products is different. Due to individual differences among different workers, the obtained products have different qualities, and therefore the yield of the products and the consistency of the appearance cannot be guaranteed.
Thirdly, in the specific work of each worker, due to the influence of proficiency, the problems of uneven welding points, unstable technology such as insufficient welding and the like are caused, and in the operation process, the microscope base can be scalded due to improper operation caused by environmental influence. It is more worth mentioning that in the existing welding method, the workpiece to be welded and the welding heating tool are heated by direct contact, and an operator needs to know the welding time and the welding degree according to experience, so that the existing welding method has higher requirements on the operator.
Fourthly, from the aspect of overall efficiency improvement and labor force liberation, the efficiency is low due to pure manual work, and workers repeat the same actions during the work process, so that operation fatigue and boredom to the work are easy to generate, and therefore, the mechanical work is required to be replaced by mechanical operation.
The present invention is directed to an innovation of the conventional pure manual operation mode, and provides a new welding process method and a corresponding device, so as to improve the defects in the prior art.
Disclosure of Invention
The invention mainly aims to provide a solder paste welding device and a solder paste welding method, which comprise a jig body suitable for limiting a jointed board component, so that an operator does not need to place jointed board workpieces and modules according to preset positions during operation, and the production efficiency is improved.
Another object of the present invention is to provide a solder paste welding apparatus and method, which includes a jig body capable of locally heating different positions of the jointed board member, thereby avoiding the need to integrally heat the jointed board member and preventing the module from being scalded.
Another objective of the present invention is to provide a solder paste soldering apparatus and method, which includes a jig body capable of locally heating a plurality of different positions of a board assembly, so as to simultaneously perform soldering operations on a plurality of modules.
The invention also aims to provide a solder paste welding device and a solder paste welding method, which realize the solder dispensing operation of jointed board components through a dispenser and avoid the welding problem caused by manual operation.
Another object of the present invention is to provide a solder paste soldering apparatus and method, which can perform a solder dispensing operation on a jointed board component by a dispenser, and can maintain a stable operation process, thereby stabilizing a yield of products and improving appearance consistency.
Another object of the present invention is to provide a solder paste welding apparatus and method, which can perform a solder dispensing operation on a jointed board component by a dispenser, and complete a process of welding a module on the jointed board component by a jig body, thereby reducing manual work in a welding process, saving labor force, and improving production efficiency.
Another objective of the present invention is to provide a solder paste welding apparatus and method, wherein the jig body includes a plurality of heating platforms, which form independent heating positions, and a channel is formed between the heating platforms, so as to facilitate picking and placing of the jointed board components.
Another objective of the present invention is to provide a solder paste welding apparatus and method, wherein the jig body includes a plurality of heating platforms, the heating platforms heat the bottom of the jointed board part during the welding process, and the heating platforms and the modules are located at two sides of the jointed board part to prevent the modules from being burned by direct heating.
Another object of the present invention is to provide a solder paste welding apparatus and method, which can simultaneously weld a plurality of modules on a jointed board component, wherein the processing process flow of each module is consistent, and the processing conditions are the same, so that the yield and the appearance consistency of the modules on the whole jointed board component are ensured.
Another object of the present invention is to provide a solder paste welding apparatus and method, which can perform a solder dispensing operation on a jointed board component through a dispenser, and limit and weld the module through a jig body, thereby reducing the problems of module scalding, uneven welding spots, silver foil sticking, and pinching caused by manual operation.
Another objective of the present invention is to provide a solder paste welding apparatus and method, which can weld a module on a jig for a jointed board by the jig body, and control the welding temperature and welding time by controlling the jig body.
Another object of the present invention is to provide a solder paste soldering apparatus and method, which provides a new solder paste soldering process different from the conventional manual solder paste soldering process.
In order to achieve the above object, the present invention provides a solder paste soldering apparatus including:
a dispenser for applying a welding material to a panel member; and
the jig body is used for heating the jointed board component so as to weld a module on the jointed board component;
the jig body is provided with a limiting groove which is suitable for limiting the jointed board part; the jig body comprises at least one heating platform which is arranged in the limiting groove.
In order to achieve the above object, the present invention further provides a solder paste soldering method, comprising the steps of:
(A) providing a dispensing machine, and dispensing tin on a jointed board component and/or a module;
(B) providing a jig body, and heating and welding the jointed board component and the module;
(C) checking the jointed boards and the module; and
(D) and taking the jointed board part welded with the module.
Preferably, in the solder paste welding device, the heating platform is convexly arranged in the limiting groove.
Preferably, the solder paste welding device comprises a plurality of heating platforms, and a channel is formed between every two adjacent heating platforms.
Preferably, the solder paste welding device, the heating platform and the channel are arranged at intervals and are mutually independently and simultaneously heated so as to simultaneously heat a plurality of local positions of the jointed board.
Preferably, each of the heating platforms of the solder paste welding device has a groove, and the groove is communicated with an external space.
Preferably, in the solder paste welding device, the heating platform is adapted to be supported on the jointed board component and heat from the bottom of the jointed board component.
Preferably, in the solder paste welding device, the height of the heating platform is smaller than the depth of the limiting groove.
Preferably, in the solder paste welding device, the front end of the limiting groove is communicated with the outside.
Preferably, in the solder paste welding device, the upper end of the limiting groove is communicated with the outside.
Preferably, in the solder paste welding device, the width of the limiting groove is matched with that of the jig for the jointed board.
Preferably, in the solder paste welding device, the heating platform is made of red copper.
Preferably, in the solder paste welding apparatus, the jig body is made of a heat insulating material.
Preferably, the jig body of the solder paste welding device comprises a control device for monitoring the heating time and the heating temperature of the heating platform.
Preferably, the solder paste welding device further comprises a dispensing machine for dispensing solder on the jointed board component and/or the module.
Preferably, the solder paste welding device comprises a pressing cover device which is suitable for pressing the jointed board components.
Preferably, the solder paste soldering method (a) further includes the steps of: (A1) and program positioning and adjusting the dispenser.
Preferably, in the solder paste welding method, the jig body is provided with a limiting groove suitable for limiting the jointed board part.
Preferably, in the solder paste welding method, the jig body includes at least one heating platform disposed in the limiting groove for heating the jointed board member.
Preferably, in the solder paste soldering method, the heating platform is convexly arranged in the limiting groove.
Preferably, in the solder paste soldering method, each of the heating platforms has a groove, and the groove is communicated with an external space.
Preferably, in the solder paste soldering method, the jig body includes a plurality of heating platforms, and a channel is formed between two adjacent heating platforms.
Preferably, in the solder paste soldering method, the heating platform and the channel are arranged at intervals and are heated independently at the same time, so that the heating platform and the channel can be heated at a plurality of local positions of the jointed board at the same time.
In the solder paste welding method, the heating platform is suitable for being supported on the jointed board component and heating from the bottom of the jointed board component.
Preferably, in the solder paste soldering method, the height of the heating platform is smaller than the depth of the limiting groove.
Preferably, in the solder paste welding method, the front end of the limiting groove is communicated with the outside.
Preferably, in the solder paste welding method, the upper end of the limiting groove is communicated with the outside.
Preferably, in the solder paste welding method, the width of the limiting groove is matched with the width of the jig for the jointed board.
Preferably, in the solder paste soldering method, the heating platform is made of red copper.
Preferably, in the solder paste welding method, the jig body is made of a heat insulating material.
Preferably, in the solder paste soldering method, the jig body includes a control device for monitoring the heating time and the heating temperature of the heating platform.
Preferably, the solder paste welding device and the dispenser comprise an adjusting device for adjusting the position, the application amount and the flatness factors of the welding material applied to the jointed board component.
Preferably, in the solder paste soldering method, the step (B) further includes the steps of:
(B1) placing the jointed board part into a limiting groove of the jig body;
(B2) heating the heating platform of the jig body; and
(B3) and placing the module at the position of the bonding pad corresponding to the jointed board component.
Preferably, in the solder paste soldering method, there is no definite sequence between the step (a) and the steps (B1), (B2) and (B3).
Preferably, in the solder paste soldering method, the step (B) further includes the steps of: (B4) and providing a gland and pressing the jointed board components.
Preferably, in the solder paste soldering method, the step (B4) is performed after the steps (B1), (B2) and (B3).
Preferably, in the solder paste soldering method, the step (B2) includes the steps of: (B21) monitoring welding parameters of the heating platform.
Drawings
FIG. 1 is a conventional flow diagram of a prior art solder paste soldering process.
Fig. 2A and 2B are schematic views of a jig body of a solder paste soldering apparatus and method according to a preferred embodiment of the invention.
Fig. 3 is a schematic view of spot soldering of solder paste soldering apparatus and method according to a preferred embodiment of the present invention.
Fig. 4 is another schematic view of solder paste soldering apparatus and method according to a preferred embodiment of the present invention.
Fig. 5 is a schematic view of a solder paste soldering apparatus and method according to a preferred embodiment of the present invention.
Fig. 6 is a schematic view of a capping process of a solder paste soldering apparatus and method according to a preferred embodiment of the present invention.
Fig. 7 is a modified embodiment of a jig body of a solder paste soldering apparatus and method according to a preferred embodiment of the present invention.
FIG. 8 is a schematic view of the overall process flow of a solder paste soldering apparatus and method according to a preferred embodiment of the present invention
Fig. 9 is a method block diagram of a solder paste soldering apparatus and method according to a preferred embodiment of the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
As can be seen from the background, in the existing camera module industry, the conventional process for welding modules to a panel assembly is shown in fig. 1, which first requires a worker to place the panel assembly on a jig platform. In order to ensure the positioning accuracy of the welding position, the jointed board components need to be placed in a certain direction or a certain position. After the jointed board components are placed, manual welding is carried out; after welding is completed, carrying out appearance full inspection on the welded jointed board part; and finally, taking the jointed board part welded with the module away from the jig platform.
As can be seen from the conventional process flow of the background art, the fundamental problem of the prior art is that the plate splicing components are fixed at stable positions by no fixing device in the process of swinging the plate splicing components in combination with the purely manual operation in fig. 1, so that the plate splicing components are always kept at the stable positions, and therefore, firstly, the possible problem is that the positions where the plate splicing components are arranged are deviated due to human factors, and the deviation is not easily corrected due to no reference or standard and is more dependent on the experience of workers; secondly, in the welding process, due to no fixing measures, the jointed board part can generate tiny displacement relative to the jig platform in the welding process, and the quality of the welding process is further unreliable; furthermore, during welding, manual welding has no reliable guarantee of the welding quality. Therefore, in the conventional process flow as a whole, the manual operation is the fundamental factor causing the position uncertainty or change.
Starting from the above problems, the conventional process flow can be improved in two main directions, namely, an external device is used for enhancing the fixing effect on the jointed board components, and the displacement of the jointed board components possibly generated in each step is reduced; on the other hand, the operation process, namely, the manual work in the operation process is replaced as far as possible, so that the manual judgment or welding work is reduced.
In view of external devices, for a common jig platform, since there is no coordinate reference of the placement position, and there is no certain blocking member, when an operator places the jointed board members according to experience, errors are likely to occur.
By comprehensively considering the two factors, if the position of the jointed board component is given by the device, the possible displacement of the jointed board component is limited, the orientation information of the flat board component does not need to be judged by the experience of an operator, and meanwhile, the movement of the jointed board component in the operation process is reduced, so that the problem of welding quality caused by the operation of placing a jig in the early stage can be avoided, which is one of the improvement directions of the conventional process flow.
Referring to fig. 2, a jig body 10 provided by the solder paste welding apparatus and method according to a preferred embodiment of the present invention is shown, wherein the jig body 10 has a limiting groove 11, and the limiting groove 11 is suitable for limiting a jointed board member 100. Furthermore, the top of the limiting groove 11 is communicated with the outside, and the front end of the limiting groove 11 is communicated with the outside. That is, the jointed board member 100 may be placed in the limiting groove 11 from the upper end of the limiting groove 11, or the jointed board member 100 may be slid into the limiting groove 11 along the limiting groove from the front end of the limiting groove 11.
Further, the opening width of the limiting groove 11 matches with the width of the plate member 100, thereby limiting the displacement of the plate member 100 in the width direction. Further, the rear end of the limiting groove 11 is closed by the jig body 10, so that the jointed board part 100 is limited from moving backwards.
That is to say, when an operator needs to place the jointed board component 100, the jointed board component 100 is placed in the limiting groove 11 of the jig body 10 only by a proper operation mode, so that the rear end of the jointed board component 100 is abutted to the jig body 10, and the jointed board component 100 is prevented from moving in the width direction and backwards due to the limiting effect of the limiting groove 11. The arrangement direction of the jigsaw jig 100 is judged without accurate experience of an operator in the whole arrangement process, and only the front end and the rear end of the jigsaw jig 100 need to be distinguished, and the jigsaw component 100 is arranged in the limiting groove 11 according to the direction of the limiting groove 11.
In other words, the plate members 100 can leave the limiting groove 11 from the upper end or front end of the limiting groove 11. When an operator needs to remove panel member 100, panel member 100 can be pulled forward or directly upward.
Therefore, the arrangement of the limiting groove 11 of the jig body 10 solves the problem of movement of the jointed board component 100 when the jointed board component is placed on a common jig platform, the position of the jointed board jig 100 is judged without excessive experience of an operator, and the position of the jointed board jig 100 placed in the limiting groove 11 is determined only by determining the position of the jig body 10, so that manual operation is reduced, errors caused by manual placement of the jointed board component are avoided, and displacement possibly generated by the jointed board component 100 in the subsequent operation process is prevented.
It should be noted that, in the forming manner of the limiting groove, the limiting groove 11 may be formed by being disposed on a platform jig, or the limiting groove 11 may be formed by disposing a blocking member on the platform jig. The platform jig is provided with the limiting groove 11, so that the application of raw materials can be reduced, the platform jig applied in the prior art can be transformed, and the utilization rate of the original jig is improved.
Continuing to consider another important aspect, a manual factor, which contributes to the deficiencies of the prior art. In view of this, there is a need to improve the welding process in this respect by replacing the manual work, and the manual work in the welding process mainly consists of two aspects, namely, a tin spot welding process, i.e., applying the welding material to the jig 100 and/or a jig 200; the other is a heat welding process of the welding material. According to the application of the preferred embodiment of the invention, the welding of the module PCB is mainly performed, and the high-temperature operation cannot be endured, so that the solder paste material is mainly adopted as the welding material. It is understood that the solder paste typically has a solder temperature in the range of about 170 to about 200 and the delivered solder position of the module 200 has a solder temperature in the range of about 160 to about 180, and according to a preferred embodiment of the present invention, the solder paste is selected to have a melting point of about 150, which is lower than the prior art solder materials, thereby achieving low temperature soldering with reduced thermal damage to the panels 100 and the module 200.
In the prior art, the tin dotting process is also realized by manual work of operators. Therefore, factors influencing the welding effect, such as the application amount of the welding material, the flatness of the applied welding material and the like, are uncertain due to artificial factors, and the problems of insufficient welding, uneven welding spots and the like are relatively easy to occur in the prior art.
Referring to fig. 3, a schematic diagram of a dispenser 20 for applying solder material in accordance with a preferred embodiment of the present invention is shown. The glue dispenser is used for applying welding materials to the jointed board component 100 and/or the module jig 200, so that a manual operation process is replaced by machine operation, and the welding materials refer to soldering fluxes or welding rods such as tin paste, and welding materials for welding such as metal welding rods, welding wires, metal powder, welding flux and gas.
The dispenser 20, the dispenser 20 includes a program control system for presetting relevant parameters of the tin dispensing process, such as the amount of tin dispensing and the setting of tin dispensing orientation. That is, before dispensing, the program control system presets dispensing parameters, so as to ensure the quality of the dispensing process, such as dispensing amount, flatness, etc.
Further, in the welding process, the control of the welding time and the welding temperature is an important factor influencing the welding quality, while in the prior art, the heating welding process is also completed through manual operation, and an operator judges the welding degree through experience and controls the welding temperature, the welding time and the like automatically. Therefore, the problem to be considered is how to reduce the manual work in the welding heating process, and the welding process is realized by the external equipment.
From the foregoing, it can be seen that, on the basis of the prior art, the limiting groove 11 is provided to limit the displacement of the jig for jointed boards 100, so as to improve the welding accuracy, but the problems existing in the heating welding process, such as the change of the heating mode, the control of the heating time and the temperature, etc., are not solved. Further understanding of the prior art, it is known that time-to-temperature control is operator controlled, which is a major factor in weld quality instability. Therefore, if the control of the heating temperature and the heating time is completed by controllable equipment, the manual operation can be replaced, thereby fundamentally improving the welding process quality.
Referring to fig. 2 and 4, according to a preferred embodiment of the present invention, the jig body 10 includes at least one heating platform 12 for heating the jointed board member 100, and the heating platform 12 is disposed in the limiting groove 11.
Furthermore, each heating platform 12 is independently protruded from the limiting groove 11 to form a plurality of independent supporting heating structures, and when the jointed board component 100 is limited in the limiting groove 11, the jointed board component 100 is supported and heated by the heating platforms 12. That is, during the heat welding process, the module 200 and the heating platform are respectively located on both sides of the jointed board component 100, and the direct manual heating mode in the prior art is changed into indirect heating, so that the module is prevented from being burnt.
Furthermore, the plurality of heating platforms 12 are independently disposed in the limiting groove 11, and a channel 13 is formed between two adjacent heating platforms 12 or the heating platform 12 and the jig body 10. In other words, the heating platform 11 and the channel 13 are disposed in the limiting groove 11 at an interval. Passageway 13 is linked together with the outside, and air passage keeps apart adjacently heating platform 12 makes heating platform 12 heats separately different positions of makeup part 100 forms relatively independent heating band, forms simultaneously and gets and put the space, provides operating position, and the operating personnel or robotic arm's of being convenient for operation follow spacing groove 11 is got and is put makeup part 100.
It should be mentioned that the heating platform 12 and the jig body 10 are made of different materials, and the jig body is made of a material with poor heat conductivity, so that the jointed board part 100 is convenient to limit and fix, and meanwhile, an operator is prevented from being scalded. The heating platform 12 is made of a material with good heat conductivity and good welding performance and a high melting point, such as a metal material, according to a preferred embodiment of the present invention, the heating platform 12 is made of a red copper material and has a high melting point and good welding performance.
It should be noted that the height of the limiting groove 11 of the jig body 10 is determined by the thickness of the jointed board member 200 and the height of the heating platform 12, that is, when the jointed board member 200 is placed on the heating platform 12, the jointed board member 100 can be limited in the limiting groove 11. Furthermore, the height of the limiting groove 11 may be greater than the sum of the thickness of the jointed board component 100 and the height of the heating platform 12, may be equal to the sum of the thickness of the jointed board component 100 and the height of the heating platform 12, and may be slightly smaller than the sum of the thickness of the jointed board component and the height of the heating platform 12 when a limiting condition is met.
It should also be mentioned that a plurality of heating platforms 12 are disposed in the limiting groove 11, each heating platform 12 forms a respective heating band, and can weld a plurality of modules 200 on one heating band at the same time, and simultaneously heat a plurality of heating bands, so that a plurality of modules 200 in a plurality of different areas can be welded to the jointed board component 100 at the same time. That is, each heating platform 12 can heat weld a plurality of modules 20, and a plurality of the heating platforms 12 heat up simultaneously, so as to realize the simultaneous quantitative heat welding of modules in different areas.
It should also be mentioned that according to a preferred embodiment of the present invention, each of the heating platforms 12 has a groove 121, the groove 121 is communicated with an external space, and the arrangement of the groove 121 reduces a heating area of the jointed board member 100 when the jointed board member is placed on the heating platform for heating, so as to improve a heating goal, reduce thermal shock to the jointed board member 100 and the module 200, reduce damage to the module, and improve stability of the module 200.
According to a preferred embodiment of the present invention, the jig body 10 further includes a control device 14 for monitoring and controlling the temperature and time of the welding process of the jointed board member 100 by the heating platform 12, which affect the welding quality. According to the preferred embodiment of the present invention, in the experimental verification process, before heating, the heating time of the heating platform 12 is set to 12s by the control device 14, and the preset heating temperature is set to 180 °.
Referring to fig. 6, according to a preferred embodiment of the present invention, the solder paste welding apparatus and method further provides a pressing device 30 for pressing the plate member 100 during the heat welding process, so that the plate member 100 and the heating platform 12 are heated in sufficient contact, thereby welding the module 200 to the plate member 100. The shape of the capping device 30 is adapted to the layout position of the module 200.
Referring to fig. 7, it is worth mentioning that the jointed board component 100 is provided with a plurality of pad positions 101 for providing the bonding positions of the module 200, and the pad positions 101 have good heat-conducting performance and good welding performance. The module 200 has at least one lead 201 for soldering to the land location 10 of the panel member 100. In other words, the bonding objects are the pad positions 101 of the jointed board part 100 and the pins 201 of the module 200 during the whole bonding process. In the above, the operation objects of the operations of spot soldering, heating, soldering, etc. with respect to the jigsaw component 100 and the module 200 are the pad position 101 of the jigsaw component 100 and the pin 201 of the module 200.
The heating platform 12 may be protruded in the limiting groove 11 to form a plurality of relatively independent supporting heating structures, that is, the jointed board component 100 is limited in the upper space formed by the plurality of heating platforms 12 and the limiting groove 11, and the heating platform may also be embedded in the jig body 10. Referring to fig. 5, which is a modified embodiment of the jig body 10 of the solder paste soldering apparatus and method according to a preferred embodiment of the present invention, the jig body 10 includes a plurality of heating platforms 12A, the heating platforms 12A are embedded into the jig body 10 at intervals, and form the limiting grooves 11A with the jig body 10.
Furthermore, the jig body 10 is provided with a channel 13A, the channel 13A is disposed below the limiting groove 11A and is communicated with the limiting groove 11A to provide an operating position, so that an operator or a mechanical arm can conveniently take and place the jointed board component 100 from the limiting groove 11A.
According to the above preferred embodiment of the present invention, the present invention further provides a solder paste soldering method, comprising the steps of:
(A) providing a dispensing machine 20 for dispensing tin on a jointed board component 100 and/or a module 200;
(B) providing a jig body 10, and heating and welding the jointed board part 100 and the module 200;
(C) inspecting the panels 100 and the modules 200; and
(D) the plate alignment member 100 welded with the die set 200 is taken.
In the step (a), the dispenser 20 is provided to replace the manual dispensing process in the existing process flow with machine dispensing, thereby reducing the adverse factors that the welding quality may be affected by uneven dispensing, inaccurate dispensing position, difficulty in controlling dispensing amount, and the like caused in the manual process.
Since the pad position 101 where each jigsaw component 100 needs to be soldered to the module 200 is determined, and the corresponding module 200 needs to be soldered to the corresponding pad position 101, in the step (a), it is necessary to complete the spot soldering of the predetermined position of the jigsaw component 100, that is, the spot soldering of the pad position 101. Therefore, the dispenser 20 needs to be set, and parameters such as the dispensing position and the dispensing amount of the dispenser 20 need to be set.
The step (a) further comprises the steps of: (A1) the program positions and adjusts the dispenser 20. That is, the dispenser 20 is programmed and debugged according to the pad positions 101 of the module 200 corresponding to the jointed board components 100.
The step (a1) is completed before the tin dotting process is performed.
In the step (B), the jig body 10 is first put into the jig 100, so that the jig 100 is heated by the heating platform 12. The step (B) comprises the following steps:
(B1) placing the jointed board part 100 into the limiting groove 11 of the jig body 10;
(B2) heating the heating platform 12 of the jig body 10; and
(B3) and placing the module 200 at the corresponding pad position 101 of the jointed board component 100.
It should be noted that, the execution contents in the steps (a) and (B) are not in a fixed sequence, that is, the plate splicing component 100 and/or the module 200 may be subjected to spot soldering, the glue dispenser 20 applies a soldering material to the plate splicing component 100 and/or the module 200, the plate splicing component 100 is placed on the heating platform 12 in the limiting groove 11 of the jig body 10, the module 200 is placed on the corresponding pad position 101 on the plate splicing component 100, and then the heating platform 12 is heated, and the module 200 is soldered to the plate splicing component 100.
It may also be a different execution step: firstly, placing the jointed board part 100 on the heating platform 12 in the limiting groove 11 of the jig body 10, so as to limit the jointed board part 100 on the limiting groove 11; then, tin dispensing is carried out on the jointed board component 100 and/or the module 200 through the glue dispenser 20; the heated platen 12 is then heated to heat weld the panel members 100 to the die set 200.
Or preheating the heating platform 12, placing the jointed board component 100 into the limiting groove 11 of the jig body 10, and performing tinning on the jointed board component 100 and/or the module 200 to complete the welding process.
That is, the tin-dotting process can be completed in an environment outside the jig body 10, or can be completed when the jig plate component 100 is placed in the limiting groove 11 of the jig body 10. The heating of the heating platform 12 may be started before the plate member 100 is not placed in the limiting groove 11, or may be started after the plate member 100 is placed in the limiting groove 11. The specific implementation process can be arranged according to specific needs. Therefore, there is no definite sequence between the step (a) and the steps (B1), (B2) and (B3), and the sequence can be arranged according to the needs of the production process.
Furthermore, in order to make the jointed board member 100 and the heating platform 12 fully contact and be heated well, heat is conducted to the pins of the module 200 through the pads, so that the module 200 is welded to the jointed board member 100, and a pressing cover 30 is provided for pressing the jointed board member 100 to ensure that the pad positions 101 of the jointed board member 100 are tightly attached to the heating platform 12.
The step (B) further comprises the steps of: (B4) a press cap 30 is provided to press the panel members 100. The step (B4) is performed after the steps (B1), (B2) and (B3).
In step (B2), it is necessary to monitor and control the welding parameters of the heating platform 12 and the jointed board members 100, such as heating time and temperature, to control the welding quality. Thus, the step (B2) includes the steps of: (B21) the welding parameters of the heated platen 12 are monitored. Welding parameters such as heating time and heating temperature.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (14)
1. A solder paste welding device for welding a pin of a module and a pad of a jointed board component, comprising:
a glue dispenser for applying welding material to the bonding pads of the jointed board components;
the jig body is used for heating the jointed board component so that the pins of the module are welded on the bonding pads of the jointed board component;
the jig body is provided with a limiting groove, the top and the front of the limiting groove are communicated with the outside, and the limiting groove is suitable for limiting the jointed board part in the jig body; the jig body is provided with a plurality of heating platforms which are convexly arranged in the limiting grooves so as to form a channel between the adjacent heating platforms and/or between the heating platforms and the jig body, wherein the heating platforms are suitable for supporting the jointed board component and allowing the heating platforms to form a supporting heating structure so as to heat the jointed board component from the bottom of the jointed board component, the jig body is made of heat insulating materials, each heating platform is respectively provided with a groove, the grooves are communicated with the external space, and the grooves of the heating platforms face the jointed board component; and
and the pressing cover device is used for pressing the jointed board component in the heating welding process so that the jointed board component and the heating platform are fully contacted and heated.
2. The solder paste soldering apparatus according to claim 1, wherein the height of the heating stage is smaller than the depth of the limiting groove.
3. The solder paste soldering apparatus according to claim 1, wherein the heating stage is made of red copper.
4. The solder paste soldering apparatus according to claim 1, wherein the jig body includes a control device for monitoring a heating time and a heating temperature of the heating stage.
5. A solder paste welding method is used for welding a pin of a module and a bonding pad of a jointed board component, and is characterized by comprising the following steps:
(A) providing a glue dispenser, and dispensing tin on the bonding pads of the jointed board component and/or the pins of the module;
(B) providing a jig body, and heating and welding the bonding pad of the jointed board part and the pin of the module;
(C) checking the jointed boards and the module;
(D) taking the jointed board part welded with the module, wherein the jig body is provided with a limiting groove, the top and the front of which are communicated with the outside, and the jig body is suitable for limiting the jointed board part in the limiting groove; the jig body is provided with a plurality of heating platforms which are convexly arranged in the limiting grooves so as to form a channel between the adjacent heating platforms and/or between the heating platforms and the jig body, wherein the heating platforms are suitable for supporting the jointed board component and allowing the heating platforms to form a supporting heating structure so as to heat the jointed board component from the bottom of the jointed board component, the jig body is made of heat insulating materials, each heating platform is respectively provided with a groove, the grooves are communicated with the external space, and the grooves of the heating platforms face the jointed board component; and
(E) and pressing the jointed board component by a pressing cover device in the heating welding process so that the jointed board component and the heating platform are fully contacted and heated.
6. The solder paste soldering method according to claim 5, (A) further comprising the steps of: (A1) and program positioning and adjusting the dispenser.
7. The solder paste soldering method according to claim 5 or 6, wherein the height of the heating platform is smaller than the depth of the limiting groove.
8. The solder paste soldering method according to claim 5 or 6, wherein the heating stage is made of red copper.
9. The solder paste soldering method according to claim 5 or 6, wherein the jig body includes a control device for monitoring the heating time and the heating temperature of the heating stage.
10. Solder paste soldering method according to claim 5 or 6, wherein the dispenser comprises an adjustment device for adjusting the position, amount and flatness factors of the applied solder material to the parts of the panels.
11. The solder paste soldering method according to claim 5, wherein the step (B) further comprises the steps of:
(B1) placing the jointed board component into the limiting groove of the jig body;
(B2) heating the heating platform of the jig body; and
(B3) and placing the module at the position of the bonding pad corresponding to the jointed board component.
12. The solder paste soldering method according to claim 11, wherein there is no definite order between the step (a) and the steps (B1), (B2) and (B3).
13. The solder paste soldering method according to claim 11, wherein the step (E) is performed after the steps (B1), (B2) and (B3).
14. The solder paste soldering method according to claim 13, said step (B2) comprising the steps of: (B21) monitoring welding parameters of the heating platform.
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| CN107199381A (en) * | 2017-06-22 | 2017-09-26 | 中科迪高微波系统有限公司 | A kind of process of SMP connectors welding |
| CN108381004A (en) * | 2018-05-15 | 2018-08-10 | 安徽精度光学科技有限公司 | A kind of camera module VCM welds fume extractor manually |
| CN108581121A (en) * | 2018-06-26 | 2018-09-28 | 付云 | A kind of auxiliary tool that electronic component is fixed on to PCB circuit board welding |
| CN112752089B (en) * | 2019-10-30 | 2022-08-16 | 宁波舜宇光电信息有限公司 | Module detection equipment and jointed board for carrying module array |
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