A kind of photovoltaic module of built-in intelligence chip
Technical field
The present invention relates to solar photovoltaic assembly technical field, chip is optimized in particular to a kind of built-in power
Intelligent photovoltaic component.
Background technology
The photovoltaic intelligent component of prior art is mostly to use intelligent wiring box, is chased after to carry out power to photovoltaic module
Track and optimization, intelligent chip are arranged in line box.The shortcoming of said structure:Line box volume is big, and materials are more, cost of idleness, increases
Plus connection line, power loss is more on circuit.For drawbacks described above, the existing photovoltaic group of built-in chip scheme in the prior art
Part product, but such product chip package in component, when wafer damage, it is impossible to individually chip is changed, once
Wafer damage, will cause whole component to be scrapped.Simultaneously when chip thickness is thicker, higher is required to backboard, it is easy to backboard
Damage is caused, reliability and the life-span of subsequent components is influenceed, crackle occurs in such as backboard, occurs electric leakage etc. and safety is impacted.
Particularly when backboard is glass, it is easy to cause back of the body glass rupture, so that built-in chip scheme can not be used in double glass groups
In part.
If Authorization Notice No. is CN104078524A, a kind of entitled Chinese patent of the intelligent photovoltaic component of built-in chip
Application, it discloses a kind of intelligent photovoltaic component of built-in chip, including safety glass, EVA layer, backboard and solar battery sheet
Layer, solar cell lamella both sides set side of the EVA layer away from solar cell lamella at EVA layer, two to set tempering respectively
Glass and backboard;Also include being arranged at solar cell lamella close to the intelligent chip of the side of safety glass and be arranged at backboard
Split diode-less wiring leading-out terminal away from EVA layer side, the solar cell lamella sets at least a piece of solar energy
Cell piece.Although the present patent application is also intelligent chip in the intelligent photovoltaic component of built-in chip, but its structure by complete
It is encapsulated in backboard, when intelligent chip is damaged, it is impossible to be individually replaced chip.
Further, the backboard in the structure of foregoing invention application is provided with stem, and the wiring of split diode-less is drawn
Terminal is welded on stem;Stem passes through backboard and EVA layer, is then connected with solar cell lamella.And intelligent chip
It is electrically connected further through busbar and solar battery sheet, such line construction is more complicated.
The content of the invention
Component is built in it is an object of the invention to provide a kind of intelligent chip, intelligent chip can be individually replaced too again
Positive energy component.And intelligent chip is both directly electrically connected by busbar with solar cell string, is turned up further through wherein one-level
Busbar is directly electrically connected with the pad in terminal box, is reduced connection line, is reduced power loss.
What the present invention was realized in:A kind of photovoltaic module of built-in intelligence chip, including front glass panel, solar cell
Chip arrays, backboard and the line box being arranged on backboard, solar cell chip arrays include some solar cells being connected in series
String, it is characterised in that:Intelligent chip is connected between the two string battery strings for needing bypass;On the both positive and negative polarity of the intelligent chip respectively
One section of busbar is welded in advance, wherein the busbar for the pole being connected with line box is long busbar, long busbar can be turned up simultaneously
Lead to outside component, be attached with line box positive/negative;During component stack, the intelligent chip of busbar will be welded in advance
It is connected to by polarity between the two string battery strings for needing to bypass;One end of long busbar has been welded in advance, and long busbar is turned up and drawn
Go out to outside component, for being attached with line box positive/negative;The two string battery strings for needing to bypass is respectively positioned at components
Each two strings battery strings of arranged on left and right sides;One perforate is set at the backboard of intelligent chip correspondence position;The intelligent chip is upward
The busbar drawn after turning up is exported from tapping;The line box is arranged in perforate, for sealing perforate.
A kind of photovoltaic module of built-in intelligence chip of the present invention, in addition to several be arranged on centre in the middle of intelligent core
Piece.
Busbar and light on a kind of photovoltaic module of built-in intelligence chip of the present invention, the both positive and negative polarity of the intelligent chip
The busbar same material that volt component is used.
It is provided with and is rolled over intelligent chip busbar in a kind of photovoltaic module of built-in intelligence chip of the present invention, the line box
The busbar pad of origin or beginning connection.
The perforate size set at a kind of photovoltaic module of built-in intelligence chip of the present invention, the component backboard can make
Chip is completely exposed, while line box can be covered completely after installing.
A kind of photovoltaic module of built-in intelligence chip of the present invention, the line box includes positive pole box body, negative pole box and centre
Box body.
A kind of photovoltaic module of built-in intelligence chip of the present invention, the backboard uses glass plate.
What the present invention was realized has the beneficial effect that:
1st, the position of intelligent chip or diode, both positive and negative polarity are placed due to that need not be reserved built in intelligent chip, in line box
The volume of line box can be made small, and middle line box be due to that need not draw lead-out wire and be welded outside component, can be with
A plastic sheet is only needed to, therefore can greatly save line box materials
2nd, intelligent chip circuit/diode need not be designed in line box, the circuits such as the copper sheet of connection intelligent chip are saved,
The loss of power in line box is reduced, the cooling requirements of line box can be greatly reduced, and line box volume can further reduce.
3rd, built-in intelligent chip, is welded a bit of busbar, component stack on the two poles of the earth of intelligent chip in advance
When busbar in busbar and component is connected, operation is simple and reliable.
4th, after line box reduces, the casting glue consumption of silica gel and sealing required for corresponding and component bonding also can be notable
Reduce.
5th, hole is provided with chip on backboard/glass, chip will not cause hole-opening on damage, glass to backboard so that
Using being possibly realized in solar double-glass assemblies;If intelligent chip is damaged simultaneously, it is only necessary to pull down line box, changing intelligent chip is
Can, it is not necessary to change box body.
In summary, the cost of terminal box can decline to a great extent, line box lower power consumption, so that component holistic cost drops
It is low, while using battery tandem MPPT power optimizations, component generated energy can be obviously improved.
Brief description of the drawings
Fig. 1 is the intelligent chip pretreatment schematic diagram of the photovoltaic module of built-in intelligence chip of the present invention;
Fig. 2 is the structural representation of the photovoltaic module of built-in intelligence chip of the present invention;
Fig. 2A is the enlarged drawing at intelligent chip 8 in Fig. 2;
Fig. 2 B are the enlarged drawings at intelligent chip 9 in Fig. 2;
Fig. 2 C are the enlarged drawings at intelligent chip 10 in Fig. 2;
Fig. 3 be built-in intelligence chip of the present invention photovoltaic module be solar double-glass assemblies when schematic rear view;
Fig. 3 A are enlarged drawings at A in Fig. 3;
Fig. 3 B are enlarged drawings at B in Fig. 3;
Fig. 4 be built-in intelligence chip of the present invention photovoltaic module be common border component when schematic rear view.
Embodiment
Embodiment 1, referring to Fig. 1~Fig. 4.
A kind of photovoltaic module of built-in intelligence chip is present embodiments provided, as shown in Fig. 2 including front glass panel 3, the sun
Can battery chip arrays 6, backboard 5, front and rear two layers of encapsulating material 4 and the line box 7 being arranged on backboard, solar cell chip arrays 6
Including some solar cell strings being connected in series.Intelligent chip 8, the and of intelligent chip 9 are connected between every two strings battery strings
Intelligent chip 10.Wherein intelligent chip 8 and intelligent chip 10 are connected between original two string battery strings for carrying out bypass connection.Intelligence
Chip 9 is middle intelligent chip, and it can be one or more to design middle intelligent chip according to component lines.
As shown in figure 1, being pre-processed to each intelligent chip, 1 is tin-coated copper strip in figure, and 2 be intelligent chip.Intelligence
Chip 2 includes left chip, intermediate chip and right chip.The two poles of the earth of intelligent chip are plated with one section respectively in advance before component stack
Tin copper strips is welded, and welding process manufacturer can also be made by intelligent chip or other foundries complete.Each photovoltaic group
Part has a left chip (i.e. intelligent chip 8), a right chip (i.e. intelligent chip 10) and several intermediate chip (intelligent cores
Piece 9) constitute.The left end of left chip (i.e. intelligent chip 8) welds one section and slightly long tin-coated copper strip and turned up, for pass backboard and
Terminal box is attached;The right-hand member of right chip (i.e. intelligent chip 10) welds one section of tin-coated copper strip slightly grown and turned up, for wearing
Go out backboard and terminal box is attached.Intermediate chip (intelligent chip 9) if the two poles of the earth the preceding paragraph tin-coated copper strip is then respectively welded
, without turning up.Busbar (i.e. tin-coated copper strip) and confluxing that photovoltaic module is used on the both positive and negative polarity of the intelligent chip
Bar same material.
During component stack, the intelligent chip that busbar has been welded in advance is connected to the two string electricity for needing to bypass by polarity
Between the string of pond;One end of longer busbar has been welded in advance, then this section of bus bar grown is turned up outside extraction component, used
It is attached in line box positive/negative.Distinguish at the backboard of intelligent chip 8, intelligent chip 9 and the correspondence position of intelligent chip 10
One perforate 11 is set.The size of the perforate 11 coordinates with the size of corresponding line box, i.e., described line box can cover the back of the body after installing
Perforate 11 on plate 5.
When component is laminated, the busbar drawn after being turned up on intelligent chip 8 and intelligent chip 10 is exported at perforate 11;Together
When, correspond to be provided with the line box above perforate and turn up the busbar pad that end is connected with intelligent chip busbar, so that real
The connection of existing intelligent chip and line box.The line box includes positive pole box body, negative pole box body and middle box body.
A kind of backboard 5 of the photovoltaic module of built-in intelligence chip of the present invention can use glass plate, the signal of its backside structure
Figure is as shown in Figure 3.Line box in Fig. 3 is not installed also, from enlarged drawing at enlarged drawing at Fig. 3 A and B (i.e. Fig. 3 A and Fig. 3 B)
As can be seen that correspondence position is to be installed with intelligent chip in perforate, so when intelligent chip is damaged, as long as taking line box apart, digging
Open the glue of tapping, you can easily change chip.Certainly during actual implementation, backboard 5 can also be outlined using common backboard
Structure, as shown in figure 4, other structures or the same.