CN105977221B - Air-tight packaging structure and packaging method - Google Patents
Air-tight packaging structure and packaging method Download PDFInfo
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- CN105977221B CN105977221B CN201610280869.5A CN201610280869A CN105977221B CN 105977221 B CN105977221 B CN 105977221B CN 201610280869 A CN201610280869 A CN 201610280869A CN 105977221 B CN105977221 B CN 105977221B
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- support plate
- cavity
- moulding bodies
- type component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of air-tight packaging structure and packaging methods.The encapsulating structure includes：First support plate；First moulding bodies are formed as annular, are arranged in the upper surface of the first support plate, and cavity is formed with the first support plate；Second support plate is arranged on the first moulding bodies, and covers cavity；M cavity package type component, it is contained in cavity, wherein, M1 cavity package type component is arranged in the upper surface of the first support plate, M2 cavity package type component is arranged in the lower surface of the second support plate, each cavity package type component is electrically connected with the wire structures on the support plate of place, M >=1, and M=M1+M2；Sealant covers the first surface region of the first support plate and surrounds the outer surface of the first moulding bodies and the second support plate, first surface region be the first support plate upper surface in the surface region that is exposed；And second moulding bodies, it is covered on sealant.Thus, it is possible to realize the air-tight packaging with cavity at lower cost.
Description
Technical field
The present invention relates to air-tight packaging fields, and in particular, to a kind of air-tight packaging structure and packaging method.
Background technology
System in package (System-in-Package, SiP) is a kind of general designation of packaging method, international semiconductor route
Scheme (ITRS) was to the definition of SiP in 2011：System in package is to be integrated in multiple active devices with different function
In one packaging body, single packaging body can provide the multi-functional of a system or subsystem.SiP can be selectively
Including various components.In these components, some components need to carry out cavity package, such as MEMS (MEMS)
Device.Meanwhile some components require air-tight packaging to need the inner cavity to packaging body for the SiP for including such component
Carry out the processing of air-tightness.Currently, air-tight packaging relies primarily on Metal Packaging technology or ceramic packaging technology.With electronics row
The development of industry, consumer to electronic product while requiring short, small, light, thin, it is also desirable to be realized with a low cost single Department of Electronics
The functional diversities of system.And currently, temporarily be also difficult to find that be of relatively low cost, the packaging method that fabrication cycle is shorter.
Invention content
The object of the present invention is to provide a kind of air-tight packaging structure and packaging methods, to realize band cavity at lower cost
Air-tight packaging.
The present invention provides a kind of air-tight packaging structure, which includes：First support plate；First moulding bodies are formed
For annular, it is arranged in the upper surface of first support plate, and cavity is formed with first support plate；Second support plate is arranged in institute
It states on the first moulding bodies, and covers the cavity；M cavity package type component, is contained in the cavity, wherein M1
Cavity package type component is arranged in the upper surface of first support plate, and M2 cavity package type component is arranged described second
The lower surface of support plate, each cavity package type component are electrically connected with the wire structures on the support plate at place, M >=1, and M
=M1+M2；Sealant covers the first surface region of first support plate and surrounds first moulding bodies and described second
The outer surface of support plate, wherein the first surface region be first support plate upper surface in the surface region that is exposed；With
And second moulding bodies, it is covered on the sealant.
Optionally, second support plate is embedded into the upper surface of first moulding bodies.
Optionally, M1 >=1, M2 >=1；Also, the encapsulating structure further includes：First conducting connecting part, connection described the
The wire structures of the wire structures of two support plates and first support plate, so that the M1 cavity package type component and the M2
Electric interconnection between a cavity package type component.
Optionally, first conducting connecting part is arranged in the cavity；Alternatively, the shape on first moulding bodies
The upper surface of first moulding bodies described in Cheng Youcong runs through the through-hole of first moulding bodies, first conducting connecting part to lower surface
It is filled in the through-hole.
Optionally, first conducting connecting part includes at least one of following：Conductive column, conductive bump, conducting sphere,
Conductive pin.
Optionally, which further includes：N number of non-cavity encapsulation type component, is arranged in the upper of first support plate
Surface, each non-cavity encapsulation type component are electrically connected with the wire structures on first support plate, also, described first
Moulding bodies cover N number of non-cavity encapsulation type component, to carry out molding envelope to N number of non-cavity encapsulation type component
Dress, wherein N >=1.
Optionally, the sealant is metal sealing layer.
Optionally, it is laid on the lower surface of first support plate and is electrically connected with the wire structures on first support plate
The second conducting connecting part, second conducting connecting part with external electrical component for being electrically connected.
The present invention also provides a kind of airtight packaging method, which includes：The cloth on the upper surface of the first support plate
If M1 cavity package type component and/or the M2 cavity package type component of laying on the upper surface of the second support plate, and make
Each cavity package type component is electrically connected with the wire structures on the support plate at place, wherein M=M1+M2, and M >=1；
It is molded on the upper surface of first support plate, forms the first moulding bodies of annular, first moulding bodies and described the
One support plate forms cavity, wherein when having laid the M1 cavity package type component on the upper surface of first support plate
When, the M1 cavity package type component is accommodated in the cavity；Second support plate is tipped upside down on into first mould
On plastomer, to cover the cavity, and to work as and laid the M2 cavity package on the upper surface of second support plate
When type component, the M2 cavity package type component is accommodated in the cavity；Sealant is laid, so that the sealing
Layer covers the first surface region of first support plate and surrounds the outer surface of first moulding bodies and second support plate,
The wherein described first surface region be first support plate upper surface in the surface region that is exposed；And in the sealant
On molded, the second moulding bodies are formed, so that second moulding bodies cover the sealant.
Optionally, described to tip upside down on second support plate on first moulding bodies, the step of to cover the cavity
Including：Second support plate is tipped upside down on first moulding bodies, and second support plate is made to be embedded into first molding
In the upper surface of body, to cover the cavity.
Optionally, M1 >=1, M2 >=1；Also, the packaging method further includes：The first conducting connecting part is laid, is made described
One end of first conducting connecting part is electrically connected with the wire structures of first support plate, the wiring of the other end and second support plate
Structure is electrically connected, so that electrical mutual between the M1 cavity package type component and the M2 cavity package type component
Even.
Optionally, the first conducting connecting part of the laying, the one end and described first for making first conducting connecting part carry
The step of wire structures of plate are electrically connected, and the other end is electrically connected with the wire structures of second support plate include：By described first
Conducting connecting part is arranged in the cavity, and makes the wire bond of one end and first support plate of first conducting connecting part
Structure is electrically connected, and the other end is electrically connected with the wire structures of second support plate；Alternatively, the first conducting connecting part of the laying, makes
One end of first conducting connecting part is electrically connected with the wire structures of first support plate, the other end and second support plate
Wire structures be electrically connected the step of include：First moulding bodies are punched, on first moulding bodies formed from
The upper surface of first moulding bodies runs through the through-hole of first moulding bodies to lower surface；And by first conducting connecting part
It is filled into the through-hole, so that one end of first conducting connecting part is electrically connected with the wire structures of first support plate,
The other end is electrically connected with the wire structures of second support plate.
Optionally, first conducting connecting part includes at least one of following：Conductive column, conductive bump, conducting sphere,
Conductive pin.
Optionally, which further includes：N number of non-cavity encapsulation type member is laid on the upper surface of first support plate
Device, and each non-cavity encapsulation type component is made to be electrically connected with the wire structures on first support plate, wherein N >=
1；And described the step of being molded on the upper surface of first support plate, forming the first annular moulding bodies, includes：?
It is molded on the upper surface of first support plate, forms the first moulding bodies of annular, so that first moulding bodies cover institute
N number of non-cavity encapsulation type component is stated, to carry out molded packages to N number of non-cavity encapsulation type component.
Optionally, the laying sealant, so that the sealant covers the first surface region, simultaneously of first support plate
The step of outer surface for surrounding first moulding bodies and second support plate includes：Metal sealing layer is laid, so that the gold
Belong to sealant to cover the first surface region of first support plate and surround the outer of first moulding bodies and second support plate
Surface.
Optionally, which further includes：The second conducting connecting part is laid on the lower surface of first support plate, and
Second conducting connecting part is set to be electrically connected with the wire structures on first support plate, wherein second conducting connecting part
For being electrically connected with external electrical component.
Through the above technical solutions, the first moulding bodies, which may be used, forms the encapsulating structure with cavity, that is, use plastic seal
Dress technology realizes cavity package.Plastic Package significantly reduces packaging cost compared to Metal Packaging and ceramic package, and
The technique of Plastic Package is relatively easy, and flexibility bigger, therefore, can shorten the manufacturing cycle of entire encapsulating structure.And
And in the forming process of cavity, the second support plate can form three-dimensional knot simultaneously as the upper cover of cavity and component carrier
Structure, it is thereby achieved that being made full use of to infrastructure resource.In addition, by sealant and the second moulding bodies, may be implemented secondary
Molded packages further enhance the reliability of system so as to ensure the air-tightness of the cavity formed by moulding material.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Description of the drawings
Attached drawing is to be used to provide further understanding of the present invention, an and part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the schematic diagram for the air-tight packaging structure that a kind of embodiment according to the present invention provides.
Fig. 2 is the schematic diagram for the air-tight packaging structure that another embodiment according to the present invention provides.
Fig. 3 is the schematic diagram for the air-tight packaging structure that another embodiment according to the present invention provides.
Fig. 4 is the schematic diagram for the air-tight packaging structure that another embodiment according to the present invention provides.
Fig. 5 a to Fig. 5 c show that the laying mode of the first conducting connecting part of different embodiments according to the present invention is shown
It is intended to.
Fig. 6 is the schematic diagram for the air-tight packaging structure that another embodiment according to the present invention provides.
Fig. 7 is the schematic diagram for the air-tight packaging structure that another embodiment according to the present invention provides.
Fig. 8 a to Fig. 8 f are the process flow charts for the airtight packaging method that a kind of embodiment according to the present invention provides.
Fig. 9 is the moulding process schematic diagram that another embodiment according to the present invention provides.
Figure 10 is the process flow chart for the first conducting connecting part of laying that a kind of embodiment according to the present invention provides.
Figure 11 a to Figure 11 b are the works for the first conducting connecting part of laying that another embodiment according to the present invention provides
Skill flow chart.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
In the present invention, in the absence of explanation to the contrary, the noun of locality used such as " upper and lower, bottom, top " typically exists
The case where encapsulating structure normal use provided by the invention, is undefined, specifically can refer to drawing side shown in Fig. 1 to Figure 11 b
To.It should be noted that these nouns of locality are served only for illustrating the present invention, it is not intended to restrict the invention.
Fig. 1 is the schematic diagram for the air-tight packaging structure that a kind of embodiment according to the present invention provides.As shown in Figure 1,
The encapsulating structure 100 may include：First support plate 101, wherein organic substrate, ceramic base may be used in first support plate 101
Plate or lead frame make, and can be made as needed of different materials.Preferably, first support plate
101 may be used ceramic substrate or lead frame to make.Alternatively, first support plate 101 or printed circuit board
(PCB).In addition, the size and thickness of support plate can be set according to the difference of technique and actual demand, for example, support plate
Size can be differed from several millimeters to several centimetres, and the thickness of support plate can be differed from hundreds of microns to several millimeters.
In addition, as shown in Figure 1, the encapsulating structure 100 can also include：First moulding bodies 103 are arranged in the first support plate
101 upper surface 101a, and form cavity 104 with the first support plate 101.
In the present invention, the material of the first moulding bodies 103 can be moulding compound.Illustratively, the material of moulding bodies 103 can be with
Using epoxy resin (Epoxy plastic).Preferably, polymeric liquid crystal copolymer (liquid crystalline can be used
Polymers, LCP) material, it is more preferable that water vapor seal fills the more common moulding compound of characteristic.
First moulding bodies 103 can be formed as annular, in this way, when carrying out mould on the upper surface 101a of the first support plate 101
It is moulding at moulding bodies 103 after, cavity 104 can be formed between the moulding bodies 103 and the first support plate 101, and moulding bodies 103 are made
For four walls of cavity 104.
In addition, as shown in Figure 1, the encapsulating structure 100 can also include the second support plate 105, setting is in the first moulding bodies 103
On, and cover cavity 104.Wherein, which may be used organic substrate, ceramic substrate or lead frame to make
Make, and can be made as needed of different materials.Alternatively, second support plate 105 or printed circuit board
(PCB).In addition, the size and thickness of support plate can be set according to the difference of technique and actual demand, for example, support plate
Size can be differed from several millimeters to several centimetres, and the thickness of support plate can be differed from hundreds of microns to several millimeters.In addition, second carries
Plate 105 can cover the cavity 104, so that cavity 104 is formed as closed cavity, to realize cavity package.
In addition, as shown in Figure 1, the encapsulating structure 100 can also include：M cavity package type component, is contained in cavity
In 104.Wherein, M1 cavity package type component can be arranged on the upper surface 101a of the first support plate 101, M2 cavity envelope
Dress type component can be arranged on the lower surface 105a of the second support plate 105, the load of each cavity package type component and place
Wire structures electrical connection on plate, M >=1, and M=M1+M2.
In the present invention, the type of the component in encapsulating structure 100 can be divided into three classes：The first kind is must to carry out sky
The component of chamber encapsulation, the second class is the component that cannot be carried out cavity package, must carry out molded packages, and third class is both may be used
The component of molded packages can be carried out to carry out cavity package again, wherein be directed to the third class component, can be regarded specific
Design requirement come determine be on earth use cavity package or molded packages.In the present invention, by above-mentioned first kind component with
And it is determined according to design requirement in above-mentioned third class component and the component for carrying out cavity package is needed to be referred to as " cavity package type
Component ", in addition, by needing to carry out according to design requirement determination in above-mentioned second class component and above-mentioned third class component
The component of molded packages is referred to as " non-cavity encapsulation type component ".
For example, as shown in Figure 1, the encapsulating structure 100 may include four cavity package type components, respectively cavity seals
Dress type component 102a, 102b, 102c, 102d, wherein this four cavity package type components are arranged on the first support plate 101
Upper surface 101a on, and be electrically connected with the wire structures 101b on the first support plate 101.Alternatively, for example, as shown in Fig. 2, envelope
Assembling structure 100 may include six cavity package type components, respectively cavity package type component 102a, 102b, 102c,
102d, 102e, 102f, wherein cavity package type component 102a, 102b, 102c, 102d are arranged on the first support plate 101
It on the 101a of upper surface, and is electrically connected with the wire structures 101b on the first support plate 101, cavity package type component 102e, 102f
It is arranged on the lower surface 105a of the second support plate 105, and is electrically connected with the wire structures 105b on the second support plate 105.Alternatively,
For example, as shown in figure 3, the encapsulating structure 100 may include two cavity package type components, respectively cavity package type member device
Part 102e, 102f, wherein cavity package type component 102e, 102f are arranged on the lower surface 105a of the second support plate 105,
And it is electrically connected with the wire structures 105b on the second support plate 105.
In the present invention, component included in the M cavity package type component can be logic chip, it is passive
The component of the different function such as device or MEMS.These components can be electrically connected with the wire structures on the support plate at place, with
Realize electric interconnection.
For cavity package type component, can be electrically connected in several ways with wire structures to realize.For example,
It is laid with pad on the upper surface 101a of one support plate 101, which is electrically connected with wire structures 101b, and later, component can be with
It is electrically connected, is electrically connected with wire structures 101b with realizing, in Fig. 1 with pad using technologies such as upside-down mounting connection, lead connections
Shown in cavity package type component 102a, 102b.In addition, the mutual of 3-dimensional multi-layered stacking form can also be formed between component
Even, for example, cavity package type component 102c, 102d as shown in Figure 1.In addition, component can be the form of bare die, or
Person is using the component after encapsulation, wherein packing forms can be varied, such as SOP (Small Out-Line
Package, small outline packages), QFN (Quad Flat No-lead Package, quad flat non-pin package), BGA
Forms such as (Ball Grid Array, welded ball array encapsulation).
For another example being laid with pad on the lower surface 105a of the second support plate 105, which is electrically connected with wire structures 105b
It connects, later, component can be electrically connected using technologies such as upside-down mounting connection, lead connections with pad, with realization and wire structures
105b is electrically connected.In addition, the interconnection of 3-dimensional multi-layered stacking form can also be formed between component.In addition, component can be
The form of bare die, or using the component after encapsulation, wherein packing forms can be varied, such as SOP, QFN, BGA etc.
Form.
When forming the first moulding bodies 103, molded in a manner of surrounding M1 cavity package type component, this
Sample, can be by M1 cavity package type component accommodation in cavity 104.The size of cavity 104 can carry out sky as needed
Depending on the quantity and size of the component of chamber encapsulation.In addition, when the second support plate 105 to be laid on the first moulding bodies 103, it can
To tip upside down on the second support plate 105 on first moulding bodies 103, in this way, cavity 104 on the one hand can be covered, on the other hand can
By M2 cavity package type component accommodation in cavity 104, to realize the cavity to whole M cavity package type components
Encapsulation.
In addition, as shown in Figure 1 to Figure 3, which can also include：Sealant 106 covers the first support plate 101
First surface region 101c and surround the outer surfaces of the first moulding bodies 103 and the second support plate 105, wherein first surface region
101c be the first support plate 101 upper surface 101a in the surface region that is exposed.In addition, the encapsulating structure 100 can also include：
Second moulding bodies 107, are covered on sealant 106.In this way, by sealant 106 and the second moulding bodies 107, can realize
Secondary molded packages further enhance the reliable of system so as to ensure the air-tightness of the cavity 104 formed by moulding material
Property.
Since sealant 106 and the second moulding bodies 107 do not cover the lower surface of the first support plate 101, the first support plate
101 itself should reach the requirement of air-tightness.Thus, it is preferable that the first support plate 101 is made using ceramic substrate or lead frame
Make.
In conclusion through the above technical solutions, the first moulding bodies, which may be used, forms the encapsulating structure with cavity, that is,
Cavity package is realized using plastic package technology.Plastic Package significantly reduces envelope compared to Metal Packaging and ceramic package
This is dressed up, and the technique of Plastic Package is relatively easy, and therefore flexibility bigger can shorten entire encapsulating structure
Manufacturing cycle.Also, in the forming process of cavity, the second support plate can simultaneously as the upper cover of cavity and component carrier,
Three-dimensional structure is formed, it is thereby achieved that being made full use of to infrastructure resource.In addition, by sealant and the second moulding bodies, it can
To realize secondary molded packages, so as to ensure the air-tightness of the cavity formed by moulding material, system is further enhanced
Reliability.
In order to facilitate the installation of, optionally, as shown in figure 4, the second support plate 105 can be embedded into the upper of the first moulding bodies 103
In the 103a of end face.In this embodiment, the top of the first moulding bodies 103 has step-like notch.By by the second support plate
105 are embedded into the upper surface 103a of the first moulding bodies 103, can improve the mechanical performance of encapsulating structure 100, and the side of installation
Just, the seal of cavity 104 can be enhanced.
In the present invention, as described above, may include being arranged in the upper surface of the first support plate 101 in encapsulating structure 100
M1 cavity package type component on 101a, and M2 cavity being arranged on the lower surface 105a of the second support plate 105 seal
Dress type component.Optionally, M1 >=1, M2 >=1.In this case, in order to realize that three-dimensional systematic encapsulates, optionally, the envelope
Assembling structure 100 can also include：First conducting connecting part 108 connects the wire structures 105b and the first support plate of the second support plate 105
101 wire structures 101b, so that electric interconnection between M1 cavity package type component and M2 cavity package type component,
To realize that three-dimensional systematic encapsulates.
Through the above technical solutions, electronics member can be laid with by being located on two pieces of support plates at the first moulding bodies both ends
Device, and can realize that electric interconnection therefore can by the first conducting connecting part between the electronic component on two pieces of support plates
To realize the three-dimensional system level packaging structure with cavity.The encapsulating structure has the characteristics that interconnection distance is short, reliability is high.Pass through
Three-dimensional system level packaging structure provided by the invention with cavity can not only increase system function, and can also reduce and be
The entire area and volume (for example, package area maximum can reduce 50%) of system improve level of integrated system.
In the present invention, can the first conducting connecting part 108 be laid any one of in several ways, to realize
Electric interconnection between one support plate 101 and the second support plate 105.Fig. 5 a to Fig. 5 c show different embodiments according to the present invention
The first conducting connecting part 108 laying schematic diagram.As shown in figure 5 a and 5b, the first conducting connecting part 108 can be by
It is arranged within cavity 104.Alternatively, as shown in Figure 5 c, being could be formed on the first moulding bodies 103 from the first moulding bodies 103
Upper surface 103b to lower surface 103c run through the through-hole 103d of first moulding bodies 103, and the first conducting connecting part 108 can
To be filled in through-hole 103d.By the way that the first conducting connecting part 108 is filled into the through-hole 103d of the first moulding bodies 103,
The stability of the electric interconnection between the first support plate 101 and the second support plate 105 can be improved.Also, the first conducting connecting part 108
It can be isolated with cavity 104, so as to prevent from generating interference to the component in cavity 104, when improving component work
Stability and reliability.
In the present invention, the first conducting connecting part 108 can for example include but not limited at least one of following：It is conductive
Column, conductive bump, conducting sphere, conductive pin.Illustratively, Fig. 5 a show that the first conducting connecting part 108 is showing for conductive pin
Example, example made of being stacked by conducting sphere Figure 5b shows that the first conducting connecting part 108.The characteristics of both embodiments, is
Simple for process, easy implementation.Fig. 5 c show that the first conducting connecting part 108 is by injecting metal material into through-hole 103d by shape
At conductive column (for example, copper post) example.Although it will be understood however, that showing that first leads by way of example above
If the dry type of electrical connector 108, but the present invention is not limited to this, and any form of first conducting connecting part 108 is applicable in
In the present invention.
Fig. 6 is the schematic diagram for the air-tight packaging structure that another embodiment according to the present invention provides.Such as Fig. 6 institutes
Show, which can also include：N number of non-cavity encapsulation type component, is arranged in the upper surface of the first support plate 101
101a, each non-cavity encapsulation type component are electrically connected with the wire structures 101b on the first support plate 101, also, the first molding
Body 103 covers N number of non-cavity encapsulation type component, to carry out molded packages to N number of non-cavity encapsulation type component, wherein and N >=
1。
For example, as shown in fig. 6, the encapsulating structure 100 may include two non-cavity encapsulation type components, respectively non-empty
Chamber encapsulation type component 109a, 109b.Wherein, the first moulding bodies 103 cover these non-cavity encapsulation type components, with to these
Non- cavity encapsulation type component carries out molded packages.
By this embodiment, it can simultaneously be realized using same moulding bodies 103 and cavity package type component is carried out
Cavity package, and molded packages are carried out to non-cavity encapsulation type component, it enhances system function to reach, improve system collection
Cheng Du, the effect for making full use of resource.
In the present invention, the sealant 106 that encapsulating structure 100 includes can be, for example, metal sealing layer, wherein the gold
Belonging to sealant can make such as by mode sputtering, deposit, plating.Since the steam permeability of metal is very low, example
Such as, the permeability of water is under same thickness, and more than 8 orders of magnitude smaller than epoxide resin material, it is advantageous to use metal conduct
Seal layer material.
May include that can carry out wirelessly in encapsulating structure 100 described above, in the component in encapsulating structure 100
The power module of charging, and the transmission module that can carry out wireless communication, in this way, the encapsulating structure 100 can independently work
Make or communicated with other external electrical components, without being electrically connected with these other external electrical components.But work as envelope
Do not include that can carry out the power module of wireless charging, and can carry out wireless communication in component in assembling structure 100
When transmission module, the encapsulating structure 100 needs are electrically connected with external electrical component, to obtain electricity from the external electrical component
Power, and/or be electrically communicated with the external electrical component.Wherein, which can for example include but not limited to：
Power Supply Assembly, other encapsulating structures, other electronic components etc..
In this case, it when making the first support plate 101, can be laid on the lower surface 101d of the first support plate 101
The second conducting connecting part being electrically connected with the wire structures 101b on the first support plate 101, second conducting connecting part can be used for
It is electrically connected with external electrical component.Wherein, which can for example include but not limited to：Conducting sphere, conductive stud
Block, pad etc..For example, as shown in fig. 7, can the lower surface 101d of the first support plate 101 plant soldered ball, formed BGA package, or
Pad is reserved on the lower surface 101d of the first support plate 101, forms QFN encapsulation.
By the above embodiment, the interconnection of encapsulating structure 100 and other external electrical components may be implemented, so as to the envelope
Assembling structure 100 can obtain electric power from the external electrical component, and/or be electrically communicated with the external electrical component.
Fig. 8 a to Fig. 8 f are the process flow charts for the airtight packaging method that a kind of embodiment according to the present invention provides.
First, as figures 8 a and 8 b show, which may include：M1 are laid on the upper surface 101a of the first support plate 101
Cavity package type component, and the M1 cavity package type component is made to be electrically connected with the wire structures 101b on the first support plate 101
It connects；M2 cavity package type component is laid on the upper surface 105c of the second support plate 105, and makes the M2 cavity package type member
Device is electrically connected with the wire structures 105b on the second support plate 105, wherein M=M1+M2, and M >=1.
May include shown in Fig. 8 a and Fig. 8 b it should be noted that in airtight packaging method provided by the invention
One of step, or including both steps shown in Fig. 8 a and Fig. 8 b.For example, in the example shown in Fig. 8 a,
Laid four cavity package type components on one support plate 101, respectively cavity package type component 102a, 102b, 102c,
102d.In addition, in the example shown in Fig. 8 b, two cavity package type components are laid on the second support plate 105, respectively
Cavity package type component 102e, 102f.
Next, as shown in Figure 8 c, being molded on the upper surface 101a of the first support plate 101, the first of annular is formed
Moulding bodies 103, first moulding bodies 103 and the first support plate 101 form cavity 104, wherein when the upper table in the first support plate 101
When having laid M1 cavity package type component on the 101a of face, which is accommodated in cavity 104.
By the step for, four walls that molded obtained the first moulding bodies 103 form cavity 104 can be passed through.
Next, as shown in figure 8d, the second support plate 105 is tipped upside down on the first moulding bodies 103, to cover cavity 104, and
So that when having laid M2 cavity package type component on the upper surface 105c in the second support plate 105, the M2 cavity envelope
Dress type component is accommodated in cavity 104.It should be noted that when the second support plate 105 is tipped upside down on the first moulding bodies 103
Afterwards, originally in figure 8b shown in the upper surface 105c of the second support plate 105 become lower surface 105a.
Next, as figure 8 e shows, sealant 106 is laid, so that the sealant 106 covers the first of the first support plate 101
Surface region 101c and the outer surface for surrounding the first moulding bodies 103 and the second support plate 105, wherein first surface region 101c
The surface region being exposed in upper surface 101a for the first support plate 101.
Next, as illustrated in fig. 8f, being molded on sealant 106, the second moulding bodies 107 are formed, so that the second mould
Plastomer 107 covers the sealant 106.
Through the above technical solutions, the first moulding bodies, which may be used, forms the encapsulating structure with cavity, that is, use plastic seal
Dress technology realizes cavity package.Plastic Package significantly reduces packaging cost compared to Metal Packaging and ceramic package, and
The technique of Plastic Package is relatively easy, and making is more flexible, therefore, can shorten the manufacturing cycle of entire encapsulating structure.Also,
In the forming process of cavity, the second support plate can form three-dimensional structure simultaneously as the upper cover of cavity and component carrier, because
This, may be implemented to make full use of infrastructure resource.In addition, by sealant and the second moulding bodies, secondary molding may be implemented
Encapsulation, so as to ensure the air-tightness of the cavity formed by moulding material, further enhances the reliability of system.
In order to facilitate the installation of, optionally, when being molded, as shown in figure 9, the first moulding bodies 103 are formed as top
Shape with step-like notch 103f, in this way, when tipping upside down on the second support plate 105 on first moulding bodies 103, it can be by it
It is buckled into the step-like notch 103f of the first moulding bodies 103, so that the second support plate 105 can be embedded in the first moulding bodies
It is shown as shown in Figure 5 a to 5 c to cover cavity 104 in 103 upper surface 103a.Thus, it is possible to improve the machine of encapsulating structure
Tool performance, and it is easy for installation, the seal of cavity 104 can be enhanced.
In the present invention, as described above, may include M1 sky being arranged on the first support plate 101 in encapsulating structure 100
Chamber encapsulation type component, and M2 cavity package type component being arranged on the second support plate 105.Optionally, M1 >=1, M2
≥1.In this case, in order to realize that three-dimensional systematic encapsulates, optionally, as shown in Figure 10, which can also wrap
It includes：The first conducting connecting part 108 is laid, the wire structures of one end and the first support plate 101 of first conducting connecting part 108 are made
101b is electrically connected, and the other end is electrically connected with the wire structures 105b of the second support plate 105 so that M1 cavity package type component and
Electric interconnection between M2 cavity package type component, to realize that three-dimensional systematic encapsulates.
In addition, when laying the first conducting connecting part 108, it in one embodiment, can be by the first conducting connecting part
108 are set up directly in cavity 104, so that the wire structures 101a of one end of the first conducting connecting part 108 and the first support plate 101
Electrical connection, the other end is electrically connected with the wire structures 105b of the second support plate 105, as shown in Fig. 5 a, Fig. 5 b and Figure 10.Alternatively,
In another embodiment, as shown in fig. 11a, the first moulding bodies 103 can be punched first, in first moulding bodies
The through-hole for running through first moulding bodies 103 from the upper surface 103b to lower surface 103c of first moulding bodies 103 is formed on 103
103d.For example, molding punching can be carried out by way of laser drill or machine drilling.Later, as shown in figure 11b, by
One conducting connecting part 108 is filled into through-hole 103d, so that the cloth of one end of the first conducting connecting part 108 and the first support plate 101
Cable architecture 101a electrical connections, the other end are electrically connected with the wire structures 105b of the second support plate 105.For example, can be by through-hole
Conductive material (for example, copper) is injected in 103d to form the first conducting connecting part 108.
By the way that the first conducting connecting part 108 to be filled into the through-hole 103d of the first moulding bodies 103, the first load can be improved
The stability of electric interconnection between plate 101 and the second support plate 105.Also, the first conducting connecting part 108 can be with cavity 104
It is isolated, so as to prevent from generating interference to the component in cavity 104, improves the job stability of component and reliable
Property.
Optionally, when carrying out the step shown in Fig. 8 a, this method can also include：In the upper surface of the first support plate 101
N number of non-cavity encapsulation type component is laid on 101a, and makes the cloth on each non-cavity encapsulation type component and the first support plate 101
Cable architecture 101b electrical connections, wherein N >=1.In this way, when carrying out the step shown in Fig. 8 c, it can be in the upper of the first support plate 101
It is molded on the 101a of surface, forms the first moulding bodies 103 of annular, so that first moulding bodies 103 cover N number of non-cavity envelope
Dress type component, to carry out molded packages to N number of non-cavity encapsulation type component.Encapsulating structure as obtained by this method can be with
Encapsulating structure for example, shown in fig. 6.
By this embodiment, it can simultaneously be realized using same moulding bodies 103 and cavity package type component is carried out
Cavity package, and molded packages are carried out to non-cavity encapsulation type component, it enhances system function to reach, improve system collection
Cheng Du, the effect for making full use of resource.
In addition, in order to realize that encapsulating structure is communicated with other external electrical components, optionally, which may be used also
To include：The second conducting connecting part is laid on the lower surface 101d of the first support plate 101, and makes second conducting connecting part and
Wire structures 101b electrical connections on one support plate 101, wherein second conducting connecting part can be used for and external electrical component electricity
Connection.For example, when making the first support plate 101, the component institute for being communicated with external electrical component can be reserved
Corresponding position, and reserve the interconnection interface with the second conducting connecting part.In this way, before forming entire encapsulating structure, it
In or later, the second conducting connecting part can be connected on the interconnection interface so that in encapsulating structure be responsible for communication member
Device can be electrically communicated via wire structures 101b and the second conducting connecting part with external electrical component.
The encapsulating structure obtained by above-mentioned packaging method can be interconnected with other external electrical components, as a result, should
Encapsulating structure can obtain electric power from the external electrical component, and/or be electrically communicated with the external electrical component.
The preferred embodiment of the present invention is described in detail above in association with attached drawing, still, the present invention is not limited to above-mentioned realities
The detail in mode is applied, within the scope of the technical concept of the present invention, a variety of letters can be carried out to technical scheme of the present invention
Monotropic type, these simple variants all belong to the scope of protection of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case of shield, it can be combined by any suitable means.In order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (14)
1. a kind of air-tight packaging structure, which is characterized in that the encapsulating structure includes：
First support plate；
First moulding bodies are formed as annular, are arranged in the upper surface of first support plate, and form sky with first support plate
Chamber；
Second support plate is arranged on first moulding bodies, and covers the cavity；
M cavity package type component, is contained in the cavity, wherein M1 cavity package type component is arranged described
The upper surface of first support plate, M2 cavity package type component are arranged in the lower surface of second support plate, each cavity
Encapsulation type component is electrically connected with the wire structures on the support plate at place, M >=1, and M=M1+M2；
N number of non-cavity encapsulation type component is arranged in the upper surface of first support plate, each non-cavity encapsulation type member device
Part is electrically connected with the wire structures on first support plate, also, first moulding bodies cover N number of non-cavity encapsulation type
Component, to carry out molded packages to N number of non-cavity encapsulation type component, wherein N >=1；
Sealant covers the first surface region of first support plate and surrounds first moulding bodies and second support plate
Outer surface, wherein the first surface region be first support plate upper surface in the surface region that is exposed；And
Second moulding bodies are covered on the sealant.
2. encapsulating structure according to claim 1, which is characterized in that second support plate is embedded into first moulding bodies
Upper surface in.
3. encapsulating structure according to claim 1, which is characterized in that M1 >=1, M2 >=1；Also, the encapsulating structure is also
Including：
First conducting connecting part connects the wire structures of the wire structures and first support plate of second support plate, so that institute
State electric interconnection between M1 cavity package type component and the M2 cavity package type component.
4. encapsulating structure according to claim 3, which is characterized in that first conducting connecting part is arranged on the sky
Intracavitary；Or
It is formed on first moulding bodies and runs through first moulding bodies from the upper surface of first moulding bodies to lower surface
Through-hole, first conducting connecting part is filled in the through-hole.
5. encapsulating structure according to claim 3, which is characterized in that first conducting connecting part include it is following in extremely
Few one：Conductive column, conductive bump, conducting sphere, conductive pin.
6. encapsulating structure according to claim 1, which is characterized in that the sealant is metal sealing layer.
7. according to the encapsulating structure described in any one of claim 1-6, which is characterized in that in the lower surface of first support plate
On be laid with the second conducting connecting part being electrically connected with the wire structures on first support plate, second conducting connecting part is used
It is electrically connected in external electrical component.
8. a kind of airtight packaging method, which is characterized in that the packaging method includes：
M1 cavity package type component is laid on the upper surface of the first support plate and/or is laid on the upper surface of the second support plate
M2 cavity package type component, and the wire structures on each cavity package type component and the support plate at place is made to be electrically connected
It connects, meanwhile, N number of non-cavity encapsulation type component is laid on the upper surface of first support plate, and make each non-cavity
Encapsulation type component is electrically connected with the wire structures on first support plate, wherein M=M1+M2, and M >=1, N >=1；
It is molded on the upper surface of first support plate, the first moulding bodies of annular is formed, so that first moulding bodies
N number of non-cavity encapsulation type component is covered, it is described to carry out molded packages to N number of non-cavity encapsulation type component
First moulding bodies and first support plate form cavity, wherein when having laid the M1 on the upper surface of first support plate
When a cavity package type component, the M1 cavity package type component is accommodated in the cavity；
Second support plate is tipped upside down on first moulding bodies, to cover the cavity, and to carry when described second
When having laid the M2 cavity package type component on the upper surface of plate, the M2 cavity package type component is accommodated in
In the cavity；
Sealant is laid, so that the sealant covers the first surface region of first support plate and surrounds first mould
The outer surface of plastomer and second support plate, wherein the first surface region be first support plate upper surface in be exposed
Surface region；And
It is molded on the sealant, forms the second moulding bodies, so that second moulding bodies cover the sealant.
9. packaging method according to claim 8, which is characterized in that described that second support plate is tipped upside down on described first
On moulding bodies, to cover cavity the step of includes：
Second support plate is tipped upside down on first moulding bodies, and second support plate is made to be embedded into first moulding bodies
Upper surface in, to cover the cavity.
10. packaging method according to claim 8, which is characterized in that M1 >=1, M2 >=1；Also, the packaging method is also
Including：
The first conducting connecting part is laid, one end of first conducting connecting part and the wire structures of first support plate is made to be electrically connected
It connects, the other end is electrically connected with the wire structures of second support plate, so that the M1 cavity package type component and the M2
Electric interconnection between a cavity package type component.
11. packaging method according to claim 10, which is characterized in that the first conducting connecting part of the laying makes described
One end of first conducting connecting part is electrically connected with the wire structures of first support plate, the wiring of the other end and second support plate
Structure be electrically connected the step of include：
First conducting connecting part is arranged in the cavity, and makes one end of first conducting connecting part and described the
The wire structures of one support plate are electrically connected, and the other end is electrically connected with the wire structures of second support plate；Or
The first conducting connecting part of the laying, makes the wire structures of one end and first support plate of first conducting connecting part
Electrical connection, the step of other end is electrically connected with the wire structures of second support plate include：
First moulding bodies are punched, to be formed from the upper surface of first moulding bodies on first moulding bodies
Run through the through-hole of first moulding bodies to lower surface；And
First conducting connecting part is filled into the through-hole, so that one end of first conducting connecting part and described the
The wire structures of one support plate are electrically connected, and the other end is electrically connected with the wire structures of second support plate.
12. packaging method according to claim 10, which is characterized in that during first conducting connecting part includes following
At least one：Conductive column, conductive bump, conducting sphere, conductive pin.
13. packaging method according to claim 8, which is characterized in that the laying sealant, so that the sealant covers
The step of covering the first surface region of first support plate and surrounding the outer surface of first moulding bodies and second support plate
Including：
Metal sealing layer is laid, so that the metal sealing layer covers the first surface region of first support plate and surrounds institute
State the outer surface of the first moulding bodies and second support plate.
14. according to the packaging method described in any one of claim 8-13, which is characterized in that the packaging method further includes：
The second conducting connecting part is laid on the lower surface of first support plate, and makes second conducting connecting part and described the
Wire structures electrical connection on one support plate, wherein second conducting connecting part with external electrical component for being electrically connected.
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| CN108899306A (en) * | 2018-07-13 | 2018-11-27 | 中国电子科技集团公司第五十八研究所 | A kind of integrated circuit plastics seal structure and preparation method thereof |
| CN109461729A (en) * | 2018-12-29 | 2019-03-12 | 山东盛芯半导体有限公司 | A kind of 3 D stereo encapsulating structure and method |
| CN110112076B (en) * | 2019-04-30 | 2020-11-24 | 中国电子科技集团公司第十三研究所 | Circuit packaging method and packaging structure |
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|---|---|---|---|---|
| CN101998930A (en) * | 2008-02-22 | 2011-03-30 | 卡文迪什动力有限公司 | Method of sealing a cavity |
| CN102012269A (en) * | 2009-06-12 | 2011-04-13 | 原子能和代替能源委员会 | Device for detecting and/or emitting electromagnetic radiation and method for manufacturing such a device |
| CN102064159A (en) * | 2010-11-05 | 2011-05-18 | 中国兵器工业集团第二一四研究所苏州研发中心 | Multi-module packaged component |
| CN204464255U (en) * | 2015-04-16 | 2015-07-08 | 歌尔声学股份有限公司 | The encapsulating structure of integrated sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004327641A (en) * | 2003-04-24 | 2004-11-18 | Tdk Corp | Electronic component module |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998930A (en) * | 2008-02-22 | 2011-03-30 | 卡文迪什动力有限公司 | Method of sealing a cavity |
| CN102012269A (en) * | 2009-06-12 | 2011-04-13 | 原子能和代替能源委员会 | Device for detecting and/or emitting electromagnetic radiation and method for manufacturing such a device |
| CN102064159A (en) * | 2010-11-05 | 2011-05-18 | 中国兵器工业集团第二一四研究所苏州研发中心 | Multi-module packaged component |
| CN204464255U (en) * | 2015-04-16 | 2015-07-08 | 歌尔声学股份有限公司 | The encapsulating structure of integrated sensor |
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