CN105939594B - The radiator and electronic equipment of electronic equipment - Google Patents
The radiator and electronic equipment of electronic equipment Download PDFInfo
- Publication number
- CN105939594B CN105939594B CN201610506200.3A CN201610506200A CN105939594B CN 105939594 B CN105939594 B CN 105939594B CN 201610506200 A CN201610506200 A CN 201610506200A CN 105939594 B CN105939594 B CN 105939594B
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- heat sink
- air
- opening area
- electronic equipment
- electronic component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The radiator and electronic equipment of offer a kind of electronic equipment of the embodiment of the present invention.The radiator of electronic equipment of the present invention, the radiator includes heat sink, the heat sink includes multiple opening areas, and each opening area is arranged at intervals with multiple through-holes, and inlet air channel is formed between at least one opening area of heat sink and the air intake vent of electronic equipment；A heat dissipation wind channel is formed between fan at each opening area of heat sink and the air outlet of electronic equipment, the electronic component to be radiated of electronic equipment is located in heat dissipation wind channel；Heat sink is in the heat dissipation wind channel where the air flow guiding in inlet air channel to be branched to electronic component to be radiated, the percent opening of the opening area corresponding with inlet air channel of heat sink is less than the percent opening of other opening areas of the heat sink, under conditions of not improving rotation speed of the fan, to meet the heat dissipation needs of the electronic component of electronic equipment internal.
Description
Technical field
The present embodiments relate to the radiators and electronic equipment of electronic technology more particularly to a kind of electronic equipment.
Background technique
Electronic equipment refers to the equipment with certain function being made of various electronic components, and electronic equipment may include
Computer, TV, projection device etc., they are closely bound up with people's lives.
During the work time, each electronic component of electronic equipment internal can generate certain thermal power to electronic equipment,
So that the operating temperature of electronic component increases, and electronic component usually has maximum operating temperature specification requirement, it is therefore desirable to
Structure member of the setting for heat dissipation in the electronic device, to realize dissipating to each electronic component of electronic equipment internal
Heat, allows the work that electronic equipment is steady in a long-term.Usual electronic equipment, which is used, is arranged fan in electronic equipment air outlet, makes
Electronic equipment is obtained from air inlet suction airflow, and passes through fan from air outlet and blows out, airflow channel is formed, thus to electronic equipment
Internal electronic component is aerated heat dissipation.
However, when there are part electronic components to be blocked by other structures component for electronic equipment internal, causes to flow through and hidden
The air-flow of the electronic component of gear is smaller, is unable to satisfy the radiating requirements for the electronic component being blocked.It is blocked to meet
Electronic component radiating requirements, can pass through improve air outlet at fan revolving speed.However, improving rotation speed of the fan can make
The noise and power consumption for obtaining electronic equipment increase.
Summary of the invention
The embodiment of the present invention provides the radiator and electronic equipment of a kind of electronic equipment, not improve rotation speed of the fan
Under the conditions of, meet the heat dissipation needs of the electronic component of electronic equipment internal.
In a first aspect, the embodiment of the present invention provides the radiator of a kind of electronic equipment, the radiator is set to institute
The enclosure interior of electronic equipment is stated, the radiator includes heat sink, and the heat sink includes multiple opening areas, Mei Gekai
Bore region is arranged at intervals with multiple through-holes, the air intake vent of at least one opening area of the heat sink and the electronic equipment it
Between formed inlet air channel；
One is formed between fan at each opening area of the heat sink and the air outlet of the electronic equipment to dissipate
The electronic component to be radiated of hot-flow flue, the electronic equipment is located in heat dissipation wind channel；
The heat sink is used to branch to the air flow guiding in inlet air channel where the electronic component to be radiated
In heat dissipation wind channel, the percent opening of the opening area corresponding with inlet air channel of the heat sink be less than the heat sink other open
The percent opening of bore region, the percent opening are the gross area of all through-holes of opening area and the gross area of the opening area
Ratio.
Second aspect, the embodiment of the present invention provide a kind of electronic equipment, comprising: the dress of heat dissipation described in above-mentioned first aspect
It sets.
The third aspect, the embodiment of the present invention provide a kind of method for realizing electronic equipment dissipating heat, comprising:
Obtain the electronic component to be radiated that electronic equipment internal needs to radiate；
It is determined according to the physical parameter of the preset temperature specification of electronic component to be radiated, thermal power and air wait dissipate
Air volume needed for the cooling electronic component of heat；
It is true according to air volume needed for the position of electronic component to be radiated and cooling electronic component to be radiated
Determine the number of the opening area of heat sink and the percent opening of opening area；
It is arranged on the heat sink according to the percent opening of the number of the opening area of the heat sink and opening area logical
Hole；
The heat sink is set to the electronic equipment internal, by the heat sink by the air flow guiding in inlet air channel
In heat dissipation wind channel where electronic component to be radiated described in branching to, so that passing through each opening area after the heat sink
Air force redistributed, with meet be located at heat dissipation wind channel in electronic component to be radiated radiating requirements；
Wherein, the inlet air channel is to be formed between the opening area of the heat sink and the air intake vent of the electronic equipment
Airflow channel, the heat dissipation channel be the heat sink opening area and the electronic equipment air outlet at fan it
Between form airflow channel, the percent opening of the opening area corresponding with inlet air channel of the heat sink is less than its of the heat sink
The percent opening of his opening area, the percent opening are the gross area of all through-holes of opening area and total face of the opening area
Long-pending ratio, the physical parameter of the air include the specific heat capacity of air and the density of air.
The radiator and electronic equipment of electronic equipment of the embodiment of the present invention, by the way that heat dissipation dress is arranged in electronic equipment internal
It sets, which may include heat sink, and heat sink may include multiple opening areas, and each opening area is arranged at intervals with
Multiple through-holes form inlet air channel between at least one opening area of the heat sink and the air intake vent of the electronic equipment,
A heat dissipation wind channel, institute are formed between fan at each opening area of the heat sink and the air outlet of the electronic equipment
The electronic component to be radiated for stating electronic equipment is located in heat dissipation wind channel, and the heat sink is for leading the air-flow in inlet air channel
Flow point is flow in the heat dissipation wind channel where the electronic component to be radiated, and the corresponding with inlet air channel of the heat sink is opened
The percent opening of bore region is less than the percent opening of other opening areas of the heat sink, due to the wind of the small opening area of percent opening
Resistance is bigger, when air-flow is by the small opening area of percent opening, the big opening area of the percent opening of fraction steering heat sink,
To which air flow guiding is branched to other opening areas, and then the corresponding radiation air of other opening areas is reached by heat sink
Road, the electronic component to be radiated into heat dissipation wind channel provides the air quantity for meeting radiating requirements, not improve rotation speed of the fan
Under conditions of, meet the heat dissipation needs of the electronic component of electronic equipment internal.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Figure 1A is the structural schematic diagram of the radiator embodiment one of electronic equipment of the present invention；
Figure 1B is the structural schematic diagram of heat sink embodiment one of the present invention；
Fig. 2A is the structural schematic diagram of projection device of the present invention；
Fig. 2 B is the structural schematic diagram of heat sink embodiment two of the present invention；
Fig. 3 A is a kind of implement scene schematic diagram；
Fig. 3 B is the structural schematic diagram of the heat sink embodiment three of the embodiment of the present invention；
Fig. 3 C is the structural schematic diagram being set to heat sink as shown in Figure 3B in projection device；
Fig. 4 A is another implement scene schematic diagram；
Fig. 4 B is the structural schematic diagram of the heat sink example IV of the embodiment of the present invention；
Fig. 4 C is the structural schematic diagram being set to heat sink as shown in Figure 4 B in electronic equipment；
Fig. 5 is the flow chart for the embodiment of the method one that the present invention realizes electronic equipment dissipating heat.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
Figure 1A is the structural schematic diagram of the radiator embodiment one of electronic equipment of the present invention, and Figure 1B is heat sink of the present invention
The structural schematic diagram of embodiment one, as shown in Figure 1A, the radiator are set to the enclosure interior of the electronic equipment, specifically
It can be set between air-flow blocking parts 11 and the component 12 that is blocked, wherein be blocked in component 12 and have what needs radiated
Electronic component, the device of the present embodiment may include: heat sink 13, the number of heat sink 13 can be one be also possible to it is more
A, explanation is explained in detail with a heat sink 13 in the present embodiment, and multiple heat sinks 13, which are arranged, can adopt in a like fashion,
The heat sink 13 includes multiple opening areas 131, and each opening area 131 is arranged at intervals with multiple through-holes 1311, described to dissipate
Inlet air channel 161 is formed between at least one opening area 131 of hot plate 13 and the air intake vent 16 of the electronic equipment, from inlet air
The air-flows that mouth 16 enters electronic equipment internal reach the opening areas of heat sink 13 corresponding with air intake vent by inlet air channel 161
131, one is formed between the fan 15 at each opening area of the heat sink 13 and the air outlet 14 of the electronic equipment
The electronic component to be radiated of heat dissipation wind channel 141, the electronic equipment is located in heat dissipation wind channel 141；The heat sink 13 is used
It is described in branching to the air flow guiding in inlet air channel 161 in the heat dissipation wind channel 141 where the electronic component to be radiated
The percent opening of the opening area corresponding with inlet air channel of heat sink is less than the percent opening of other opening areas of the heat sink,
Wherein, percent opening is the ratio of the gross area of all through-holes of opening area and the gross area of the opening area.
Specifically, fan can be not provided at the air intake vent 16 of electronic equipment, fan also can be set, specifically can be set
The fan of quantity identical as the fan 15 being arranged at air outlet 14, to form airflow channel.Air-flow enters electronics from air intake vent 16
Heat sink 13 inside equipment Jing Guo air-flow blocking parts 11, the embodiment of the present invention and the component 12 that is blocked, by fan 15 from
Air outlet 14 is blown out.Wherein, air-flow blocking parts 11 refers specifically to so that being located at the air-flow of the component 12 that is blocked of its vertical direction
Reduced component (another intelligible paraphrase: sees the direction of electronic equipment internal along air intake vent 16, there are components for electronic equipment
Behind a component, which is air-flow blocking parts 11, and the subsequent component of the component is the component that is blocked
12), air-flow blocking parts 11 is located at air intake vent 16 and is blocked between component 12, and air-flow is inhaled into from air intake vent 16, due to
Air-flow blocking parts 11 is blocked, and windage is larger, and the air-flow for passing through air-flow blocking parts 11 has the obvious pressure loss, and makes
The position in the lesser inlet air channel 161 of windage can be blowed to around the air-flow blocking parts 11 by obtaining some air-flow, so as to cause
Wind-force is concentrated mainly in inlet air channel 161, heat sink 13 is reached by the air-flow in inlet air channel 161 with inlet air channel 161
The percent opening of corresponding opening area 131, the opening area 131 corresponding with inlet air channel 161 of heat sink 13 is less than the heat dissipation
The percent opening of other opening areas of plate 13, since the windage of the small opening area of percent opening is big, position that air-flow can be big from windage
Set and blow to the small position of windage, so, air-flow the air-flow of logical wind passage 161 reach heat sink 13 with inlet air channel 161
When corresponding opening area 131, air-flow can water conservancy diversion branch to the big opening area of other percent openings of the heat sink 13, air-flow is logical
It crosses heat sink 13 and enters heat dissipation wind channel 141, radiate to the electronic component to be radiated in heat dissipation channel 141.Wherein, quilt
Electronic component to be radiated in blocking parts 12 can be located in a heat dissipation wind channel, thus through the embodiment of the present invention
Heat sink 13 branches to the air flow guiding in inlet air channel in multiple heat dissipation wind channels 141, to meet the quilt in heat dissipation wind channel 141
The radiating requirements of electronic component to be radiated in blocking parts 12.Wherein, the air force in each heat dissipation wind channel 141 can
With difference, the percent opening of the corresponding opening area of heat dissipation wind channel 141 is bigger, and the air quantity in the heat dissipation wind channel 141 is bigger.
Wherein, electronic component to be radiated may include the electronic component being blocked on component 12, can also include
Other electronic components, other electronic components can be the electronics member device on the component not blocked by air-flow blocking parts 11
Part, the be blocked electronic component on component 12 and other electronic components can be located in different heat dissipation wind channels 141,
The percent opening of the corresponding opening area 131 of different heat dissipation wind channels 141 can be different, so that the heat dissipation of the embodiment of the present invention fills
It sets and guarantees that the heat dissipation of other electronic components needs while meeting the radiating requirements for the electronic component being blocked on component 12
It asks.
As follows in the principle that the heat sink 13 by radiator realizes that the water conservancy diversion of air-flow shunts: heat sink 13 may include
Multiple opening areas 131, wherein the percent opening of opening area 131 can be 0, can also be greater than 0, wherein percent opening is greater than 0
Opening area 131 may include multiple spaced through-holes 1311.Wherein, a kind of achievable mode, heat sink 13 include
The opening area 131 that opening area 131 of one percent opening greater than 0 and a percent opening are 0, the non-aperture which is 0
Through-hole is not provided in region, air-flow flows through the side of the air-flow for the opening area that the percent opening is 0 when passing through the heat sink 13
To opening area 131 of the percent opening greater than 0 is turned to, so that percent opening is greater than the 0 corresponding heat dissipation wind channel of opening area 131
Air quantity in 141 increases, thus meet be located in the corresponding heat dissipation wind channel 141 of opening area 131 of the percent opening greater than 0 wait dissipate
Heat electronic component radiating requirements, this implementation be suitable for percent opening be 0 opening area vertical direction be not present to
The electronic component of heat dissipation；The achievable mode of another kind, when heat sink 13 includes multiple opening areas 131, and each aperture area
The percent opening in domain 131 is not 0, wherein whether the specific heat sink 13 includes that percent opening can be according to reality for 0 opening area
Border is arranged demand and carries out flexible setting, wherein the number of the opening area 131 of heat sink 13 and the boundary position of opening area
It is related with the position of electronic component to be radiated, and the percent opening of each opening area 131 be located at the opening area 131
Air force needed for the cooling electronic component to be radiated of vertical direction is related, wherein cooling electronic component institute to be radiated
Required airflow is bigger, and the percent opening of corresponding opening area 131 is higher.And percent opening is higher, the windage of the opening area 131 is got over
It is small.The percent opening of each opening area 131 is different, and the windage of each opening area 131 is also different, when air-flow is needed by one
When opening area, if the windage of the opening area is larger, the fraction in air-flow can be another by the opening area
Portion's air-flow can then flow to the lesser opening area of windage, to realize leading for air-flow by the opening area 131 on heat sink 13
Flow point stream.
Optionally, heat sink 131 is vertical with the direction of air-flow that the air intake vent 16 of the electronic equipment enters.
Optionally, the direction for the air-flow that the air intake vent of heat sink 131 and the electronic equipment enters is in predetermined angle.Specifically
, which can flexibly be chosen according to practical radiating requirements.Specifically, i.e. heat sink 13 is with certain predetermined angle
It being set to air-flow blocking parts 11 and is blocked between component 12, the tilt angle that can use heat sink turns to air-flow,
It realizes and is shunted air flow guiding by the heat sink 13 to improve the air quantity for meeting radiating requirements to electronic component to be radiated.
Optionally, heat sink 13 is along the section of the thickness direction of heat sink for rectangle or with the quadrangle of radian.
It should be noted that the thickness of heat sink is unsuitable blocked up, heat sink is thicker, and aperture axial path is longer, and air-flow is logical
The flow resistance formed when crossing heat sink is also bigger, finally increases the pressure loss of air-flow, it is preferred, therefore, that, it can choose smaller
The heat sink of thickness.
Optionally, if heat sink 13 along the section of the thickness direction of heat sink be the quadrangle with radian, it is described to have
Air intake vent of the protrusion direction of the quadrangle of radian towards electronic equipment.The heat sink 13 with radian can effectively reduce gas
The impact force when transformation of direction, the airflow direction that is more suitable turnover are flowed, to be conducive to reduce windage loss.
Optionally, air force needed for cooling electronic component to be radiated by the electronic component to be radiated heat
The physical parameter of power, preset temperature specification and air determines that the physical parameter of the air may include the specific heat capacity of air
With the density of air.(local environment is identical, electronic component preset temperature specification is identical), hot merit under the conditions of same size
Rate is higher, and cooling electronic component institute required airflow to be radiated is bigger.
The present embodiment, by the way that radiator is arranged in electronic equipment internal, which may include heat sink, heat dissipation
Plate may include multiple opening areas, and each opening area is arranged at intervals with multiple through-holes, and at least one of the heat sink is opened
Inlet air channel, each opening area and the electricity of the heat sink are formed between bore region and the air intake vent of the electronic equipment
A heat dissipation wind channel, the electronic component position to be radiated of the electronic equipment are formed between fan at the air outlet of sub- equipment
In in heat dissipation wind channel, the heat sink is used to branching to the air flow guiding in inlet air channel into the electronic component institute to be radiated
Heat dissipation wind channel in, the percent opening of the opening area corresponding with inlet air channel of the heat sink is less than its of the heat sink
The percent opening of his opening area, since the windage of the small opening area of percent opening is bigger, in the air-flow aperture small by percent opening
When region, the big opening area of the percent opening of fraction steering heat sink, so that air flow guiding is branched to other aperture areas
Domain, and then the corresponding heat dissipation wind channel of other opening areas is reached by heat sink, the electronics member to be radiated into heat dissipation wind channel
Device provides the air quantity for meeting radiating requirements.
Specific explanations explanation is carried out to Figure 1A, Figure 1B illustrated embodiment using several specific embodiments below.
Using electronic equipment as projection device as an example, carry out specific explanations explanation.
Fig. 2A is the structural schematic diagram of projection device of the present invention, and Fig. 2 B is the structural representation of heat sink embodiment two of the present invention
Figure.As shown in Figure 2 A, projection device specifically may include air intake vent 21, DMD radiator 22, ray machine (23 and 24), light source 25, rectification
Plate 26, fan (27 and 28), air outlet 29 and radiator 30, specifically, fan 27 and fan 28 are arranged side by side in projection
At the air outlet 29 of equipment, air-flow is inhaled into from the air intake vent 21 of projection device, and from other side air outlet 29 by fan (27 Hes
28) it blows out, airflow channel is formed, to be aerated heat dissipation to the electronic component inside projection device.Wherein, light source 25 is given
The component of power supply is known as cowling panel 26, and cowling panel 26 can also be referred to as stabilizer, and effect is the wink in projection device booting
Between by 12V boost in voltage to 2300V so that light source 25 is lighted, and maintain low-voltage power supply after power-up for light source 25, with
The stable operation for guaranteeing light source 25, provides radiation source for projection device.Cowling panel 26 is installed on the rear of light source 25, relative to
Projection device bottom case is disposed vertically.Air-flow is inhaled at air intake vent 21, and due to blocking for DMD radiator 22, windage is larger, is made
The air-flow that DMD radiator must be flowed through has the apparent pressure loss, and some air-flow can bypass DMD radiator 22, lead
Wind-force is caused to be concentrated mainly on DMD radiator rear windage smaller part.And due to the installation site of cowling panel 26, in what is be blocked
Position, air-flow can only first pass through DMD radiator using cowling panel 26, and the decrease of air quantity adds air loss, fan (27 before
With 28) under appropriate revolving speed, the temperature of the first electronic component in part can be more than default specification on cowling panel 26, it is difficult to meet it and dissipate
Heat demand.And radiator 30 is set in the projection device, it can effectively change airflow direction, meet the electronics of cowling panel 26
The radiating requirements of component.The present embodiment specifically can be using the radiator 30 including a heat sink.Specifically, heat sink
It specifically can be set between DMD radiator 22 and cowling panel 26 as shown in Figure 2 A, and the partial region of the heat sink is straight
It connects corresponding with air intake vent 21.DMD radiator 22 in the present embodiment is the air-flow blocking parts of embodiment illustrated in fig. 1, this reality
Apply the component that is blocked that the cowling panel 26 in example is embodiment illustrated in fig. 1.Current embodiment require that being passed through by heat sink raising
The air-flow size of cowling panel 26, it is possible to set structure as shown in Figure 2 B for heat sink, i.e. heat sink is opened including two
Bore region (opening area a and opening area b), wherein cowling panel 26 is located at the vertical direction of opening area a, so, Ke Yishe
The percent opening for setting opening area b is less than opening area a, thus in the electronic component for guaranteeing to be located at opening area b vertical direction
Radiating requirements on the basis of, by heat sink promoted opening area a air-flow size, as shown in Figure 2 B, in opening area a
The area of through-hole accounts for the ratio of the area of opening area a, than the area that the area of through-hole in opening area b accounts for opening area b
Ratio is big, it should be noted that the shape, size of the through-hole of opening area a and arrangement and opening area b in Fig. 2 B
Shape, size and the arrangement of through-hole are only a kind of major electrical components, can also use other shapes, size or row
Cloth.It different one illustrates herein.Air-flow point after heat sink shown in Fig. 2 B is set in projection device, inside projection device
Cloth may refer to Fig. 2A, and as shown in Figure 2 A, since the percent opening of opening area b is less than opening area a, air-flow is passing through heat sink
Before, opening area a due to DMD radiator 22 to block air quantity smaller, and opening area b is due to blocking, air quantity compared with
Greatly, for air-flow when passing through heat sink, the part that airflow direction is directed toward in the air-flow of opening area b can be by opening area b, in turn
It is blown out by fan 28 from air outlet 29, another part that airflow direction is directed toward in the air-flow of opening area b can be due to aperture area
Domain b windage is larger, and turns to opening area a, and flow to air outlet 29 from opening area a, may refer to Fig. 2A, air-flow is passing through
Significant change occurs for the distribution of its air force before and after heat sink, so as to effectively promote the air force of opening area a, meets
The radiating requirements of electronic component on cowling panel 26.
The present embodiment, by the way that heat sink, the opening area a of heat sink and opening for opening area b are arranged in projection device
Porosity is different, so that the air-flow for reaching heat sink will receive different windages, wherein opening area b percent opening is smaller, windage
It is larger, so that the air-flow that part flows to opening area b originally changes flow direction to opening area a, so that passing through heat dissipation
The air quantity of plate is redistributed, and under conditions of not improving rotation speed of the fan, meets each electronics member device inside projection device
The radiating requirements of part.
There are two opening areas for the heat sink tool of above-described embodiment, below to the heat dissipation with three, five opening areas
Plate is explained.
Fig. 3 A be a kind of implement scene schematic diagram, as shown in Figure 3A, the stabilizer of the intermediate region inside projection device and
There is an electronic component thermal power higher (electronic component A and electronic component B) on power panel respectively, wherein electronics member
The thermal power of device A is 10W, and the thermal power of electronic component B is 8W, and maximum operating temperature specification is 85 DEG C.It is needing
When carrying out air blast cooling heat dissipation, since structure is blocked, air-flow can not be reached directly where electronic component A and electronic component B
The radiating requirements for being unable to satisfy electronic component A and electronic component B are caused in position.The relative position of two electronic components
It may refer to shown in Fig. 3 A with the air flow method situation of the heat sink of the not set embodiment of the present invention.
Fig. 3 B is the structural schematic diagram of the heat sink embodiment three of the embodiment of the present invention, as shown in Figure 3B, in order to meet electricity
Three opening areas, respectively aperture area can be arranged in the radiating requirements of sub- component A and electronic component B on heat sink
Domain a, opening area b and opening area c, wherein the thermal power due to the thermal power of electronic component A compared with electronic component B is high,
Its required airflow is big compared with electronic component B, it is possible to which the percent opening of setting opening area a corresponding with electronic component A is high
It, then can be with due to there is no electronic component to be located at opening area c in the percent opening of opening area b corresponding with electronic component B
It is not provided with through-hole at opening area c, so that air-flow all turns to opening area a and opening area b, to meet electronic component
The radiating requirements of A and electronic component B.Specifically, the material of heat sink can be rigid plastics, the thickness of heat sink can be
2mm, having a size of 240 × 150mm, the percent opening of opening area a can be set to 80%, and the percent opening of opening area b can be set
It is set to 50%, the percent opening of opening area c can be set to 0 (not aperture), opening area a and the through-hole on opening area b
Shape can be set to rectangle.The arrangement signal of specific through-hole may refer to shown in Fig. 3 B.
Fig. 3 C is the structural schematic diagram being set to heat sink as shown in Figure 3B in projection device, wherein in Fig. 3 C
The air flow method being accordingly shown provided with inside the projection device of heat sink as shown in Figure 3B, as shown in Figure 3 C, heat sink is set
It is placed between air-flow blocking parts and electronic component A, as shown in Figure 3 C, air-flow is before and after by heat sink, the distribution of air-flow
Changed, specifically, the air-flow for flowing to opening area c originally turns and flow to opening area a and opening area b, and
And since the percent opening of opening area a is higher than the percent opening of opening area b, so by the air quantity of opening area a compared with by opening
The air quantity of bore region b is big, and opening area c does not have air-flow, so that air-flow goes to the region for needing to radiate, realizes that air quantity utilizes
Maximization.
Fig. 4 A is another implement scene schematic diagram, as shown in Figure 4 A, in a region of an electronic equipment internal,
There are the fever electronics members of electronic component A, electronic component B and electronic component C totally three identical preset temperature specifications
Device, and the size relation of the thermal power of three electronic components is specially Wa > Wc > Wb.And it is as shown in Figure 4 A, air-flow enters
Only by the region around electronic component B in the region, air-flow is unable to reach around electronic component A and electronic component C
Region so that electronic component B can satisfy radiating requirements, electronic component A and electronic component C are unable to satisfy scattered
Heat demand.The air flow method situation of the heat sink of the relative position and not set embodiment of the present invention of three electronic components can be with
Referring to fig. 4 shown in A.
Fig. 4 B is the structural schematic diagram of the heat sink example IV of the embodiment of the present invention, as shown in Figure 4 B, in order to guarantee
While the radiating requirements of electronic component B, meet the radiating requirements of electronic component A and electronic component C, can radiate
Five opening areas, respectively opening area a, opening area b, opening area c, opening area d and aperture area are set on plate
Domain e, wherein since the thermal power relationship of electronic component A, electronic component B and electronic component C are Wa > Wc > Wb, then
The size relation that the percent opening of above-mentioned five opening areas can be set is f (a) > f (c) > f (b) > f (d)=f (e), with full
The radiating requirements of sufficient electronic component A, electronic component B and electronic component C.The shape of through-hole on five opening areas
It can be set to rectangle.The arrangement signal of specific through-hole may refer to shown in Fig. 4 B.
Fig. 4 C is the structural schematic diagram being set to heat sink as shown in Figure 4 B in electronic equipment, wherein in Fig. 4 C
It is accordingly shown provided with the air flow method of the electronic equipment internal of heat sink as shown in Figure 4 B, as shown in Figure 4 C, air-flow is passing through
It crosses before and after heat sink, the distribution of air-flow is changed, specifically, the airflow portion for flowing to opening area b originally turns
It flow to opening area a, opening area d, opening area e and opening area c, and big due to the percent opening of five opening areas
Small relationship is f (a) > f (c) > f (b) > f (d)=f (e), so that being G (a) by the air-flow size distribution after heat sink
> G (c) > G (b) > G (d) > G (e), so that the electronic component for being located at different opening area vertical direction all may be used
With effectively it is for convection heat dissipation, improve the integral heat sink effect of electronic equipment.
The radiator of the embodiment of the present invention is particularly suitable for the electronic equipment of miniaturization, such as the projection device of miniaturization
In, since projection device calorific value is larger, temperature is increased comparatively fast, it needs to radiate in time, and compact apparatus structure is usually compact,
Excessive fan will not be set, and will not in the structure between increase setting fan and radiate.Therefore, it is necessary to limited
In structure space, the radiator by the way that the embodiment of the present invention is arranged can take into account the radiating requirements of all parts, improve small-sized
Change the radiating efficiency inside projection device, avoids the problem that hot-spot causes component capabilities to decline.
Fig. 5 is the flow chart for the embodiment of the method one that the present invention realizes electronic equipment dissipating heat, as shown in figure 5, the present embodiment
Method may include:
Step 101 obtains the electronic component to be radiated that electronic equipment internal needs to radiate.
It is step 102, true according to the physical parameter of the preset temperature specification of electronic component to be radiated, thermal power and air
Air volume needed for the fixed cooling electronic component to be radiated.
Specifically, according to the thermal power of electronic component to be radiated, preset temperature specification, (i.e. electronic component can be held
The maximum temperature received), the specific heat capacity of air, the density of air, the parameters such as humidity determine cooling electronic component institute to be radiated
The size of required airflow.
Step 103, the position according to electronic component to be radiated and cooling electronic component institute required airflow to be radiated
Size determine heat sink opening area number and opening area percent opening.
Specifically, can determine the number of the opening area of heat sink according to the position of electronic component to be radiated and open
The boundary of bore region, so the air volume according to needed for cooling electronic component to be radiated and the number of opening area and
The boundary of opening area determines the percent opening of the opening area of heat sink.
Step 104, according to the number of the opening area of the heat sink and the percent opening of opening area in the heat sink
Upper setting through-hole.
The heat sink is set to the electronic equipment internal by step 105, by the heat sink by inlet air channel
Air flow guiding branches in the heat dissipation wind channel where the electronic component to be radiated, so that by each after the heat sink
The air force of opening area is redistributed, to meet the heat dissipation for the electronic component to be radiated being located in heat dissipation wind channel
Demand.
Wherein, the inlet air channel is to be formed between the opening area of the heat sink and the air intake vent of the electronic equipment
Airflow channel, the heat dissipation channel be the heat sink opening area and the electronic equipment air outlet at fan it
Between form airflow channel, the percent opening of the opening area corresponding with inlet air channel of the heat sink is less than its of the heat sink
The percent opening of his opening area, the percent opening are the gross area of all through-holes of opening area and total face of the opening area
Long-pending ratio, the physical parameter of the air include the specific heat capacity of air and the density of air.
The present embodiment, the electronic component to be radiated for needing to radiate by obtaining electronic equipment internal, according to wait radiate
Electronic component position and cooling electronic component to be radiated needed for air volume determine the opening area of heat sink
Number and opening area percent opening, according to the percent opening of the number of the opening area of the heat sink and opening area in institute
It states and through-hole is set on heat sink, heat sink is set to electronic equipment internal, shunted by heat sink water conservancy diversion, so that passing through heat dissipation
The air force of each opening area is redistributed after plate, so that meeting under conditions of not improving rotation speed of the fan
The radiating requirements of each electronic component inside projection device.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above-mentioned each method embodiment can lead to
The relevant hardware of program instruction is crossed to complete.Program above-mentioned can be stored in a computer readable storage medium.The journey
When being executed, execution includes the steps that above-mentioned each method embodiment to sequence；And storage medium above-mentioned include: ROM, RAM, magnetic disk or
The various media that can store program code such as person's CD.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. the radiator of a kind of electronic equipment, which is characterized in that the radiator is set to the shell of the electronic equipment
Inside, the radiator include heat sink, and the heat sink includes multiple opening areas, and each opening area is arranged at intervals with
Multiple through-holes form inlet air channel between at least one opening area of the heat sink and the air intake vent of the electronic equipment；
A radiation air is formed between fan at each opening area of the heat sink and the air outlet of the electronic equipment
The electronic component to be radiated in road, the electronic equipment is located in heat dissipation wind channel；
The heat sink is used to branching to the air flow guiding in inlet air channel into the heat dissipation where the electronic component to be radiated
In air duct, the percent opening of the opening area corresponding with inlet air channel of the heat sink is less than other aperture areas of the heat sink
The percent opening in domain, the percent opening are the ratio of the gross area of all through-holes of opening area and the gross area of the opening area
Value；
The electronic component number to be radiated of the electronic equipment be it is multiple, multiple electronic components to be radiated are located at
In one heat dissipation wind channel；
The percent opening of the corresponding opening area of heat dissipation wind channel each where electronic component to be radiated and described to be radiated
Air force needed for cooling electronic component is proportional.
2. the apparatus according to claim 1, which is characterized in that the air intake vent of the heat sink and the electronic equipment enters
Air-flow direction it is vertical.
3. the apparatus according to claim 1, which is characterized in that the air intake vent of the heat sink and the electronic equipment enters
Air-flow direction be in predetermined angle.
4. the apparatus according to claim 1, which is characterized in that section of the heat sink along the thickness direction of the heat sink
Face is rectangle or the quadrangle with radian.
5. device according to claim 4, which is characterized in that if the heat sink is along the thickness direction of the heat sink
Section is the quadrangle with radian, the air intake vent of the protrusion direction of the quadrangle with radian towards electronic equipment.
6. device according to any one of claims 1 to 5, which is characterized in that the cooling electronic component to be radiated
Required air force is determined by the physical parameter of the thermal power of the electronic component to be radiated, preset temperature specification and air
It is fixed；
Wherein, the physical parameter of the air includes the specific heat capacity of air and the density of air.
7. a kind of electronic equipment, which is characterized in that the electronic equipment includes such as heat dissipation as claimed in any one of claims 1 to 6
Device.
8. electronic equipment according to claim 7, which is characterized in that the electronic equipment includes projection device.
9. electronic equipment according to claim 8, which is characterized in that the radiator is set to DMD radiator and electricity
Between the plate of road, the circuit board includes at least one in mainboard, power panel and cowling panel.
10. a kind of method for realizing electronic equipment dissipating heat characterized by comprising
Obtain the electronic component to be radiated that electronic equipment internal needs to radiate；
According to the physical parameter of the preset temperature specification of the electronic component to be radiated, thermal power and air determine it is described to
Air volume needed for the cooling electronic component of heat dissipation；
It is true according to air volume needed for the position of electronic component to be radiated and the cooling electronic component to be radiated
Determine the number of the opening area of heat sink and the percent opening of opening area；
Through-hole is set on the heat sink according to the percent opening of the number of the opening area of the heat sink and opening area；
The heat sink is set to the electronic equipment internal, is shunted the air flow guiding in inlet air channel by the heat sink
Into the heat dissipation wind channel where the electronic component to be radiated, so that passing through the wind of each opening area after the heat sink
Amount size is redistributed, to meet the radiating requirements for the electronic component to be radiated being located in heat dissipation wind channel；
Wherein, the inlet air channel is the gas formed between the opening area of the heat sink and the air intake vent of the electronic equipment
Circulation road, heat dissipation wind channel shape between the fan at the opening area of the heat sink and the air outlet of the electronic equipment
At airflow channel, the percent opening of the opening area corresponding with inlet air channel of the heat sink be less than the heat sink other open
The percent opening of bore region, the percent opening are the gross area of all through-holes of opening area and the gross area of the opening area
Ratio, the physical parameter of the air include the specific heat capacity of air and the density of air.
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| CN201610506200.3A CN105939594B (en) | 2016-06-30 | 2016-06-30 | The radiator and electronic equipment of electronic equipment |
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| CN201610506200.3A CN105939594B (en) | 2016-06-30 | 2016-06-30 | The radiator and electronic equipment of electronic equipment |
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| CN105939594A CN105939594A (en) | 2016-09-14 |
| CN105939594B true CN105939594B (en) | 2018-12-14 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108551012A (en) * | 2018-05-25 | 2018-09-18 | 郑州云海信息技术有限公司 | A kind of electronic equipment and its connector |
| CN110120639A (en) * | 2019-06-25 | 2019-08-13 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | A kind of electronic equipment and electrical cabinet comprising it |
| CN111414062A (en) * | 2020-03-25 | 2020-07-14 | 联想(北京)有限公司 | Electronic apparatus and control method |
| CN111741657B (en) * | 2020-06-30 | 2022-03-25 | 联想(北京)有限公司 | Electronic equipment |
| CN113923962A (en) * | 2021-12-16 | 2022-01-11 | 广东省新一代通信与网络创新研究院 | Electronic equipment cooling system and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203151932U (en) * | 2013-03-28 | 2013-08-21 | 杭州华三通信技术有限公司 | Electronic device by using fan for heat radiation |
| CN104238695A (en) * | 2014-07-08 | 2014-12-24 | 浪潮(北京)电子信息产业有限公司 | Method and server for realizing distributed heat dissipation |
| CN204217288U (en) * | 2014-07-28 | 2015-03-18 | 佛山市顺德区美的电热电器制造有限公司 | Circuit components radiator structure and electromagnetic oven |
| CN205793929U (en) * | 2016-06-30 | 2016-12-07 | 海信集团有限公司 | The heat abstractor of electronic equipment and electronic equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201403273Y (en) * | 2009-03-24 | 2010-02-10 | 深圳市四方电气技术有限公司 | Radiating structure of electronic device |
| CN102103396A (en) * | 2009-12-16 | 2011-06-22 | 纬创资通股份有限公司 | Heat vent mechanism capable of adjusting air flow and portable computer device capable of adjusting air flow |
| TW201314425A (en) * | 2011-09-30 | 2013-04-01 | Hon Hai Prec Ind Co Ltd | Radiator device and electronic device using same |
| JP2015053330A (en) * | 2013-09-05 | 2015-03-19 | 富士通株式会社 | Electronic apparatus |
-
2016
- 2016-06-30 CN CN201610506200.3A patent/CN105939594B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203151932U (en) * | 2013-03-28 | 2013-08-21 | 杭州华三通信技术有限公司 | Electronic device by using fan for heat radiation |
| CN104238695A (en) * | 2014-07-08 | 2014-12-24 | 浪潮(北京)电子信息产业有限公司 | Method and server for realizing distributed heat dissipation |
| CN204217288U (en) * | 2014-07-28 | 2015-03-18 | 佛山市顺德区美的电热电器制造有限公司 | Circuit components radiator structure and electromagnetic oven |
| CN205793929U (en) * | 2016-06-30 | 2016-12-07 | 海信集团有限公司 | The heat abstractor of electronic equipment and electronic equipment |
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Effective date of registration: 20200820 Address after: 266555 Qian WAN port road, Huangdao District, Qingdao, Shandong Province, No. 218 Patentee after: Qingdao Hisense Laser Display Co.,Ltd. Address before: Donghai West Road 266071 Shandong city of Qingdao province No. 17 Patentee before: HISENSE Co.,Ltd. |