CN105891531B - Measure the measurement method of laser scanning speed - Google Patents
Measure the measurement method of laser scanning speed Download PDFInfo
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- CN105891531B CN105891531B CN201510590749.0A CN201510590749A CN105891531B CN 105891531 B CN105891531 B CN 105891531B CN 201510590749 A CN201510590749 A CN 201510590749A CN 105891531 B CN105891531 B CN 105891531B
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- laser
- scanning speed
- laser beam
- beam machining
- mirror
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S11/00—Systems for determining distance or velocity not using reflection or reradiation
- G01S11/14—Systems for determining distance or velocity not using reflection or reradiation using ultrasonic, sonic, or infrasonic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H3/00—Measuring characteristics of vibrations by using a detector in a fluid
- G01H3/04—Frequency
- G01H3/06—Frequency by electric means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
- G01S15/50—Systems of measurement, based on relative movement of the target
- G01S15/58—Velocity or trajectory determination systems; Sense-of-movement determination systems
- G01S15/586—Velocity or trajectory determination systems; Sense-of-movement determination systems using transmission of continuous unmodulated waves, amplitude-, frequency-, or phase-modulated waves and based upon the Doppler effect resulting from movement of targets
Abstract
Provide a kind of measurement method for measuring laser scanning speed.Laser beam machining appts (1) include mirror (7,8), and handle workpiece by irradiation laser (PL).Laser (PL) is irradiated by operation mirror (7,8).The measurement method includes: to scan workpiece by operation mirror (7,8) Lai Liyong laser (PL), and the processing sound of workpiece is measured by microphone using laser beam machining appts (1).In addition, the measurement method includes: to calculate the scanning speed of laser (PL) based on the frequency shift amount of sound is handled caused by Doppler effect using laser beam machining appts (1).
Description
Technical field
The present invention relates to a kind of technologies of method about measurement laser scanning speed.
Background technique
In recent years, thermoprint (hot stamp) material is more widely applied.In thermoprint material, pass through progress
Hot briquetting forms oxidation film on a surface of a steel sheet.Since oxidation film is the factor for reducing paint adhesion, have
Oxidation film on necessity removal surface.As the method for the oxidation film that removal is formed on thermoprint material surface, swashed using pulse
The process for treating surface of light is well known.In the process for treating surface using pulse laser, the determinant packet for the treatment of conditions
Include the laser energy of each pulse, the frequency of oscillation of laser and laser scanning speed.
Inspection equipment using the processing technique of laser includes, for example, publication number 62-114786 (JP62- as described below
114786 A) Japanese patent application described in equipment, be well known.The inspection described in JP62-114786 A
The sound during device detection process is looked into, to check processing status.In such devices, since head scanning speed and head are mobile
Speed is identical, so can easily detect laser scanning speed by detector movement speed.
Meanwhile as laser beam machining appts, in Publication No. 2012-256062 (JP2012-256062 as described below
A a kind of equipment is described in Japanese patent application), the structure not moved with laser irradiating head.In JP 2012-
In laser beam machining appts disclosed in 256062 A, since mirror is operated in the inside of irradiation head, laser is executed
Scanning is without mobile irradiation head itself.
Summary of the invention
Using a kind of laser beam machining appts disclosed in JP 2012-256062 A, not due to irradiation head
It is mobile, so being difficult to measure laser scanning speed.
The present invention provides a kind of measurement method, the laser scanning speed in following laser beam machining appts can be measured
Degree: the laser beam machining appts are constructed such that execute laser scanning by the operation of mirror.
One aspect of the present invention is the measurement method for measuring the laser scanning speed of laser beam machining appts.Laser
Beam process equipment includes mirror, and is configured as handling workpiece by irradiation laser.Laser is irradiated by operation mirror.
The measurement method includes: to utilize laser scanning workpiece by operation mirror, and pass through Mike using laser beam machining appts
Wind measures the processing sound of workpiece.In addition, the measurement method includes: to be imitated using laser beam machining appts based on Doppler
The frequency shift amount of sound is handled caused by answering to calculate the scanning speed of laser.
It, can be by using the laser beam for being configured to be scanned by operating mirror with laser in terms of above-mentioned
Process equipment measures laser scanning speed.
In in terms of above-mentioned, laser beam machining appts can be configured as the average treatment executed to processing sound.It should
The frequency for handling sound is analyzed.
In in terms of above-mentioned, by using the laser beam processing for being configured to be scanned by operation mirror with laser
Equipment, laser scanning speed is by accurately measure.
Detailed description of the invention
Next, with reference to attached drawing, feature, advantage to exemplary embodiment of the present and technical and industrial
Meaning is described, and identical label indicates identical element in figure, in which:
Fig. 1 shows the laser beam according to an embodiment of the present invention for realizing the method for measuring laser scanning speed and adds
The integrally-built schematic diagram of construction equipment;
Fig. 2A shows measurement processing sound in the method according to an embodiment of the present invention for measuring laser scanning speed
State perspective illustration and Fig. 2 B show the method according to an embodiment of the present invention for measuring laser scanning speed
The schematic side view of the state of middle measurement processing sound;
Fig. 3 is the schematic diagram for indicating the irradiating state (overlap condition of the laser of each pulse) of pulse laser;
Fig. 4 A is the processing sound shown in the method according to an embodiment of the present invention for measuring laser scanning speed
The schematic diagram of frequency analysis result in the view of measurement result, showing processing sound;Fig. 4 B is shown according to this hair
It is in the view of processing sound measurement result in the method for the measurement laser scanning speed of bright embodiment, show at average place
The view of result after reason;And
Fig. 5 is to show the schematic diagram of laser beam machining appts (the wherein type that irradiation head is moved).
Specific embodiment
Then, embodiments of the present invention will be described.Firstly, using Fig. 1 and Fig. 5 to the whole of laser beam machining appts
Body structure is illustrated, wherein the method for measurement laser scanning speed according to an embodiment of the present invention is applied to the equipment.Such as
Shown in Fig. 1, laser beam machining appts 1 are the equipment for handling workpiece 10 by irradiated with pulse laser PL, and are constructed
At including scanner 2, optical fiber 3, light receiving element (power meter) 4 and microphone 5.(the so-called galvo-scanner of scanner 2
(galvano scanner)) it include multiple mirrors 6,7,8, and (so-called current mirror (the galvano of mirror therein 7,8
Mirror it)) is configured to rotate around axis different from each other.Scanner 2 is configured to be utilized with mirror 7,8 by operation
The PL of pulse laser is scanned.In brief, laser beam machining appts 1 are constructed such that using irradiating from scanner 2
Pulse laser PL executes scanning, without mobile scanners have been 2 itself.
Meanwhile Fig. 5 shows the overall structure that the present invention is not applied to its laser beam machining appts.As shown in figure 5,
Laser beam machining appts 21 are the equipment of irradiated with pulse laser PL, and by including irradiation head 22, optical fiber 23, light receiving element
(power meter) 24, mirror 25 etc. construct.The laser beam machining appts 21 be configured to by from front to back and from a side to
The mobile irradiation head 22 in the other side itself, Lai Liyong pulse laser PL is scanned.Therefore, the laser beam with above structure is processed
In equipment 21, the scanning speed of pulse laser PL can easily be measured by observing the movement of irradiation head 22.
The method of measurement laser scanning speed according to an embodiment of the present invention allows to using following kind of laser
The scanning speed of pulse laser PL is measured in the case where beam process equipment 1: in the laser beam machining appts 1, passing through mirror 7,8
Operation be scanned using pulse laser PL, rather than surveyed using following kind of laser beam machining appts 21
The scanning speed of the pulse laser PL of amount: in the laser beam machining appts 21, irradiation head 22 is moved.
Referring to figs. 1 to Fig. 4, the operation of laser beam machining appts 1 is illustrated.As shown in Figure 1, constituting scanner 2
Mirror 6 is half-reflecting mirror (half mirror).Pulse laser PL is generated and passes through optical fiber 3 to enter by laser source (not shown)
It penetrates, is transmitted through mirror 6, reflected by mirror 7,8, and be irradiated on workpiece 10, the irradiation of pulse laser PL on workpiece 10
Position is changed according to the operation of mirror 7,8, and pulse laser PL is scanned along zigzag (zigzag) scan line, such as
Shown in Fig. 2A and Fig. 2 B.
As shown in Figure 1, the reflected light RL for the pulse laser PL being radiated on workpiece 10 is reflected by mirror 8,7,6, and enter
It is mapped on light receiving element 4.
As pulse laser PL is illuminated, the superficial layer (for example, oxidation film) of workpiece 10 is removed, such as Fig. 2A and Fig. 2 B institute
Show.Pulse laser PL is illuminated to draw zigzag scan line, and the zigzag scan line is perpendicular to superficial layer processing direction X's
It is swung on the Y of direction.
Microphone 5 is arranged such that the axis direction M of microphone 5 is parallel with direction Y, and direction Y is pulse laser PL
Scan line swaying direction.Microphone 5 is configured to: by back and forth transporting the irradiation position (processing position) of pulse laser PL
It is dynamic, and influenced by Doppler effect the most significant.
As shown in figure 3, pulse laser PL passes through by with the intensity illumination of setting to irradiation model for the irradiation of a pulse
It encloses A and executes processing, and thus give the specified energy of range of exposures A.Then, in the irradiation of next pulse, position is irradiated
It sets and is moved, then specified energy is given next range of exposures A.
Next, illustrating the measurement for handling sound by using 1 pair of laser beam machining appts using Fig. 4 A and Fig. 4 B
Experimental result.In this experiment, ps pulsed laser and ns pulsed laser is used in laser source, and oxidation film (its on the surface of workpiece 10
For thermoprint material) it is removed in the state of 20 DEG C of room temperatures.Then, processing sound is measured by microphone 5.In ps pulsed laser and ns pulsed laser
Frequency of oscillation (processing frequency) be set to carry out the measurement, the scanning speed quilt of pulse laser PL in the state of 15.0KHz
It is set as 9m/s, and microphone 5 is fixed (zero velocity).
Then, in this experiment, it can be verified that be based on the calculated scanning speed of frequency analysis result and actual scanning
Speed is accurately consistent.Therefore, it can be verified that based on processing sound measurement be effective to the calculating of scanning speed.
By using Δ f=f (V-V0)/(V-V1), wherein the velocity of sound is V, frequency of oscillation f, and observer's movement speed is
V0, sound source movement speed are V1, can calculate frequency offset Δ f of the measured processing sound in Doppler effect.?
In the experiment, velocity of sound V is corrected (using Euler's series (Euler ' s series)) as V=331.5+0.6t (t: room temperature).It is excellent
Selection of land, according to the atmospheric pressure as measuring condition, as one sees fit using the updating formula appropriate for being used for velocity of sound V.
Under experimental conditions, the mathematics frequency shift amount Δ f obtained from the calculating using above-mentioned numerical expression is 0.4kHz, because
This, estimates that the shifted frequencies (hereinafter referred to transposition frequency) of measured processing sound are 14.6kHz and 15.4kHz.
Fig. 4 A is shown when workpiece 10 is handled by pulse laser PL, by the frequency point for the processing sound S that microphone 5 measures
The result of analysis.According to Fig. 4 A, when the acoustic pressure for handling sound S becomes designated value Z or bigger, frequency is confirmed as transposition frequency,
It is 14.6kHz and 15.4kHz that the transposition frequency, which can be read,.In this case, the average value of transposition frequency is 15.0kHz,
This value is consistent with the frequency of oscillation f of ps pulsed laser and ns pulsed laser.
As described above, the experimental result according to shown in Fig. 4 A is it can be confirmed that experimental result and calculated result and experiment item
Part is accurately consistent.In brief, it can be verified that the calculation formula based on frequency shift amount Δ f utilizes the measurement of processing sound S
As a result, accurately calculating the scanning speed of pulse laser PL.
In the above-described embodiments, the frequency when acoustic pressure for handling sound S is more than designated value Z is confirmed as transposition frequency.So
And the frequency analysis result for handling sound S can be averaged, and the frequency when peak value of acoustic pressure occurs can be used.Fig. 4 B
Show when workpiece 10 by pulse laser PL handle when, using microphone 5 measure processing sound S frequency analysis as a result,
And the result of the average treatment of the frequency analysis.
According to Fig. 4 B, generally it is consistent with 14.6kHz and 15.4kHz according to the peak value of the acoustic pressure of calculation processing sound S,
14.6kHz and 15.4kHz is transposition frequency.It means that can also be based not only on the processing sound S's measured by microphone 5
Frequency analysis, and swashing as a result, accurately calculating pulse according to the calculation formula for frequency shift amount Δ F based on average treatment
The scanning speed of light PL.
In brief, the method for measurement laser scanning speed according to an embodiment of the present invention is that measurement swashs in a case where
The method of optical scanning speed: in this case, as pulse laser PL is irradiated to the mirror 7,8 for executing laser scanning
In laser beam machining appts 1, workpiece 10 is processed.This method is the processing sound S that workpiece 10 is measured by pulse laser PL, and
The scan velocity V 1. of pulse laser PL is calculated by executing the frequency analysis to measured processing sound S
Using this structure, the scanning speed of pulse laser PL using laser beam machining appts 1, can be measured
V1, the structure which there is irradiation head not move are spent, also, pulse laser is utilized by operation mirror 7,8
PL is scanned.
In the method for measurement laser scanning speed according to an embodiment of the present invention, imitated based on processing sound S in Doppler
Frequency shift amount Δ F in answering calculates the scan velocity V of pulse laser.In addition, in the scan velocity V 1 for calculating pulse laser, frequency
The analyzed processing sound S of rate is averaged.It according to this structure, can be with the scanning speed of accurately measure pulse laser PL
V1。
In the method for measurement laser scanning speed according to an embodiment of the present invention, processing sound S is measured, and is then calculated
Scan velocity V 1., can also be by the vibration that is generated in detection workpiece however, by using Doppler effect, or pass through detection
The reflected light generated during processing, rather than sound is handled, to calculate scan velocity V 1.Using vibration, use
The calculation formula propagated about vibration by substance.In addition, using the Doppler effect about light using light
Calculation formula.
Implement the example for being illustrated the method for the scanning speed for measuring pulse laser PL.However, not being when using
When the laser of pulse laser, scanning speed can also be measured with measurement method according to the present invention.
Claims (2)
1. a kind of measurement method, for measuring the laser scanning speed of laser beam machining appts (1), the laser beam machining appts
(1) include mirror (7,8), and be configured as handling workpiece by irradiation laser (PL), by operating the mirror (7,8)
Irradiate the laser (PL), the measurement method be characterized in that include:
Using the laser beam machining appts (1), utilized by operating the mirror (7,8) described in the laser (PL) scanning
Workpiece, and measure by microphone the processing sound of the workpiece;And
Using the laser beam machining appts (1), calculated based on the frequency shift amount of processing sound caused by Doppler effect
The scanning speed of the laser (PL).
2. measurement method according to claim 1, which is characterized in that the frequency for analyzing measured processing sound includes:
The average treatment to the processing sound is executed, so that the frequency of the processing sound is analyzed.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2014195098A JP6079739B2 (en) | 2014-09-25 | 2014-09-25 | Measuring method of laser scanning speed |
JP2014-195098 | 2014-09-25 |
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CN105891531A CN105891531A (en) | 2016-08-24 |
CN105891531B true CN105891531B (en) | 2019-08-09 |
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US (1) | US10267905B2 (en) |
EP (1) | EP3002567B1 (en) |
JP (1) | JP6079739B2 (en) |
KR (2) | KR102082824B1 (en) |
CN (1) | CN105891531B (en) |
BR (1) | BR102015024421B1 (en) |
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CN108106711B (en) * | 2017-12-11 | 2020-01-31 | 武汉理工大学 | optical fiber vibration pickup and sensing system based on interference filtering principle |
EP3613564B1 (en) * | 2018-08-22 | 2021-06-16 | Concept Laser GmbH | Determination device for determining a scan velocity of an energy beam |
CN111136382A (en) * | 2019-12-29 | 2020-05-12 | 北京航空航天大学合肥创新研究院 | Laser manufacturing process regulation and control method based on sound wave monitoring |
DE102021119426A1 (en) | 2021-07-27 | 2023-02-02 | Bayerische Motoren Werke Aktiengesellschaft | Method for producing a press-hardened shaped sheet metal part, press-hardened shaped sheet metal part produced therewith and plant for manufacturing press-hardened shaped sheet metal parts |
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- 2014-09-25 JP JP2014195098A patent/JP6079739B2/en active Active
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2015
- 2015-09-16 CN CN201510590749.0A patent/CN105891531B/en active Active
- 2015-09-17 US US14/856,862 patent/US10267905B2/en active Active
- 2015-09-22 EP EP15186270.3A patent/EP3002567B1/en active Active
- 2015-09-22 KR KR1020150133739A patent/KR102082824B1/en active IP Right Grant
- 2015-09-23 BR BR102015024421-5A patent/BR102015024421B1/en active IP Right Grant
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- 2017-12-22 KR KR1020170178423A patent/KR20180004051A/en active Application Filing
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JP2016064433A (en) | 2016-04-28 |
KR102082824B1 (en) | 2020-02-28 |
EP3002567B1 (en) | 2019-07-31 |
KR20160036499A (en) | 2016-04-04 |
BR102015024421B1 (en) | 2021-04-27 |
JP6079739B2 (en) | 2017-02-15 |
US10267905B2 (en) | 2019-04-23 |
BR102015024421A2 (en) | 2016-04-19 |
CN105891531A (en) | 2016-08-24 |
KR20180004051A (en) | 2018-01-10 |
US20160091600A1 (en) | 2016-03-31 |
EP3002567A1 (en) | 2016-04-06 |
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