CN105813404B - Processing method and its made circuit board light-guide device in the hole of circuit board - Google Patents
Processing method and its made circuit board light-guide device in the hole of circuit board Download PDFInfo
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- CN105813404B CN105813404B CN201410853173.8A CN201410853173A CN105813404B CN 105813404 B CN105813404 B CN 105813404B CN 201410853173 A CN201410853173 A CN 201410853173A CN 105813404 B CN105813404 B CN 105813404B
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Abstract
Processing method and its made circuit board light-guide device in a kind of hole of circuit board, processing method includes in the hole of circuit board：Circuit board is provided；Circuit board is formed with perforation hole wall and has the coating being formed on perforation hole wall, and coating encirclement defines through-hole and comprising predetermined removal position.Light-guide device is inserted into the through-hole of circuit board；The terminal part of light-guide device is equipped with reflecting surface.The predetermined removal position of coating is adjusted within the region formed to reflecting surface orthographic projection in perforation hole wall.Emit laser beam towards the through-hole of circuit board, laser beam is made to be transferred on the reflecting surface of light-guide device, and laser beam steering is enabled to be radiated at coating via the reflecting surface of light-guide device and make a reservation for remove position, and then remove at least part of coating and make a reservation for remove position.In addition, the present invention separately provides circuit board and the used light-guide device in a kind of hole of foregoing circuit plate made by processing method.
Description
Technical field
A kind of related circuit board of the present invention, and particularly with regard to processing method in a kind of hole of circuit board and its made
Circuit board.
Background technology
Refering to Figure 1, it is custom circuit plate 100a, include a plate 1a and a conductive layer 2a.Wherein, it is above-mentioned
Plate 1a is formed with a perforation 11a, and the road 12a that sunkens cord mostly is formed at least one in plate 1a, and conductive layer 2a is then shape
Into on the hole wall in above-mentioned perforation 11a.However, the custom circuit plate 100a designs of above-mentioned Fig. 1 will be such that current distributing makees for one
Streaming current IAWith a delayed current IB, that is to say, that due to delayed current IBInto the time point meeting and start of the interior road 12a that sunkens cord
Electric current IAIt is poor into generation time between the time point of the interior road 12a that sunkens cord, and then enable the signal for being transferred to the interior road 12a that sunkens cord can not
Maintain its integrality.
Accordingly, existing improvement mode is that custom circuit plate 100a shown in Fig. 1 carries out back drill (back
Drilling), use to form circuit board 100a constructions as shown in Figure 2.In more detail, through the step of back drill, in conduction
Layer 2a is formed drilling 13a and is removed with the position that will need not be used to, and reduces loss electric current IBGeneration, and then keep signal it
Integrality.Furthermore circuit board intensive porose area (such as：Near ball bar structure of arrays), above-mentioned back drill mode even more easily makes phase
The drilling 13a hypotelorisms of neighbour connect and signal transmission quality are caused to decline.Accordingly, the mode of above-mentioned back drill has its limitation
In the presence of, and may cause to be unfavorable for the influence of the follow-up research and development of circuit board.
Then, the above-mentioned missing of the present inventor's thoughts can improve, and be that spy concentrates on studies and coordinates the utilization of scientific principle, carry finally
Go out a kind of reasonable design and be effectively improved the present invention of above-mentioned missing.
Invention content
The embodiment of the present invention is to provide processing method and its made circuit board in a kind of hole of circuit board, can be effective
Ground improves the limitation produced by the back drill mode of custom circuit plate.
The embodiment of the present invention provides processing method in a kind of hole of circuit board, including：One circuit board is provided；Wherein, the electricity
Road plate is formed with a perforation hole wall, and the circuit board has the coating being formed on the perforation hole wall, the coating packet
It encloses and defines a through-hole, and the coating includes a predetermined removal position；One external form is corresponded roughly to the leaded light of the through-hole
Element is inserted into the through-hole of the circuit board；Wherein, the terminal part for being placed in the light-guide device in the through-hole is equipped with a reflecting surface；
The predetermined removal position of the coating is adjusted within the region formed to the reflecting surface orthographic projection in the perforation hole wall；And
Emit a laser beam towards the through-hole of the circuit board, the laser beam is made to be transferred on the reflecting surface of the light-guide device, and via this
The reflecting surface of light-guide device and laser beam steering is enabled to be radiated at the predetermined removal position of the coating, and then remove at least partly
The coating make a reservation for remove position.
Preferably, the coating is a conductive layer；In the step of through-hole towards the circuit board emits the laser beam, hold
Supervention penetrates the laser beam, until the predetermined removal position of the conductive layer is completely removed, and is separated from each other conductive layer formation
Two conductive parts.
Preferably, the coating includes a conductive layer and a shielding layer, which is formed on the perforation hole wall, should
Shielding layer, which is formed on the conductive layer and surrounds, defines the through-hole；Emit the step of the laser beam in the through-hole towards the circuit board
In rapid, persistently emit the laser beam, until the predetermined removal position of the shielding layer is completely removed, so that the conductive layer is predetermined
Removal position is exposed to outer；The predetermined removal position of the conductive layer is etched with an etching solution, is mutually divided so that the conductive layer is formed
From two conductive parts.
The embodiment of the present invention separately provides more than one and states circuit board in the hole of circuit board made by processing method, including：
One perforation hole wall；And a conductive layer, it is formed on the perforation hole wall, which, which is formed with, makes outside the perforation hole wall of part
One notch of dew, and the conductive layer is separated into two conductive parts through the notch.
In conclusion processing method in the hole for the circuit board that the embodiment of the present invention is provided, can penetrate and utilize guide-lighting member
The cooperation of part and laser beam, and be processed in the perforation of circuit board, it uses to provide in a kind of hole different from the past and process
Mode and made circuit board, and then overcome the limitation for commonly using back drill mode.
For the enabled feature and technology contents for being further understood that the present invention, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, but these explanations are only for illustrating the present invention rather than the interest field of the present invention being appointed with institute's accompanying drawings
What limitation.
Description of the drawings
Fig. 1 is the schematic diagram of custom circuit plate.
Fig. 2 is the schematic diagram after the custom circuit plate processing in Fig. 1.
Fig. 3 is the step S101 schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Fig. 4 is the step S102 of processing method first embodiment and step S103 schematic diagrames in the hole of circuit board of the present invention.
Fig. 5 is the step S104 schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Fig. 6 is the step S105 schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Fig. 7 is the step S104 ' schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Fig. 8 is the step S201 schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Fig. 9 is the step S202 of processing method first embodiment and step S203 schematic diagrames in the hole of circuit board of the present invention.
Figure 10 is the step S204 schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Figure 11 is the step S205 schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Figure 12 is the step S206 schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Figure 13 is the step S204 ' schematic diagrames of processing method first embodiment in the hole of circuit board of the present invention.
Specific embodiment
[first embodiment]
Fig. 3 to Fig. 7 is please referred to, is the first embodiment of the present invention, need to first be illustrated, the present embodiment correspondence pattern institute
The correlated measure and external form referred to, only to specifically describe embodiments of the present invention, in order to understand its content, Er Feiyong
With the interest field of the limitation present invention.
The present embodiment provides processing method in a kind of hole of circuit board, and for ease of understanding, the present embodiment is with circuit board
For one unit area, and the sectional view for each step of arranging in pairs or groups is described.Wherein, the schema corresponding to refering to each step
When, and please optionally consider the schema of other steps in light of actual conditions together.And in the hole in relation to the present embodiment circuit board processing method step
General description is as follows：
Step S101：As shown in figure 3, provide a circuit board 100；Wherein, circuit board 100 is formed with a perforation hole wall 1, and
And circuit board 100 has the coating 2 being formed on perforation hole wall 1.Coating 2, which surrounds, defines rounded logical of a nodal section
Hole 21, and coating 2 surrounds definition and has positioned at one first opening 211 of 21 two opposite sides of through-hole and one second opening 212；And
And the coating 2 includes a predetermined removal position 221 (in this present embodiment, above-mentioned predetermined removal position 221 is substantially covered
The central part of cap rock 2).
In more detail, the coating 2 is in this present embodiment a conductive layer 22, therefore in the description below, coating 2
It is directly represented with conductive layer 22, and the thickness of above-mentioned conductive layer 22 is required pre- in practical application less than circuit board 100
Determine thickness.The conductive layer 22 be preferably black brown after layers of copper, use conducive in subsequent step absorb laser beam and be easy to by
Etching removes.
In addition, the circuit board 100 can be laminated plates, that is, circuit board 100 has the plate body of number layer stack (figure omits)
And gluing appoints the colloid (figure omits) of two-phase reactor pallet body, at least one of which plate body of foregoing circuit plate 100 is formed at least
One conducting wire (figure omits), to be used as signal transmission.Wherein, the plate body is typically with the prepreg bed of material
(Preimpregnated Material) is formed, is divided according to different reinforcing materials, the prepreg bed of material can be glass fibers
Tie up prepreg (Glass fiber prepreg), carbon fibre initial rinse material (Carbon fiber prepreg), epoxy resin
Materials such as (Epoxy resin).But, plate body can also be formed with soft board material, that is to say, that plate body be largely by
Polyester material (Polyester, PET) or polyimide resin (Polyimide, PI) are formed without containing glass fibers
Dimension, carbon fiber etc..However, embodiments of the present invention are not limited the material of plate body.
Step S102：As shown in figure 4, a light-guide device 200 is inserted into through-hole via the first opening 211 of circuit board 100
21；Wherein, above-mentioned light-guide device 200 includes a generally cylindrical body part 201 and from 201 ora terminalis (such as Fig. 4 of body part
Shown in 201 top edge of body part) terminal part 202 that integrally extends.The external form of above-mentioned body part 201 corresponds to through-hole
21, also that is, the 21 cross sectional shape phase of through-hole that body part 201 is substantially plugged perpendicular to the cross sectional shape of its long axis direction with it
Together, use after light-guide device 200 is made to be inserted into through-hole 21,201 side surface of body part of light-guide device 200 can substantially with conductive layer
Gapless setting is presented between 22.Furthermore the terminal part 202 of the light-guide device 200 is placed in through-hole 21 and sets (as plated
If) there is a coniform reflecting surface 203.
In more detail, the terminal part 202 of the light-guide device 200 is in cone in this present embodiment, terminal part 202
Maximum gauge is no more than (such as：Be substantially equal to) diameter of body part 201, and terminal part 202 be by 201 ora terminalis of body part along
The long axis direction of body part 201 is extended to form by being gradually reduced in a manner of diameter.Furthermore the reflecting surface 203 is as above-mentioned
The outer surface of terminal part 202 and preferably smooth minute surface, use the effect for reaching fully reflective laser beam.
Step S103：It is just being thrown as shown in figure 4, adjusting at the predetermined removal position 221 of above-mentioned conductive layer 22 to reflecting surface 203
Within the region that shadow is formed in perforation hole wall 1.In more detail, through mobile light-guide device 200 or circuit board 100, with
The relative position of both light-guide device 200 or circuit board 100 is adjusted, and then makes 221, the predetermined removal position of conductive layer 22
In the outside of reflecting surface 203.
Step S104：As shown in figure 5, a laser beam is emitted with the through-hole 21 of a laser equipment 300 towards circuit board 100
301, and laser beam 301 is incident to the through-hole 21 of circuit board 100 via the second opening 212, is transferred to laser beam 301 and leads
On the reflecting surface 203 of optical element 200, use via the reflecting surface 203 of light-guide device 200 and enable laser beam 301 radially
The predetermined removal position 221 for being radiated at conductive layer 22 is turned to, and then removes the predetermined removal position 221 of conductive layer 22.Wherein, institute
It states laser equipment 300 and persistently emits laser beam 301, until the predetermined removal position 221 of above-mentioned conductive layer 22 is completely removed, by
So that conductive layer 22 forms two conductive parts 222 being separated from each other.
It should be noted that by 301 intensity of laser beam that reflecting surface 203 is reflected, be from far from body part 201 towards ontology
201 direction of portion (also that is, by 203 top of reflecting surface to bottom end direction in Fig. 5) gradually successively decrease it is weak so that far from body part
Corresponding to 201 203 position of reflecting surface to the part of predetermined removal position 221 will first be completely removed, and then persistently corrode and pass through
Hole hole wall 1, until adjacent body portion 201 203 position of reflecting surface corresponding to predetermined removal position 221 be completely removed.
Accordingly, after predetermined removal position 221 is completely removed, perforation hole wall 1 will form a circular recess 11, and above-mentioned
The depth of recess 11 is gradually reduced from far from body part 201 towards 201 direction of body part.
A bit, above-mentioned steps are by taking conductive layer 22 forms two conductive parts 222 being separated from each other as an example, but not to supplementary explanation
Conductive layer 22 is formed over the conductive part (figure omits) being separated from each other of two or more by exclusion.For example, in this step S104
Later, a predetermined removal position (figure omits) is additionally provided in one of above-mentioned two conductive part 222 conductive part 222, then repeated
Implement above-mentioned steps S102 to step S104, you can conductive layer 22 is made to form three conductive parts being separated from each other (figure omits).
Step S105：As shown in fig. 6, at least one in two conductive part 222 implements plating, increased with forming one
Mend conductive layer 3；Wherein, the material of above-mentioned supplement conductive layer 3 is the same as the material of the conductive layer 22, and augments conductive layer
3 with its accompanying by the overall thickness of both conductive parts 222 be the required predetermined thickness when in use of circuit board 100.
It should be noted that be that the conductive part 222 being only located above in figure 6 is implemented for being electroplated in this present embodiment, but
It is not precluded within above-mentioned two conductive part 222 while implements to be electroplated or only underlying conductive part 222 implements plating in figure 6.
After the step S101 to step S105 for implementing the above, circuit board 100 as shown in Figure 6 can be completed,
But when practical application, each step is not excluded for substituting with reasonable variation aspect.For example, as shown in fig. 7, this is step
The conversion step S104 ' of S104, wherein, light-guide device 200 is transparent light guide, and 200 terminal part 202 of light-guide device is in circle
Taper groove.Therefore, laser equipment 300 is laser beam 301 to be incident in light-guide device 200, and then be transferred to light-guide device
200 reflecting surface 203.
In addition, when the aperture of through-hole 21 is excessive, can laser be rotated as axle center using the central axis of light-guide device 200 and set
Standby 300, the laser beam 301 that laser equipment 300 is sent out is made to be irradiated on reflecting surface 203 along the track of annular shape.Furthermore when
When the aperture of through-hole 21 is smaller, the component such as optical fiber can also be used in light-guide device 200.
In addition, though it is for above-mentioned that the light-guide device 200 of the present embodiment, which constructs, it can also require and be subject to according to designer
Variation.For example, in another embodiment not being painted, the terminal part of the light-guide device can form the reflection of monoclinic
Face, and the mode of rotation light-guide device is penetrated to reach the effect that reflecting surface is in circular mode reflection laser beam.
Then, it is following to be directed to the explanation that circuit board 100 shown in fig. 6 makees a structure technology feature.Wherein, due to many
Construction refers to that therefore, part something in common is then no longer repeated in above-mentioned manufacturing method.The circuit board 100 includes consistent
Hole hole wall 1, the conductive layer 22 being formed on perforation hole wall 1, the supplement conductive layer being formed at least part conductive layer
3.Wherein, above-mentioned conductive layer 22 is formed with the notch 223 for making part perforation hole wall 1 exposed, and conductive layer 22 is through notch 223
And two conductive parts 222 are separated into, and the supplement conductive layer 3 is then formed at least one of above-mentioned two conductive part 222.
[second embodiment]
Fig. 8 to Figure 13 is please referred to, is the second embodiment of the present invention, need to first be illustrated, the present embodiment correspondence pattern
Mentioned correlated measure and external form, only to specifically describe embodiments of the present invention, in order to understand its content rather than
To limit to the interest field of the present invention.
The present embodiment also provides processing method in a kind of hole of circuit board, and it is then no longer superfluous to be identical with the first embodiment part
It states.And the step general description of processing method is as follows in the hole in relation to the present embodiment circuit board：
Step S201：As shown in figure 8, provide a circuit board 100；Wherein, circuit board 100 is formed with a perforation hole wall 1, and
And circuit board 100 has the coating 2 being formed on perforation hole wall 1.Coating 2, which surrounds, defines rounded logical of a nodal section
Hole 21, and above-mentioned coating 2 surrounds definition and has positioned at one first opening 211 of 21 two opposite sides of through-hole and one second opening
212；And coating 2 include a predetermined removal position 221,231 (in this present embodiment, above-mentioned predetermined removal position 221,
The central part of 231 substantially coatings 2).
In more detail, the coating 2 is in this present embodiment a conductive layer 22 and a shielding layer 23, conductive layer 22
It is formed on perforation hole wall 1, shielding layer 23, which is formed on conductive layer 22 and surrounds, defines above-mentioned through-hole 21.Wherein, it is above-mentioned to lead
It is the required predetermined thickness in practical application of circuit board 100 that electric layer 22, which is preferably layers of copper and its thickness, and the masking
Layer 23 is preferably suitable for absorbing laser beam and being easy to removed material, and e.g. organic material is (such as：Resin) or metal material
Material is (such as：Tin).
Step S202：As shown in figure 9, a light-guide device 200 is inserted into through-hole via the first opening 211 of circuit board 100
21；Wherein, above-mentioned light-guide device 200 includes a generally cylindrical body part 201 and from 201 ora terminalis (such as Fig. 9 of body part
Shown in 201 top edge of body part) terminal part 202 that integrally extends.The external form of above-mentioned body part 201 corresponds to through-hole
21, also that is, the 21 cross sectional shape phase of through-hole that body part 201 is substantially plugged perpendicular to the cross sectional shape of its long axis direction with it
Together, use after light-guide device 200 is made to be inserted into through-hole 21,201 side surface of body part of light-guide device 200 can substantially with shielding layer
Gapless setting is presented between 23.Furthermore the terminal part 202 of the light-guide device 200 is placed in through-hole 21 and sets (as plated
If) there is a coniform reflecting surface 203.It should be noted that the light-guide device 200 of the present embodiment construct substantially with first embodiment
Light-guide device 200 construct it is identical.
Step S203：As shown in figure 9, the predetermined removal position 221,231 of above-mentioned coating 2 is adjusted to reflecting surface 203
Within the region that orthographic projection is formed in perforation hole wall 1.In more detail, through mobile light-guide device 200 or circuit board
100, to adjust the relative position of both light-guide device 200 or circuit board 100, and then make the predetermined removal position of shielding layer 23
231 are located at the outside of reflecting surface 203.
Step S204：As shown in Figure 10, a laser beam is emitted with the through-hole 21 of a laser equipment 300 towards circuit board 100
301, and laser beam 301 is incident to the through-hole 21 of circuit board 100 via the second opening 212, is transferred to laser beam 301 and leads
On the reflecting surface 203 of optical element 200, use via the reflecting surface 203 of light-guide device 200 and enable laser beam 301 radially
The predetermined removal position 231 for being radiated at shielding layer 23 is turned to, and then removes the predetermined removal position 231 of shielding layer 23.Wherein, thunder
Jet device 300 persistently emits laser beam 301, until the predetermined removal position 231 of shielding layer 23 is completely removed, makes shielding layer 23
A notch 232 is formed with, and the predetermined removal position 221 of above-mentioned conductive layer 22 is exposed to outside via above-mentioned notch 232.
Step S205：As shown in figure 11, the predetermined removal position 221 of the conductive layer 22 is etched with an etching solution, is used
Conductive layer 22 is made to form two conductive parts 222 being separated from each other.And during above-mentioned etching solution etches conductive layer 22, conductive layer
Part other than 22 predetermined removal position 221, will be shielded from the covering protection of layer 23, and then avoid being etched liquid and be lost
It carves.
A bit, above-mentioned steps are by taking conductive layer 22 forms two conductive parts 222 being separated from each other as an example, but not to supplementary explanation
Conductive layer 22 is formed over the conductive part (figure omits) being separated from each other of two or more by exclusion.For example, in this step S203
Later, a predetermined removal position (figure omits) is additionally provided on remaining shielding layer 23, then repeat to implement above-mentioned steps S202 with
Step S203, you can shielding layer 23 is made separately to be formed there are one notch (figure omits), is continued and implementation steps S204, you can make conductive layer 22
Form three conductive parts being separated from each other (figure omits).
Step S206：As shown in figure 12, it is formed in conductive layer 22 after two conductive parts 222 being separated from each other, removal masking
Layer 23.
After the step S201 to step S206 for implementing the above, circuit board 100 as shown in figure 12 can be completed,
But when practical application, each step is not excluded for substituting with reasonable variation aspect.For example, as shown in figure 13, this is step
The conversion step S204 ' of S204, wherein, the light-guide device 200 is transparent light guide, and the end of light-guide device 200
Portion 202 is in coniform groove.Therefore, laser equipment 300 is that laser beam 301 is incident in light-guide device 200, and then is transferred to
The reflecting surface 203 of light-guide device 200.
Then, following explanations that will make a structure technology feature for the circuit board 100 shown in Figure 12.Wherein, due to being permitted
More constructions refer to that therefore, part something in common is then no longer repeated in above-mentioned manufacturing method.The circuit board 100 includes one
Perforation hole wall 1 and the conductive layer 22 being formed on perforation hole wall 1.Wherein, above-mentioned conductive layer 22, which is formed with, makes part perforation
The exposed notch 223 of hole wall 1, and conductive layer 22 is separated into two conductive parts 222 through notch 223.
[the possibility effect of the embodiment of the present invention]
In conclusion processing method in the hole for the circuit board that the embodiment of the present invention is provided, penetrates and utilizes light-guide device
It with the cooperation of laser beam, and is processed in the perforation of circuit board, so that the conductive layer on the perforation hole wall of circuit board can
Two conductive parts are separated into, uses and processing method and made circuit board in a kind of hole different from the past, Jin Erke is provided
The limitation of acclimation back drill mode.
Furthermore since the conductive layer on the perforation hole wall of circuit board can be separated into several conductive parts, and above-mentioned lead
Electric portion can be each provided with the function of conducting, use and achieve the effect that save processing cost and increase wiring density.
The foregoing is merely the preferable possible embodiments of the present invention, all not to limit to the scope of the claims of the present invention
The equivalent changes and modifications done according to scope of the present invention patent should all belong to the covering scope of the present invention.
【Symbol description】
[known]
100a circuit boards
1a plates
11a perforations
It sunkens cord in 12a road
13a drills
2a conductive layers
IAMake streaming current
IBLoss electric current
[embodiment of the present invention]
100 circuit boards
1 perforation hole wall
11 recesses
2 coatings
21 through-holes
211 first openings
212 second openings
22 conductive layers
221 predetermined removal positions
222 conductive parts
223 notches
23 shielding layers
231 predetermined removal positions
232 notches
3 supplement conductive layers
200 light-guide devices
201 body parts
202 terminal parts
203 reflectings surface
300 laser equipments
301 laser beams.
Claims (9)
1. a kind of processing method in hole of circuit board, which is characterized in that including：
One circuit board is provided；Wherein, which is formed with a perforation hole wall, and the circuit board has and is formed in the perforation hole
A coating on wall, coating encirclement defines a through-hole, and the coating includes a predetermined removal position；
One external form is inserted into the through-hole of the circuit board corresponding to the light-guide device of the through-hole；Wherein, it is placed in being somebody's turn to do in the through-hole
One terminal part of light-guide device is equipped with a reflecting surface；
The predetermined removal position of the coating is adjusted within the region formed to the reflecting surface orthographic projection in the perforation hole wall；
And
Emit a laser beam towards the through-hole of the circuit board, the laser beam is made to be transferred on the reflecting surface of the light-guide device, and pass through
Laser beam steering is enabled to be radiated at the predetermined removal position of the coating by the reflecting surface of the light-guide device, and then is removed at least
The partial coating makes a reservation for remove position.
2. processing method in the hole of circuit board according to claim 1, wherein, which is a conductive layer；In direction
The through-hole of the circuit board emitted in the step of laser beam, persistently emitted the laser beam, until the predetermined removal portion of the conductive layer
Position is completely removed, and two conductive parts for being separated from each other conductive layer formation.
3. processing method in the hole of circuit board according to claim 2, wherein, it is somebody's turn to do what conductive layer formation was separated from each other
After two conductive parts, at least one in two conductive part implements plating, to form a supplement conductive layer；Wherein, the increasing
The overall thickness for mending both conductive layer and the conductive part accompanying by it is a predetermined thickness.
4. processing method in the hole of circuit board according to claim 3, wherein, the material of the conductive layer is identical to the supplement
The material of conductive layer.
5. processing method in the hole of circuit board according to claim 1, wherein, which includes a conductive layer and one
Shielding layer, the conductive layer are formed on the perforation hole wall, which, which is formed on the conductive layer and surrounds, defines the through-hole；
In the step of through-hole towards the circuit board emits the laser beam, persistently emit the laser beam, until the shielding layer is predetermined
Removal position is completely removed, so that the predetermined removal position of the conductive layer is exposed to outside；The conductive layer is etched with an etching solution
Predetermined removal position so that two conductive parts that are separated from each other of conductive layer formation.
6. processing method in the hole of circuit board according to claim 5, wherein, the thickness of the conductive layer is a predetermined thickness
Degree；After two conductive part being separated from each other in conductive layer formation, the shielding layer is removed.
7. processing method in the hole of circuit board according to any one of claim 1 to 6, wherein, which is somebody's turn to do
Terminal part is in cone, and the coating surrounds definition and has one first opening positioned at the through-hole two opposite sides to be opened with one second
Mouthful；The light-guide device be via this first opening be inserted into the circuit board through-hole, and the laser beam be via this second opening and
It is incident to the through-hole of the circuit board.
8. processing method in the hole of circuit board according to any one of claim 1 to 6, wherein, which is
Bright light guide, and the light-guide device terminal part is in coniform groove；The laser beam is incident in the light-guide device, Jin Erchuan
It is handed to the reflecting surface of the light-guide device.
9. the circuit board in a kind of hole of circuit board of basis as described in claim 2 or 5 made by processing method, feature exist
In, including：
One perforation hole wall；And
One conductive layer is formed on the perforation hole wall, which is formed with the notch for making the part perforation hole wall exposed,
And the conductive layer is separated into two conductive parts through the notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410853173.8A CN105813404B (en) | 2014-12-31 | 2014-12-31 | Processing method and its made circuit board light-guide device in the hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410853173.8A CN105813404B (en) | 2014-12-31 | 2014-12-31 | Processing method and its made circuit board light-guide device in the hole of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105813404A CN105813404A (en) | 2016-07-27 |
| CN105813404B true CN105813404B (en) | 2018-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410853173.8A Active CN105813404B (en) | 2014-12-31 | 2014-12-31 | Processing method and its made circuit board light-guide device in the hole of circuit board |
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| CN (1) | CN105813404B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10481496B2 (en) * | 2017-06-28 | 2019-11-19 | International Business Machines Corporation | Forming conductive vias using a light guide |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2671079Y (en) * | 2002-09-17 | 2005-01-12 | 雅马哈株式会社 | Electronic apparatus and panel structure thereof |
| EP1073321A3 (en) * | 1999-07-27 | 2005-09-07 | Matsushita Electric Works, Ltd. | Processing method of printed wiring board |
| JP2008205070A (en) * | 2007-02-19 | 2008-09-04 | Matsushita Electric Ind Co Ltd | Printed wiring board and manufacturing method therefor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI394504B (en) * | 2005-05-31 | 2013-04-21 | Hitachi Via Mechanics Ltd | Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor |
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2014
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1073321A3 (en) * | 1999-07-27 | 2005-09-07 | Matsushita Electric Works, Ltd. | Processing method of printed wiring board |
| CN2671079Y (en) * | 2002-09-17 | 2005-01-12 | 雅马哈株式会社 | Electronic apparatus and panel structure thereof |
| JP2008205070A (en) * | 2007-02-19 | 2008-09-04 | Matsushita Electric Ind Co Ltd | Printed wiring board and manufacturing method therefor |
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| CN105813404A (en) | 2016-07-27 |
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