CN105810599A - Substrate embedded with fingerprint identification chip and processing method thereof - Google Patents
Substrate embedded with fingerprint identification chip and processing method thereof Download PDFInfo
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- CN105810599A CN105810599A CN201410842337.7A CN201410842337A CN105810599A CN 105810599 A CN105810599 A CN 105810599A CN 201410842337 A CN201410842337 A CN 201410842337A CN 105810599 A CN105810599 A CN 105810599A
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- 239000000758 substrate Substances 0.000 title claims abstract description 98
- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 238000005476 soldering Methods 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 36
- 239000004033 plastic Substances 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract 5
- 241000218202 Coptis Species 0.000 description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Image Input (AREA)
Abstract
The invention discloses a substrate embedded with an embedded fingerprint identification chip and a processing method thereof in order to reduce the technology complexity and packaging cost of the substrate embedded with the fingerprint identification chip. The processing method comprises steps of providing a finger identification chip and a carrier plate, plastering one side of the fingerprint identification chip which is provided with a welding plate on the carrier plate, stacking a layer-adding structure on the side of the carrier plate which is provided with the fingerprint identification chip by plastering and compressing to form a substrate adhered on the carrier plate, embedding the fingerprint identification chip in the substrate, separating the carrier plate from the substrate, wherein one side of the substrate which exposes the side of the fingerprint identification chip which has the welding plate, forming a first metal layer on one side of the substrate where the fingerprint identification chip is exposed, performing outer layer pattern processing on the substrate, and forming a welding plate connection circuit on one side of the substrate where the fingerprint identification chip is exposed, wherein the welding plate connection circuit is connected to the welding plate of the fingerprint identification chip.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of substrate imbedding fingerprint recognition chip and processing method thereof.
Background technology
Common chip package is generally adopted the mode of routing (wirebonding).As it is shown in figure 1, the lower surface of chip 901 is mounted on substrate 902, the pad 903 of chip 901 is located thereon surface, is generally adopted routing mode at present and makes pad 903 by the pad on gold thread 904 and substrate 902 or connection.Owing to the gold thread 904 of routing is bent with certain radian, the peak of gold thread 904 can 50-100um higher than chip 901, so the height of plastic packaging glue 905 can be higher 100-200um than chip after plastic packaging.
Encapsulation for fingerprint recognition chip, owing to needs gather finger print information, therefore it is required that the thickness of the plastic packaging glue of fingerprint recognition chip surface is as far as possible little, and the plastic packaging glue thickness on the chip packaging method chips surface of above-mentioned direct routing has reached 100-200um, it is impossible to meet the encapsulation requirement of fingerprint recognition chip.
For solving this problem, as shown in Figure 2, the method for packing of existing a kind of fingerprint recognition chip includes: first carry out step groove making on fingerprint recognition chip 801 surface, the pad 802 on fingerprint recognition chip 801 surface is connected on the new pad 803 of step of a lower horizontal plane by special processing technique, when so carrying out routing, gold thread 804 can be beaten on the new pad 803 of low one-level, the thickness of plastic packaging glue 805 above fingerprint recognition chip 801 just can be reduced when carrying out plastic packaging again, never guarantee that fingerprint recognition chip 801 can normally identify fingerprint, normal operation.
Practice finds, it is bigger that the chip packaging method of above-mentioned direct routing forms plastic packaging glue thickness at chip surface, it is impossible to meets the encapsulation requirement of fingerprint recognition chip；The above-mentioned step groove that first carries out processes the chip packaging method of routing again, owing to step groove processing technique is complicated, chip package cost can be significantly increased.
Summary of the invention
The embodiment of the present invention provides a kind of substrate imbedding fingerprint recognition chip and processing method thereof, to reduce process complexity and the packaging cost of the substrate of embedment fingerprint recognition chip.
First aspect present invention provides the processing method of a kind of substrate imbedding fingerprint recognition chip, including: fingerprint recognition chip and support plate are provided, the one side with pad of described fingerprint recognition chip is mounted on described support plate；In the one side stacking layer reinforced structure having mounted described fingerprint recognition chip the pressing of described support plate, form the substrate being attached on described support plate, in the chip buried described substrate of described fingerprint recognition；Being separated with described substrate by described support plate, the one side of described substrate manifests the one side with pad of described fingerprint recognition chip；The one side appearing described fingerprint recognition chip at described substrate forms the first metal layer；Described substrate is carried out outer graphics processing, and the one side appearing described fingerprint recognition chip at described substrate forms soldering pad connection line road, and described soldering pad connection line road is connected with the pad of described fingerprint recognition chip.
Second aspect present invention provides a kind of substrate imbedding fingerprint recognition chip, and in described substrate, embedment has fingerprint recognition chip, and the one side with pad of described fingerprint recognition chip is revealed in the one side of described substrate；
The one side appearing described fingerprint recognition chip of described substrate has soldering pad connection line road, and described soldering pad connection line road is connected with the pad on described fingerprint recognition chip.
Therefore, the embodiment of the present invention is by utilizing support plate auxiliary lamination, in fingerprint recognition chip buried base plate, soldering pad connection line road will be formed at substrate surface and realizes the technical scheme that base plate line is connected with fingerprint recognition chip bonding pad, achieve techniques below effect:
The embodiment of the present invention utilizes soldering pad connection line road, it is achieved that the electrical connection of fingerprint recognition chip and substrate；Mode relative to direct routing, the thickness on soldering pad connection line road is only small, have only to when carrying out plastic packaging form plastic packaging glue one layer very thin at fingerprint recognition chip surface, for instance thickness is even less than the plastic packaging glue of 50um less than 100, without influence on the functional realiey of fingerprint recognition chip；
Relative to existing packaged type, owing to not needing routing, it is not required that fingerprint recognition chip is carried out step groove processing, both simplify processing technique, reduced process complexity, eliminated again the expensive materials such as gold thread, significantly reduce cost.
Accompanying drawing explanation
In order to be illustrated more clearly that embodiment of the present invention technical scheme, the accompanying drawing used required in embodiment and description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is existing a kind of chip-packaging structure schematic diagram；
Fig. 2 is existing another kind of chip-packaging structure schematic diagram；
Fig. 3 is the flow chart of the processing method of the substrate of the embedment fingerprint recognition chip of the embodiment of the present invention；
Fig. 4 a-4g adopts embodiment of the present invention method to carry out substrate to add the structural representation in each process segment in the man-hour.
Detailed description of the invention
The embodiment of the present invention provides the processing method of a kind of substrate imbedding fingerprint recognition chip, to reduce process complexity and the packaging cost of the substrate of embedment fingerprint recognition chip.The embodiment of the present invention also provides for imbedding accordingly the substrate of fingerprint recognition chip.
In order to make those skilled in the art be more fully understood that the present invention program, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a present invention part, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, all should belong to the scope of protection of the invention.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Refer to Fig. 3, the embodiment of the present invention provides the processing method of a kind of substrate imbedding fingerprint recognition chip, it may include:
110, provide fingerprint recognition chip and support plate, the one side with pad of fingerprint recognition chip is mounted on support plate.
As shown in fig. 4 a, being the schematic diagram of a kind of fingerprint recognition chip 20 that the embodiment of the present invention provides, the upper surface of fingerprint recognition chip 20 is functional surfaces 201, is used for identifying fingerprint, and functional surfaces 201 has one or more pad 202, as the port externally connected.It should be noted that the structure of the fingerprint recognition chip 20 shown in Fig. 4 a is only a kind of example, in other embodiments, it is also possible to be other version.
As shown in Figure 4 b, it is the schematic diagram of a kind of support plate 30 that provides of the embodiment of the present invention.Support plate 30 is a kind of aid plate, it is preferable that its size is identical with the size of the substrate that will make.Support plate 30 can be the non-metallic materials such as metal material or epoxy resin such as rustless steel, copper, aluminum, it is preferred to use the material such as rustless steel easily separated with prepreg (PP sheet) etc. make support plate 30.
As illustrated in fig. 4 c, in this step, binding material 31 can be coated with in advance on support plate 30, then the one side (i.e. functional surfaces 201) with pad 202 of fingerprint recognition chip 20 is mounted on the one side being coated with binding material 31 of support plate 30, it is to say, the one side with pad of fingerprint recognition chip 20 is mounted on support plate 30 by binding material 31.
120, in the one side stacking layer reinforced structure having mounted fingerprint recognition chip of support plate pressing, the substrate being attached on support plate is formed, in fingerprint recognition chip buried base plate.
As shown in figure 4d, in this step, at the one side stacking layer reinforced structure 40 having mounted fingerprint recognition chip 20 of support plate 30, then carry out pressing, the substrate 40 that folded layer reinforced structure 40 is formed as after pressing being attached on support plate 30, and fingerprint recognition chip 20 is imbedded in substrate 40.
Optionally, layer reinforced structure 40 at least includes layer of prepreg 41, and the thickness of layer of prepreg is more than the thickness of fingerprint recognition chip 20.Optionally, layer reinforced structure 40 may include that the layer of prepreg 41 being layered on support plate 30 and the second metal level 42 being layered in layer of prepreg 41.Optionally, layer reinforced structure 40 can also include more multi-layered structure, herein this is not limited as.
130, being separated with substrate by support plate, the one side of substrate manifests the one side with pad of fingerprint recognition chip.
As shown in fig 4e, in this step, support plate 30 is separated with substrate 40, it will therefore be readily appreciated that the one side of substrate 40 manifests fingerprint recognition chip 20, and fingerprint recognition chip 20 manifests the one side with pad 202.
140, the first metal layer is formed in the one side appearing fingerprint recognition chip of substrate.
As shown in fig. 4f, in this step, it is possible to adopting sputtering or the technique such as plating or chemical plating, the one side appearing fingerprint recognition chip 20 at substrate 40 forms the first metal layer 43.Such as, sputtering or chemical copper technique can be adopted as the first metal layer 43 at the one side one layer of copper of deposition appearing fingerprint recognition chip 20 of substrate 40.
150, substrate being carried out outer graphics processing, the one side appearing fingerprint recognition chip at substrate forms soldering pad connection line road, and soldering pad connection line road is connected with the pad of fingerprint recognition chip.
As shown in figure 4g, substrate 40 is carried out outer graphics processing by this step, the first metal layer 43 on substrate 40 surface is formed soldering pad connection line road 44.Outer graphics processing can adopt the etch process of routine, for instance may include that
At the surface configuration photoresist layer of substrate 40, photoresist layer it is exposed and develops, the first metal layer 43 defines soldering pad connection line road, it may be assumed that by needing the photoresist layer forming region, soldering pad connection line road to remove, retaining the photoresist layer in other region；Photoresist layer can be dry film or wet film etc..
With photoresist layer for corrosion protection layer; substrate 40 is etched; form the outer graphics needed; including: soldering pad connection line road 44 is etched removal with the first metal layer 43 of exterior domain; thus; the one side appearing fingerprint recognition chip 20 at substrate 40 forms soldering pad connection line road 44, and soldering pad connection line road 44 is connected with the pad of fingerprint recognition chip 20.
Optionally, method can also include: processing via 45 on the substrate 40, one end of via 45 connects soldering pad connection line road 44.Optionally, soldering pad connection line road 44 other end can connect other line layer or the metal level of substrate 40, for instance is connected to the second metal level 42 of the another side relative with the first metal layer 43.Further, the second metal level 42 is carried out outer graphics and add man-hour, it is possible to the pad that processing connects for via 45 near via 45.
After outer-layer circuit completion of processing, it is possible to substrate 40 is carried out plastic packaging processing, soldering pad connection line road 44 and via 45 are covered in plastic packaging glue, completes the encapsulation to fingerprint recognition chip.
To sum up, the processing method embodiments providing a kind of substrate imbedding fingerprint recognition chip, the method is by by fingerprint recognition chip buried base plate, form soldering pad connection line road at substrate surface and realize the technical scheme that base plate line is connected with fingerprint recognition chip bonding pad, achieve techniques below effect:
The embodiment of the present invention utilizes soldering pad connection line road, it is achieved that the electrical connection of fingerprint recognition chip and substrate；Mode relative to direct routing, the thickness on soldering pad connection line road is only small, have only to when carrying out plastic packaging form plastic packaging glue one layer very thin at fingerprint recognition chip surface, for instance thickness is even less than the plastic packaging glue of 50um less than 100, without influence on the functional realiey of fingerprint recognition chip；
Relative to existing packaged type, owing to not needing routing, it is not required that fingerprint recognition chip is carried out step groove processing, both simplify processing technique, reduced process complexity, eliminated again the expensive materials such as gold thread, significantly reduce cost.
Embodiment two,
Refer to Fig. 4 g, the embodiment of the present invention provides a kind of substrate imbedding fingerprint recognition chip, and in substrate 40, embedment has fingerprint recognition chip 20, the one side with pad 202 of fingerprint recognition chip 20 to be revealed in the one side of substrate 40；The one side appearing fingerprint recognition chip 20 of substrate 40 has soldering pad connection line road 44, and soldering pad connection line road 44 is connected with the pad 202 on fingerprint recognition chip 20.
Optionally, substrate 40 having via 45, one end of via 45 connects soldering pad connection line road 44.
Optionally, the one side appearing fingerprint recognition chip 20 of substrate 40 has plastic packaging glue, soldering pad connection line road 44 and via 45 and is coated in plastic packaging glue.
To sum up, embodiments provide a kind of substrate imbedding fingerprint recognition chip, this substrate can adopt the processing method that embodiment one provides to prepare, adopt in fingerprint recognition chip buried base plate, form soldering pad connection line road at substrate surface and realize the technical scheme that base plate line is connected with fingerprint recognition chip bonding pad, achieve techniques below effect:
The embodiment of the present invention utilizes soldering pad connection line road, it is achieved that the electrical connection of fingerprint recognition chip and substrate；Mode relative to direct routing, the thickness on soldering pad connection line road is only small, have only to when carrying out plastic packaging form plastic packaging glue one layer very thin at fingerprint recognition chip surface, for instance thickness is even less than the plastic packaging glue of 50um less than 100, without influence on the functional realiey of fingerprint recognition chip；
Relative to existing packaged type, owing to not needing routing, it is not required that fingerprint recognition chip is carried out step groove processing, both simplify processing technique, reduced process complexity, eliminated again the expensive materials such as gold thread, significantly reduce cost.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, the part being not described in certain embodiment, it is possible to referring to the associated description of other embodiments.
It should be noted that, for aforesaid each embodiment of the method, in order to be briefly described, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, embodiment described in this description belongs to preferred embodiment, necessary to involved action and the module not necessarily present invention.
Substrate and the processing method thereof of the embedment fingerprint recognition the chip above embodiment of the present invention provided are described in detail, but the explanation of above example is only intended to help to understand method and the core concept thereof of the present invention, should not be construed as limitation of the present invention.Those skilled in the art, according to the thought of the present invention, in the technical scope that the invention discloses, the change that can readily occur in or replacement, all should be encompassed within protection scope of the present invention.
Claims (10)
1. the processing method of the substrate imbedding fingerprint recognition chip, it is characterised in that including:
Fingerprint recognition chip and support plate are provided, the one side with pad of described fingerprint recognition chip is mounted on described support plate；
In the one side stacking layer reinforced structure having mounted described fingerprint recognition chip the pressing of described support plate, form the substrate being attached on described support plate, in the chip buried described substrate of described fingerprint recognition；
Being separated with described substrate by described support plate, the one side of described substrate manifests the one side with pad of described fingerprint recognition chip；
The one side appearing described fingerprint recognition chip at described substrate forms the first metal layer；
Described substrate is carried out outer graphics processing, and the one side appearing described fingerprint recognition chip at described substrate forms soldering pad connection line road, and described soldering pad connection line road is connected with the pad of described fingerprint recognition chip.
2. method according to claim 1, it is characterised in that the described one side with pad by described fingerprint recognition chip is mounted on described support plate to include:
Described support plate is coated with binding material, by described binding material, the one side with pad of described fingerprint recognition chip is mounted on described support plate.
3. method according to claim 1, it is characterised in that the described one side stacking layer reinforced structure having mounted described fingerprint recognition chip at described support plate pressing, forms the substrate being attached on described support plate and includes:
At the one side stacking layer reinforced structure having mounted described fingerprint recognition chip of described support plate, described layer reinforced structure includes: be layered in the layer of prepreg on described support plate and the second metal level being layered in described layer of prepreg；
Described layer reinforced structure carries out pressing, and described layer reinforced structure forms the substrate being attached on described support plate.
4. method according to claim 1, it is characterised in that the described one side appearing described fingerprint recognition chip at described substrate forms the first metal layer and includes:
Adopt sputtering or chemical copper technique at the one side one layer of copper of deposition appearing described fingerprint recognition chip of described substrate.
5. method according to claim 1, it is characterized in that, described described substrate being carried out outer graphics processing, the one side appearing described fingerprint recognition chip at described substrate forms soldering pad connection line road, and described soldering pad connection line road is connected with the pad of described fingerprint recognition chip and includes:
At the surface configuration photoresist layer of described substrate, described photoresist layer it is exposed and develops, defining soldering pad connection line road；
With described photoresist layer for corrosion protection layer; described substrate is etched; described soldering pad connection line road is etched with the described the first metal layer of exterior domain and removes; the one side appearing described fingerprint recognition chip at described substrate forms soldering pad connection line road, and described soldering pad connection line road is connected with the pad of described fingerprint recognition chip.
6. according to described method arbitrary in claim 1 to 5, it is characterised in that described method also includes:
Processing via on the substrate, one end of described via connects described soldering pad connection line road.
7. method according to claim 6, it is characterised in that described method also includes:
Described substrate is carried out plastic packaging processing, described soldering pad connection line road and described via are covered in plastic packaging glue.
8. the substrate imbedding fingerprint recognition chip, it is characterised in that
In described substrate, embedment has fingerprint recognition chip, and the one side with pad of described fingerprint recognition chip is revealed in the one side of described substrate；
The one side appearing described fingerprint recognition chip of described substrate has soldering pad connection line road, and described soldering pad connection line road is connected with the pad on described fingerprint recognition chip.
9. substrate according to claim 8, it is characterised in that
Having via on described substrate, one end of described via connects described soldering pad connection line road.
10. substrate according to claim 9, it is characterised in that
The one side appearing described fingerprint recognition chip of described substrate has plastic packaging glue, and described soldering pad connection line road and described via are coated in described plastic packaging glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410842337.7A CN105810599A (en) | 2014-12-30 | 2014-12-30 | Substrate embedded with fingerprint identification chip and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410842337.7A CN105810599A (en) | 2014-12-30 | 2014-12-30 | Substrate embedded with fingerprint identification chip and processing method thereof |
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| CN105810599A true CN105810599A (en) | 2016-07-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018145413A1 (en) * | 2017-02-13 | 2018-08-16 | 深圳市汇顶科技股份有限公司 | Secondary packaging method for through-silicon via chip and secondary package thereof |
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| TW201406217A (en) * | 2012-07-27 | 2014-02-01 | Tripod Technology Corp | Device embedded printed circuit board and manufacturing method thereof |
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| WO2018145413A1 (en) * | 2017-02-13 | 2018-08-16 | 深圳市汇顶科技股份有限公司 | Secondary packaging method for through-silicon via chip and secondary package thereof |
| US11183414B2 (en) | 2017-02-13 | 2021-11-23 | Shenzhen GOODIX Technology Co., Ltd. | Secondary packaging method and secondary package of through silicon via chip |
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Application publication date: 20160727 |