CN105764299B - Radiator structure and preparation method thereof - Google Patents
Radiator structure and preparation method thereof Download PDFInfo
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- CN105764299B CN105764299B CN201410791259.2A CN201410791259A CN105764299B CN 105764299 B CN105764299 B CN 105764299B CN 201410791259 A CN201410791259 A CN 201410791259A CN 105764299 B CN105764299 B CN 105764299B
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Abstract
A kind of radiator structure comprising the first base material and the second base material, the first base material include opposite first surface and third surface, which offers the through-hole through the first surface and the third surface；Second base material includes second surface, the second surface offers holding tank, the first surface of the first base material forms seal chamber with the holding tank, heat transfer medium is accommodated in the seal chamber, it is further opened with groove between the holding tank of the second surface, the groove is communicated with the through-hole, which is used to fix the first base material and second base material with binder, the binder is filled in the groove.The present invention also provides a kind of production methods of radiator structure.
Description
Technical field
The present invention relates to the technical field of heat dissipation of electronic product more particularly to a kind of radiator structure and preparation method thereof.
Background technology
Currently, electronic product gradually develops to high speed, lightening direction, in high speed, high-frequency and miniaturization
Under it is required that so that the volume smaller of electronic building brick simultaneously has more powerful function, however this results in the fever of electronic building brick close
Spend higher and higher, therefore, radiating efficiency, which has become, determines electronic product service life, reliability and an important factor for stability.By
There is efficient thermal conduction characteristic in radiator structure, therefore radiator structure has been widely applied heat-conductive assembly in electronic product
One of, however, a kind of radiator structure can be suitably used for the small inner space of electronic product of design is those skilled in the art
Letter project to be solved.
Invention content
In view of this, it is necessary to provide a kind of radiator structure and production methods.
A kind of radiator structure comprising the first base material and the second base material, the first base material include opposite first surface and
Third surface；Second base material includes second surface, which offers holding tank, the first surface of the first base material
Seal chamber is formed with the holding tank, heat transfer medium is accommodated in the seal chamber, it is characterised in that：The first base material, which offers, to be run through
The through-hole of the first surface and the third surface, opens up between the holding tank of the second surface fluted, and the groove is logical with this
Hole communicates, which is used to fix the first base material and second base material with binder, the binder is filled in the groove.
A kind of production method of radiator structure, including step：
The first base material and the second base material are provided, which includes first surface and the third opposite with first surface
Surface, second base material include second surface and fourth surface opposite with second surface；
Multiple through-holes through the first surface and the third surface are formed in the first base material, in the second surface shape
At multiple grooves, and holding tank is formed between adjacent grooves, which is arranged in array in the first base material, the groove
With the holding tank array arrangement is respectively formed in the second surface；
Heat transfer medium is injected in the holding tank；
First surface is set to be arranged with second surface face, which forms seal chamber with the holding tank, in the through-hole
And filling adhesive in groove corresponding with through-hole, and binder is cured, by the binder by the first base material with
Second base material is adhesively fixed.
Compared with prior art, the radiator structure being made according to method for fabricating structure of heat elimination provided by the invention,
Through-hole is formed in the second base material of the first base material, it is corresponding to be formed in through-hole on the second base material surface opposite with the first base material
Groove and the holding tank for forming receiving heat transfer medium between the grooves, by fixing this with filling adhesive in groove to through-hole
The first base material and second base material, will not increase the thickness of radiator structure.
Description of the drawings
Fig. 1 is the schematic diagram for the radiator structure that first embodiment of the invention provides.
Fig. 2 is the decomposition diagram for the radiator structure that Fig. 1 is provided.
Fig. 3 is diagrammatic cross-section of the radiator structure along the directions III-III of Fig. 1 offers.
Fig. 4 is diagrammatic cross-section of the radiator structure along the directions IV-IV of Fig. 1 offers.
Fig. 5 is the diagrammatic cross-section for the radiator structure that second embodiment of the invention provides.
Fig. 6-10 is the diagrammatic cross-section for the method for fabricating structure of heat elimination that first embodiment of the invention provides.
Main element symbol description
The first base material 10
Second base material 20
First surface 11
Third surface 13
Second surface 21
4th surface 23
Through-hole 110
Micro- fin 230
Holding tank 212
Groove 210
Binder 30
Heat transfer medium 50
Seal chamber 40
Radiator structure 100,200
Oil reservoir 120
Bottom surface 214
Following specific implementation mode will be further illustrated the present invention in conjunction with above-mentioned attached drawing.
Specific implementation mode
Radiator structure provided the technical program below in conjunction with accompanying drawings and embodiments and preparation method thereof is made further
Detailed description.
- 4 are please referred to Fig.1, there is disclosed the radiator structure 100 that first embodiment of the invention provides, which uses
It radiates in the electronic heating element of setting on circuit boards, which includes the first base material 10 and the second base
Material 20,20 generally rectangular sheet of the first base material 10 and the second base material.The first base material 10 and the second base material 20 are circuit board
Special copper foil.The length of the first base material 10 and second base material 20 is in the same size with width and is fixed by binder 30.It should
Multiple seal chambers 40 are collectively formed with second base material 20 in the first base material 10, and the internal face of the seal chamber 40 is coated with one layer of oil reservoir
120, heat transfer medium 50 is accommodated in the seal chamber 40.
In the present embodiment, in order to ensure that the flexibility energy of radiator structure 100, the thickness of the first base material 10 be
12um or 18um；The thickness of second base material 20 is more than the thickness of the first base material 10, is 70um, in 105um, 140um
It is a kind of.
The first base material 10 includes first surface 11 and the third surface 13 opposite with first surface 11, second base material
20 include second surface 21 and fourth surface 23 opposite with second surface 21.The first base material 10 offers through-hole 110.
In present embodiment, which arranges for array.Certainly, in other embodiments, the setting of through-hole 110 can not also
Array arranges.Through-hole 110 is cylindrical hole, polygonal through hole or ellipse hole.
The second surface 21 of second base material 20 opens up fluted 210 and holding tank 212.The groove 210 this second
Surface 21 is arranged in array；The holding tank 212 is arranged in the second surface 21 in array.In the present embodiment, each row are logical
Hole includes three through-holes 110, and each row through-hole 110 corresponds to the groove 210, which is connected with the through-hole 110.
Filled with the binder 30 for fixing the first base material 10 and second base material 20 in the groove 210 and the through-hole 110.The appearance
Slot 212 of receiving is formed between groove 210.The sealing is collectively formed with the holding tank 212 in the first surface 11 of the first base material 10
Chamber 40.The groove 212 for accommodating the binder 30 is arranged in the second thicker base material 20, can be reduced subsequently to binder 30
When being cured, the first base material 10 and the heated probability that warpage occurs of the second base material 20.
The width of the groove 210 with and its corresponding through-hole 110 width it is unequal.Here, by second base material 20
Long side direction be named as first direction, the short side direction of the second base material 20 is named as second direction, herein signified width
Refer to along be parallel to first direction institute's section shape at surface on be formed by size.In the present embodiment, the width of the groove 210
Width of the degree more than the corresponding through-hole 110.In other embodiments, the width of the through-hole 110 can also be made to be more than
The width of corresponding groove 210.So set, being filled in the binder 30 in groove 210 and at left and right sides of through-hole 110
The adhesion area for increasing first surface 11 and second surface 21, to be conducive to the first base material 10 and second base material 20
Stablize and fixes.That is, after binder 30 is cured, be located at the binder 30 of each through-hole 110 in the corresponding groove 210
Binder 30 can form the closing component structure of an entirety, the sectional widths of two parts up and down which includes not phase
Deng realizing that stablizing for the first base material 10 and the second base material 20 is fixed with this.
In the present embodiment, each length of groove 210 in a second direction is more than the holding tank 212 in a second direction
Length.So set, after through-hole 110 is with filling adhesive 30 in corresponding groove 210, holding tank 212 is better achieved
The sealing of surrounding, prevents heat transfer medium from revealing.In other embodiments, it can be arranged and surround each holding tank 212 1 weeks
Groove 210, it will be appreciated, of course, that if groove 210 to be provided around to the circumference of the holding tank 212, the first base material 10
Through-hole 110 corresponding with groove can be correspondingly set, will pass through the filling adhesive 30 into groove 210 of through-hole 110.
The operation principle of the radiator structure 100 is：The 4th surface 23 and the hair in electronic product of second base material 20
Heat source (not shown) is in contact, and when pyrotoxin generates high temperature, the 4th surface 23 of the radiator structure 100 is heated, makes seal chamber
Heat transfer medium 221 in 240 is heated and vaporizes, and steam is moved to first surface 11, hotter steam and seal chamber face
First surface 11 contacts, and condenses into the inner surface that droplet is attached to seal chamber 40, then condenses into large water drop and falls or edge
The inner surface of seal chamber 40 flows back into holding tank 212, and such process constantly recycles, to realize dissipating for electronic product
Heat.
Referring to Fig. 5, Fig. 5 is the schematic diagram for the radiator structure 200 that second embodiment of the invention provides, the radiator structure
The structure of 200 radiator structures 100 provided with first embodiment is essentially identical, the difference is that：Second base material 20
4th surface 23 is also formed with micro- fin 230.Specifically, it can be formed on the 4th surface 23 in the way of chemical etching
Micro- fin 230.Specifically, the section of micro- fin 230 is trapezoidal.Trapezoidal shape can increase micro- fin 230 and the second base material
20 bond strength prevents micro- fin 230 to be broken.Micro- fin 230, which is made, on the 4th surface 23 increases dissipating for radiator structure 200
Hot area can make the quick region air of heat form convection current, enhance heat dissipation effect.It is appreciated that in other embodiments, it should
Micro- fin 230 can also be arranged on the third surface 13 of the first base material 10, can also reinforce heat dissipation effect in this way.
The production method for the radiator structure 100 that the technical program first embodiment provides includes the following steps：
The first step：Referring to Fig. 6, providing the first base material 10 and the second base material 20.The first base material 10 includes first surface
11 and the third surface 13 opposite with first surface 11, second base material 20 include second surface 21 and with second surface 21
The 4th opposite surface 23.
The material of the first base material 10 and the second base material 20 can be copper, nickel or be silver.In the present embodiment, this
One base material 10 and the second base material 20 are copper foil.The first base material 10 and second base material 20 are rectangular sheet but thickness not phase
Together, wherein the thickness of the first base material 10 is 12um or 18um；The thickness of second base material 20 is more than the thickness of the first base material 10
Degree, is 70um, one kind in 105um, 140um.Keep the first base material 10 different from the thickness of the second base material 20, it is ensured that
In the case of not increasing by 100 integral thickness of radiator structure, subsequently receiving heat transfer medium is made using the second thicker base material 20
Holding tank, so as to increase the volume of accommodated heat transfer medium, and then improve the heat dissipation effect of radiator structure 100.
Second step, referring to Fig. 7, being formed through the first surface 11 and the third surface 13 in the first base material 10
Multiple through-holes 110；Multiple grooves 210 are formed in the second surface 21, and form holding tank 212 between adjacent grooves.It should
Through-hole 110 is arranged in array in the first base material 10.The groove 210 distinguishes shape with the holding tank 212 in the second surface 21
It is arranged into an array.Each groove 210 is correspondingly arranged a row through-hole 110.Specifically, machine drilling or etching can be passed through
Mode forms the through-hole 110 in the first base material 10, forms the groove 210 and the holding tank 212 in the second surface 21.
The width of the groove 210 with and its corresponding through-hole 110 width it is unequal.So set, can be increased
The adhesion area of 20 contact position of one base material 10 and the second base material, is conducive to the first base material 10 and the stabilization of second base material 20 is solid
It is fixed.
The through-hole 110 is cylindrical hole, polygonal through hole or ellipse hole.
The each length of groove 210 in a second direction is more than the length of holding tank 212 in a second direction.So set
It sets, after through-hole 110 is with filling adhesive 30 in corresponding groove 210, the sealing around holding tank 212 is better achieved,
Prevent heat transfer medium from revealing.In other embodiments, can be arranged around 212 1 weeks grooves of holding tank 210.
In the present embodiment, the depth of the holding tank 212 is 2/3rds of 20 integral thickness of the second base material, the receiving
Slot 212 is for accommodating heat transfer medium 50.
In the present embodiment, which includes a bottom surface 214, which is plane.In other embodiment party
In formula, which can be tilted from one end of groove 210 to the other end.When by through-hole 110 into corresponding groove 210
When injecting binder 30, inclined bottom surface is conducive to binder under gravity, makes binder from groove 210 higher one
It holds to lower one end and flows, thereby may be ensured that binder fills up entire groove 210, to ensure the first base material 10 and second
Base material 20 is fixed well.
Third walks, referring to Fig. 8, in the inner wall and the first base material corresponding with holding tank 212 10 of the holding tank 212
First surface 11 is coated with one layer of oil reservoir 120；And heat transfer medium is injected in holding tank, for example water.Since fluid oil is in room temperature
Under specific heat capacity be about 2 × 103J/ (kg.K), to which one layer of oil reservoir of coating is conducive to improve the radiating efficiency of radiator structure.
4th step：Please refer to Fig. 9-10, first surface 11 and 21 face of second surface made to be arranged, in the through-hole 110 and
Filling adhesive 30 in groove 210 corresponding with through-hole.Specifically binder 30 is injected into groove by through-hole 110, according to
By the mobility of binder 30, make binder 30 full of entire groove 210 and through-hole 110.The binder 30 can be silver paste, copper
Cream is glue.
5th step：Binder 30 is cured, by the binder 30 after solidification by the first base material 10 and the second base
Material 20 is adhesively fixed together.After solidification, it is located at the binder 30 of each through-hole 110 and gluing in the corresponding groove 210
Knot agent 30 can form the closing component structure of an entirety, and the sectional width for two parts up and down which includes is unequal,
The stable fixation of the first base material 10 and the second base material 20 is realized with this.At this point, the first surface 11 is common with the holding tank 212
A seal chamber 40 is formed, and seal chamber 40 is vacuumized, forms the radiator structure 100.
In conclusion according to the radiator structure that method for fabricating structure of heat elimination provided by the invention is made, in the first base
Through-hole 110 is formed in material 10, is formed on the second base material 20, the surface opposite with the first base material 10 corresponding with the through-hole
Groove 210, by the filling adhesive 30 into through-hole 110 and groove 210, after curing to binder 30, to make filling
Binder 30 in through-hole 110 and groove formed an entirety sealed shape come inlay card fix the first base material 10 with this
Two base materials 20, will not increase the thickness of radiator structure 100；Stability is more when the first base material 10 can also be made to be combined with the second base material 20
By force, prevent heat transfer medium 50 from revealing.
It is understood that for those of ordinary skill in the art, can be conceived with the technique according to the invention and be done
Go out various other corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
It encloses.
Claims (8)
1. a kind of radiator structure comprising the first base material and the second base material, the first base material include opposite first surface and the
Three surfaces；Second base material includes second surface, which offers holding tank, which should with the first base material
First surface forms seal chamber, and heat transfer medium is accommodated in the seal chamber, it is characterised in that：The first base material is offered to run through and is somebody's turn to do
The through-hole of first surface and the third surface opens up fluted, the groove and the through-hole between the holding tank of the second surface
It communicates, the width and the width of corresponding through-hole of each groove are unequal, and binder, position are filled in the through-hole and the groove
Binder in the groove and the through-hole forms T font structures, and the binder is for consolidating the first base material and second base material
It is fixed.
2. radiator structure as described in claim 1, which is characterized in that the through-hole be cylindrical hole, polygonal through hole or
Ellipse hole.
3. radiator structure as described in claim 1, which is characterized in that the through-hole arranges in the first base material in array, should
Groove arranges in second base material in array, each groove is correspondingly arranged a row through-hole.
4. radiator structure as described in claim 1, which is characterized in that second base material further includes opposite with second surface
Four surfaces, the 4th surface are formed with micro- fin.
5. a kind of production method of radiator structure, including step：
The first base material and the second base material are provided, which includes first surface and the third table opposite with first surface
Face, second base material include second surface and fourth surface opposite with second surface；
Multiple through-holes through the first surface and the third surface are formed in the first base material, second base material this
Two surfaces form multiple grooves, and the width and the width of corresponding through-hole of each groove are unequal, and adjacent grooves it
Between form holding tank；
Heat transfer medium is injected in the holding tank；
So that first surface and second surface face is arranged, which forms seal chamber with the holding tank, in the through-hole and
Filling adhesive in groove corresponding with through-hole is located at the groove and forms T font structures with the binder in the through-hole；
Binder is cured, the first base material and second base material are adhesively fixed by the binder.
6. the production method of radiator structure as claimed in claim 5, which is characterized in that second base material further includes and the second table
The 4th opposite surface of face, further includes forming micro- fin in the 4th surface etching after forming the groove.
7. the production method of radiator structure as claimed in claim 6, which is characterized in that the through-hole is cylindrical hole, polygon
Shape through-hole or ellipse hole.
8. the production method of radiator structure as claimed in claim 5, which is characterized in that the through-hole is in battle array in the first base material
Row arrangement, the groove arrange in second base material in array, each groove is correspondingly arranged a row through-hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410791259.2A CN105764299B (en) | 2014-12-19 | 2014-12-19 | Radiator structure and preparation method thereof |
| TW104101002A TWI561791B (en) | 2014-12-19 | 2015-01-12 | Heat dissipating structure and manufacturing method of same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410791259.2A CN105764299B (en) | 2014-12-19 | 2014-12-19 | Radiator structure and preparation method thereof |
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| Publication Number | Publication Date |
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| CN105764299A CN105764299A (en) | 2016-07-13 |
| CN105764299B true CN105764299B (en) | 2018-09-25 |
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| CN201410791259.2A Active CN105764299B (en) | 2014-12-19 | 2014-12-19 | Radiator structure and preparation method thereof |
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| TW (1) | TWI561791B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107846810A (en) * | 2016-09-18 | 2018-03-27 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof and electronic equipment |
| CN111212547B (en) * | 2018-11-22 | 2022-04-19 | 宏达国际电子股份有限公司 | Manufacturing method of heat dissipation module, heat dissipation module and electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105764299A (en) | 2016-07-13 |
| TWI561791B (en) | 2016-12-11 |
| TW201623902A (en) | 2016-07-01 |
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Effective date of registration: 20170307 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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