CN105728695A - Preparation method of high-orientation heat conduction material of composite structure - Google Patents
Preparation method of high-orientation heat conduction material of composite structure Download PDFInfo
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- CN105728695A CN105728695A CN201410747927.1A CN201410747927A CN105728695A CN 105728695 A CN105728695 A CN 105728695A CN 201410747927 A CN201410747927 A CN 201410747927A CN 105728695 A CN105728695 A CN 105728695A
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Abstract
The invention relates to a preparation method of a high-orientation heat conduction material of a composite structure and belongs to the technical field of preparation of heat management materials. The preparation method comprises the steps that firstly, a metal powder fabricated part is prepared from metal packaging material powder, and high-heat-conductivity carbon materials are buried in the fabricated part; secondly, the fabricated part is placed in a graphite mold, the same metal packaging material is smelted, and the metal packaging material is extruded and cast into the fabricated part; and cooling is conducted, and the high-orientation heat conduction material of the composite structure is prepared after demolding. According to the preparation method of the high-orientation heat conduction material of the composite structure, material preparation and interfacial modification are completed in the same process step, so that mechanical contact between a high-heat-conductivity material and a sealing metal material in an original process is avoided, heat resistance is reduced, and meanwhile the number of process links is reduced. The high-orientation heat conduction material can be widely applied to microelectronic packaging, laser diodes and insulated gate bipolar translators (IGBTs) which need local efficient heat dissipation, and semiconductors, cooling fins and cover plates.
Description
Technical field
The preparation method that the present invention relates to a kind of highly directional Heat Conduction Material with composite structure, belongs to thermal management materials preparing technical field.
Background technology
Current integrated circuit component is to high power and miniaturization, and its density is increasing, continues to explore the novel encapsulated material of higher heat conduction.Material higher than diamond/copper (aluminum) heat conductivity at present is material with carbon element, wherein high starch breeding material is with charcoal hydrogen for raw material, under high temperature more than 2000 DEG C, the carbon material with higher crystalline orientation that graphite matrix goes out through chemical vapour deposition (CVD).It is typical layer structure, and the former molecular hexagonal aspect of charcoal is showed the order of height.Pyrolytic graphite have high density (2.255-2.265g/cm3), high-purity (impurity content < 0.002%), x-y direction thermal conductivity be 1350-1700W/mK, z-axis direction is 10-30W/mK.Although highly directional heat conduction material with carbon element hot property is excellent, but self-supporting ability, it is difficult to be directly used in heat sink material, limit the commercial application of material.If placed in-yl body, the shortcoming being solved poor mechanical property by the support of matrix, give full play to the hot property that material with carbon element is excellent simultaneously.
The research inserting highly heat-conductive material in metal-base composites once had been reported that, CPS company is pre-buried TPG sheet in the laser diode package substrate of thermoelectric (al) cooler, thickness 0.38 millimeter, within 2005, DS&ALLC embeds the highly oriented pyrolytic graphite sheet of super-high heat-conductive and the composite base plate of Buddha's warrior attendant stone bolt at SiC/Al composite, and radiating effect improves a lot.Owing to above Liang Jia research unit is all the technique that have employed reinforced particulate prefabricated component-liquid die casting, inlay and be easier to realize.And if insert in traditional encapsulating material such as Materials for Metal Packaging such as copper, aluminum highly heat-conductive material mostly by machining place highly heat-conductive material groove, insert highly heat-conductive material, add a cover and seal up for safekeeping, then integral heat pressure seam.USP5296310 just refer to the preparation technology being previously mentioned, but the improvement at interface is not done any improvement, and interface is only Mechanical Contact, sliding contact between highly heat-conductive material and sealing metal material in the process of cold cycling.
Summary of the invention
The preparation method that it is an object of the invention to provide a kind of highly directional Heat Conduction Material with composite structure, inlays material with carbon element in Materials for Metal Packaging, improves the preparation technology of interface cohesion simultaneously.
The preparation method of a kind of highly directional Heat Conduction Material with composite structure, comprises the technical steps that:
1) adopt Materials for Metal Packaging powder preparation metal dust prefabricated component, prefabricated component is imbedded high heat conduction carbon material；
2) by step 1) in the prefabricated component for preparing load in graphite jig, melting same metal encapsulating material, extrusion casint enters in prefabricated component；
3) cooling, prepares the highly directional Heat Conduction Material with composite structure after the demoulding.
Step 1) in, described Materials for Metal Packaging includes aluminum, copper, aluminium alloy and copper alloy etc..Materials for Metal Packaging powder used is existing commercially available prod or is prepared by various existing methods.The granularity of Materials for Metal Packaging powder is 100-200 μm.
Described high heat conduction carbon material includes HOPG (highly oriented pyrolytic graphite), CAPG (compressive stress thermal pyrolytic graphite), APG (anneal pyrolytic graphite) and TPG (high conductive graphite) etc..The preparation method of metal dust prefabricated component may select existing method, such as powder metallurgic method.
Step 2) in, the technological parameter such as the temperature of extrusion casint and pressure depends on the fusing point of Materials for Metal Packaging, and the pressure such as optional extrusion casint is 5-10MPa, and the dwell time is 3-10min.
Advantages of the present invention:
Highly heat-conductive material is first adopted existing technique to be embedded in the prefabricated component of metal powder by the present invention, the same metal liquid that then extrusion casint is melted in prefabricated component, prepares a highly directional Heat Conduction Material with composite structure.Material preparation and interface modification are completed by the present invention in same processing step, both Mechanical Contact between highly heat-conductive material and the sealing metal material existed in original technique had been improved, reduce thermal resistance, be effectively improved highly heat-conductive material and encapsulating material interface cohesion, reduce again process procedure simultaneously.
Material prepared by the present invention can be widely used in the microelectronics Packaging, laser diode, IGBT and quasiconductor, fin and the cover plate that need local to dispel the heat.
Accompanying drawing explanation
Fig. 1 is the highly directional Heat Conduction Material structure chart with composite structure, and left side is schematic diagram, and right side is pictorial diagram.
Fig. 2 is the highly directional Heat Conduction Material preparation method flow chart with composite structure.
Main Reference Numerals illustrates:
1 high heat conduction carbon material 2 Materials for Metal Packaging
Detailed description of the invention
As it is shown in figure 1, be the directed Heat Conduction Material with composite structure, left side is schematic diagram, and right side is pictorial diagram, is made up of Materials for Metal Packaging 2 and sealing high heat conduction carbon material 1 therein.Materials for Metal Packaging 2 may select known package metals material, such as Al, Cu and alloy etc. thereof.High heat conduction carbon material 1 optional HOPG, CAPG, APG, TPG with the coat of metal.
As in figure 2 it is shown, be the technological process of the present invention: select Materials for Metal Packaging powder；Prepare the metal dust prefabricated component of pre-buried high heat conduction carbon material；Motlten metal encapsulating material, with melted Materials for Metal Packaging liquation extrusion casint prefabricated component；Cooling, the demoulding.
The present invention has the highly directional Heat Conduction Material of composite structure and is made up of Materials for Metal Packaging and the high heat conduction carbon material being sealed in encapsulating material.Initially with the prefabricated component of the pre-buried material with carbon element of powder preparation of Materials for Metal Packaging, then adopting the method infiltration encapsulating material of the same race of extrusion casint, preparation has the highly directional Heat Conduction Material of composite structure.Material preparation and interface modification are completed by the present invention in same processing step, namely improve Mechanical Contact between highly heat-conductive material and the sealing metal material existed in original technique, reduce thermal resistance, reduce process procedure simultaneously.
Embodiment 1
Flow process shown in Fig. 2, adopts the aluminium powder of 100 μm to adopt powder metallurgic method to prepare prefabricated component, HOPG thick for pre-buried 1mm in preparation process；Prefabricated component is loaded in graphite jig, smelting aluminum, smelting temperature 750 DEG C；9MPa downforce infiltration Al, pressurize 5min, be molded into aluminium extrusion in prefabricated component；Obtaining the material of the highly directional heat conduction of composite structure, this thickness of composite material 3mm after cooling and demolding, the x-y axle thermal conductivity of material is 800W/mK.
Embodiment 2
Flow process shown in Fig. 2, adopts the copper powder of 150 μm to adopt powder metallurgic method to prepare prefabricated component, HOPG thick for pre-buried 2.5mm in preparation process；Prefabricated component is loaded in graphite jig, melting copper, smelting temperature 1280 DEG C；9MPa downforce infiltration Cu, pressurize 5min, enter copper extrusion casint in prefabricated component；Obtaining the material of the highly directional heat conduction of composite structure, this material thickness 3mm after cooling and demolding, the x-y axle thermal conductivity of material is 1100W/mK.
Embodiment 3
Flow process shown in Fig. 2, adopts the chromiumcopper powder of 150 μm to adopt powder metallurgic method to prepare prefabricated component, TPG thick for pre-buried 2.5mm in preparation process；Prefabricated component is loaded in graphite jig, melting copper evanohm, smelting temperature 1340 DEG C；5MPa downforce infiltration chromiumcopper liquation, pressurize 5min, chromiumcopper extrusion casint is entered in prefabricated component；Obtaining the material of the highly directional heat conduction of composite structure, this material thickness 3mm after cooling and demolding, the x-y axle thermal conductivity of material is 1060W/mK.
As can be seen here, the present invention, under reducing process procedure situation, is effectively improved highly heat-conductive material and encapsulating material interface cohesion, and the thermal conductivity of the directed Heat Conduction Material of combined type result does not reduce.This type of material can be widely used in need that local dispels the heat in microelectronics Packaging, laser diode, IGBT and quasiconductor, fin and cover plate.
Claims (6)
1. a preparation method with the highly directional Heat Conduction Material of composite structure, comprises the steps:
1) adopt Materials for Metal Packaging powder preparation metal dust prefabricated component, prefabricated component is imbedded high heat conduction carbon material；
2) loading in graphite jig by prefabricated component, melting same metal encapsulating material, extrusion casint enters in prefabricated component；
3) cooling, prepares the highly directional Heat Conduction Material with composite structure after the demoulding.
2. the preparation method of the highly directional Heat Conduction Material with composite structure according to claim 1, it is characterised in that: described Materials for Metal Packaging includes aluminum, copper, aluminium alloy and copper alloy.
3. the preparation method of the highly directional Heat Conduction Material with composite structure according to claim 1, it is characterised in that: the granularity of described Materials for Metal Packaging powder is 100-200 μm.
4. the preparation method of the highly directional Heat Conduction Material with composite structure according to claim 1, it is characterised in that: described high heat conduction carbon material includes highly oriented pyrolytic graphite, compressive stress thermal pyrolytic graphite, anneal pyrolytic graphite and high conductive graphite.
5. the preparation method of the highly directional Heat Conduction Material with composite structure according to claim 1, it is characterised in that: the preparation method of described metal dust prefabricated component is powder metallurgic method.
6. the preparation method of the highly directional Heat Conduction Material with composite structure according to claim 1, it is characterised in that: the pressure of described extrusion casint is 5-10MPa, and the dwell time is 3-10min.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109321212A (en) * | 2018-10-28 | 2019-02-12 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The preparation method of the compound PCM combined phasetransform temperature control component of nanotube |
| CN111584371A (en) * | 2020-05-25 | 2020-08-25 | 苏州融睿电子科技有限公司 | Manufacturing method of packaging shell and packaging shell |
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| JPS62156066A (en) * | 1985-12-27 | 1987-07-11 | Nippon Kokan Kk <Nkk> | Production of composite metallic material |
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| CN111584371A (en) * | 2020-05-25 | 2020-08-25 | 苏州融睿电子科技有限公司 | Manufacturing method of packaging shell and packaging shell |
| CN111584371B (en) * | 2020-05-25 | 2022-04-01 | 苏州融睿电子科技有限公司 | Manufacturing method of packaging shell and packaging shell |
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