CN105658033A - Device with heat exchange - Google Patents

Device with heat exchange Download PDF

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Publication number
CN105658033A
CN105658033A CN201610051956.3A CN201610051956A CN105658033A CN 105658033 A CN105658033 A CN 105658033A CN 201610051956 A CN201610051956 A CN 201610051956A CN 105658033 A CN105658033 A CN 105658033A
Authority
CN
China
Prior art keywords
heat exchanger
heat
rack
air
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610051956.3A
Other languages
Chinese (zh)
Inventor
林辉
洪宇平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN201610051956.3A priority Critical patent/CN105658033A/en
Publication of CN105658033A publication Critical patent/CN105658033A/en
Priority to PCT/CN2016/091912 priority patent/WO2017128659A1/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The embodiment of the invention provides a device with heat exchange. Through the adoption of the device, the overall height of the device and the overall height of the device needed to be increased when the heat consumption of the electronic equipment is increased are reduced. The device comprises a cabinet in which the electronic equipment, an inner circulation fan and a first heat exchanger are arranged; the inner circulation fan is arranged above the electronic equipment, the first heat exchanger is arranged on a door at the side wall of the cabinet; a wind guiding structural component is arranged between the inner circulation fan and the first heat exchanger, the inner circulation fan enables the air in the cabinet to flow through the first heat exchanger through the wind guiding structural component; and the external top of the cabinet is provided with a second heat exchanger and an outer circulation fan, the first heat exchanger is connected with the second heat exchanger through a conduit and contains the communicated heat transfer working medium, the conduit enables the heat transfer working medium to circularly flow between the first heat exchanger and the second heat exchanger to realize the heat exchange.

Description

There is the device of heat exchange
Technical field
The present embodiments relate to the communications field, more particularly, to the device in the communications field with heat exchange.
Background technology
The heat that electronic equipment operationally produces, electronic equipment internal temperature is made to increase rapidly, if not in time this heat is distributed, this electronic equipment may proceed to heat up, when temperature is beyond the normal working temperature scope of the electronic device in this electronic equipment, the performance of this electronic equipment is remarkably decreased, and greatly affects the reliability of electronic equipment, and therefore the heat dissipation problem of electronic equipment increasingly comes into one's own. For the impact preventing communication electronic system to be subject in environment the adverse environmental factors such as dust, corrosive gas, mycete, ensure the reliable and stable operation of electronic system, electronic device and equipment in electronic system are often placed in airtight rack, and the heat-sinking capability of rack is determined by the factor such as area of dissipation, air quantity, by the restriction of rack volume. Along with IT industry (InformationTechnology, referred to as " IT ") and mechanics of communication industry (CommunicationTechnology, referred to as " CT ") the continuous lifting of professional ability, outdoor airtight cabinet needs higher heat-sinking capability.
In order to realize higher heat-sinking capability, it is necessary to higher volume of temperature conditioning unit. Temperature conditioning unit is generally wholy set in enclosure top by prior art, by increasing the height of temperature conditioning unit, it is achieved the lifting of heat-sinking capability. But, when internal electronic equipment heat consumption is very big, it is a lot of that this mode needs the height of temperature conditioning unit to increase, and the volume causing rack overall increases a lot, affects the compactness (i.e. the unit volume heat-sinking capability of rack) of rack.
Summary of the invention
In view of this, embodiments provide a kind of device with heat exchange, it is possible to reduce this device whole height and when electronic equipment heat consumption increases this device need increase height.
First aspect, provide a kind of device with heat exchange, this device includes rack 200, electronic equipment 201, internal recycle fan 202 and First Heat Exchanger 203 it is provided with in this rack 200, wherein, this internal recycle fan 202 is arranged at the top of this electronic equipment 201, and this First Heat Exchanger 203 is arranged on the door of sidewall of this rack 200;Being provided with air guide structure part 204 between this internal recycle fan 202 and this First Heat Exchanger 203, this internal recycle fan 202 makes the air in this rack 200 flow through this First Heat Exchanger 203 by this air guide structure part 204; This outer top of rack 200 is provided with the second heat exchanger 205 and outer circulation fan 206, wherein, this First Heat Exchanger 203 is connected by conduit 207 and is contained, with this second heat exchanger 205, the heat-transfer working medium connected, this conduit 207 makes this heat-transfer working medium circulate between this First Heat Exchanger 203 and this second heat exchanger 205, it is achieved heat exchange.
In the first possible implementation of first aspect, this rack 200 top is provided with through hole, and this conduit 207 connects this First Heat Exchanger 203 and this second heat exchanger 205 by this through hole.
In conjunction with the above-mentioned possible implementation of first aspect, in the implementation that the second of first aspect is possible, this First Heat Exchanger 203 is arranged at from this electronic equipment 201 on the door of maximum sidewall.
In conjunction with the above-mentioned possible implementation of first aspect, in the third possible implementation of first aspect, this First Heat Exchanger 203 is for being converted to cold air by the hot-air flowed through, and this First Heat Exchanger 203 includes vaporizer.
In conjunction with the above-mentioned possible implementation of first aspect, in the 4th kind of possible implementation of first aspect, this second heat exchanger 205 is for being converted to hot-air by the cold air flowed through, and this second heat exchanger 205 includes condenser.
In conjunction with the above-mentioned possible implementation of first aspect, in the 5th kind of possible implementation of first aspect, this outer top of rack 200 is additionally provided with the cold pump of liquid or compressor of air conditioner 208, and the cold pump of this liquid or compressor of air conditioner 208 are used for freezing.
In conjunction with the above-mentioned possible implementation of first aspect, in the 6th kind of possible implementation of first aspect, this First Heat Exchanger 203 or this second heat exchanger 205 include fin, and this fin is plate-fin, fin-tube type or nest plate type.
In conjunction with the above-mentioned possible implementation of first aspect, in the 7th kind of possible implementation of first aspect, this heat-transfer working medium is ammonia, acetone or tetrafluoroethane R134A.
The device with heat exchange that the embodiment of the present invention provides, by by temperature conditioning unit scattering device in the diverse location of rack, make full use of the enclosure interior that prior art does not effectively utilize, the height that this device is overall can be reduced, thus reducing the volume of this device, this device when electronic equipment heat consumption increases can be reduced simultaneously and need the whole height increased, to meet the radiating requirements of the continuous evolution of rack.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, the accompanying drawing used required in the embodiment of the present invention will be briefly described below, apparently, drawings described below is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the fundamental diagram of the device in prior art with heat exchange;
The fundamental diagram of the device with heat exchange that Fig. 2 provides for the embodiment of the present invention;
Fig. 3 provide for the embodiment of the present invention another there is the fundamental diagram of device of heat exchange.
Accompanying drawing labelling:
200-rack
201-electronic equipment
202-internal recycle fan
203-First Heat Exchanger
204-air guide structure part
205-the second heat exchanger
206-outer circulation fan
207-conduit
Detailed description of the invention
Referring now to multiple embodiments that accompanying drawing describes, wherein use identical accompanying drawing labelling instruction similar elements herein.In the following description, for the ease of explaining, a large amount of detail is given, in order to provide the comprehensive understanding to one or more embodiments. It may be evident, however, that described embodiment can also be practiced without these specific details. In other example, provide known features and equipment in block diagram form, in order to describe one or more embodiment.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is a part of embodiment of the present invention, rather than whole embodiment. Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the premise not making creative work, all should belong to the scope of protection of the invention.
In prior art, the device with heat exchange includes rack and heat exchanger, and this heat exchanger is arranged at the top of rack, and interior of equipment cabinet only includes electronic equipment. As shown in Figure 1, the electronic equipment 101 that this device includes rack 100, is arranged in rack 100, this device also includes the mutually isolated cold air spatially and thermally air space being arranged on this rack 100 top, cold air space is in communication with the outside, hot-air space connects with this rack 100, this cold air interior volume is provided with condenser 102 and outer circulation fan 104, this hot-air interior volume is provided with vaporizer 103 and internal recycle fan 105, is provided with the heat-transfer working medium of connection between this condenser 102 and this vaporizer 103.
When electronic equipment 101 works, the hot-air that this electronic equipment 101 produces flows into hot-air space under the drive of internal recycle fan 105, meanwhile, flows into cold air space under the drive of the circulating fan 104 outside of the cold air outside this device. So, when hot-air in hot-air space is by this vaporizer 103, heat-transfer working medium in vaporizer 103 absorbs the heat that overwhelming majority hot-air brings, entered in rack 100 (shown in the arrow N in figure) by the hot-air absorbing heat by the air outlet in hot-air space, the portion of heat transfer working medium gasification being positioned at vaporizer 103 expands rapidly and boosts, and promotes heat-transfer working medium to flow to condenser 102; When cold air in cold air space is by condenser 102, heat-transfer working medium in condenser 102 runs into cold air heat release cooling, bubble shrinkage, gas is condensed into liquid, pressure declines, and the heat discharged and small part cold air are discharged to the outside environment (shown in the arrow W in figure) by the air outlet in cold air space.
By above it can be seen that temperature conditioning unit, i.e. above-mentioned heat exchanger, it is as a top being wholy set in rack. When electronic equipment 101 heat consumption is very big, have to the height being greatly increased this temperature conditioning unit to meet the heat-sinking capability of this rack 100, it is a lot of that this can cause that the overall volume of this device increases, and affects the compactness (i.e. the unit volume heat-sinking capability of rack) of rack.
Below in conjunction with Fig. 2 to Fig. 3, the device with heat exchange that the embodiment of the present invention is provided is described in detail.
The fundamental diagram of the device with heat exchange that Fig. 2 provides for the embodiment of the present invention. As shown in Figure 2, this device includes rack 200, is provided with electronic equipment 201, internal recycle fan 202 and First Heat Exchanger 203, wherein in this rack 200, this internal recycle fan 202 is arranged at the top of this electronic equipment 201, and this First Heat Exchanger 203 is arranged on the door of sidewall of this rack 200;Being provided with air guide structure part 204 between this internal recycle fan 202 and this First Heat Exchanger 203, this internal recycle fan 202 makes the air in this rack 200 flow through this First Heat Exchanger 203 by this air guide structure part 204;
This outer top of rack 200 is provided with the second heat exchanger 205 and outer circulation fan 206, wherein, this First Heat Exchanger 203 is connected with this second heat exchanger 205 by conduit 207 and is provided with the heat-transfer working medium of connection, this conduit 207 makes this heat-transfer working medium circulate between this First Heat Exchanger 203 and this second heat exchanger 205, it is achieved heat exchange.
Specifically, in embodiments of the present invention, when electronic equipment 201 works, the hot-air that this electronic equipment 201 produces flows through First Heat Exchanger 203 by air guide structure part 204 under the drive of internal recycle fan 202, meanwhile, the second heat exchanger 205 is flowed through under the drive of the circulating fan 206 outside of the cold air outside this device. So, when hot-air is by First Heat Exchanger 203, the heat-transfer working medium in this First Heat Exchanger 203 absorbs the heat that overwhelming majority hot-air brings, and is entered in rack 200 (shown in the arrow N2 in figure) by the hot-air absorbing heat again. Owing to this First Heat Exchanger 203 is connected by conduit 207 with this second heat exchanger 205, therefore, the portion of heat transfer working medium gasification being positioned at First Heat Exchanger 203 expands rapidly and boosts, and promotes heat-transfer working medium to flow to the second heat exchanger 205. When extraneous cold air is by the second heat exchanger 205, heat-transfer working medium in second heat exchanger 205 runs into cold air heat release cooling, bubble shrinkage, gas is condensed into liquid, pressure declines, and the heat discharged and small part cold air can be discharged to the outside environment (shown in the arrow W2 in figure). Due to two ends pressure reduction, and the inhomogeneities of the randomness of gas/liquid bolt distribution and localized heat transfer causes pressure imbalance in adjacent tubes, heat-transfer working medium is driven to circulate between First Heat Exchanger 203 and this second heat exchanger 205, it is achieved heat is by the transmission of one end to the other end.
It should be understood that, the layout of current communication cabinet is all that internal recycle fan 202 is arranged on the top of electronic equipment 201, as shown in Figure 2, such layout has two advantages: on the one hand, owing to hot-air rises naturally, the principle of cold air natural subsidence, internal recycle fan 202 is placed on above electronic equipment 201 to be more conducive to hot-air is delivered to First Heat Exchanger 203 place in time; On the other hand, being disposed below by electronic equipment 201 can so that the installation of electronic equipment 201 and maintenance.
Should also be understood that merely illustrating outer circulation fan 206 in Fig. 2 is positioned at the situation on the right side of the second heat exchanger 205, alternatively, outer circulation fan 206 may be additionally located at the left side of the second heat exchanger 205, and this is not construed as limiting by the embodiment of the present invention.
In prior art, the height assuming rack is L, the height of vaporizer is M, the height of condenser is N, so the whole height of this device is L+M+N, and the embodiment of the present invention make use of the enclosure interior that prior art does not utilize, the door of such as interior of equipment cabinet is along part, vaporizer and internal recycle fan have been placed into interior of equipment cabinet, in embodiments of the present invention, the height of rack is that (inside has included vaporizer to L, i.e. First Heat Exchanger in the present invention), the height of condenser is N, therefore, the whole height of the device of the embodiment of the present invention is L+N, compared with prior art reduce the whole height of device. additionally, when electronic equipment heat consumption constantly increases, prior art needs to increase the height of temperature conditioning unit, namely height M+N is increased, the present invention has only to increase height M, and therefore, the present invention can also reduce this device when electronic equipment heat consumption increases needs the whole height increased.
The device with heat exchange that the embodiment of the present invention provides, by by temperature conditioning unit scattering device in the diverse location of rack, make full use of the enclosure interior that prior art does not effectively utilize, the height that this device is overall can be reduced, thus reducing the volume of this device, this device when electronic equipment heat consumption increases can be reduced simultaneously and need the whole height increased, to meet the radiating requirements of the continuous evolution of rack.
As an alternative embodiment, this rack 200 top is provided with through hole, and this conduit 207 connects this First Heat Exchanger 203 and this second heat exchanger 205 by this through hole.
As an alternative embodiment, this First Heat Exchanger 203 is arranged at from this electronic equipment 201 on the door of maximum sidewall.
Specifically, this First Heat Exchanger 203 can be arranged on the door of arbitrary sidewall of this rack, if this rack 200 only one of which door, so this First Heat Exchanger is necessarily arranged on this door, if this rack 200 has at least two door, then this First Heat Exchanger 203 can be arranged at from this electronic equipment 201 on the door of maximum sidewall.
Should be understood that on the door of the sidewall that this First Heat Exchanger 203 is arranged at rack 200, it is possible to achieve open the door and be easy to the electronic equipment 201 in rack 200 is safeguarded, close internal recycle fan 202 and this airtight ventilation of First Heat Exchanger 203 behind the door.
As an alternative embodiment, this First Heat Exchanger 203 is for being converted to cold air by the hot-air flowed through, and this First Heat Exchanger 203 includes vaporizer.
Should be understood that this First Heat Exchanger includes but not limited to vaporizer, any device that the hot-air flowed through can be converted to cold air can serve as this First Heat Exchanger, and this is not construed as limiting by the embodiment of the present invention.
As an alternative embodiment, this second heat exchanger 205 is for being converted to hot-air by the cold air flowed through, and this second heat exchanger 205 includes condenser.
Should be understood that this second heat exchanger includes but not limited to condenser, any device that the cold air flowed through can be converted to hot-air can serve as this second heat exchanger, and this is not construed as limiting by the embodiment of the present invention.
As an alternative embodiment, as it is shown on figure 3, this outer top of rack 200 is additionally provided with the cold pump of liquid or compressor of air conditioner 208, it is used for freezing.
Specifically, cold for liquid pump or compressor of air conditioner 208 can be arranged at the outer top of this rack 200, by the cold pump of liquid or compressor of air conditioner 208, substitute action of gravity, drive the heat-transfer working medium in heat radiating flat tube to flow between First Heat Exchanger 203 and this second heat exchanger 205.
It should be understood that, Fig. 3 merely illustrates the cold pump of liquid or compressor of air conditioner 208 is in the situation below the second heat exchanger 205, alternatively, the cold pump of this liquid or compressor of air conditioner 208 also can be located at the top of the second heat exchanger 205, or the size reasonable according to the cold pump of this liquid or compressor of air conditioner 208 and the second heat exchanger 205 is placed, and this is not construed as limiting by the embodiment of the present invention.
In embodiments of the present invention, by the cold pump of annex solution or compressor of air conditioner on the basis of original scheme, it is possible to make machine in-cabinet temperature lower than ambient temperature, it is achieved fast-refrigerating, be greatly improved the heat-sinking capability of this device, meet the radiating requirements of the continuous evolution of rack.
As an alternative embodiment, this First Heat Exchanger 203 or this second heat exchanger 205 include fin, and this fin is plate-fin, fin-tube type or nest plate type. Should be understood that this First Heat Exchanger 203 can be vaporizer, the second heat exchanger 205 can be condenser.
Specifically, this First Heat Exchanger 203 and/or the second heat exchanger 205 may include that fin and heat radiating flat tube, and this fin is arranged between adjacent two heat radiating flat tube, considerably increases effective heat exchange area. Being filled with heat-transfer working medium inside this heat radiating flat tube, this heat-transfer working medium can be ammonia, acetone or tetrafluoroethane R134A etc.
The device with heat exchange that the embodiment of the present invention provides, by by temperature conditioning unit scattering device in the diverse location of rack, make full use of the enclosure interior that prior art does not effectively utilize, the height that this device is overall can be reduced, thus reducing the volume of this device, this device when electronic equipment heat consumption increases can be reduced simultaneously and need the whole height increased, to meet the radiating requirements of the continuous evolution of rack.
Should be understood that the technical scheme of the embodiment of the present invention can apply to the various rack needing heat radiation, for instance, outdoor communication cabinet, server cabinet, cable distribution cabinet, this is not construed as limiting by the embodiment of the present invention.
The terms "and/or", is only a kind of incidence relation describing affiliated partner, and expression can exist three kinds of relations, for instance, A and/or B, it is possible to represent: individualism A, there is A and B, individualism B these three situation simultaneously. It addition, character "/" herein, typically represent forward-backward correlation to as if the relation of a kind of "or".
The above; it is only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those familiar with the art is in the technical scope that the invention discloses; can readily occurring in amendment or the replacement of various equivalence, these amendments or replacement all should be encompassed within protection scope of the present invention. Therefore, protection scope of the present invention should be as the criterion with scope of the claims.

Claims (8)

1. a device with heat exchange, it is characterized in that, described device includes rack (200), electronic equipment (201), internal recycle fan (202) and First Heat Exchanger (203) it is provided with in described rack (200), wherein, described internal recycle fan (202) is arranged at the top of described electronic equipment (201), and described First Heat Exchanger (203) is arranged on the door of described rack (200) sidewall; Being provided with air guide structure part (204) between described internal recycle fan (202) and described First Heat Exchanger (203), described internal recycle fan (202) makes the air in described rack (200) flow through described First Heat Exchanger (203) by described air guide structure part (204);
Described rack (200) outer top is provided with the second heat exchanger (205) and outer circulation fan (206), wherein, described First Heat Exchanger (203) is connected and containing the heat-transfer working medium connected by conduit (207) with described second heat exchanger (205), described conduit (207) makes described heat-transfer working medium circulate between described First Heat Exchanger (203) and described second heat exchanger (205), it is achieved heat exchange.
2. device according to claim 1, it is characterized in that, described rack (200) top is provided with through hole, and described conduit (207) connects described First Heat Exchanger (203) and described second heat exchanger (205) by described through hole.
3. device according to claim 1 and 2, it is characterised in that described First Heat Exchanger (203) is arranged at from described electronic equipment (201) on the door of maximum sidewall.
4. device according to any one of claim 1 to 3, it is characterised in that described First Heat Exchanger (203) is for being converted to cold air by the hot-air flowed through, and described First Heat Exchanger (203) includes vaporizer.
5. device according to any one of claim 1 to 4, it is characterised in that described second heat exchanger (205) is for being converted to hot-air by the cold air flowed through, and described second heat exchanger (205) includes condenser.
6. device according to any one of claim 1 to 5, it is characterized in that, described rack (200) outer top is additionally provided with the cold pump of liquid or compressor of air conditioner (208), the cold pump of described liquid or compressor of air conditioner (208) and is used for freezing.
7. device according to any one of claim 1 to 6, it is characterised in that described First Heat Exchanger (203) or described second heat exchanger (205) include fin, and described fin is plate-fin, fin-tube type or nest plate type.
8. device according to any one of claim 1 to 7, it is characterised in that described heat-transfer working medium is ammonia, acetone or tetrafluoroethane R134A.
CN201610051956.3A 2016-01-26 2016-01-26 Device with heat exchange Pending CN105658033A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610051956.3A CN105658033A (en) 2016-01-26 2016-01-26 Device with heat exchange
PCT/CN2016/091912 WO2017128659A1 (en) 2016-01-26 2016-07-27 Device with heat exchange function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610051956.3A CN105658033A (en) 2016-01-26 2016-01-26 Device with heat exchange

Publications (1)

Publication Number Publication Date
CN105658033A true CN105658033A (en) 2016-06-08

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ID=56487180

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610051956.3A Pending CN105658033A (en) 2016-01-26 2016-01-26 Device with heat exchange

Country Status (2)

Country Link
CN (1) CN105658033A (en)
WO (1) WO2017128659A1 (en)

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CN106163242A (en) * 2016-08-31 2016-11-23 杭州华为数字技术有限公司 A kind of rack heat-exchange system and server
WO2017128659A1 (en) * 2016-01-26 2017-08-03 华为技术有限公司 Device with heat exchange function
CN113747763A (en) * 2021-09-08 2021-12-03 广东电网有限责任公司 Heat dissipation system for substation exchange cabinet
CN114554779A (en) * 2020-11-24 2022-05-27 华为技术有限公司 Heat dissipation device and vehicle
WO2023044740A1 (en) * 2021-09-24 2023-03-30 华为数字能源技术有限公司 Machine box, energy storage system and data system

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US20080156030A1 (en) * 2006-12-28 2008-07-03 Whirlpool Corporation Hybrid multi-evaporator central cooling system for modular kitchen
CN201289187Y (en) * 2008-08-26 2009-08-12 许红飞 Heat exchanger
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017128659A1 (en) * 2016-01-26 2017-08-03 华为技术有限公司 Device with heat exchange function
CN106163242A (en) * 2016-08-31 2016-11-23 杭州华为数字技术有限公司 A kind of rack heat-exchange system and server
CN106163242B (en) * 2016-08-31 2019-05-28 杭州华为数字技术有限公司 A kind of cabinet heat-exchange system and server
CN114554779A (en) * 2020-11-24 2022-05-27 华为技术有限公司 Heat dissipation device and vehicle
WO2022110692A1 (en) * 2020-11-24 2022-06-02 华为技术有限公司 Heat dissipation device and vehicle
CN113747763A (en) * 2021-09-08 2021-12-03 广东电网有限责任公司 Heat dissipation system for substation exchange cabinet
CN113747763B (en) * 2021-09-08 2023-12-19 广东电网有限责任公司 Heat dissipation system of transformer substation exchange cabinet
WO2023044740A1 (en) * 2021-09-24 2023-03-30 华为数字能源技术有限公司 Machine box, energy storage system and data system

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Application publication date: 20160608