CN105647434B - Compound hot melt adhesive film of polypropylene cellular board and preparation method thereof - Google Patents
Compound hot melt adhesive film of polypropylene cellular board and preparation method thereof Download PDFInfo
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- CN105647434B CN105647434B CN201610072073.0A CN201610072073A CN105647434B CN 105647434 B CN105647434 B CN 105647434B CN 201610072073 A CN201610072073 A CN 201610072073A CN 105647434 B CN105647434 B CN 105647434B
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- hot melt
- melt adhesive
- adhesive film
- ethylene
- polypropylene
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/10—Homopolymers or copolymers of propene
- C09J123/14—Copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses compound hot melt adhesive film of polypropylene cellular board and preparation method thereof, ternary polymerized polypropylene, ethylene, propylene or the ethylene-butylene copolymer of a certain proportion of low melting point, C5/C9 copolymer resinses, HMW PP waxes and antioxidant, which are placed in kneader, carries out banburying processing, after after system thawing, repeatedly adding closure silane attaches power accelerator and carry out after kneading processing water ring granulation and extrude progress curtain coating processing again hot melt adhesive film is made.Matrix uses ternary polymerized polypropylene blending and modifying in the present invention, can meet client and is combined in the case of PP cellular boards not softening transform；The low temperature flexibility of PUR can be improved using ethylene, propylene or ethylene-butylene copolymer；Closure silane attaches power accelerator can improve bonding strength；The hot melt adhesive film of this formula system is fast due to good film-forming property, crystallization, and glued membrane is produced beneficial to using casting technique, without lining paper, cost reduction, beneficial to popularization.
Description
Technical field
The present invention relates to the compound hot melt adhesive film of polypropylene cellular board, and in particular to the compound PUR of polypropylene cellular board
Film and preparation method thereof.
Background technology
Feature, light material are the themes of current new material, and more low-gravity polypropylene（PP）Plastics collocation honeybee
Nest structure will bring more excellent application performances, be with a wide range of applications.
PP cellular boards are, by two pieces of relatively thin panels, honeycomb core two sides one layer thicker to be bonded in securely and is made
Sheet material, also known as honeycomb sandwich construction.This structure is because lightweight Gao Gang, asepsis environment-protecting, damping are cold-resistant, sound-insulating, anti-tidal rip
Hot the advantages of, it is widely used in boot-lid panel, baggage-compartment partition, baggage compartment carpet substrate, the gusset dress of medium-to-high grade passenger car
The interior trim such as plaque, ceiling position, engine Turnover Box etc..For example, auto parts and components are main by Germany, Japan with Turnover Box at present
Production, though domestic enterprise has started to walk, comes still without the marketization more 2 years.
A big technical barrier prepared by PP cellular boards is compound.Use traditional glue, although can be combined, but a side
Theory of the face due to not meeting environmental protection；One side glue is generally curing type system, and low temperature embrittlement is than more serious, and performance can not be protected
Card.And the product of PUR type is at present still without the glue for being adapted to five layers of combination process.
1）The hot melt adhesive film of modified EVA type, although adhesion strength is adapted to client with combination process, but because EVA is fatal
Low softening point and can not promote.
2）Although the TPE of encapsulated type can be used for coating PP materials, but the technique is mainly using the encapsulated method of injection,
Encapsulated temperature is high, is coated under PP soft states, is not suitable for the continuous process of laminating machine.In addition, TPE types of material into
Film is poor, even if the TPE of oil-filled property, the speed of casting films is still very slow, it is impossible to the marketization.
The content of the invention
The present invention in view of the above-mentioned problems, there is provided compound hot melt adhesive film of a kind of polypropylene cellular board and preparation method thereof with
Solve the above problems.
In order to solve the above technical problems, one aspect of the present invention is：The compound hot melt of polypropylene cellular board
Glued membrane, includes the material of following weight fraction：The ternary polymerized polypropylene of 40% ~ 70% low melting point, 20% ~ 40% ethene-the third
Alkene or ethylene-butene copolymer, 5% ~ 20% C5/C9 copolymer resinses, 2% ~ 15% HMW PP waxes, 2 ‰ ~ 8 ‰ envelope
Closing property silane attaches power accelerator and 1 ‰ ~ 2 ‰ antioxidant.
As the preferred of such scheme, the fusing point of described ternary polymerized polypropylene is 90-120 DEG C.
The preparation method of the compound hot melt adhesive film of polypropylene cellular board, by the ternary polymerization of 40% ~ 70% low melting point poly- third
Alkene, 20% ~ 40% ethylene-propylene or ethylene-butene copolymer, 5% ~ 20% C5/C9 copolymer resinses, 2% ~ 15% macromolecule
Amount PP waxes and 1 ‰ ~ 2 ‰ antioxidant, which are placed in kneader, carries out banburying processing, after after system thawing, repeatedly adds closure
Silane attaches power accelerator simultaneously carries out kneading processing, after the completion of kneading discharging go forward side by side the granulation of water-filling ring processing hot melt adhesive tablet is made,
Curtain coating processing is carried out after hot melt adhesive tablet is extruded through screw extruder hot melt adhesive film is made.
As the preferred of such scheme, the total amount of the closure silane attaches power accelerator repeatedly added is 2 ‰ ~ 8 ‰, often
The amount of the closure silane attaches power accelerator of secondary addition is identical.
As the preferred of such scheme, 5 ~ 8min of kneading time when mediating processing.
The beneficial effects of the invention are as follows：
1）Matrix is polypropylene blending modified using ternary polymerization low melting point, and modified PUR can meet 80 DEG C and not open
The application environment requirement of glue, can firmly be combined in 150 ~ 160 DEG C of temperature ranges, can meet client not soft in PP cellular boards again
It is combined in the case of changing deformation.
2）The present invention uses ethylene-propylene or ethylene-butene copolymer, can improve the low temperature flexibility of PUR,
The problem of solving current product cold cracking.
3）C5/C9 copolymer resinses, HMW PP waxes, which assign PUR, good initial bonding strength and base material digestibility, to low
The polypropylene of surface energy（PP）Material has splendid digestibility, and material surface reduces work without surface treatments such as the dizzy, plasmas of point
Sequence, while also reducing cost.
4）Closure silane attaches power accelerator can be bonded with the inorganic reinforcing filler in PP cellular boards, improve viscous
Close intensity.
5）The hot melt adhesive film of this formula system is fast due to good film-forming property, crystallization, and glued membrane, nothing are produced beneficial to using casting technique
Need lining paper, cost reduction, beneficial to popularization.
Embodiment
With reference to embodiment, the embodiment to the present invention is further described.
The compound hot melt adhesive film of polypropylene cellular board, includes the material of following weight fraction：The three of 40% ~ 70% low melting point
First COPP, 20% ~ 40% ethylene-propylene or ethylene-butene copolymer, 5% ~ 20% C5/C9 copolymer resinses, 2% ~
15% HMW PP waxes, 2 ‰ ~ 8 ‰ closure silane attaches power accelerator and 1 ‰ ~ 2 ‰ antioxidant.
Wherein, the fusing point of ternary polymerized polypropylene is 90-120 DEG C.
The preparation method of the compound hot melt adhesive film of polypropylene cellular board, by the ternary polymerization of 40% ~ 70% low melting point poly- third
Alkene, 20% ~ 40% ethylene-propylene or ethylene-butene copolymer, 5% ~ 20% C5/C9 copolymer resinses, 2% ~ 15% macromolecule
Amount PP waxes and 1 ‰ ~ 2 ‰ antioxidant, which are placed in kneader, carries out banburying processing, and after after system thawing, total amount is added in four times
Closure silane attaches power accelerator for 2 ‰ ~ 8 ‰ simultaneously carries out kneading processing, mediates the water-filling ring of going forward side by side of discharging after 5 ~ 8min and makes
Hot melt adhesive tablet is made in grain processing, curtain coating processing is carried out after hot melt adhesive tablet is extruded through screw extruder hot melt adhesive film is made.
Wherein, the amount of the closure silane attaches power accelerator added every time is identical.
Embodiment one：
The compound hot melt adhesive film of polypropylene cellular board, includes the material of following weight fraction：The ternary of 50% low melting point is total to
Poly- polypropylene, 30% ethylene-propylene or ethylene-butene copolymer, 15% C5/C9 copolymer resinses, 5 ‰ closure silane
Adhesion promoter and 2 ‰ antioxidant.Surplus is HMW PP waxes.
Embodiment two：
The compound hot melt adhesive film of polypropylene cellular board, includes the material of following weight fraction：The ternary of 70% low melting point is total to
Poly- polypropylene, 20% ethylene-propylene or ethylene-butene copolymer, 5% C5/C9 copolymer resinses, 8 ‰ closure silane
Adhesion promoter and 1 ‰ antioxidant.Surplus is HMW PP waxes.
Embodiment three：
The compound hot melt adhesive film of polypropylene cellular board, includes the material of following weight fraction：The ternary of 40% low melting point is total to
Poly- polypropylene, 30% ethylene-propylene or ethylene-butene copolymer, 20% C5/C9 copolymer resinses, 8 ‰ closure silane
Adhesion promoter and 2 ‰ antioxidant.Surplus is HMW PP waxes.
Example IV：
The compound hot melt adhesive film of polypropylene cellular board, includes the material of following weight fraction：The ternary of 40% low melting point is total to
Poly- polypropylene, 40% ethylene-propylene or ethylene-butene copolymer, 10% C5/C9 copolymer resinses, 8 ‰ closure silane
Adhesion promoter and 2 ‰ antioxidant.Surplus is HMW PP waxes.
For those skilled in the art, the technical scheme described in foregoing embodiments can still be repaiied
Change, or equivalent substitution is carried out to which part technical characteristic, within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (5)
1. the compound hot melt adhesive film of polypropylene cellular board, it is characterised in that include the material of following weight fraction：40% ~ 70%
The ternary polymerized polypropylene of low melting point, 20% ~ 40% ethylene-propylene or ethylene-butene copolymer, 5% ~ 20% C5/C9 are total to
Poly resin, 2% ~ 15% HMW PP waxes, 2 ‰ ~ 8 ‰ closure silane attaches power accelerator and 1 ‰ ~ 2 ‰ antioxygen
Agent.
2. the compound hot melt adhesive film of polypropylene cellular board as claimed in claim 1, it is characterised in that described ternary polymerization gathers
The fusing point of propylene is 90-120 DEG C.
3. the preparation method of the compound hot melt adhesive film of polypropylene cellular board, it is characterised in that by the ternary of 40% ~ 70% low melting point
COPP, 20% ~ 40% ethylene-propylene or ethylene-butene copolymer, 5% ~ 20% C5/C9 copolymer resinses, 2% ~ 15%
HMW PP waxes and 1 ‰ ~ 2 ‰ antioxidant be placed in kneader and carry out banburying processing, after after system thawing, repeatedly plus
Enter closure silane attaches power accelerator and carry out kneading processing, after the completion of kneading discharging go forward side by side the granulation of water-filling ring processing heat is made
Melten gel grain, carries out curtain coating processing and hot melt adhesive film is made after hot melt adhesive tablet is extruded through screw extruder.
4. the preparation method of the compound hot melt adhesive film of polypropylene cellular board as claimed in claim 3, it is characterised in that repeatedly add
The total amount of the closure silane attaches power accelerator entered is 2 ‰ ~ 8 ‰, the closure silane attaches power accelerator added every time
Amount is identical.
5. the preparation method of the compound hot melt adhesive film of polypropylene cellular board as claimed in claim 3, it is characterised in that at kneading
5 ~ 8min of kneading time during reason.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610072073.0A CN105647434B (en) | 2016-02-02 | 2016-02-02 | Compound hot melt adhesive film of polypropylene cellular board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610072073.0A CN105647434B (en) | 2016-02-02 | 2016-02-02 | Compound hot melt adhesive film of polypropylene cellular board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN105647434A CN105647434A (en) | 2016-06-08 |
| CN105647434B true CN105647434B (en) | 2017-10-03 |
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| CN201610072073.0A Active CN105647434B (en) | 2016-02-02 | 2016-02-02 | Compound hot melt adhesive film of polypropylene cellular board and preparation method thereof |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273731B (en) * | 2016-08-04 | 2018-05-25 | 合肥杰迈特汽车新材料有限公司 | A kind of automotive trim water-proof environmental protection type honeycomb composite cardboard and preparation method thereof |
| CN106379422B (en) * | 2016-10-12 | 2019-02-05 | 杭州华聚复合材料有限公司 | Logistic car compartment and its skirt general assembly structure |
| CN109321147A (en) * | 2018-08-24 | 2019-02-12 | 重庆诚惠丰胶粘制品有限公司 | A kind of environment-friendly hot-melt glue film and preparation method for nonpolarity material bonding |
| CN112852346A (en) * | 2020-12-25 | 2021-05-28 | 上海邦中新材料有限公司 | High-adhesion-strength hot melt adhesive for polypropylene plastic honeycomb plate and preparation method thereof |
| CN116476356B (en) * | 2023-06-20 | 2023-09-15 | 石狮佳南热熔胶有限公司 | Prevent fold hot melt adhesive film and cooling device for hot melt adhesive film production |
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| WO2002000807A1 (en) * | 2000-06-24 | 2002-01-03 | Seong Il Chemical Co., Ltd. | Polyolefin-based hot melt adhesive for deflection yoke |
| CN101760145A (en) * | 2009-12-22 | 2010-06-30 | 广州鹿山新材料股份有限公司 | Halogen-free flame-retardant hot-melt pressure sensitive adhesive tape and preparation method thereof |
| CN102786895A (en) * | 2012-09-11 | 2012-11-21 | 无锡市万力粘合材料有限公司 | Hot-melt adhesive for transparent PP (polypropylene) boxes and preparation method of hot-melt adhesive |
| WO2013003196A1 (en) * | 2011-06-27 | 2013-01-03 | H.B. Fuller Company | Propylene-alpha-olefin polymers, hot melt adhesive compositions that include propylene-alpha-olefin polymers and articles that include the same |
| CN104419349A (en) * | 2013-09-10 | 2015-03-18 | 杭州邦林热熔胶有限公司 | Hot melt adhesive for food and daily chemical product bottle caps and preparation method of hot melt adhesive |
-
2016
- 2016-02-02 CN CN201610072073.0A patent/CN105647434B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002000807A1 (en) * | 2000-06-24 | 2002-01-03 | Seong Il Chemical Co., Ltd. | Polyolefin-based hot melt adhesive for deflection yoke |
| CN101760145A (en) * | 2009-12-22 | 2010-06-30 | 广州鹿山新材料股份有限公司 | Halogen-free flame-retardant hot-melt pressure sensitive adhesive tape and preparation method thereof |
| WO2013003196A1 (en) * | 2011-06-27 | 2013-01-03 | H.B. Fuller Company | Propylene-alpha-olefin polymers, hot melt adhesive compositions that include propylene-alpha-olefin polymers and articles that include the same |
| CN102786895A (en) * | 2012-09-11 | 2012-11-21 | 无锡市万力粘合材料有限公司 | Hot-melt adhesive for transparent PP (polypropylene) boxes and preparation method of hot-melt adhesive |
| CN104419349A (en) * | 2013-09-10 | 2015-03-18 | 杭州邦林热熔胶有限公司 | Hot melt adhesive for food and daily chemical product bottle caps and preparation method of hot melt adhesive |
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| CN105647434A (en) | 2016-06-08 |
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Denomination of invention: Hot-melt adhesive film for polypropylene honeycomb plate composite and its preparation method Effective date of registration: 20221230 Granted publication date: 20171003 Pledgee: Pinghu Rural Commercial Bank of Zhejiang, Limited by Share Ltd. Pledgor: PINGHU ZHANPENG HOT MELT ADHESIVE WEB & FILM Co.,Ltd. Registration number: Y2022980029907 |
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