CN105644829A - Packaging method for small-size PCBs - Google Patents
Packaging method for small-size PCBs Download PDFInfo
- Publication number
- CN105644829A CN105644829A CN201610100544.4A CN201610100544A CN105644829A CN 105644829 A CN105644829 A CN 105644829A CN 201610100544 A CN201610100544 A CN 201610100544A CN 105644829 A CN105644829 A CN 105644829A
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- CN
- China
- Prior art keywords
- gummed paper
- pcb board
- packaging
- little size
- packaging method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/02—Attaching small articles, e.g. buttons, to cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B5/00—Packaging individual articles in containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, jars
- B65B5/10—Filling containers or receptacles progressively or in stages by introducing successive articles, or layers of articles
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packages (AREA)
Abstract
The invention discloses a packaging method for small-size PCBs. The packaging method includes the steps that gummed paper is selected and cut into the proper size; the small-size PCBs are uniformly distributed on the gummed paper, and then another gummed paper and the gummed paper are bonded; and the bonded gummed paper is overlaid in a packaging carton, and therefore packaging is completed. The problems that the small-size PCBs are prone to moving, collapsing and skewing in the packaging process are solved, or complex packaging methods for solving the problems are avoided, for example, special clamps and special packaging boxes are omitted. By means of the packaging method, the packaging problems of the small-size PCBs can be solved simply, quickly, safely and reliably.
Description
Technical field
The present invention relates to PCB packaging field, particularly relate to the Packaging Method of a kind of little size pcb board.
Background technology
After PCB completes, common shipment mode is all shipment in flakes, but for not accepting the little size pcb board of shipment in flakes, it easily occurs collapsing in wrapping process, the wiping flower bad phenomenon caused such as crooked, mobile.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide the Packaging Method of a kind of little size pcb board, it is intended to solve existing little size pcb board and easily occur collapsing in wrapping process, the wiping caused such as crooked, mobile spend bad problem.
The technical scheme of the present invention is as follows:
A Packaging Method for little size pcb board, wherein, comprises step:
Select gummed paper, gummed paper is cut into suitable size;
Little size pcb board is evenly arranged on a gummed paper, then bond with another gummed paper;
The gummed paper bonded is layered in Packaging Box and namely completes packaging.
The Packaging Method of described little size pcb board, wherein, described little size pcb board is of a size of 50*50mm.
The Packaging Method of described little size pcb board, wherein, described gummed paper is PET gummed paper.
The Packaging Method of described little size pcb board, wherein, described gummed paper is the red gummed paper of the film.
The Packaging Method of described little size pcb board, wherein, described gummed paper is the gummed paper that one side has viscosity.
The Packaging Method of described little size pcb board, wherein, described gummed paper is hinge.
The Packaging Method of described little size pcb board, wherein, when bonding, gummed paper edge needs the space of reserved 10 ~ 20mm.
Useful effect: the invention solves that little size pcb board easily moves in wrapping process, collapses, the problem such as crooked, or avoid the Packaging Method that the comparison that adopts for overcoming the above problems is complicated, such as unit clamp, package box special etc., the Packaging Method of the present invention can simple and fast and solve the packaging Problems of this type of little size PCB safely and reliably.
Accompanying drawing explanation
Fig. 1 is the schema of the better embodiment of Packaging Method of a kind of little size pcb board of the present invention.
Fig. 2 is the distribution schematic diagram of method little size pcb board when packing of the present invention.
Embodiment
The present invention provides the Packaging Method of a kind of little size pcb board, and for making the object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below. It is to be understood that specific embodiment described herein is only in order to explain the present invention, it is not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is the schema of the better embodiment of Packaging Method of a kind of little size pcb board of the present invention, and as shown in the figure, it comprises step:
S1, selection gummed paper, cut into suitable size by gummed paper;
S2, little size pcb board is evenly arranged on a gummed paper, then bond with another gummed paper;
S3, the gummed paper bonded is layered in Packaging Box namely complete packaging.
In the present invention, as shown in Figure 2, first gummed paper cutting into suitable size, to ensure that often opening gummed paper can stick the little size pcb board meeting requirement, but be also unlikely to excessive, waste gummed paper, such as, shown in Fig. 2, can cut into square by gummed paper 10.
Then being evenly arranged on a gummed paper 10 by little size pcb board 11, the little size pcb board 11 that such as each little size pcb board 11 is adjacent is 10mm apart, it is ensured that mutually do not impact. Bonding with another gummed paper 10, close little size pcb board 11, the mode such as arranged can be 15 row and 15 row (15 little size the pcb board 11 and 15 little size pcb board 11 of row of row), and line-spacing and arranging apart from identical, i.e. 10mm.
Two the gummed paper 10(folders obtaining multiple bonding according to the method described above good have little size pcb board 11), finally the gummed paper 10 bonded is layered in Packaging Box and namely completes packaging.
Described little size pcb board 11 is of a size of 50*50mm. For this kind little size pcb board 11, traditional shipment easily causes problems, and the method for the present invention is then simple, very applicable.
Described gummed paper 10 is PET gummed paper. Or described gummed paper is the red gummed paper of the film, i.e. red film gummed paper. Described PET gummed paper, by mass parts, consists of the following composition: basis rubber 100, tackified rubber 70, resin 40
Described gummed paper 10 has the gummed paper of viscosity for one side. It is used for the one side of viscosity bonding little size pcb board 11, is used for bonding with the one side of viscosity with another kind of gummed paper 10 simultaneously. Gummed paper 10 can be placed without the one side of viscosity with another gummed paper 10 without the one side of viscosity, avoids being bonded together, and facilitates multiple gummed papers 10 fitted stacked.
Described gummed paper 10 is hinge. Hinge can conveniently check the little size pcb board 11 wherein bonded, and judges whether to have the little size pcb board 11 of bag mistake or other problems.
As shown in Figure 2, the present invention has viscosity, transparent gummed paper 10 with a kind of one side, first adheres on a gummed paper 10 by evenly distributed for little size pcb board 11, then bonds with another gummed paper 10 and first gummed paper 10, can realize simple and efficient packaging.
When bonding, gummed paper 10 edge needs the space of reserved 10 ~ 20mm, leaves this space, can be used to closed two sides gummed paper 10, ensures that two sides gummed paper 10 is fitted closely. Such as gummed paper 10 is square, up and down the space of four all reserved 15mm in limit, it is ensured that can be used to closed two gummed papers 10, avoids polluting or damaging pcb board.
Should be understood that, the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, it is possible to is improved according to the above description or converts, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (7)
1. the Packaging Method of one kind little size pcb board, it is characterised in that, comprise step:
Select gummed paper, gummed paper is cut into suitable size;
Little size pcb board is evenly arranged on a gummed paper, then bond with another gummed paper;
The gummed paper bonded is layered in Packaging Box and namely completes packaging.
2. the Packaging Method of little size pcb board according to claim 1, it is characterised in that, described little size pcb board is of a size of 50*50mm.
3. the Packaging Method of little size pcb board according to claim 1, it is characterised in that, described gummed paper is PET gummed paper.
4. the Packaging Method of little size pcb board according to claim 1, it is characterised in that, described gummed paper is the red gummed paper of the film.
5. the Packaging Method of little size pcb board according to claim 1, it is characterised in that, described gummed paper is the gummed paper that one side has viscosity.
6. the Packaging Method of little size pcb board according to claim 1, it is characterised in that, described gummed paper is hinge.
7. the Packaging Method of little size pcb board according to claim 1, it is characterised in that, when bonding, gummed paper edge needs the space of reserved 10 ~ 20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610100544.4A CN105644829A (en) | 2016-02-24 | 2016-02-24 | Packaging method for small-size PCBs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610100544.4A CN105644829A (en) | 2016-02-24 | 2016-02-24 | Packaging method for small-size PCBs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105644829A true CN105644829A (en) | 2016-06-08 |
Family
ID=56488732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610100544.4A Pending CN105644829A (en) | 2016-02-24 | 2016-02-24 | Packaging method for small-size PCBs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105644829A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107662402A (en) * | 2016-07-29 | 2018-02-06 | 蓝思科技股份有限公司 | A kind of thermal transfer device and heat-transferring method for sheet product |
| CN109733660A (en) * | 2018-12-29 | 2019-05-10 | 杭州易正科技有限公司 | A kind of auxiliary packaging jig of potsherd capacitor |
| CN111465179A (en) * | 2020-05-27 | 2020-07-28 | 西安金百泽电路科技有限公司 | Post-processing method for characters of small pcs unit board |
Citations (6)
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| CN101746520A (en) * | 2008-12-19 | 2010-06-23 | 普光科技（广州）有限公司 | Method for packaging light-emitting diode |
| CN101969745A (en) * | 2010-10-20 | 2011-02-09 | 厦门弘信电子科技有限公司 | Manufacturing method of flexible printed circuit board post-procedures |
| US20120117925A1 (en) * | 2010-11-16 | 2012-05-17 | Lapis Semiconductor Co., Ltd. | Apparatus and method for packaging chip components |
| CN103010580A (en) * | 2012-12-14 | 2013-04-03 | 厦门市三安光电科技有限公司 | LED (Light Emitting Diode) core grain packaging method |
| CN203392174U (en) * | 2013-06-27 | 2014-01-15 | 深圳市中软信达电子有限公司 | Packaging structure of flexible circuit boards |
| JP2014084144A (en) * | 2012-10-23 | 2014-05-12 | Murata Mfg Co Ltd | Method of manufacturing carrier tape |
-
2016
- 2016-02-24 CN CN201610100544.4A patent/CN105644829A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101746520A (en) * | 2008-12-19 | 2010-06-23 | 普光科技（广州）有限公司 | Method for packaging light-emitting diode |
| CN101969745A (en) * | 2010-10-20 | 2011-02-09 | 厦门弘信电子科技有限公司 | Manufacturing method of flexible printed circuit board post-procedures |
| US20120117925A1 (en) * | 2010-11-16 | 2012-05-17 | Lapis Semiconductor Co., Ltd. | Apparatus and method for packaging chip components |
| JP2014084144A (en) * | 2012-10-23 | 2014-05-12 | Murata Mfg Co Ltd | Method of manufacturing carrier tape |
| CN103010580A (en) * | 2012-12-14 | 2013-04-03 | 厦门市三安光电科技有限公司 | LED (Light Emitting Diode) core grain packaging method |
| CN203392174U (en) * | 2013-06-27 | 2014-01-15 | 深圳市中软信达电子有限公司 | Packaging structure of flexible circuit boards |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107662402A (en) * | 2016-07-29 | 2018-02-06 | 蓝思科技股份有限公司 | A kind of thermal transfer device and heat-transferring method for sheet product |
| CN109733660A (en) * | 2018-12-29 | 2019-05-10 | 杭州易正科技有限公司 | A kind of auxiliary packaging jig of potsherd capacitor |
| CN109733660B (en) * | 2018-12-29 | 2020-11-06 | 钟小二 | Auxiliary packaging jig for ceramic chip capacitor |
| CN111465179A (en) * | 2020-05-27 | 2020-07-28 | 西安金百泽电路科技有限公司 | Post-processing method for characters of small pcs unit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160608 |
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| RJ01 | Rejection of invention patent application after publication |