CN105632893B - The method for preparing micro- inductance based on 3D printing - Google Patents
The method for preparing micro- inductance based on 3D printing Download PDFInfo
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- CN105632893B CN105632893B CN201510977677.5A CN201510977677A CN105632893B CN 105632893 B CN105632893 B CN 105632893B CN 201510977677 A CN201510977677 A CN 201510977677A CN 105632893 B CN105632893 B CN 105632893B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/64—Treatment of workpieces or articles after build-up by thermal means
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/53—Nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/55—Two or more means for feeding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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Abstract
The present invention relates to the methods for preparing micro- inductance based on 3D printing, belong to micro- inductance manufacture technology field, and micro- inductance prepared by the printing is three-dimensional inductance or the micro- inductance of plane；This method includes：Deposit SiO on substrate first2Film；Using electron-beam evaporation as buffer layer and seed layer, improve the combination of micro- inductance coil and substrate；Deposited metal material film is as micro- inductance coil；Metallic film is processed into micro- inductance coil and electrode using MEMS technology；Upper area using 3D printing nozzle in micro- inductance coil prints ferrimagnet；Ferromagnetic material is sintered and while using equidirectional external magnetic field is applied, Ferrite Material crystallization, magnetic moment orientation arrangement unification being made to be conducive to the magnetic conductivity and saturation magnetization that improve Ferrite Material.3D printing technique is combined by the present invention with micro- inductive technologies, is prepared ferrimagnet using application external magnetic field and selective local, is realized the extensive preparation of the micro- inductance of high-performance on piece.
Description
Technical field
The invention belongs to micro- inductance manufacture technology field, the method that micro- inductance is particularly prepared based on 3D printing.
Background technology
In in the past few decades, the rapid development of semiconductor information technology promotes electronic product to high integration, miniature
The directions such as change, intelligence, low-power consumption are developed, and final target is to realize various functions unit on a single chip.
4G, 5G mobile communication at present and the popularization of technology of Internet of things and development, power management and high speed data transfer are to the integrated electricity of IC
The requirement on road is also more and more high.Micro- inductance can turn electric energy as passive perceptual device indispensable in IC integrated circuits
It changes magnetic energy into, " the low pass high resistant " of AC signal may be implemented, power supply energy management (such as work(being gradually applied in intelligent electric appliance
Rate inductance), the biologic medical miniature inductance of energy transmission (be used for), the radio communication circuit (filtering in such as RF transmit-receive circuit
In the modules such as the voltage-controlled vibrator of device, frequency mixer, power amplifier and low-noise amplifier.The outer discrete inductance of piece traditional at present
Device has accounted for significant proportion space in electronic circuit, and production cost is higher, and in addition its pin leads has also attracted additionally
Parasitic drain has been unable to meet present people for electronic product high integration, low-power consumption and high performance demand.
Micro- inductance includes mainly three parts：Substrate, coil and magnetic material layer.According to space structure, micro- inductance coil
It is divided into and declines inductance and the micro- inductance of 3 D stereo for plane.The main performance indicator of micro- inductance includes inductance value L, quality factor
Q, cutoff frequency f0With suitable services frequency fmax.It is relatively low in order to solve conventional planar solenoidal inductor inductance value L and quality factor q
The problem of, research means include mainly at present：(1) use suspension, three-dimensional structure or thick dielectric layer by inductance coil with lining
Bottom is isolated, or plain conductor is configured to the helical coil structure design specialized substrates of stacking using CMOS multilayer wirings technique
Material, to achieve the purpose that reduce substrate vortex and leakage loss；But these processing preparation process is extremely complex, needs more
During which layer plate-making also needs to mutual alignment between design multilayer reticle, expensive complex process, especially three-dimensional knot
It is prepared by the processing of structure.In addition in processing preparation process, it is easy to cause inductance coil corrosion of metal or etching injury, reduce
The electromagnetic performance of micro- inductance.(2) being based on core flux enhances principle, makes electricity by the method for introducing thin magnetic film in micro- inductance
The magnetic flux for feeling coil increases, and can improve the inductance value L and quality factor q of micro- inductance.The selection of magnetic material can be from soft magnetism
Alloy (CoNbZr, CoZrTa, CoFe, NiFe permalloy etc.) arrives soft magnetic ferrite (NiZnCuFeO, YBiFeO).For soft
Permalloy material, in high frequency magnetic field, eddy-current loss is larger, is unfavorable for improving micro- inductance performance.Soft ferrite film is exhausted
Edge material, eddy-current loss can be ignored, but the required excessively high (600-750 of temperature in traditional processing preparation process
DEG C), can accelerate local inductance coil metal diffusion, reduce device performance, this method also with traditional IC processing technologys not
It is compatible.In addition, being also easily peeled off and falling off in the integrated magnetic-particle composite material prepared of micro- inductance using coating processes.It is comprehensive
On, the micro- inductance coil of tradition mainly uses MEMS or micro-nano technology technique to be prepared, but processing technology is complicated, especially three-dimensional spiral shell
Rotating inductance.Traditional processing technology：Firstly the need of preparation multilayer photolithography plate, furthermore layer needs to use with layer interconnection coil region
Via design is connected, finally due to due to complex process, the center deposition growth ferrimagnet for the inductance that declines in spiral
Relatively difficult, the inductance value and quality factor of micro- inductance prepared by general this technique are difficult to obtain the raising of higher magnitude.
3D printing technique rapidly developed in recent years, and was combined with traditional processing manufacturing technology, was suitable only for by initial
The rapid shaping of the raw material such as resin and plastic develops to the new technology way of the labyrinths such as metal, high temperature alloy, ferrite processing
Diameter.3D printing technique is under the guide of computer-aided design data, and integrated use electronic chart, swashs at remote data transmission
The series techniques such as optical scanning, material fusing, by special metal powder or memory material according to electronic model figure instruction from level to level
It stacks up, ultimately forms mock-up.The technology realizes the three-dimensional of more materials or function-graded material by digitizing injection
Printing shaping is, it can be achieved that the three-dimensional material fusion of the rapid processing of 3 D complex structure and local localization region covers.3D printing
Technique includes mainly：Stereolithography, the manufacture of stacking entity, selective laser sintering, Fused Deposition Modeling, 3 D-printing molding
With shaped deposition manufacture etc., wherein Stereolithography technique use photosensitive resin, in laser scanning resin liquid level, scanning area
The manufacture of part is realized in solidification by being successively superimposed.Entity manufacturing process, which is laminated, and then uses has certain thickness sheet material, every layer
Profile is cut by laser, and realizes superposition manufacture part successively.Selective laser sintering technique uses solid powder material, is swashing
Under light irradiation, melting and solidification occurs, to complete every layer of molding, the material ranges which uses are wider, especially in gold
Belong to the unique advantage of molding aspect with ceramic material；Fused Deposition Modeling technique uses electrical heating plastic wire, makes it in nozzle
Reach and melt state, nozzle is under the control of the computer by the material spraying to workbench of melting, to successively realize entire part
Molding；Shaped deposition manufacturing process generally completes the removal of material in deposition process using machining center, has often deposited one
This layer of part or backing material are processed into forming surface using numerical-control processing method, then carry out next layer again by layer material
Deposition process.Different methods may be used according to the material of part for shaped deposition manufacturing process, and can use three-dimensional arbitrary thick
It spends and is not layered for the part geometry of plane to manufacture part.However, due to rapidoprint and the work that application magnetic field can not be pinpointed
It is prepared by skill technology, the printing that traditional 3D printing also cannot be used directly for micro- inductance.
Invention content
The invention aims to solve the micro- inductance of tradition to prepare processing technology complexity, it is tired that ferrimagnet prepares processing
It is difficult, it is difficult to which that the problem of IC techniques are combined provides a kind of method preparing micro- inductance based on 3D printing, and the present invention is by 3D printing skill
Art is combined with micro- inductive technologies, is prepared ferrimagnet using application external magnetic field and selective local, is realized high-performance on piece
The extensive preparation of micro- inductance.
The first method that micro- inductance is prepared based on 3D printing proposed by the present invention, which is characterized in that micro- inductance is
Three-dimensional inductance, the preparation method include the following steps：
1) underlying metal for using the first 3D printing nozzle to print micro- inductance on substrate according to preset program is micro-
Inductance coil；
2) the micro- inductance coil of the underlying metal of printing is sintered with laser；
3) one layer of insulating materials is grown using PECVD in the micro- inductance coil of underlying metal, as micro- inductor wire ring layer and layer
Between isolation, repeat step 1) -3) make one layer go out the preset micro- inductance coil of layer stereo metal；
4) use the second 3D printing nozzle according to preset journey in the middle section of the micro- inductance coil of manufactured metal
Sequence prints ferrimagnet body；
5) ferrimagnet body is sintered using laser, while applies magnetic field to ferromagnetism by preset direction
Material cylinder is magnetized, and Ferrite Material crystallization is made, and magnetic moment orientation arrangement is unified, to be conducive to improve Ferrite Material
Magnetic conductivity and saturation magnetization, the first 3D printing nozzle is interior to be equipped with metal powder, is equipped in the second 3D printing nozzle
Ferrimagnet powder.
The second proposed by the present invention method that micro- inductance is prepared based on 3D printing, which is characterized in that micro- inductance is
Three-dimensional micro- inductance, the preparation method include the following steps：
1) SiO of 500nm is deposited on high resistant Si substrates2Film；
2) use electron-beam evaporation 50nm Ti/Au be used as buffer layer and seed layer, with improve micro- inductance coil and
The combination of substrate；
3) the first 3D printing nozzle and the second 3D printing nozzle are used, prints the micro- inductor wire of metal simultaneously, alternately or respectively
Circle and Ferrite Material body, and ferrimagnet body is made to be enclosed in around micro- inductance coil；
4) ferromagnetic material is sintered while printing ferrimagnet while using equidirectional external magnetic field is applied, is made
Ferrite Material crystallization, magnetic moment orientation arrangement is unified, is conducive to the magnetic conductivity and saturation magnetization that improve Ferrite Material.
The method proposed by the present invention that the third prepares micro- inductance based on 3D printing, which is characterized in that micro- inductance is
The micro- inductance of plane, the preparation method include the following steps：
1) SiO of 500nm is deposited first on high resistant Si substrates2Film；
2) then using electron-beam evaporation 50nmTi/Au be used as buffer layer and seed layer, improve micro- inductance coil and
The combination of substrate；
3) subsequent deposited metal material C u films are as micro- inductance coil；
4) utilize MEMS technology by Ni metal processing film at micro- inductance coil and electrode；
5) the second 3D printing nozzle is utilized to print ferrimagnet in the upper area of micro- inductance coil；
6) laser be sintered to ferromagnetic material and while using equidirectional external magnetic field is applied, keeping Ferrite Material brilliant
Change, magnetic moment orientation arrangement is unified, is conducive to the magnetic conductivity and saturation magnetization that improve Ferrite Material.
The 4th kind of method that micro- inductance is prepared based on 3D printing proposed by the present invention, which is characterized in that micro- inductance is
The micro- inductance of plane, the preparation method include the following steps：
1) thermal oxide is carried out to high resistant Si substrates first, the SiO of 500nm is deposited in substrate surface2Film；
2) and then using electron-beam evaporation 50nmTi/Au as buffer layer and seed layer, to improve micro- inductance coil
And the combination of substrate；
3) followed by the SiO that PECVD growth thickness is 500nm2Insulating layer；
4) using photoetching and it is dry-etched in SiO2It is 20um*20um through-holes that size is formed on insulating layer；
5) utilize magnetron sputtering in SiO2The Ti/Au that 500nm is grown on insulating layer connects upper/lower electrode as through-hole；
6) the Cu metallic material film layers of 3 μm of the print disposed thereon then made in 5) step；
7) Ni metal film layer is processed into micro- inductance coil and electrode by being pre-designed using MEMS technology；
8) 3D printing nozzle is utilized to be printed in the top of micro- inductance coil, lower section, the double-deck double team, intermediate sandwich region ferromagnetic
Property metal material NiFe films, thickness range apply in 500nm, print procedure press predetermined direction size induced bias magnetic field；
9) it is put into vacuum after the completion of printing and applies high-intensity magnetic field again and anneal, keep the arrangement of NiFe magnetic moment orientations unified,
Improve the magnetic conductivity and saturation magnetization of material.
Any of the above-described kind of method for preparing micro- inductance, which is characterized in that the metal material for making micro- inductance coil is adopted
It is any with conductivity high Cu, Al, Ag, Au.
Any of the above-described kind of method for preparing micro- inductance, which is characterized in that the substrate material selects the substrate material of the low k of high resistant
High resistance GaAs, sapphire Al2O3, any material in high resistant Si.
Any of the above-described kind of method for preparing micro- inductance, which is characterized in that the ferrimagnet using high frequency magnetic permeability μ,
High saturation and magnetic intensity Ms, low-coercivity HcWith high ferromagnetic resonance frequency fFMRSoft iron magnetic material NiZnCuFeO, Y(3-x)
BixFeO, CoFeSiO, BaCoFeO Ferrite Material or magnetic-particle material, CoFe, NiFe, CoTaZr, CoFeB, CoNbZr,
CoFeSi, CoMnSi, CoFeAl, CoFeAlSi, CoFe-C, CoFe-N multilayer or multilayer ferromagnetic metal alloy.
The invention has the characteristics that and advantageous effect：
Coil is prepared into planar spiral inductor or three-dimensional structure inductance by the method for the present invention according to pre-optimized design,
By apply external magnetic field and selective local it is laser sintered or melting, around it processing of selective area site-directed quantitative prepare iron
Magnetic material.The present invention can both reduce the preparation processing technology difficulty of micro- inductance, reduce processing cost, can also realize fixed point
It is quantitative to prepare ferrimagnet in selective area processing.Keep its comprehensive performance more superior.
The present invention targetedly processing can prepare the micro- inductance coil of complex three-dimensional, also have independent and flexible in alternative
Region processing prepares 3 D complex ferrimagnet, solve in tradition micro- inductance coil processing preparation process ferrimagnet with
Semiconductor technology incompatibility problem improves the high-frequency inductor L and quality factor q of micro- inductance.
Description of the drawings
Fig. 1 is the equipment schematic diagram of the 3D printing of the present invention；
Fig. 2 is that the 3D printing stereo spiral of the method for the present invention declines the schematic diagram of inductance coil；
Fig. 3 is the structural schematic diagram of the micro- inductance coil of plane of the method for the present invention；
Fig. 4 is the selective area in the micro- inductance coil of plane of the method for the present invention, 3D printing ferrimagnet schematic diagram；
Fig. 5 is the structural schematic diagram of the micro- inductance coil of 3 D stereo laminar metal spiral of the method for the present invention；
Fig. 6 is the selective area in the micro- inductance coil of 3 D stereo laminar metal spiral of the method for the present invention, 3D printing
Ferrimagnet schematic diagram；
Fig. 7 is that the embedded horizontal of the method for the present invention shows to the micro- inductance coil of helical and 3D printing ferrimagnet magnetic core
It is intended to.In each figure：
101：Micro- Inductor substrate；102：Micro- inductance coil electrode；103：Micro- inductance coil；104：Ferrimagnet may be selected
Region；105：The micro- inductance coil nozzle of 3D printing；106：Micro- inductance coil powder/liquid/jelly；107：Laser；108：
3D printing magnetic material nozzle；109：Ferrimagnet powder/liquid/jelly；110：Apply external magnetic field；111：Dielectric
Layer.
Specific implementation mode
To make those skilled in the art more fully understand technical scheme of the present invention, the present invention is carried below in conjunction with the accompanying drawings
It is described in detail for a kind of embodiment preparing micro- inductive methods based on 3D printing.
The equipment that Fig. 1 shows the 3D printing of the present invention, the schematic diagram of micro- inductance coil and ferrimagnet are shown in figure
Go out micro- Inductor substrate 101, micro- inductance coil electrode 102, micro- inductance coil 103, ferrimagnet print area 104 may be selected.
3D printing equipment of the present invention includes the external magnetic field 109 that can apply, coil metal material 3D printing nozzle
105, ferrimagnet 3D printing nozzle 108 and laser 107.Wherein, the sprayable coil of coil metal material 3D printing nozzle
Powder/liquid/jelly of metal can be used laser sintered, melting, stack and process；Ferrimagnet 3D printing nozzle can
Ferrimagnet powder/liquid/jelly is sprayed, using laser sintered, melting, stacking and can be processed under external magnetic field,
And then the unified direction of magnetization can be formed.
Micro- inductance coil prepared by the present invention can be used but be not limited to using the high metal material of conductivity such as, Cu, Al,
Ag, Au, using 3D printing go out plane on substrate or 3 D stereo declines inductance.Eddy-current loss and electric leakage to reduce substrate are damaged
Consumption, the substrate material of the low k of the preferred high resistant of substrate, such as high resistance GaAs, sapphire Al2O3, high resistant Si (ρ>1000Ωcm).Ferromagnetism
Material can be located at the top of micro- inductance coil, lower section, it is double-deck sandwich, the intermediate positions such as sandwich, in process can with it is micro-
Inductance coil/alternately/prints respectively simultaneously.Ferrimagnet is preferred but is not limited only to larger high frequency magnetic permeability μ, high saturation
Intensity Ms, low-coercivity HcWith higher ferromagnetic resonance frequency fFMRSoft iron magnetic material, such as NiZnCuFeO, Y(3-x)BixFeO、
CoFeSiO, BaCoFeO Ferrite Material or magnetic-particle material, CoFe, NiFe, CoTaZr, CoFeB, CoNbZr, CoFeSi,
CoMnSi, CoFeAl, CoFeAlSi, CoFe-C, CoFe-N multilayer or multilayer ferromagnetic metal alloy.Magnetic can be applied in process
Field makes the magnetic moment of ferrimagnet be arranged along unified direction.
Embodiment 1
In the present embodiment, micro- inductance coil of preparation is stereo spiral formula inductance, and the present embodiment is prepared based on 3D printing
Three-dimensional spiral inductor it is as shown in Figure 2.Wherein 101 be the substrate for processing micro- inductance, and 103 be the coil of micro- inductance, and 104 beat for 3D
The region of tin graphed sheet magnetic material, 105 and 108 be the nozzle of the micro- inductance coil of 3D printing, and 106 and 109 be micro- inductance coil Cu powder
End and ferrimagnet powder；107 be the laser that processing needs, and 110 be to apply external magnetic field while print magnetic material
Direction.
A diameter of 100 μm of the micro- inductance coil of stereo spiral of the present embodiment, coil diameter are 8 μm, coil layer and layer it
Between spacing be 20 μm, the coil number of plies be 10 layers.
The preparation method of the present embodiment includes the following steps：
1) high resistant Si wafers are chosen first as substrate material, and the SiO of 500nm is deposited first on high resistant Si substrates2It is thin
Film；
2) it uses electron-beam evaporation 200nmTi/Au as buffer layer and hearth electrode, improves micro- inductance coil and substrate
Combination；
3) it is beaten on substrate 101 according to preset program using the first nozzle (printing micro- inductance coil nozzle) 105
Print the bottom Cu coils 103 of micro- inductance；
4) laser 108 for being 400W with power is sintered the micro- inductance coils of bottom Cu of printing, wherein sintering temperature
Degree is 1100 DEG C, and the Cu micro-coil surface roughnesses of sintering is made to be less than 1um；
5) one layer of insulating materials SiO is then grown using PECVD in the micro- inductance coils of bottom Cu2Layer 111 is used as micro- inductance
The isolation of coil between layers repeats to produce the preset micro- inductance coils of multi-layer C u with this；
6) then the second nozzle (print magnetic material nozzle) 108 is used in the middle section of the micro- inductance coils of manufactured Cu
According to preset program print ferrimagnet NiZnCuFeO104；
7) laser for being then 400W with power is sintered, while being applied size by preset direction and being
The magnetic field 110 of 500Oe magnetizes material, makes Ferrite Material crystallization, and magnetic moment orientation arrangement is unified, is conducive to improve iron oxygen
The magnetic conductivity and saturation magnetization of body material；
8) finally use electron-beam evaporation 200nmTi/Au as top electrode.
Embodiment 2
In the present embodiment, micro- inductance coil is the micro- inductance of plane.Preparation method includes the following steps：
1) SiO of 500nm is deposited first on high resistant Si substrates2Film；
2) then using electron-beam evaporation 200nmTi/Au be used as buffer layer and hearth electrode, improve micro- inductance coil and
The combination of substrate；
3) metal material of 3 μm of the Ni metal as micro- inductance coil is then deposited, it is using MEMS technology that Ni metal is thin
Film is processed into micro- inductance coil 21 and electrode 11, electrode size 300um*500um, and coil overall diameter is 500 μm, coil width
It it is 15 μm, the spacing between coil is 25 μm, and coil number is 4 circles.As shown in Figure 3.
4) 3D printing nozzle is utilized to print ferrimagnet NiZnCuFeO in the upper area of micro- inductance coil, thickness is
500nm, laser are sintered ferrimagnet and while using application along ferromagnetic material easy axis direction size for the outer of 500Oe
Magnetic field makes Ferrite Material crystallization, and magnetic moment orientation arrangement is unified, is conducive to the magnetic conductivity and saturated magnetization that improve Ferrite Material
Intensity, as shown in Figure 4.
5) finally use electron-beam evaporation 200nmTi/Au as top electrode.
In addition the number of turns n of micro- inductance coil of the present embodiment, area A, coil-span s, coil width w, can be according to reality
It is determined it is required that carrying out advance design.To improve the performance parameter inductance value L, quality factor q, self-resonant frequency of micro- inductance coil
f0And maximum suitable services frequency fmax。
Embodiment 3
In the present embodiment, micro- inductance coil is the micro- inductance of plane.Preparation method includes the following steps：
1) thermal oxide is carried out to high resistant Si substrates first, the SiO of 500nm is deposited in substrate surface2Film；
2) then using electron-beam evaporation 200nmTi/Au be used as buffer layer and seed layer, improve micro- inductance coil and
The combination of substrate；
3) followed by the insulating layer SiO that PECVD growth thickness is 500nm2, again using photoetching and be dry-etched in absolutely
Edge SiO2Upper formation size is 20um*20um through-holes；
4) utilize magnetron sputtering in SiO again2The Ti/Au that 500nm is grown on insulating layer connects upper/lower electrode as through-hole；
5) the Ni metal metallic material film layer of 3 μm of the print disposed thereon then then made in 5) step utilizes
Ni metal film layer is processed into micro- inductance coil and electrode by being pre-designed by MEMS technology, as shown in Figure 5；
6) 3D printing nozzle is utilized to print ferromagnetic metal material NiFe films, thickness in the upper area of micro- inductance coil
Range applies in 500nm, print procedure by the induced bias magnetic field that predetermined direction size is 500Oe, is put into after the completion of printing
Apply high-intensity magnetic field in vacuum again to anneal, keep the arrangement of NiFe magnetic moment orientations unified, improves the magnetic conductivity and saturation magnetic of material
Change intensity, as shown in Figure 6；
7) finally use electron-beam evaporation 200nmTi/Au as top electrode.
In addition the number of turns n of micro- inductance coil of the present embodiment, area A, coil-span s, coil width w, can be according to reality
It is determined it is required that carrying out advance design.To improve the performance parameter inductance value L, quality factor q, self-resonant frequency of micro- inductance coil
f0And maximum suitable services frequency fmax.Specific process parameter used in above-mentioned manufacturing process is given in table 1.
Table 1
Embodiment 4
In the present embodiment, micro- inductance coil is three-dimensional inductance.Specific steps are as follows：
(1) SiO of 500nm is deposited first on high resistant Si substrates2Film；
(2) it and then uses the Ti/Au of electron-beam evaporation 200nm as buffer layer and seed layer, improves micro- inductor wire
The combination of circle and substrate；
(3) the micro- inductance coil nozzle 105 of 3D printing and 3D ferrimagnets printing head 108, printing alternate are then used
Inductance coil Cu and Ferrite Material NiZnCuFeO.Laminated inductor is designed, ferrimagnet is enclosed in micro- inductance coil
Around, as shown in Figure 5.The width 10um of wherein micro- inductance coil, 4 layers of the coil number of plies, every layer 2 circle, 200 μm of outermost layer width,
5 μm of interlayer spacing；
(4) it carries out local sintering while printing ferrimagnet while using to apply equidirectional size as 500Oe
External magnetic field, make Ferrite Material crystallization, magnetic moment orientation arrangement is unified, is conducive to the magnetic conductivity and saturation that improve Ferrite Material
The intensity of magnetization.
8) finally use electron-beam evaporation 200nmTi/Au as top electrode.
It is understood that embodiment of above is intended to be merely illustrative of the present patent principle and the exemplary reality that uses
Mode is applied, however the present invention is not limited thereto.For those skilled in the art, do not departing from the present invention's
In the case of spirit and essence, various changes and modifications can be made therein, these variations and modifications are also considered as the guarantor of patent of the present invention
Protect range.
Claims (4)
1. a kind of method preparing micro- inductance based on 3D printing, which is characterized in that micro- inductance is three-dimensional inductance, the preparation side
Method includes the following steps：
1) the first 3D printing nozzle is used to print the micro- inductance of underlying metal of micro- inductance on substrate according to preset program
Coil；
2) the micro- inductance coil of the underlying metal of printing is sintered with laser；
3) one layer of insulating materials is grown using PECVD in the micro- inductance coil of underlying metal, between layers as micro- inductance coil
Isolation, repeat step 1) -3) produce the preset micro- inductance coil of layer stereo metal；
4) it is beaten according to preset program using the second 3D printing nozzle in the middle section of the micro- inductance coil of manufactured metal
Print off ferrimagnet body；
5) ferrimagnet body is sintered using laser, while applies magnetic field to ferrimagnet by preset direction
Cylinder is magnetized, and ferrimagnet crystallization is made, and magnetic moment orientation arrangement is unified, to be conducive to improve the magnetic conductance of ferrimagnet
Rate and saturation magnetization, the first 3D printing nozzle is interior to be equipped with metal powder, is equipped in the second 3D printing nozzle ferromagnetic
Property material powder；
The metal material of micro- inductance coil is made using any of high Cu, Al, Ag, the Au of conductivity；
The substrate material selects the substrate material high resistance GaAs of the low k of high resistant, sapphire Al2O3, any material in high resistant Si；
The ferrimagnet is using high frequency magnetic permeability μ, high saturation and magnetic intensity Ms, low-coercivity HcWith high ferromagnetic resonance frequency
Rate fFMRSoft iron magnetic material NiZnCuFeO, Y(3-x)BixFeO, CoFeSiO, BaCoFeO, or by CoFe, NiFe, CoTaZr,
One or more formation in CoFeB, CoNbZr, CoFeSi, CoMnSi, CoFeAl, CoFeAlSi, CoFe-C, CoFe-N
Multilayer ferromagnetic metal alloy.
2. a kind of method preparing micro- inductance based on 3D printing, which is characterized in that micro- inductance is three-dimensional micro- inductance, the preparation
Method includes the following steps：
1) SiO of 500nm is deposited on high resistant Si substrates2Film；
2) use the Ti and Au of electron-beam evaporation 50nm as buffer layer and seed layer, to improve micro- inductance coil and substrate
Combination；
3) the first 3D printing nozzle and the second 3D printing nozzle are used, either simultaneously or alternately prints the micro- inductance coil of metal and iron respectively
Body of magnetic material, and ferrimagnet body is made to be enclosed in around micro- inductance coil；
4) ferrimagnet is sintered while printing ferrimagnet while using equidirectional external magnetic field is applied, makes iron
Magnetic material crystallizing, magnetic moment orientation arrangement is unified, is conducive to the magnetic conductivity and saturation magnetization that improve ferrimagnet.
3. a kind of method preparing micro- inductance based on 3D printing, which is characterized in that micro- inductance is the micro- inductance of plane, the preparation
Method includes the following steps：
1) SiO of 500nm is deposited first on high resistant Si substrates2Film；
2) and then using electron-beam evaporation 50nmTi/Au as buffer layer and seed layer, improve micro- inductance coil and substrate
Combination；
3) subsequent deposited metal material C u films are as micro- inductance coil；
4) utilize MEMS technology by Ni metal processing film at micro- inductance coil and electrode；
5) 3D printing nozzle is utilized to print ferrimagnet in the upper area of micro- inductance coil；
6) laser is sintered ferrimagnet and while using equidirectional external magnetic field is applied, making ferrimagnet crystallization, magnetic
Square orientations are unified, are conducive to the magnetic conductivity and saturation magnetization that improve ferrimagnet.
4. a kind of method preparing micro- inductance based on 3D printing, which is characterized in that micro- inductance is the micro- inductance of plane, the preparation
Method includes the following steps：
1) thermal oxide is carried out to high resistant Si substrates first, the SiO of 500nm is deposited in substrate surface2Film；
2) and then using electron-beam evaporation 50nmTi and Au as buffer layer and seed layer, to improve micro- inductance coil and lining
The combination at bottom；
3) followed by the SiO that PECVD growth thickness is 500nm2Insulating layer；
4) using photoetching and it is dry-etched in SiO2It is 20um*20um through-holes that size is formed on insulating layer；
5) utilize magnetron sputtering in SiO2The Ti and Au that 500nm is grown on insulating layer connect upper/lower electrode as through-hole；
6) the Cu metallic material film layers of 3 μm of the print disposed thereon then made in 5) step；
7) Ni metal film layer is processed into micro- inductance coil and electrode by being pre-designed using MEMS technology；
8) utilize 3D printing nozzle in the top of micro- inductance coil, lower section, the double-deck double team, intermediate sandwich region printing ferromagnetism gold
Belong to material Ni Fe films, thickness range applies in 500nm, print procedure presses predetermined direction size induced bias magnetic field；
9) it is put into vacuum after the completion of printing and applies high-intensity magnetic field again and anneal, kept the arrangement of NiFe magnetic moment orientations unified, improve
The magnetic conductivity and saturation magnetization of material.
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| WO2019171652A1 (en) * | 2018-03-05 | 2019-09-12 | 株式会社村田製作所 | Coil component and manufacturing method for same |
| CN108429542A (en) * | 2018-03-19 | 2018-08-21 | 南京邮电大学 | A kind of LTCC bandpass filters with high performance three-dimensional inside spin inductance |
| FR3083365B1 (en) * | 2018-06-27 | 2020-07-17 | Safran Electronics & Defense | TRANSFORMER HAVING A PRINTED CIRCUIT |
| DE102018118551A1 (en) * | 2018-07-31 | 2020-02-06 | Tdk Electronics Ag | Method for producing an inductive component and inductive component |
| US20200105453A1 (en) * | 2018-10-01 | 2020-04-02 | Texas Instruments Incorporated | Inkjet printed electronic components |
| CN109158602B (en) * | 2018-10-30 | 2020-08-21 | 浙江工贸职业技术学院 | Coaxial powder feeding device for 3D printing of metal workpiece |
| CN109655084B (en) * | 2018-12-10 | 2020-06-02 | 上海交通大学 | Preparation method of drivable nerve photoelectrode array |
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