A kind of fingerprint sensor and the electronic equipment that comprises it
Technical field
The disclosure relates to biometrics identification technology, in particular to a kind of fingerprint sensor andThe electronic equipment that comprises it.
Background technology
Some biological characteristic of human body (as fingerprint, palmmprint etc.) is the unique feature of human body, andTheir complexity can provide enough feature for identification.
Finger print/palm print recognition technology is the cheapest living things feature recognition skill of the most ripe and price at presentArt. Wherein, fingerprint identification technology is most widely used, as gate inhibition, notebook computer, mobile phone,All can employing fingerprint recognition technology on the electronic equipment such as automobile, bank paying.
The rough lines of finger surface skin is made up of ridge line graph, and fingerprint recognition is to utilizeThe feature of fingerprint uniqueness and stability realizes identification, and fingerprint is remembered without user. OrderFront fingerprint recognition mode mainly contains characteristics of image identification, laser feature identification and slip electric capacity and passesSense. Characteristics of image identification and laser feature identification utilize respectively visible ray and laser approach by fingerprint ridgeLine information extraction also utilizes algorithm to carry out signature analysis, identification Different Individual; Two kinds of methods all needWill be as more complicated space structures such as CCD photoreceptor, laser generators, be unsuitable for lightening answeringWith. Tradition slip capacitance sensor is common in notebook computer, by finger sliding sensor sensingFace scanning fingerprint information. Fingerprint recognition speed and space simplification degree are better than the above two, but equally notBe suitable for the Future Consumption electronic applications that market is huge, require highly integrated, flexible, light-transmissive.
How to make fingerprint sensor be used in mobile electronic device, as the glass display of smart mobile phone etc.On screen, and the image definition sensing can be identified as the problem of the lasting research of industry.
Therefore the electronic equipment that, needs a kind of new fingerprint sensor and comprise it.
In the disclosed above-mentioned information of described background technology part only for strengthening background of the present disclosureUnderstand, therefore it can comprise and not form prior art known to persons of ordinary skill in the artInformation.
Summary of the invention
The electronic equipment that the disclosure provides a kind of fingerprint sensor and comprises it, can realize fingerprintSensor application is to the glass display screen of the electronic equipments such as mobile phone.
Other characteristics of the present disclosure and advantage will become obviously by detailed description below, or partGround acquistion by practice of the present disclosure.
According to one side of the present disclosure, a kind of fingerprint sensor, comprising: on dielectric layer, manyPole plate and many bottom crowns, described top crown and described bottom crown lay respectively at described dielectric layerApparent surface is upper, and described top crown extends and arranges along first direction, and described bottom crown is along with described theThe crossing second direction of one direction is extended setting, and described top crown and described bottom crown are by described electricityDielectric layer separates and intersects to form multiple induction points, and described top crown and described bottom crown adopt conductionProperty nano material.
According to an embodiment of the present disclosure, described conductive nanometer material is Nano Silver or graphiteAlkene.
According to an embodiment of the present disclosure, the well-regulated conductive pattern of described induction point tool.
According to an embodiment of the present disclosure, the conductive pattern of described induction point comprises hexagon, circleAny one in shape, square and rectangle.
According to an embodiment of the present disclosure, described top crown comprises induction electrode, described bottom crownComprise drive electrode.
According to an embodiment of the present disclosure, also comprise fingerprint control chip, wherein said induced electricityThe utmost point and described drive electrode are electrically connected with described fingerprint control chip respectively.
According to an embodiment of the present disclosure, described dielectric layer adopts transparent pressure sensitive adhesive.
According to an embodiment of the present disclosure, described dielectric layer comprises dielectric ceramic powder.
According to an embodiment of the present disclosure, the span of the dielectric constant of described dielectric layer isBe greater than 6F/m.
According to an embodiment of the present disclosure, the span of described dielectric constant is 10-50F/m.
According to another aspect of the present disclosure, a kind of electronic equipment, comprising: above-mentioned arbitrary described fingerprint passesSensor; Display element. Wherein, described fingerprint sensor is arranged at the described demonstration of described electronic equipmentElement entirety at least partly under.
According to an embodiment of the present disclosure, described display element comprise glass or sapphire orAny one in ceramic material.
According to an embodiment of the present disclosure, also comprise conductive ink, described conductive ink is arranged atBetween described display element and described fingerprint sensor.
According to an embodiment of the present disclosure, porose on described display element, and fill out in described holeEnter metal material and form wire, described wire is communicated with described display element and described fingerprint control coreSheet.
According to fingerprint sensor of the present disclosure and the electronic equipment that comprises it, by adopting electric conductivity materialMaterial is as the conductive material of the two-plate up and down of fingerprint sensor, can obtain that electric conductivity is strong, hardnessSuperpower, light transmission good, thermal conductivity is strong and the induction point array of surface area super large, be especially suitable for applicationIn full frame fingerprint occasion.
Should be understood that, it is only exemplary that above general description and details are hereinafter described,Can not limit the disclosure.
Brief description of the drawings
By describe its example embodiment in detail with reference to accompanying drawing, above-mentioned and other target of the present disclosure,It is more apparent that feature and advantage will become.
Fig. 1 schematically shows according to the fingerprint sensor structure of disclosure example the first embodimentFigure;
Fig. 2 schematically shows according to the structure of the fingerprint sensor of disclosure example the second embodimentFigure;
Fig. 3 schematically shows according to the structure of the fingerprint sensor of disclosure example the 3rd embodimentFigure.
Detailed description of the invention
Referring now to accompanying drawing, example embodiment is more fully described. But, example embodimentCan implement in a variety of forms, and should not be understood to be limited to example set forth herein; On the contrary, carryMake the disclosure by more comprehensive and complete for these embodiments, and by the structure of example embodimentThink to convey to all sidedly those skilled in the art. Accompanying drawing is only schematic illustrations of the present disclosure, andNon-must be to draw in proportion. In figure, identical Reference numeral represents same or similar part, because ofAnd will omit being repeated in this description them.
In addition, described feature, structure or characteristic can be combined in one in any suitable mannerIn individual or more embodiments. In the following description, right thereby provide many details to provideFully understanding of embodiment of the present disclosure. But, one of skill in the art will appreciate that passablePut into practice technical scheme of the present disclosure and omit one or more in described specific detail, or canAdopt other method, constituent element, device, step etc. In other cases, be not shown specifically orDescribing known features, method, device, realization, material or operation makes to avoid that a presumptuous guest usurps the role of the hostObtaining each side of the present disclosure thickens.
Some block diagrams shown in accompanying drawing are functional entitys, not necessarily must be with physics or in logicIndependently entity is corresponding. Can adopt software form to realize these functional entitys, or at oneOr realize these functional entitys in multiple hardware modules or integrated circuit, or at heterogeneous networks and/or locateIn reason apparatus and/or microcontroller device, realize these functional entitys.
It should be noted that, when element is called as " being fixed on " another element, it can be directOn another element or also can have an element placed in the middle. When an element is considered to " connectConnect " another element, it can be directly connected to another element or may have residence simultaneouslyMiddle element. Term as used herein " vertical ", " level ", " left side ", " right side "And similarly statement is for illustrative purposes. Term as used herein " and/or " bagDraw together one or more relevant Listed Items arbitrarily with all combinations.
Fingerprint identification technology becomes and is widely used, and be usually used to provide to electronic equipment and/Or the secure access of data. In general, capacitive fingerprint sensing device can be used to pass through by measurementThe electric capacity of each capacitive induction point of capacitance type sensor is determined fingerprint image. Electric capacity is higher,Surface distance capacitive induction point adjacent or finger above is nearer. Thereby, compare fingerprint paddyCapacitive induction point below, the capacitive induction point below fingerprint ridge provides higher electric capacity.
At least there is two kinds of forms, i.e. active and passive type in capacitive fingerprint sensing device. Initiatively electricityCapacity sensor is usually used in electronic equipment, so that user's biometric secure and identification to be provided.
The epidermis of the sensed finger of active electric capacity sensor initial excitation. The electric capacity of epidermis existsEach capacitive induction point place is measured. For example,, by the modulating frequency in capacitive induction lattice arrayLow voltage stage and high voltage stage during measure voltage and/or the electric charge of capacitive induction point,Can measure or determine electric capacity. Voltage difference can be used to determine electric capacity.
Active fingerprint sensor of the prior art sends to fingerprint sensor by radiofrequency signal simultaneouslyInduction electrode and drive electrode, thereby excitation finger, and due to the voltage potential of finger along withModulation and changing, therefore the voltage at each capacitive induction point place of capacitive induction lattice array and/Or electric charge changes.
In this sensor, the voltage that is applied to described fingerprint sensor is limited. Conventionally,Voltage is no more than the P-to-P voltage of 4 volts. Exceed this voltage and finger may be activated to too high electricityPress; And excessive excitation user points meeting generation " shouting pain " or uncomfortable sensation. Although peopleThe precise voltage that can sense shouting pain changes along with people's difference, but the P-to-P voltage of 4 voltsConventionally be regarded as threshold value, exceed this threshold value and can notice this sensation.
Owing to limiting the voltage that is used for modulating described fingerprint sensor to avoid user awareness, therefore coverThe thickness of for example glass of fingerprint input module of cover sensor is also limited. Sensor and fingerBetween glass thicker, the electric capacity of generation becomes more decay and fingerprint image becomes fuzzyyer. For toolThere is the thickness of about 400 microns or be greater than the glass of about 400 microns or be greater than for havingThe thickness of 100 microns or be greater than the ceramic material of about 100 microns, fingerprint image may becomeUnreliable, and fingerprint sensor is in the application of common electronic equipment, its glass or potteryThe thickness of ceramic material all has a lower limit, for example the display screen glass of general mobile phone or panel computerThickness is more than 0.4mm, if lower than this lower limit, screen easily damages by pressure or breaks into pieces.
DPI (the DotsPer of the capacitance touch screen under the existing glass that is made in the electronic equipments such as mobile phoneInch, the pixel of per inch) resolution is poor, the resistance Chinese People's Anti-Japanese Military and Political College, light penetration are poor, fingerprint cannot be passedSensor reaches the application of full frame fingerprint.
Fig. 1 schematically shows according to the fingerprint sensor structure of disclosure example the first embodimentFigure.
As shown in Figure 1, this fingerprint sensor comprises: dielectric layer (not shown), many top crowns110 and many bottom crowns 120, described in described top crown 110 and described bottom crown 120 lay respectively atThe apparent surface of dielectric layer is upper, and described top crown 110 extends and arranges along first direction, described underPole plate 120 extends and arranges along the second direction crossing with described first direction, described top crown 110 withDescribed bottom crown 120 separates and intersects to form multiple induction points 130 by described dielectric layer, described inTop crown 110 and described bottom crown 120 adopt conductive nanometer material. Wherein, described top crown110 and bottom crown 120 between can form electric capacity at induction point 130. Described dielectric layer is transparentOr opaque insulating materials, and there are two opposing surfaces.
According to example embodiment, described conductive nanometer material is Nano Silver or Graphene.
Described Graphene (Graphene) is peeled off out, is made up of carbon atom from graphite materialOnly has the two dimensional crystal of one deck atomic thickness.
Described Graphene is the general designation of single-layer graphene, double-layer graphite alkene and multi-layer graphene.
Graphene has perfect two dimensional crystal structure, and its lattice is surrounded by six carbon atomHexagon, thickness is an atomic layer. Between carbon atom, connected by σ key, combination is that sp2 is assortedChange, these σ keys have given Graphene extremely excellent mechanical property and structural rigidity. GrapheneThe best iron and steel of hardness ratio is strong 100 times, even also will exceed diamond. In Graphene, each carbonElectronics on a p track of atom contribution residue forms large π key, and pi-electron can be in crystal freelyMobile, and movement velocity is up to 1/300 of the light velocity, has given Graphene good electric conductivity. GraphiteAlkene is transparent conductive material of new generation, at visible region, and the transmitance of four layer graphenes and traditionIto thin film suitable, at other wave band, the transmitance of four layer graphenes is thin higher than ITO far awayFilm.
Graphene is known thin, the hardest nano material in world, and it is almost completely transparent, only absorb 2.3% light; Thermal conductivity factor is up to 5300W/mK, higher than CNT and goldHard rock, under normal temperature, its electron mobility exceedes 15000cm2/Vs, again than CNT or silicon waferHeight, and only about 10-6 Ω cm of resistivity is lower than copper or silver, for world resistivity minimumMaterial. Its resistivity is extremely low, and the speed of electron transfer is exceedingly fast. Graphene is in fact thoroughly a kind ofBright, good conductor.
The induction point of the described fingerprint sensor in the embodiment of the present invention, adopts upper and lower two-plate to establishMeter, the plate material of top crown and bottom crown, adopts conductive nanometer material as Graphene, therebyThe induction point that utilizes five large physical characteristics of Graphene to be made into fingerprint sensor has following advantage:Electric conductivity forces the induction point impedance making can be less than 0.1 ohm; Hardness is superpower, and applicable finger is pressedPress, the induction point grid service life is long; Light transmission is strong, is produced on mobile phone or panel computer etc. aobviousShow that screen does not above affect its display effect; Especially be suitable for and make full frame fingerprint application, because of grid circuitIntensive, Graphene thermal conductivity is strong, can not cause thermal impedance effect; Surface area super large characteristic, can makeBecome high-resolution Graphene induction point grid.
According to example embodiment, the well-regulated conductive pattern of described induction point tool.
According to example embodiment, the conductive pattern of described induction point comprises hexagon, circle, squareWith any one in rectangle. Because if be only that described top crown and described bottom crown circuit are handed overFork, the intersection area forming is less, and the electric capacity that can store is few, consequent capacity effectLittle, above cited or other can increase and intersects shape of area and be all fine arbitrarily.Certainly, the present invention can also adopt the induction point conductive pattern of other arbitrary shape, does not limit at thisFixed.
According to example embodiment, described induction point is made by Graphene grid manufacturing process.
According to example embodiment, described top crown comprises induction electrode, and described bottom crown comprises driving electricityThe utmost point.
According to example embodiment, described top crown comprises the induction electrode that multiple mutually insulateds distribute. ExampleAs, between multiple described induction electrodes, can parallelly distribute, and can between multiple described induction electrodeEquidistantly to distribute.
Described bottom crown comprises the drive electrode that multiple mutually insulateds distribute. For example, described in, multiple, driveBetween moving electrode, can parallelly distribute, and can equidistantly distribute between multiple described drive electrode.
According to example embodiment, also comprise fingerprint control chip, wherein said induction electrode and described in driveMoving electrode is electrically connected with described fingerprint control chip respectively.
According to example embodiment, described dielectric layer adopts transparent pressure sensitive adhesive.
According to example embodiment, described dielectric layer comprises dielectric ceramic powder. Described dielectric ceramic powder canFor increasing described dielectric layer
Dielectric constant, thus the electric capacity between described top crown and described bottom crown can be increased.
According to example embodiment, described dielectric ceramic powder can comprise silica, and aluminium oxide can also haveA small amount of sodium oxide molybdena, potassium oxide, calcium oxide, magnesia, iron oxide, titanium oxide etc.
According to example embodiment, the span of the dielectric constant of described dielectric layer is for being greater than 6F/M. For example, described dielectric constant can be selected 10-50F/m.
Fig. 2 schematically shows according to the structure of the fingerprint sensor of disclosure example the second embodimentFigure.
As shown in Figure 2, this fingerprint sensor comprises: dielectric layer 210, top crown 220, the lower utmost pointPlate 230 and fingerprint input module 240. Described fingerprint input module 240 and described fingerprint sensor are logicalCross bonding coat laminating. Wherein, described top crown 220 comprises induction electrode, and described bottom crown 230 wrapsDraw together drive electrode, described top crown 220 passes through 210 points of described dielectric layers with described bottom crown 230From and intersect to form multiple capacitive induction points. Wherein said induction electrode and described drive electrode are respectivelyBe electrically connected with described fingerprint control chip.
Described fingerprint input module 240 is the panel for fingerprint input. The material of fingerprint input moduleMaterial is here the non-conducting materials such as transparent glass, sapphire or ceramic material. Fingerprint inputThe shape of module can be set as required, can be square, rectangle, circle etc. otherShape.
Described bonding coat is transparent optical cement, as OCA optical cement or transparent UV glue etc.
According to example embodiment, described drive electrode receive that described fingerprint control chip sends for adjustingMake the radiofrequency signal of its voltage and/or operating frequency, meanwhile, user is on described fingerprint input moduleFinger contact point be electrically connected with described fingerprint control chip, described radiofrequency signal is sent to userFinger.
Described capacitive induction point can be modulated according to various frequencies. Capacitive induction point can be at heightDuring voltage and measure again the voltage of all capacitive induction points during low-voltage. NamelySay, the voltage that offers the array of capacitive induction point can generally be similar to square wave, although at itIn its embodiment, voltage can adopt other waveform. Described fingerprint control chip also comprises modulationDevice, described modulator can carry out according to clock signal modulation or the vibration of control capacitance formula induction point. ?Measured during the height in radiofrequency signal cycle and lower part, capacitive induction point voltage and/or electric chargeBetween poor allow chip determine each capacitive induction point and the lower part pointed between electric capacityAnd thereby definite this electric capacity. From the electric capacity of each capacitive induction point, can sensing, measurement and heavyBuild fingerprint.
The signal difference at capacitive induction point place can be used to shine upon fingerprint. The resolution ratio of fingerprint sensor canAlong with distance and covering between surface and the finger of capacitive induction dot density, fingerprint sensorThe thickness of the fingerprint input module of fingerprint sensor and changing. In general, along with fingerprint input mouldPiece thickness increases, and the electric capacity between finger and fingerprint sensor becomes more and more decay, and thereforeSignal difference also can decay. Can be by described finger contact point and described fingerprint control chip be electrically connectedConnect, cause at the higher detectable signal of described fingerprint control chip. By by described finger contactPoint is electrically connected with described fingerprint control chip, and the Capacitance Coupled between fingerprint sensor and finger can be mendedRepay the thickness of coating. In addition, by described finger contact point and described fingerprint control chip are electrically connectedConnect, the electric capacity between finger and the capacitive induction point of described fingerprint control chip can increase, fromAnd better resolution ratio and the imaging of acquisition fingerprint.
Each capacitive induction point can electric capacity be coupled on capacitive induction point one of fingerPoint, i.e. the finger contact point of finger and described fingerprint control chip: finger part above and electric capacityDistance between formula induction point is determined the electric capacity between the two and thereby is determined at capacitive induction pointThe signal of place's record. Along with distance reduces, signal increases. Each capacitive induction is put also electric capacity couplingBe connected to other contiguous finger part above, and along with distance increases, this causes fuzzy effectReally, its resultant signal that reduces direct capacitive induction point under finger ridge and finger paddy is poor.
Fig. 3 schematically shows according to the structure chart of the fingerprint sensor of disclosure example embodiment.
As shown in Figure 3, this fingerprint sensor comprises top crown 320, bottom crown 330 and induction point310, described induction point 310 is intersected to form by described top crown 320 and described bottom crown 330. InstituteThe shape of stating induction point 310 can be hexagon, square, rectangle and circle etc.
According to example embodiment, described fingerprint sensor also comprises base material substrate and lead-in wire. Under describedPole plate and described top crown and described dielectric layer form the conducting channel of described fingerprint sensor, instituteStating conducting channel is formed on described base material substrate. For example, described lead-in wire can be positioned at described in applicationThe not visible region of the electronic equipment of fingerprint sensor.
According to example embodiment, in order to reduce the integral thickness of described fingerprint sensor, described base materialThe thickness of substrate is not more than 200 μ m, and the thickness of described dielectric layer is less than 50 μ m.
According to example embodiment, described dielectric layer comprises latticed groove. Described bottom crown and upperPole plate is contained in described latticed groove, in described latticed groove, is filled with conductive material, asMetal or its combinations such as silver, copper, gold, aluminium.
Because people's fingerprint convex ridge width and trench place width are all roughly between 150-300 μ m, at thisIn invention, the Breadth Maximum of drive electrode and induction electrode is not more than 100 μ m, can ensure singleThe quantity that can sense crestal line or trench in induction point is not more than 1, thereby ensures same inspectionSurveying coordinate can only a corresponding crestal line or the position of a trench; And between adjacent driven electrodeDistance between distance and adjacent induction electrode is all not more than 100 μ m. When hand is placed in fingerprint inputIn module time, the distance between adjacent driven electrode and adjacent induction electrode is all less than 100 μ m,Distance between each adjacent induction point is less than 100 μ m, and ensureing like this can have 2-5 induction simultaneouslyPoint induces different capacitance signals to determine the position of crestal line or trench, compares original individual unitThe pattern of reflection convex ridge or trench position, the accurately input signal of sensing fingerprint, raising refers toThe accuracy of line recognition device and sensitivity.
For ensureing the precision of fingerprint recognition, in the present embodiment, described bottom crown and described top crownBreadth Maximum be 50 μ m; Ultimate range between adjacent bottom crown or between adjacent top crownBe 10 μ m.
The fingerprint sensor of disclosure embodiment adopts the metal grill structure of groove shape, will conduct electricityMaterial is filled in groove, and having saved conductive material, to improve again the anti-scratch of fingerprint sensor anti-scratchAbility; And the conductive material of filling is mainly argent etc., low price, reduces and manufacturedThis. In addition, this fingerprint sensor adopts individual layer conductive structure to realize the identification of finger print information, reducesThe thickness of fingerprint sensor; Meanwhile, in view of the average distance between fingerprint lines is 100 μ m, thereforeThe width of bottom crown and top crown is all not more than 100 μ m, and bottom crown and top crown cooperation formationAdjacent recognition unit between distance be also not more than 100 μ m, improved the precision of fingerprint recognition.
For coordinating fingerprint control chip, described bottom crown and top crown can be designed to different leadingElectrical pattern, for example rhombus, rectangle, circle, square, hexagon, can be also other figureShape, the present invention is not as limit. As shown in FIG., described bottom crown is designed to horizontally disposedStrip; Described top crown is designed to vertically disposed strip, passes through described electricity with described bottom crownDielectric layer separates and is vertical.
The fingerprint sensor of the present embodiment, utilizes top crown disconnected from each other and bottom crown to form electricityHold, according to capacitance variations and sensing form fingerprint pattern, do not need to utilize cmos semiconductor techniqueOn silicon substrate substrate, form fingerprint sensor, thereby can avoid using monocrystalline silicon substrate, reduceCost.
Described lead-in wire is in order to by multiple described induction electrodes and multiple described drive electrode and described fingerprintControl chip connects. In the edge-invisible area of described dielectric layer, offer latticed groove,Described lead-in wire is contained in latticed groove. Meanwhile, described lead-in wire can be by serigraphy or ink-jetPrint, to form protruding latticed conductor wire or conduction line segment in described dielectric layer surface. ProtrudingThe minimum widith that plays latticed conductor wire or conduction line segment can be 10 μ m~200 μ m, highly canBe 5 μ m~10 μ m.
The width of latticed groove and latticed groove is 0.2 μ m~5 μ m, and the degree of depth is 2 μ m~6 μM, and the ratio of the degree of depth and width is greater than 1. The mesh shape of latticed groove is rule or does not adviseGrid, the mesh shape of latticed groove can be regular hexagon, square, rhombus, squareAny one in shape, parallelogram, curvilinear boundary quadrilateral or random grid. Corresponding, described inThe mesh shape of drive electrode and described induction electrode can be regular hexagon, square, rhombus,Rectangle, parallelogram, curvilinear boundary quadrilateral or random grid shape.
Adopt above-mentioned double-deck conductive structure, each induction electrode and each drive electrode are respectively one by oneConnect a lead-in wire. Because having adopted lead-in wire connected mode, the described fingerprint control being connected with described lead-in wireCoremaking sheet judges that by the capacitance variations size of responding to each induction point fingerprint ridge or paddy are with shapeWhile becoming fingerprint pattern, induction point is positioned and calculated.
The described fingerprint control chip connecting from described lead-in wire becomes in the capacitance by different induction pointsChange while forming fingerprint pattern, because electric capacity and the positive correlation of induction point area, therefore can be by correspondingInduction point area calculates the capacitance size of different induction points each induction point is distinguished.
When described in finger presses when fingerprint sensor, according to said method, locate respectively finger pressesTime corresponding different induction points, and then successively the capacitance variation at this difference induction point place is enteredRow calculates.
According to one embodiment of present invention, between described drive electrode and described induction electrode, formMutual capacitance. The place that now described induction electrode and described drive electrode intersect will form electric capacity,Also be the two poles of the earth that described induction electrode and described drive electrode have formed respectively electric capacity. Work as finger pressesDuring to described fingerprint sensor, affect the coupling between the electrode of two, each crosspoint, thereby changedCapacitance between electrode. In the time that Detection capacitance changes, described drive electrode sends driving successivelySignal, described induction electrode receives signal simultaneously, can obtain so all induction electrodes and drivingThe capacitance size at electrode joint place, according to two-dimentional capacitance change data, can calculate everyThe coordinate of a touch point, simultaneously again according to the variable quantity of capacitance judge each coordinate place corresponding beRidge or the paddy of finger line. Now its operation principle is:
The initial capacitance C that forms of described induction electrode and described drive electrode, in the time of finger touchThereby finger is taken away partition capacitance and is made initial capacitance C be decreased to C ', and C ' < C, described fingerprintControl chip judges that according to capacitance variation the fingerprint of correspondence position is ridge or paddy again. For example, at the beginning ofBeginning C1=1000, C2=1200; Electric capacity corresponding after finger touch becomes C1 '=100,C2 '=900, △ C1=900, △ C2=300. Fingerprint control chip can effectively distinguish C1 andC2, and if simultaneously judgement △ C be more than or equal to a threshold value, for example 500, corresponding fingerprint isRidge; If △ C is less than this threshold value, corresponding fingerprint is paddy.
Point in the time contacting with described fingerprint sensor convex ridge place tables different from trench place actual rangeThe now capacitance difference for producing, and its value is in pico farad (pF) rank, thereby the electric current of its transmissionSignal also there are differences, and these faint current signal differences are entered by described fingerprint control chipRow amplifies, the convex ridge place and the trench place that judge fingerprint with this, and each induction point detects in this induction pointCurrent signal, and these current signals are sent to described fingerprint control chip, according to current signalDifference, detect the position of convex ridge and trench, thereby sketch the contours of the lines train of thought of finger, soBy comparing with the fingerprint of pre-stored, can realize the qualification to user identity afterwards.
According to example embodiment, described fingerprint sensor also comprises lead wire set, outside lead wire set is connected toThe IC process chip of portion. It is defeated that described fingerprint sensor receives the fingerprint that described fingerprint input module sendsEnter signal, and can fingerprint input signal be for example sent to exterior I C process chip by lead wire setApply the main control chip of the mobile phone of described fingerprint sensor.
The conductive material of a plurality of leads is electrically connected with the conductive material in described latticed groove, and withLead wire set electrical connection; Each lead-in wire is electrically connected with each bottom crown or each top crown respectively,Lead-in wire can be latticed groove structure, can be also the conductor wire of the latticed or strip of projectionOr conduction line segment.
Bottom crown or top crown are connected with lead wire set by going between separately, each bottom crown or everyThe driving lead-in wire that one top crown is corresponding with one or sense lead electrical connection, adjacent bottom crown or phaseBetween adjacent top crown, insulate.
The fingerprint sensor of disclosure embodiment, its induction point adopts upper and lower two-plate design, onThe plate material of pole plate and bottom crown, adopts conductive nanometer material as Graphene, Nano Silver, fromAnd the induction point that utilizes five large physical characteristics of Graphene to be made into fingerprint sensor has following excellentGesture: electric conductivity forces the induction point impedance making can be less than 0.1 ohm; Hardness is superpower, is applicable to fingerPress, the induction point grid service life is long; Light transmission is strong, is produced on mobile phone or panel computer etc.On display screen and do not affect its display effect; Especially be suitable for and make full frame fingerprint application, because of grid linesRoad is intensive, and Graphene thermal conductivity is strong, can not cause thermal impedance effect; Surface area super large characteristic, canMake high-resolution Graphene induction point grid; The present invention can also adopt Graphene grid techniqueProcess technique, makes the induction point of described fingerprint sensor.
A kind of electronic equipment, comprising: above-mentioned arbitrary described fingerprint sensor; Display element. Wherein instituteState fingerprint sensor be arranged at described electronic equipment described display element entirety at least partly under.
According to example embodiment, described display element comprises in glass or sapphire or ceramic materialAny one. For example, can adopt 400 microns of above glass of thickness, also can adopt thickness250 microns of above sapphires, or adopt 100 microns of above ceramic materials of thickness. Certainly,It is all passable that display element described in the present invention adopts any available material and any available thickness,In this no limit. But with prior art, the technique of the thickness of this different materials and correspondence thereof is goodRate is high, buys or makes by oneself and easily obtain, thereby can reduce costs.
According to example embodiment, also comprise conductive ink, described conductive ink is arranged at described display elementAnd between described fingerprint sensor.
According to example embodiment, porose on described display element, and insert metal material in described holeForm wire, described wire is communicated with described display element and described fingerprint control chip. By fingerContact point is electrically connected with described fingerprint control chip, can make penetrating of described fingerprint control chip transmittingFrequently signal also sends to user and touch panel in sending to the induction electrode of fingerprint sensorContact point finger part.
According to example embodiment, the described display element here can be used as fingerprint input module.
According to example embodiment, described fingerprint sensor can be disposed at the visual of electronic equipment etc.District, is used in conjunction with the display unit of electronic equipment, for electronic apparatus system runningAuthentication, as bank account safety verification, its dielectric layer is transparent insulating materials.
According to example embodiment, multiple fingerprint sensors can be applicable in Single Electron equipment. Preferably, described multiple fingerprint sensors are arranged under the display element of described electronic equipment, for example,Fingerprint sensor can be disposed under the glass or outer surface of electronic equipment. Preferably, fingerprintSensor can be arranged according to array or other orderly pattern. Preferably, described fingerprint sensorCan be placed in randomly under surface at random or partly. Preferably, described fingerprint sensor can be placed in and closeAnd within the demonstration lamination of the electronic equipment of display or under, this electronic equipment is such as mobile electricityWords, dull and stereotyped computing equipment, computer display screens etc. In this embodiment, fingerprint passesSensor can be by the glass capacitive ground sensing fingerprint of display and/or display.
Described electronic equipment can also comprise housing, described housing can be electronic equipment shell orPanel, described housing can be metal material or insulation material. Described electronic equipment can also compriseFPC (flexible PCB), it is upper that described fingerprint control chip is located at described FPC, and described housing is electrically connectedBe connected to the ground plane of described FPC. When fingerprint sensor has detected that similar finger thing touches or touchingTime, fingerprint sensor is converted to high voltage from low voltage (park mode voltage, as 0.5V)(mode of operation voltage, as 5V), thus make to be similar to finger thing charged generation sufficient intensityRadiated electric field, described fingerprint control chip detection type is seemingly pointed thing and is launched rf electric field, according to coreThe pixel internal electric field size that sheet surface is detected describes to form fingermark image.
In addition, described electronic equipment also comprises a protective layer, and protective layer is covered in described fingerprint sensingOn device, in order to protect fingerprint sensor and fingerprint control chip, protective layer can be UV glue, pressurePrint glue or Merlon.
In certain embodiments, described fingerprint control chip can use external module. For example, ASICCan be used as fingerprint control chip. ASIC also can be to transmitting data with the main control chip from electronic equipment.
In some embodiments, described fingerprint sensor can be positioned at described display element entiretyUnder. Described conductive ink can be placed in the top of basal surface and the described fingerprint sensor of described display elementBetween surface. Can also comprise binding agent, described binding agent can be attached to described fingerprint sensorFor example on glass. One or more soldered balls can be attached to fingerprint sensor on fexible conductor. Soldered ball canTo be generally placed near the possibility of splitting causing due to stress with reduction the central authorities of fingerprint sensorProperty.
In the embodiment of the present invention, other content is with reference to the content in above-mentioned other embodiment, at this no longerRepeat.
Fingerprint sensor disclosed by the invention and the electronic equipment that comprises it, have following technology effectReally: induction point adopts upper and lower two-plate design, the plate material of top crown and bottom crown, employing is ledElectrically nano material is as Graphene, Nano Silver, thereby utilizes five large physical characteristics making of GrapheneBecome the induction point of fingerprint sensor to there is following advantage: electric conductivity forces the induction point impedance making canBe less than 0.1 ohm; Hardness is superpower, is applicable to finger presses, and the induction point grid service life is long; Printing opacityProperty is strong, is produced on the display screen such as mobile phone or panel computer and does not affect its display effect; EspeciallyBe suitable for and make full frame fingerprint application, because grid circuit is intensive, Graphene thermal conductivity is strong, can not causeThermal impedance effect; Surface area super large characteristic, can be made into high-resolution Graphene induction point grid;The present invention can also adopt Graphene grid manufacturing process technology, makes the sense of described fingerprint sensorYing Dian. In addition, put with fingerprint control chip and be electrically connected by finger contact, can make radiofrequency signalIn sending to the induction electrode of fingerprint sensor, also send to contacting of user and touch panelPoint finger part.
Below illustrate particularly and described illustrative embodiments of the present disclosure. Should be intelligibleThat the disclosure is not limited to detailed structure described herein, set-up mode or implementation method; On the contrary,Disclosure intention contains various amendments and the equivalence in the spirit and scope that are included in claimsArrange.