CN105430943B - The method that monitoring printed circuit board multilayer inner cord is scrapped - Google Patents
The method that monitoring printed circuit board multilayer inner cord is scrapped Download PDFInfo
- Publication number
- CN105430943B CN105430943B CN201510753396.1A CN201510753396A CN105430943B CN 105430943 B CN105430943 B CN 105430943B CN 201510753396 A CN201510753396 A CN 201510753396A CN 105430943 B CN105430943 B CN 105430943B
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- CN
- China
- Prior art keywords
- core material
- wiring board
- printed wiring
- mark zone
- printed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of method for monitoring printed circuit board multilayer inner cord and scrapping, it is characterized in that, include the following steps：（1）Square marks area is made on the break edge for the core material for making printed wire；（2）Core material there are it is bad scrap situation when, white paint notes number are applied in mark zone, while are coated the printed wire for the core material scrapped using conductive stylus；（3）Core material is pressed with the prepreg as dielectric layer material by press；（4）Subsequent printed wiring board production is carried out using common process, when doing outer-layer circuit, the copper foil of mark zone is subjected to windowing and leaks out mark zone.The present invention is using the making label on the break edge of printed wiring board, appearance and size is small, it does not take up space, it can be adjusted accordingly according to the printed wiring board of different type, size, the number of plies, convenient for the production management of printed wiring board processing factory, lifting means production capacity and working efficiency reduce unnecessary work.
Description
Technical field
It is especially a kind of to be directed to using more the present invention relates to a kind of method for monitoring printed circuit board multilayer inner cord and scrapping
Open the monitoring method of the printed wiring board of core material.
Background technology
With lightening, integrated, multifunction the development trend of consumption electronic product, the soft or hard combination to printed circuit
The manufacture craft requirement of plate is higher and higher.This trend is complied with, the printed wiring board with the application of multilayer core material can be gradual
As the pith of printed circuit board.With multilayer core material application printed wiring board, as the term suggests it is exactly core material
The printed wiring board that 2 layers of quantity ＞, core material quantity≤2 layer of normal printed wiring board, effect can allow printed wire
Plate plate thickness is thinner, the number of plies is more, signal transmission faster, finished size smaller the advantages that.
When the core material circuit of multilayer printed circuit board and time outer-layer circuit production process have bad scrap at present, generally
Processing procedure is all coated the circuit for scrapping plate using conductive stylus, short circuit is formed in finished product electrical testing, while exist using white paint pen
The edge setting-out of veneer can distinguish bad plate after finished product fishing type, play double insurance, and above method is lacked there are following
It falls into：Edges of boards are indicated along setting-out, drag for into be difficult after platelet find out from the appearance it is bad, especially with black ink printing
Wiring board, doing electrical testing by board for the bad plate of this appearance respectively not has short circuit, can increase the work of board
Amount reduces equipment mobility（Production yields）, because uncertain is genuine short circuit or the short circuit of the preceding bad plate of report, to exception
Analysis brings puzzlement.
Invention content
The purpose of the present invention is overcoming the deficiencies in the prior art, provide in a kind of monitoring printed circuit board multilayer plate
The method that layer is scrapped, lifting means production capacity and working efficiency.
According to technical solution provided by the invention, the method for monitoring printed circuit board multilayer inner cord and scrapping is special
Sign is to include the following steps：
（1）Square marks area is made on the break edge for the core material for making printed wire；
（2）Core material there are it is bad scrap situation when, mark zone apply white paint notes number, while using conductive stylus will report
The printed wire of useless core material is coated；
（3）Core material is pressed with the prepreg as dielectric layer material by press；
（4）Subsequent printed wiring board production is carried out using common process, when doing outer-layer circuit, by the copper foil of mark zone
It carries out windowing and leaks out mark zone.
The method that monitoring printed circuit board multilayer inner cord of the present invention is scrapped, using in the break edge of printed wiring board
Upper to make label, appearance and size is small, does not take up space, and can do corresponding tune according to different type, size, the printed wiring board of the number of plies
Whole, convenient for the production management of printed wiring board processing factory, lifting means production capacity and working efficiency reduce unnecessary work.
Description of the drawings
Fig. 1 is the schematic diagram that mark zone is made on core material.
Fig. 2 is the schematic diagram after the mark zone marking of the bad core material scrapped.
Fig. 3 is the schematic diagram that copper foil opens a window in mark zone when doing outer-layer circuit.
Specific embodiment
With reference to specific attached drawing, the invention will be further described.
The method that monitoring printed circuit board multilayer inner cord of the present invention is scrapped, includes the following steps：
（1）As shown in Figure 1, square marks area 3 is made on the break edge for the core material 2 for making printed wire 1；Print
Printed wiring board is all made of, and there are some waste materials several platelet typesettings in the processing procedure production of brush wiring board processing factory
Region, and for the rigidity of wiring board, paving copper design generally can be all done, these back zones of giving up are referred to as break edge by industry；Small
The break edge of all internal layer circuits of plate, one fritter square region of design is as mark zone 3, size macroscopic；
（2）As shown in Fig. 2, core material 2 there are it is bad scrap situation when, white paint notes numbers 4 are applied in mark zone 3, simultaneously
The printed wire for the core material scrapped is coated using conductive stylus, short circuit is formed in finished product electrical testing；
（3）Core material 2 is pressed with the prepreg 5 as dielectric layer material by press；
（4）As shown in figure 3, carrying out subsequent printed wiring board production using common process, when doing outer-layer circuit, will mark
The copper foil in note area 3 opens a window, you can leaks out mark zone 3, bad scraps plate so as to observe whether core material has.
Claims (1)
1. a kind of method for monitoring printed circuit board multilayer inner cord and scrapping, it is characterized in that, include the following steps：
（a）Printed wiring board is made of, and useless there are some several platelet typesettings in the processing procedure production of printed wiring board processing
Expect region, these scrap areas are referred to as break edge；Making printed wire（1）Core material（2）Break edge on
A fritter square region is designed as mark zone（3）；
（b）Core material（2）There are it is bad scrap situation when, in mark zone（3）Apply white paint notes number（4）, while using conductive
Pen coats the printed wire for the core material scrapped；
（c）By core material（2）With the prepreg as dielectric layer material（5）It is pressed by press；
（d）Subsequent printed wiring board production is carried out using common process, when doing outer-layer circuit, by mark zone（3）Top
Copper foil carries out windowing and shows mark zone（3）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510753396.1A CN105430943B (en) | 2015-11-06 | 2015-11-06 | The method that monitoring printed circuit board multilayer inner cord is scrapped |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510753396.1A CN105430943B (en) | 2015-11-06 | 2015-11-06 | The method that monitoring printed circuit board multilayer inner cord is scrapped |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105430943A CN105430943A (en) | 2016-03-23 |
| CN105430943B true CN105430943B (en) | 2018-06-19 |
Family
ID=55508790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510753396.1A Active CN105430943B (en) | 2015-11-06 | 2015-11-06 | The method that monitoring printed circuit board multilayer inner cord is scrapped |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430943B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108712819B (en) * | 2018-05-17 | 2021-02-26 | 惠州中京电子科技有限公司 | Printed circuit board scrapping method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6091598A (en) * | 1997-03-28 | 2000-07-18 | Tdk Corporation | Laminated ceramic electronic part including a plurality of internal electrodes having two leading portions and a non-exposed portion between the two leading portions |
| CN101056498A (en) * | 2006-04-13 | 2007-10-17 | 日东电工株式会社 | Wired circuit board assembly sheet |
| TW201018930A (en) * | 2008-11-06 | 2010-05-16 | Fuji Machinery Mfg & Electronics Co Ltd | Multilayer printed circuit board, method for examining multilayer printed circuit board, system for examining multilayer printed circuit board, and method for manufacturing multilayer printed circuit board |
| CN102469703A (en) * | 2010-11-16 | 2012-05-23 | 富葵精密组件(深圳)有限公司 | Method for manufacturing blind holes of circuit board |
| CN202262084U (en) * | 2011-10-24 | 2012-05-30 | 厦门爱谱生电子科技有限公司 | Marking plate for electric detection of flexible circuit board |
| CN103118482A (en) * | 2012-12-28 | 2013-05-22 | 威力盟电子(苏州)有限公司 | Circuit board with quality identification tag and identification method thereof |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
| CN203884070U (en) * | 2014-04-25 | 2014-10-15 | 深圳市卓创通电子有限公司 | Precise PCB with novel target hole structures |
-
2015
- 2015-11-06 CN CN201510753396.1A patent/CN105430943B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6091598A (en) * | 1997-03-28 | 2000-07-18 | Tdk Corporation | Laminated ceramic electronic part including a plurality of internal electrodes having two leading portions and a non-exposed portion between the two leading portions |
| CN101056498A (en) * | 2006-04-13 | 2007-10-17 | 日东电工株式会社 | Wired circuit board assembly sheet |
| TW201018930A (en) * | 2008-11-06 | 2010-05-16 | Fuji Machinery Mfg & Electronics Co Ltd | Multilayer printed circuit board, method for examining multilayer printed circuit board, system for examining multilayer printed circuit board, and method for manufacturing multilayer printed circuit board |
| CN102469703A (en) * | 2010-11-16 | 2012-05-23 | 富葵精密组件(深圳)有限公司 | Method for manufacturing blind holes of circuit board |
| CN202262084U (en) * | 2011-10-24 | 2012-05-30 | 厦门爱谱生电子科技有限公司 | Marking plate for electric detection of flexible circuit board |
| CN103118482A (en) * | 2012-12-28 | 2013-05-22 | 威力盟电子(苏州)有限公司 | Circuit board with quality identification tag and identification method thereof |
| CN103607852A (en) * | 2013-12-06 | 2014-02-26 | 柏承科技(昆山)股份有限公司 | Printed circuit board core transplanting method |
| CN203884070U (en) * | 2014-04-25 | 2014-10-15 | 深圳市卓创通电子有限公司 | Precise PCB with novel target hole structures |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105430943A (en) | 2016-03-23 |
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Address after: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee before: GULTECH (JIANGSU) ELECTRONIC TECHNOLOGIES CO.,LTD. |