CN105425350B - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
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- CN105425350B CN105425350B CN201510869580.2A CN201510869580A CN105425350B CN 105425350 B CN105425350 B CN 105425350B CN 201510869580 A CN201510869580 A CN 201510869580A CN 105425350 B CN105425350 B CN 105425350B
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- golden finger
- receiving unit
- pcb
- emitting module
- optical module
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of optical module, it is related to technical field of photo communication, while receiving sensitivity is ensured, to reduce the high frequency attenuation of the electric signal on PCB trace.Optical module includes：PCB, PCB include first surface, second surface and the golden finger end that multiple golden fingers are distributed with；Emitting module on the first surface is set, and emitting module is connected with golden finger；Receiving unit on a second surface is set, and receiving unit is connected with golden finger；PCB further includes ground plane.The optical module can be the optical module of transceiver.
Description
Technical field
The present invention relates to technical field of photo communication, more particularly to a kind of optical module.
Background technology
Optical module includes emitting module and receiving unit, at present, emitting module and receiving unit generally is arranged on PCB
On the upper surface of (Printed Circuit Board, printed circuit board), as shown in Figure 1.In addition, divide on the golden finger end of PCB
Multiple golden fingers are furnished with, emitting module is connected with receiving unit with golden finger.Driving chip and laser in emitting module
Between the energy that gives off of line (i.e. gold thread) receiving unit can be interfered, the reception that this can influence receiving unit is sensitive
Degree.
To solve the above-mentioned problems, at present generally by emitting module and receiving unit stagger setting in the horizontal direction, such as
Shown in Fig. 2.Energy field is laterally one week most strong at it according to radiation field energy space distribution theory, and so setting can make to connect
Receive component and be effectively shielded from the main energy that emitting module gives off, so that reduce interference of the emitting module to receiving unit,
Improve the receiving sensitivity of receiving unit；But such that line (i.e. PCB trace) between emitting module and golden finger
Length increase, and PCB trace is longer, and the high frequency attenuation of the electric signal on PCB trace is more serious.
The content of the invention
The embodiment of the present invention provides a kind of optical module, while receiving sensitivity is ensured, to reduce on PCB trace
Electric signal high frequency attenuation.
To reach above-mentioned purpose, the embodiment of the present invention adopts the following technical scheme that：
A kind of optical module, including：
Printing board PCB, the PCB include first surface, second surface and the golden finger that multiple golden fingers are distributed with
End；
Emitting module on the first surface is set, and the emitting module is connected with the golden finger；
The receiving unit being arranged on the second surface, the receiving unit are connected with the golden finger.
Optical module provided in an embodiment of the present invention, by setting emitting module on the first surface of PCB, and PCB's
Receiving unit is set on second surface, energy field is laterally one week most strong at it according to radiation field energy space distribution theory,
So setting can make receiving unit be effectively shielded from the main energy that emitting module gives off, so as to reduce transmitting group
Interference of the part to receiving unit, so as to ensure the receiving sensitivity of receiving unit.Further, since emitting module and receiving unit are set
Put on the different surfaces of PCB, therefore, there is no need to consider that the position of emitting module and receiving unit in the horizontal direction is closed
System, therefore, in the range of technique permission, can shorten the length of the cabling between emitting module and golden finger as far as possible,
So as to reduce the high frequency attenuation of the electric signal on the cabling between emitting module and golden finger.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, the present invention will be implemented below
Attached drawing is briefly described needed in example or the prior art, it is clear that drawings below is only some realities of the present invention
Example is applied, for those of ordinary skill in the art, without having to pay creative labor, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is a kind of structure diagram of the optical module provided in the prior art；
Fig. 2 is the structure diagram of another optical module provided in the prior art；
Fig. 3 is a kind of top view of optical module provided in an embodiment of the present invention；
Fig. 4 is a kind of side view of the optical module based on shown in Fig. 3 provided in an embodiment of the present invention；
Fig. 5 is the top view of another optical module provided in an embodiment of the present invention；
Fig. 6 is a kind of side view of the optical module based on shown in Fig. 5 provided in an embodiment of the present invention；
Fig. 7 is the side view of another optical module provided in an embodiment of the present invention；
Fig. 8 is the top view of another optical module provided in an embodiment of the present invention.
Embodiment
With reference to the attached drawing in the embodiment of the present invention, exemplary retouch is carried out to the technical solution in the embodiment of the present invention
State, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, the every other implementation that those of ordinary skill in the art are obtained without making creative work
Example, belongs to the scope of protection of the invention.
"and/or" in the embodiment of the present invention, is only a kind of incidence relation for describing affiliated partner, represents there may be
Three kinds of relations, for example, A and/or B, can represent：Individualism A, while there are A and B, these three situations of individualism B.“/”
It is a kind of relation of "or" to typically represent forward-backward correlation object." multilayer " refers to two layers or more than two layers；" multiple " refer to two
Or two or more." upper surface ", " lower surface ", " upper end ", " lower end ", " left side ", " right side ", " transverse direction ", " longitudinal direction " etc. and side
To the concept related with position, it is all based on what is illustrated exemplified by the attached drawing that the embodiment of the present invention is provided.
The basic principle of technical solution provided in an embodiment of the present invention is by the way that emitting module and receiving unit are arranged on
On different two surface of PCB, interference of the emitting module to receiving unit is then shielded by the ground plane of PCB.
It is a kind of structure diagram of optical module provided in an embodiment of the present invention referring to Fig. 3 and Fig. 4, wherein, Fig. 3 is this
A kind of top view for optical module that inventive embodiments provide, Fig. 4 is the side view based on the optical module shown in Fig. 3.Fig. 3 and Fig. 4
Shown optical module includes：PCB11, emitting module 12 and receiving unit 13.Wherein：
PCB11 includes first surface 111, second surface 112 and the golden finger end 113 that multiple golden fingers are distributed with.Transmitting
Component 12 is arranged on first surface 111, and emitting module 12 is connected with golden finger.Receiving unit 13 is set on a second surface
112, receiving unit 13 is connected with golden finger.
Wherein, " optical module " that is provided in the embodiment of the present invention can be the optical module of transceiver, can be specifically high
Fast parallel optical module, such as 25G high-speed parallels optical module or 56G high-speed parallel optical modules etc..
In embodiments of the present invention, PCB11 is multi-layer PCB (for example, four layers of PCB or six layer of PCB).Wherein, multi-layer PCB bag
Upper surface, lower surface and one/multiple intermediate layers are included, for example, four layers of PCB include upper surface, among lower surface and first
Layer and the second intermediate layer；Alternatively, multi-layer PCB includes top layer signals layer, bottom layer signal layer and one/multiple intermediate layers.Also
It is to say, the upper surface of PCB11 refers to the upper surface of the top layer signals layer of PCB11, and the lower surface of PCB11 refers to the bottom of PCB11
The lower surface of signals layer.The thickness of PCB11 follows the thickness calibration of PCB, for example, the thickness of PCB11 substantially 1mm (millimeter).
One end of PCB11 is golden finger end, and the other end is used to connect optical fiber.Wherein, golden finger end is used for transmission on PCB11
The communication electric signal between device/module outside each device/module and PCB11 that set；Optical fiber be used for transmission optical module with
Communicating light signal between other equipment/module.
First surface 111 and two different surfaces that second surface 112 is PCB11.Optionally, first surface 111 is
The upper surface of PCB11, second surface 112 are the lower surfaces of PCB11；Or, first surface 111 is the lower surface of PCB11, the second table
Face 112 is the upper surface of PCB11.In the attached drawing of the embodiment of the present invention with " first surface 111 is the upper surface of PCB11, second
Surface 112 is the lower surface of PCB11 " exemplified by illustrate.In this way, the vertical view of the optical module provided in embodiments of the present invention
Scheme in (such as Fig. 3, Fig. 5, Fig. 6), in theory, can only see the transmitting set on the first surface 111 (i.e. upper surface) of PCB11
13 emitting module 12 of component and each cabling/gold thread, it is impossible to see that what is set on the second surface 112 (i.e. lower surface) of PCB11 connects
Component 13 and each cabling/gold thread are received, for the technical solution of the clear explanation embodiment of the present invention, is represented with dotted line frame and dotted line
Receiving unit 13 and each cabling/gold thread on the second surface 112 of PCB11 etc..
Golden finger end 113 is distributed with golden finger on first surface 111 and second surface 112；Wherein " golden finger " by
Numerous golden yellow conductive contact blade compositions, because of its surface gold-plating and conductive contact blade arrangement such as finger-shaped, so being known as " golden hand
Refer to ".The number for the golden finger that the embodiment of the present invention is distributed golden finger end on first surface 111 and second surface 112 is not
Be defined, wherein, first surface 111 and the number of golden finger that is distributed on second surface 112 can it is identical can not also
Together；Can be oppositely arranged between the golden finger being distributed on first surface 111 and second surface 112 can also stagger setting.Need
It is noted that 8 golden fingers at golden finger end 113 are only symbolically depicted in Fig. 3, including on first surface 111
4 golden fingers being distributed on 4 golden fingers and second surface 112 being distributed.
As shown in figure 5, emitting module 12 can include transmitting chip and laser, it can in addition contain including driving chip
Deng, wherein, laser can be Vcsel (Vertical Cavity Surface Emitting Laser, vertical-cavity surface-emitting
Laser) etc..As shown in figure 5, receiving unit 13 can include receiving chip and PD (Photo Devices, photodetector,
It can in addition contain including driving chip etc..Each device of emitting module 12, and the connection between each device of receiving unit 13
Relation and its effect may be referred to the prior art, no longer describe herein.Transmitting chip is usually IC with receiving chip
(Integrated Circuit, integrated circuit) chip.As shown in fig. 6, it is the side view based on the optical module shown in Fig. 5.
The embodiment of the present invention to emitting module 12 and receiving unit 13 position in the horizontal direction without limiting, its
In, the optical mode emitting module 12 in the block and receiving unit 13 shown in Fig. 3 are on same level direction, and in the vertical direction
It is not overlapping.During specific implementation, the two can not be on same level direction, in addition, in the vertical direction can also partly overlap
It is or completely overlapped.
Optical module provided in an embodiment of the present invention, by setting emitting module on the first surface of PCB, and PCB's
Receiving unit is set on second surface, energy field is laterally one week most strong at it according to radiation field energy space distribution theory,
So setting can make receiving unit be effectively shielded from the main energy that emitting module gives off, so as to reduce transmitting group
Interference of the part to receiving unit, so as to ensure the receiving sensitivity of receiving unit.Further, since emitting module and receiving unit are set
Put on the different surfaces of PCB, therefore, there is no need to consider that the position of emitting module and receiving unit in the horizontal direction is closed
System, therefore, in the range of technique permission, can shorten the length of the cabling between emitting module and golden finger as far as possible,
So as to reduce the high frequency attenuation of the electric signal on the cabling between emitting module and golden finger.
In an optional implementation manner, emitting module 12 passes through the first cabling and golden finger on first surface 111
Connection.Receiving unit 13 sets on a second surface 112, and receiving unit 13 passes through the second cabling on second surface 112 and gold
Finger connects.In addition, PCB11 further includes ground plane, wherein, ground plane is arranged on region and the second cabling where the first cabling
Between the region at place.
Ground plane is used to shield the energy that emitting module 12 radiates receiving unit 13, can specifically include：For
Shield the gold thread between the driving chip and laser in emitting module 12, and the PCB between emitting module 12 and golden finger
The energy that cabling etc. is radiated, so as to shield the energy that emitting module 12 radiates receiving unit 13.The optional realization side
Formula can further decrease or even eliminate interference of the emitting module to receiving part.
" ground plane is arranged between the region where the first cabling and the region where the second cabling " can be understood as：Connect
Stratum is arranged between the plane domain where plane domain and the second cabling where the first cabling；Specifically it can be implemented as：
Ground plane is arranged between first surface 111 and second surface 112, optionally, can be made any one intermediate layer of PCB11
For ground plane., can be between the plane domain where the first cabling and the plane domain where the second cabling during specific implementation
An intermediate layer on the more complete copper sheet of larger area is set as ground plane, in PCB design, on the intermediate layer not into
Row etching wiring.
Optionally, in technique, driving chip can use flipchip packaging technologies, transceiving device (such as Vcsel and
PD gold thread routing technique can) be used., can since silver paste has mobility since device is fixed on PCB usually using silver paste
To be reserved in IC chip (such as transmitting chip and reception chip) between optical device (such as laser and photodetector)
The safe distance of 300~500 μm (micron), as shown in fig. 7, flowing to the beating on gold thread pad of PCB to avoid silver paste.Further
Ground, in the range of technological level permission, shortens the distance of the gold thread between IC chip and optical device, so as to reduce as much as possible
The energy that emitting module 12 is given off.
In an optional implementation manner, the golden finger being distributed on golden finger end 113 include transmitting terminal golden finger and
Receiving terminal golden finger, wherein, transmitting terminal golden finger is used to send electric signal, and receiving terminal golden finger is used to receive electric signal；Transmitting
Component 12 is connected by the first cabling with transmitting terminal golden finger；Receiving unit 13 is connected by the second cabling and receiving terminal golden finger
Connect.In the implementation, the transmitting terminal golden finger that is connected with emitting module 12, and, connect with what receiving unit 13 was connected
The position relationship of receiving end golden finger can be following any：
1st, transmitting terminal golden finger and receiving terminal golden finger are arranged on first surface 111.
In this case, can by the signals layer where first surface 111 (i.e.：Top layer signals layer or bottom layer signal layer)
And it is punched on each intermediate layer, so as to realize the connection between receiving unit 13 and receiving terminal golden finger by via.
2nd, transmitting terminal golden finger and receiving terminal golden finger are arranged on second surface 112.
In this case, can by the signals layer where second surface 112 (i.e.：Bottom layer signal layer or top layer signals layer)
And it is punched on each intermediate layer, so as to realize the connection between emitting module 12 and transmitting terminal golden finger by via.
3rd, transmitting terminal golden finger is arranged on second surface 112, and receiving terminal golden finger is arranged on first surface 111.
In this case, can be by punched on every layer of PCB11, so as to realize emitting module 12 by via
With the connection between transmitting terminal golden finger, and receiving unit 13 and receiving terminal golden finger.
4th, transmitting terminal golden finger is arranged on first surface 111, and receiving terminal golden finger is arranged on second surface 112.Should
Implementation is preferable implementation, and attached drawing 3,5,8 is illustrated by taking the implementation as an example.
It should be noted that during specific implementation, transmitting terminal can be respectively provided with first surface 111 and second surface 112
Golden finger and receiving terminal golden finger.Furthermore it is possible to be respectively provided with via on each layer of PCB11, so as to fulfill emitting module 12 with
Transmitting terminal golden finger connects, and receiving unit 13 is connected with receiving terminal golden finger.
In an optional implementation manner, emitting module 12 and transmitting terminal golden finger are arranged on the first side of PCB11；Connect
Receive component 13 and receiving terminal golden finger is arranged on second side opposite with the first side of PCB11.
In theory, " the first side " can be left side, and " the second side " can be right side；Alternatively, " the first side " can be right side,
" the second side " can be left side；Alternatively, " the first side " can be upside, " the second side " can be downside；Alternatively, " the first side " can
To be downside, " the second side " can be upside.In fact, usually, the golden finger end 113 of PCB11 is known as to the lower end of PCB,
I.e.：Side where golden finger end 113 is known as the downside of PCB；In this way, " the first side " can be left side, " the second side " can be
Right side；Alternatively, " the first side " can be right side, " the second side " can be left side.Hereinafter with " the first side " be right side, " second
Side " be left side, as shown in figure 8, exemplified by illustrate.
Optionally, the first side and the second side are distinguished with the central axes of PCB11.That is, when " the first side " and " second
When side " represents the left and right sides of PCB11, the left-half of PCB11 and the area equation of right half part；Alternatively, when " the first side " and
When " the second side " represents the upper and lower sides of PCB11, the top half of PCB11 and the area equation of the latter half.
Optionally, transmitting terminal golden finger and receiving terminal golden finger are respectively provided with first surface 111 and second surface 112；And
Transmitting terminal golden finger is on the right side of PCB, and receiving terminal golden finger is in the left side of PCB.
In addition, when being laid out emitting module 12 and receiving unit 13, following rule can be followed：
1), emitting module 12 and/or receiving unit 13 and the distance at golden finger end are less than or equal to predetermined threshold value, wherein should
Distance refers to, since the lower end of emitting module 12 and/or receiving unit 13 the distance between to the lower end of PCB11.Such as Fig. 8 institutes
Show, on longitudinal direction, the length of emitting module 12 and receiving unit 13 cabling between golden finger respectively is less than or equal to default
Threshold value.
It should be noted that if the length of the cabling between emitting module 12 and/or receiving unit 13 and golden finger is larger,
Then the high frequency attenuation of the electric signal on cabling is with regard to larger；If between emitting module 12 and/or receiving unit 13 and golden finger end
Cabling length it is smaller, then the radian of the different cablings connected on same component (including emitting module 12 and receiving unit 13)
It is different so that length between the difference cabling differs greatly, this can cause the electric signal that is obtained through the different cabling it
Between differ greatly.In addition, during specific implementation, one capacitance of setting on every cabling is generally required, it is straight for isolating
Galvanic electricity signal；Therefore, determine emitting module 12 and/or receiving unit 13 and golden finger end apart from when, it is also necessary to consider
The size (for example, 2mm or so) of capacitance.In addition, as shown in figure 8, the distance also needs to the length for including golden finger, because
This, during specific implementation, it is also necessary in view of the length (for example, 5mm or so) of golden finger.Considering the feelings of above-mentioned each factor
Under condition, an embodiment of the present invention provides a kind of optional implementation, emitting module 12 and/or receiving unit 13 and golden finger it
Between the value range of length of cabling be [10mm, 30mm].Preferably, emitting module 12 and/or receiving unit 13 and golden hand
The length of cabling between finger is in 16mm or so.
It is further to note that during specific implementation, considering what the different cablings through being connected from same component obtained
, can in the range of technique permission after the factors such as the size of difference, capacitance between electric signal, the size of golden finger
To shorten the length of the cabling between emitting module 12 and/or receiving unit 13 and golden finger as far as possible.
2), SSF Committee (Small Form Factor Committee, minimize the committee) specification QSFP
Pin definition and the module overall dimensions of interface plug, wherein, as shown in figure 8, transmitting terminal golden finger on the right side of PCB11, connects
Receiving end golden finger is in the left side of PCB11.Therefore, in this scenario, it is contemplated that through being obtained from the different cablings of same component connection
Electric signal between difference it is smaller, emitting module 12 is generally arranged on to the right side of first surface 111, receiving unit 13 is set
In the left side of second surface 112.Optionally, the left side and right side of PCB11 is distinguished with the central axes of PCB11.Therefore, usually,
In the horizontal, the maximum of the distance between right side boundary of the left side of emitting module 12 and PCB11 is the one of the width of PCB11
Half, the maximum of the distance between the right side of receiving unit 13 and left border of PCB11 is the half of the width of PCB11.Separately
Outside, in technique, generally require and reserve the safe distance of about 2mm on PCB both sides.Optionally, when PCB11 width is 16.4mm
When, as shown in figure 8, in the horizontal, emitting module 12 can set the distance between right side boundary with PCB11 2mm~
Between 8.2mm；Receiving unit can be arranged on the distance between left border with PCB11 2mm~8.2mm it
Between in the range of.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
To modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical solution spirit and
Scope.
Claims (9)
- A kind of 1. optical module, it is characterised in that including：Printing board PCB, the PCB include first surface, second surface and the golden finger end that multiple golden fingers are distributed with；Emitting module on the first surface is set, and the emitting module is connected with the golden finger；The receiving unit being arranged on the second surface, the receiving unit are connected with the golden finger；The emitting module is connected by the first cabling on the first surface with the golden finger；The receiving unit is connected by the second cabling on the second surface with the golden finger；The PCB further includes ground plane, and the ground plane is arranged on region and second cabling where first cabling Between the region at place.
- 2. optical module according to claim 1, it is characterised in that the multiple golden finger includes transmitting terminal golden finger and connects Receiving end golden finger；The emitting module is connected by first cabling with the transmitting terminal golden finger；The receiving unit is connected by second cabling with the receiving terminal golden finger.
- 3. optical module according to claim 2, it is characterised in that the transmitting terminal golden finger is arranged on the first surface On, the receiving terminal golden finger is arranged on the second surface.
- 4. optical module according to claim 2, it is characterised in thatThe transmitting terminal golden finger is arranged on the second surface, passes through the signals layer being arranged on where the first surface and institute The via on each intermediate layer of PCB is stated, realizes the connection between the emitting module and the transmitting terminal golden finger；And/orThe receiving terminal golden finger is arranged on the first surface, passes through the signals layer being arranged on where the second surface and institute The via on each intermediate layer of PCB is stated, realizes the connection between the receiving unit and the receiving terminal golden finger.
- 5. optical module according to claim 2, it is characterised in thatThe emitting module and the transmitting terminal golden finger are arranged on the first side of the PCB；The receiving unit and the receiving terminal golden finger are arranged on second side opposite with first side of the PCB.
- 6. optical module according to claim 5, it is characterised in thatFirst side and second side are distinguished with the central axes of the PCB.
- 7. optical module according to claim 1, it is characterised in that the ground plane be the PCB any one among Layer.
- 8. optical module according to claim 1, it is characterised in that the emitting module and the receiving unit respectively with institute Stating the value range at the distance between golden finger end is：[10 millimeters, 30 millimeters].
- 9. optical module according to claim 8, it is characterised in that the emitting module and the receiving unit respectively with institute It is 16 millimeters to state the distance between golden finger end.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510869580.2A CN105425350B (en) | 2015-12-02 | 2015-12-02 | A kind of optical module |
| PCT/CN2016/080259 WO2017092220A1 (en) | 2015-12-02 | 2016-04-26 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510869580.2A CN105425350B (en) | 2015-12-02 | 2015-12-02 | A kind of optical module |
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| Publication Number | Publication Date |
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| CN105425350A CN105425350A (en) | 2016-03-23 |
| CN105425350B true CN105425350B (en) | 2018-05-04 |
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| CN (1) | CN105425350B (en) |
| WO (1) | WO2017092220A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105425350B (en) * | 2015-12-02 | 2018-05-04 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN106646777B (en) * | 2016-12-14 | 2019-05-28 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module and its design method |
| CN106793455B (en) * | 2016-12-14 | 2019-06-14 | 广东海信宽带科技有限公司 | A kind of optical module |
| WO2019218978A1 (en) * | 2018-05-14 | 2019-11-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN108598865A (en) * | 2018-06-06 | 2018-09-28 | 复旦大学 | Pulse driving circuit based on vertical cavity surface emitting laser |
| WO2020078432A1 (en) * | 2018-10-17 | 2020-04-23 | 青岛海信宽带多媒体技术有限公司 | Circuit board and optical module |
| WO2021184844A1 (en) * | 2020-03-20 | 2021-09-23 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114217390B (en) * | 2021-12-24 | 2024-02-23 | 苏州浪潮智能科技有限公司 | Optical switch design method, optical switch, electronic device, and storage medium |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7476040B2 (en) * | 2004-02-02 | 2009-01-13 | Jds Uniphase Corporation | Compact optical sub-assembly with ceramic package |
| KR101127844B1 (en) * | 2005-06-21 | 2012-03-21 | 엘지디스플레이 주식회사 | Apparatus and method for driving image display device |
| KR100818510B1 (en) * | 2007-01-16 | 2008-03-31 | 삼성전기주식회사 | Printed circuit board connector for back light unit and chassis using the same |
| JP5541483B2 (en) * | 2009-08-07 | 2014-07-09 | 日立金属株式会社 | Photoelectric conversion module |
| TWI441119B (en) * | 2010-04-02 | 2014-06-11 | Arolltech Co Ltd | Display with in-cell touch sensor |
| CN201867521U (en) * | 2010-11-17 | 2011-06-15 | 华为技术有限公司 | Transmitting and receiving integrated optical module |
| CN102565965B (en) * | 2010-12-07 | 2014-04-02 | 中国科学院微电子研究所 | Laminated high-density optical module |
| JP2013093345A (en) * | 2011-10-24 | 2013-05-16 | Hitachi Ltd | Optical module and multilayer substrate |
| TWI514699B (en) * | 2011-12-28 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | Optical fiber connector |
| CN103323921B (en) * | 2013-06-21 | 2015-08-12 | 武汉电信器件有限公司 | A kind of parallel transmission optical device of highly dense type |
| CN104540319B (en) * | 2014-12-31 | 2017-08-25 | 苏州旭创科技有限公司 | Printed circuit board (PCB) for optical module |
| CN104503044B (en) * | 2014-12-31 | 2016-08-24 | 苏州旭创科技有限公司 | Optical module |
| CN104836619B (en) * | 2015-03-30 | 2017-08-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical device |
| CN105425350B (en) * | 2015-12-02 | 2018-05-04 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
-
2015
- 2015-12-02 CN CN201510869580.2A patent/CN105425350B/en active Active
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2016
- 2016-04-26 WO PCT/CN2016/080259 patent/WO2017092220A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN105425350A (en) | 2016-03-23 |
| WO2017092220A1 (en) | 2017-06-08 |
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