CN105374283A - Anti-counterfeit material and preparation method thereof - Google Patents
Anti-counterfeit material and preparation method thereof Download PDFInfo
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- CN105374283A CN105374283A CN201510891483.3A CN201510891483A CN105374283A CN 105374283 A CN105374283 A CN 105374283A CN 201510891483 A CN201510891483 A CN 201510891483A CN 105374283 A CN105374283 A CN 105374283A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F2003/0208—Indicia
- G09F2003/0213—Concealed data
Abstract
The invention relates to anti-counterfeit technologies, in particular to a stereoscopic multi-material anti-counterfeit material and a preparation method thereof. The anti-counterfeit material comprises a flaky amorphous silicon module and a metal module, wherein the flaky amorphous silicon module is provided with hollowed-out areas, and the metal module is inlaid in the hollowed-out areas. The preparation method of the anti-counterfeit includes plating an adhering layer, a sacrificial layer and an amorphous silicon layer on the upper surface of a glass substrate, coating light solid glue prior to exposing, developing and rinsing, and etching the amorphous silicon layer; coating light solid glue for the second time prior to exposing, developing and rinsing, plating the metal module, rinsing the light solid glue, etching the sacrificial layer, rinsing and filtering.
Description
Technical field
The present invention relates to anti-counterfeiting technology, particularly relate to a kind of anti-fake material and preparation method thereof.
Background technology
In existing skill counterfeit-proof tech, greatly mainly with the body and stochastic distribution etc. of watermark, coloured fibre, fluorescent ink printing, micro-point or small mark as counterfeit protection measures.
Such as, prior art 1, Chinese patent literature CN102108653A, disclosed a kind of sheet anti-fake material, described sheet anti-fake material adopts the polymorphic structure beyond square; And described sheet anti-fake material is made up of following layer structure: the false proof carrier layer of papery, the false proof carrier of wherein said papery is the paper obtained by least two kinds of composite manufactures of fiber; And false proof layer.Also disclose the preparation method of described sheet anti-fake material and the cheque paper containing this sheet anti-fake material.Sheet anti-fake material of the present invention can obtain possesses the multi-level anti-fraud functional cheque paper such as naked eyes identification, fast machine-readable, analysis expert simultaneously.
For another example, prior art 2, Chinese patent literature CN104610812A, disclosed fluorescence silicon nano particles, as the application of anti-fake mark, prepare fluorescence silicon nano particles by silicon source, the fluorescence silicon nano particles obtained are used as anti-counterfeiting ink to prepare security pattern.Because nano silicon particles has good photoluminescent property, quantum yield is high, and storage stability is good, has good excitation wavelength dependence, and the security pattern of preparation can show the light of different colours under the illumination of different excitation wavelength, can play good antifalse effect.
For another example, prior art 3, Chinese patent literature CN101673341A, disclosed in the present invention relates to anti-counterfeiting technology, particularly relate to a kind of anti-counterfeiting method of micro-points.The method comprises the following steps: (1) provides a kind of micro-point; (2) provide a kind of glue, micro-point is mixed among glue; (3) the mixed atomarius glue of point on carrier; (4) solidified glue; (5) glue of taking pictures drips, and forms original Contrast's picture; (6) original Contrast's picture is stored in background data base; (7) fake certification glue of taking pictures drips, and is formed by than picture; (8) read background data base original Contrast picture, compare with by than picture, make the true and false and judge; Wherein, the glue of taking pictures described in (5) step drips, and takes pictures for amplifying; Fake certification described in (7) step glue of taking pictures drips, and is also to amplify to take pictures.The invention provides the not imitability anti-counterfeiting method of micro-points of one.Corresponding, Chinese patent literature CN102267287A discloses a kind of preparation method of similar a kind of micro-some anti-counterfeiting stamp and and realizes the device of the method.The preparation method of micro-some anti-counterfeiting stamp comprises the following steps: S1, provides a kind of micro-some label, provides a kind of ink; S2, mixed ink, mixes with ink by micro-some label; S3, provides at least two shower nozzles, provides object; S4, sprays, by shower nozzle, the ink being mixed with micro-some label is sprayed to subject matter; S5, drying is mixed with the ink of micro-some label; In course of injection, mixed black step is carried out continuously, mixes ink, completes in totally enclosed fluid path to shower nozzle ink supply, injection.The invention provides in a kind of process the preparation method being not easily mixed into the micro-some anti-counterfeiting stamp that impurity, the in real time micro-point of maintenance are evenly distributed in ink and the device realizing the method.
For another example, prior art 4, Chinese patent literature CN1350274A, disclosed a kind of anti-fake mark containing most small mark or pattern and forming method thereof, with the anti-fake mark containing most micro pattern mark, reach the application identified article genuine-fake and prevent from forging.Object qualification method is at least one unique tag according to being formed in object, it contains most micro pattern or mark, and close in mark in the mode of random combine, with as a comparison, qualification method, and have prevent other people from forging and can reach easily identify and qualification and contrast effect.
But, enumerate such as, the body and stochastic distribution etc. of the composition fiber of prior art, fluorescence silicon nano particles, micro-point or small mark are as counterfeit protection measures, it is not the effect that can prevent other people from forging like that to open text narration, along with the progress of science and technology, these technological means all can be cheap imitated, the background data base only had described in prior art 3 that can not copy, but back-end data is also dangerous, the database of enterprise is easy to suffer assault, and need communication security guarantee, still undesirable.Prior art 3 and prior art 4, Xie Shineng solve most of false proof demand, but are all that the anti-fake material that single material is formed easily is imitated, and unified gray tone does not have stereovision and stereoscopic sensation, still high-end demand can not be met, thus, need constantly to weed out the old and bring forth the new, constantly progress.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art part and a kind of anti-fake material with many materials is provided.
The present invention also aims to overcome above-mentioned the deficiencies in the prior art part and a kind of relief anti-fake material is provided.
The present invention also aims to overcome above-mentioned the deficiencies in the prior art part and a kind of preparation method with many materials, relief anti-fake material is provided.
Object of the present invention can be achieved through the following technical solutions:
A kind of anti-fake material, it is characterized in that: this anti-fake material comprises the amorphous silicon module of sheet, and amorphous silicon module has void region, this anti-fake material also comprises metal module, and metal module is embedded in described void region.
Described anti-fake material, it is characterized in that: described metal module, refer in a unit anti-fake material, the summation of each submodule be made up of metal, discrete distribution between each submodule, described metal module can be a figure or character, also can form a block graphics or character string by most submodules; Described amorphous silicon module, refer in a unit anti-fake material, the summation of each submodule be made up of amorphous silicon, discrete distribution between each submodule, described amorphous silicon module can be a figure or character, also can form a block graphics or character string by most submodules.
Described anti-fake material, is characterized in that: described metal module bottom surface and amorphous silicon module bottom surface in the same plane, described metal module and amorphous silicon module consistency of thickness.
Described anti-fake material, is characterized in that: described metal module bottom surface and amorphous silicon module bottom surface in the same plane, described metal module is larger than amorphous silicon module thickness.
Described anti-fake material, is characterized in that: described metal module is chromium, may also be gold or titanium or copper.。
Described anti-fake material, is characterized in that: under visible light, and metal module display metallic luster, amorphous silicon module is arranged to black, and the form content of metal module adds the anti-counterfeiting information that black amorphous silicon module substrate forms this anti-fake material.
Described anti-fake material, is characterized in that: between the thickness of described schistose texture is 2 to 10 microns.
Object of the present invention can also be achieved through the following technical solutions:
A preparation method for anti-fake material, is characterized in that, comprises the following steps: S110, provides substrate of glass; S120, on the glass substrate face plating adhesion layer; S130, plates sacrifice layer on adhesion layer; S140, plates amorphous si-layer on sacrifice layer; S150, at amorphous si-layer coated thereon light binding; S160, provides ultraviolet light source, provides and floods template, light binding coating exposure S150 step be coated with; S170, developer solution is provided, development, with developer solution cured portion light binding, the light binding of amorphous si-layer solidification is etched as protective seam in order to S190 step, to stay on finished product and to need all amorphous silicon module, etch away the void region of all plating metal modules, and the neighboring area between each unit anti-fake material; S180, provides pure water, washes uncured light binding; S190, provides plasma etching to equip, etching amorphous si-layer, the neighboring area namely outside void region and each unit anti-fake material; S200, second time is coated with light binding; S210, provides second to flood template, light binding coating exposure S200 step be coated with; S220, development, solidifies the light binding of the neighboring area outside each unit anti-fake material; S230, with pure water cleaning, cleans uncured light binding; S240, in void region plating module; S250, provides cleaning fluid, washes all light bindings had cured; S260, provides sacrificial layer etching liquid, etching sacrificial layer; S270, provides cleaning and filtering to equip and pure water, cleaning, filters; Wherein, S230 step, the uncured light binding of cleaning void region; S240 step, describedly refers to Vacuum Deposition in void region plating module, or electroless plating; There is provided cleaning fluid described in described S250 step, cleaning fluid is acetone.
The preparation method of described a kind of anti-fake material, is characterized in that: S120 step, and described adhesion layer is Cr or Ni or stainless steel, and described plating refers to Vacuum Deposition; S130 step, described sacrifice layer is among Al or Cu, and described plating refers to Vacuum Deposition.
The preparation method of described a kind of anti-fake material, is characterized in that: also comprise S195 step, provide cleaning fluid, cleaning.Wash the light binding had cured for the protection of amorphous si-layer, object is to prepare uniform thickness product, namely described metal module bottom surface and amorphous silicon module bottom surface in the same plane, described metal module and amorphous silicon module consistency of thickness.
The preparation method of described a kind of anti-fake material, is characterized in that: described S150 step, also comprises providing being coated with equipment step, with being coated with method coating.
The preparation method of described a kind of anti-fake material; it is characterized in that: described S200 step; also comprise and painting equipment step is provided; be coated with spraying method; this coating object is for S240 step is when void region plating module; neighboring area outside each unit anti-fake material, arranges protective seam.
The preparation method of described a kind of anti-fake material, it is characterized in that: described light binding can select positive light binding and negative light binding one wherein, the cured portion light binding that described S170 step is mentioned refers to, exposure or unexposed part light binding, particularly, the part light binding exposed for positive light binding does not solidify, unexposed part light binding solidification; Accordingly, for the part light binding solidification that negative light binding exposes, unexposed part light binding does not solidify; The light binding of described S200 step coating is selected identical with the method.
The preparation method of described a kind of anti-fake material, it is characterized in that: described S110 provides substrate of glass, also comprise and glass sheet be cut into square or rectangle, and chamfering, polishing, cleaning, drying steps, for the thickness of substrate of glass between 0.3 to 0.5 millimeter.
The preparation method of described a kind of anti-fake material, is characterized in that: provide developer solution described in described S170 step, and developer solution is that tetramethyl adds water; S220 step also adds water development with tetramethyl.
The preparation method of described a kind of anti-fake material, is characterized in that: described S190 step etching amorphous si-layer, gases used is CF6, can certainly increase assist gas.
The preparation method of described a kind of anti-fake material, is characterized in that: described S210 step, provides sacrificial layer etching liquid, and the sacrifice layer plated for S130 step is Al, provides etching solution to be one in hydrochloric acid, NaOH; The sacrifice layer plated for S130 step is Cu, provides etching solution to be the aqueous solution of hydrochloric acid and ferric trichloride.
Anti-fake material involved in the present invention comprises the amorphous silicon module of sheet, amorphous silicon module has void region, this anti-fake material also comprises metal module, metal module is embedded in described void region, and metal module is embedded in amorphous silicon module can form anti-counterfeiting information, as pattern, character string etc., metal material has gloss and unformed silicon materials reflect mutually, have modelling effect, when especially metal module thickness is greater than amorphous silicon module, stereoscopic sensation is stronger.Larger than prior art difficulty in its technique, not easily copy, if in fact there is no metal module morphological data, only according to hiccough and computer, specific embodiments of the present invention cannot be copied, comparatively prior art safety.
The preparation method of a kind of anti-fake material involved in the present invention, by the plating of face on the glass substrate adhesion layer, plates sacrifice layer on adhesion layer, amorphous si-layer is plated on sacrifice layer, at amorphous si-layer coated thereon light binding, ultraviolet light source is provided, provides and flood template, by the exposure of the light binding coating of coating, development, cleaning, has washed the light binding of void region, also wash the neighboring area outside each unit anti-fake material, define each independently unit anti-fake material; Reoffer plasma etching equipment, etching amorphous si-layer, the region that amorphous si-layer does not have light binding to protect, just forms void region, defines each independently unit anti-fake material; Second time gluing again, floods template exposure by second time, development cleaning, and wash the second time gluing on the false proof material of uncured light binding and unit, the neighboring area light binding outside each unit anti-fake material is as protective seam; In void region plating module, during plating, sacrifice layer exposed section is protected by the light binding layer be coated with for the second time, and the non-openwork part of amorphous silicon is protected by the light binding layer be coated with for the first time; All light bindings had cured are washed again with cleaning fluid.There is provided sacrificial layer etching liquid, etching sacrificial layer, provide cleaning and filtering to equip and pure water, cleaning, filter; Thus finished product has the sense of many material stereos, and whole technological process is all linked with one another, counterfeit cost and height, does not expose with flooding template, and inventor can not reproduce the case of the present invention that others implements.
Accompanying drawing explanation
Fig. 1 is the front schematic view of first embodiment of the invention.
Fig. 2 is the diagrammatic cross-section of first embodiment of the invention.
Fig. 3 is the diagrammatic cross-section of second embodiment of the invention.
Fig. 4 is the schematic diagram of S110 to the S150 step of the present invention's the 3rd, the 4th embodiment.
Fig. 5 is the schematic diagram of S160 to the S180 step of the present invention's the 3rd, the 4th embodiment.
Fig. 6 is the schematic diagram of the S190 step of the present invention's the 3rd, the 4th embodiment.
Fig. 7 is the schematic diagram of the S195 step of third embodiment of the invention.
Fig. 8 is the schematic diagram of the S200 step of third embodiment of the invention.
Fig. 9 is the schematic diagram of S210 to the S230 step of third embodiment of the invention.
Figure 10 is the schematic diagram of the S200 step of four embodiment of the invention.
Figure 11 is the schematic diagram of S210 to the S230 step of four embodiment of the invention.
Figure 12 is the schematic diagram of the S240 step of third embodiment of the invention.
Figure 13 is the schematic diagram of the S240 step of four embodiment of the invention.
Figure 14 is the schematic diagram of the S250 step of third embodiment of the invention, also supplies the S250 step reference of the 4th embodiment.
Figure 15 is the schematic diagram of the S260 step of third embodiment of the invention, also supplies the S260 step reference of the 4th embodiment.
Figure 16 is the process flow diagram of third embodiment of the invention.
Figure 17 is the process flow diagram of four embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
With reference to figure 1, Fig. 2, Fig. 2 is A-A face sectional view in Fig. 1, first embodiment of the invention is a kind of anti-fake material, comprise the amorphous silicon module 001 of sheet, amorphous silicon module 001 has void region, this anti-fake material also comprises metal module 002, and metal module 002 is embedded in described void region.Described metal module 002, refer in a unit anti-fake material 000, the summation of each submodule be made up of metal, discrete distribution between each submodule, described metal module 002 forms character string " Red " by three submodules, should be appreciated that metal module 002 can be a figure or character, metal module 002 also can form a block graphics or character string by most submodules, described amorphous silicon module 001, refer in a unit anti-fake material 000, the summation of each submodule be made up of amorphous silicon, discrete distribution between each submodule, described amorphous silicon module 001 is made up of the submodule of four discrete distributions, the i.e. enclosure portion on character " R " top, the enclosure portion on character " e " top, character " d " lower closed portion, also has character string " Red " part around, be to be understood that, namely amorphous silicon module 001 can be a figure or character, also a block graphics or character string can be formed by most submodules, certainly, amorphous silicon module 001 most cases is intended for the background of metal module 002.
In the present embodiment, described metal module 002 bottom surface and amorphous silicon module 001 bottom surface in the same plane, described metal module 002 and amorphous silicon module 001 consistency of thickness.Described metal module 002 is chromium, titanium, copper wherein a kind of composition, and certainly, other can plate that establish, stable, glossiness metal also can realize the present invention.
In the present embodiment, under visible light, metal module 002 shows metallic luster, and black is arranged to by amorphous silicon list 001 yuan, and the form content of metal module 002 adds the anti-counterfeiting information that black amorphous silicon module 001 substrate forms this anti-fake material.The thickness of the amorphous silicon module 001 of described sheet is 6 microns, certainly as required, all can implement the present invention between 2 to 10 microns.
With reference to figure 1, Fig. 3, Fig. 3 is A-A face sectional view in Fig. 1, second embodiment of the invention is also a kind of anti-fake material, be with the difference of first embodiment of the invention, described metal module 002 is larger than amorphous silicon module 001 thickness, examine under a microscope, this anti-fake material stereoscopic sensation is more powerful.
With reference to figure 4 to 9, Figure 12, Figure 14 to 16, third embodiment of the invention is a kind of preparation method of anti-fake material, i.e. the preparation method of first embodiment of the invention, comprises the following steps: refer again to Fig. 4, and S110 step provides substrate of glass 101; S120 step, plates adhesion layer 102 on substrate of glass 101; S130 step, plates sacrifice layer 103 on adhesion layer 102; S140 step, plates amorphous si-layer 104 on sacrifice layer 103; S150 step, at amorphous si-layer 104 coated thereon light binding 105, forms the first semi-manufacture 100 for S160 step; Refer again to Fig. 5, S160 step, ultraviolet light source 999 is provided, provide and flood template 901, by the light binding coating exposure that the first semi-manufacture 100 are coated with in S150 step; S170 step, there is provided developer solution, development, with developer solution cured portion light binding 201, S180 step, pure water is provided, washes uncured light binding, form the second semi-manufacture 200 step, the light binding 201 solidified when etching amorphous si-layer 104 in order to S190 step is as protective seam, to stay on finished product and to need all amorphous silicon module 001, etch away the void region 301 of all plating metal modules, and the neighboring area 302 between each unit anti-fake material; Refer again to Fig. 6, S190 step, provide plasma etching to equip, etching amorphous si-layer 104, the neighboring area 302 namely outside void region 301 and each unit anti-fake material, form the 3rd semi-manufacture 300 and continue processing for next step; Refer again to Fig. 7, S195 step, provides cleaning fluid, washes the solidification light binding for the protection of unformed layer; Refer again to Fig. 8, S200 step, second time is coated with light binding, is on amorphous silicon surface size, and in order to technique is convenient, gluing on the sacrifice layer of low level, forms the 4th semi-manufacture 400; Refer again to Fig. 9, S210 step, provide second to flood template 902, the light binding coating of the 4th semi-manufacture 400 is exposed; S220 step, development, solidifies the light binding of the neighboring area outside each unit anti-fake material; S230 step, with pure water cleaning, cleans uncured light binding; Refer again to Figure 12, S240 step, in void region plating module; Refer again to Figure 14, S250 step, provides cleaning fluid, washes all light bindings had cured, and sacrifice layer shows each unit anti-fake material 000; Refer again to Figure 15, S260 step, provide sacrificial layer etching liquid, etching sacrificial layer, after sacrifice layer dissolves, each unit anti-fake material 000 comes off with glass substrate; S270 step, provides cleaning and filtering to equip and pure water, cleaning, filters; Wherein, S120 step, described adhesion layer is Cr, and described plating refers to Vacuum Deposition; S130 step, described sacrifice layer is Cu, and described plating refers to Vacuum Deposition; ; S230 step, cleans uncured light binding; S240 step, described in void region plating module, refer to Vacuum Deposition.With reference to Figure 16, it is the process flow diagram of the present embodiment.
In the present embodiment, described S150 step, also comprises providing and is coated with equipment step, with being coated with method coating.Described S200 step; also comprise and painting equipment step is provided; with spraying method coating, this coating object is for S240 step is when void region plating module, the neighboring area outside each unit anti-fake material; protective seam is set; when of course it is to be understood that amorphous si-layer is very thin; described S200 step can, with being coated with method coating, not have any essence to distinguish yet.
In the present embodiment, described light binding can select positive light binding and negative light binding one wherein, the cured portion light binding that described S170 step is mentioned refers to, exposure or unexposed part light binding, particularly, the part light binding exposed for positive light binding does not solidify, unexposed part light binding solidification; Accordingly, for the part light binding solidification that negative light binding exposes, unexposed part light binding does not solidify; The light binding of described S200 step coating is selected identical with the method.
In the present embodiment, described S110 provides substrate of glass, also comprises and glass sheet is cut into square or rectangle, and chamfering, polishing, cleaning, drying steps, the thickness for substrate of glass is 0.4 millimeter.
In the present embodiment, provide developer solution described in described S170 step, developer solution is that tetramethyl adds water; S220 step also adds water development with tetramethyl.There is provided cleaning fluid described in described S250 step, cleaning fluid is acetone.Described S190 step etching amorphous si-layer, gases used is CF6.Described S210 step, provides sacrificial layer etching liquid, is the aqueous solution of hydrochloric acid and ferric trichloride.
With reference to figure 4 to 6, Figure 10 to 11, Figure 17, four embodiment of the invention is also a kind of preparation method of anti-fake material, i.e. the preparation method of first embodiment of the invention, is with the difference of third embodiment of the invention, S240 step, in void region plating module.The height of the 3rd embodiment institute plating module is identical with the height of amorphous si-layer, and the present embodiment metal module height is greater than amorphous silicon module height.Concrete, the difference in height of metal module and amorphous silicon module can be controlled with the glue-line height of S150 step coating.Other step all can be implemented with reference to the character express of accompanying drawing and three embodiments of the present invention.
Claims (15)
1. an anti-fake material, is characterized in that: this anti-fake material comprises the amorphous silicon module of sheet, and amorphous silicon module has void region, and this anti-fake material also comprises metal module, and metal module is embedded in described void region.
2. anti-fake material according to claim 1, it is characterized in that: described metal module, refer in unit anti-fake material, the summation of each submodule be made up of metal, discrete distribution between each submodule, described metal module can be a figure or character, also can form a block graphics or character string by most submodules; Described amorphous silicon module, refer in unit anti-fake material, the summation of each submodule be made up of amorphous silicon, discrete distribution between each submodule, described amorphous silicon module can be a figure or character, also can form a block graphics or character string by most submodules.
3. anti-fake material according to claim 1, is characterized in that: described metal module bottom surface and amorphous silicon module bottom surface in the same plane, described metal module and amorphous silicon module consistency of thickness.
4. anti-fake material according to claim 1, is characterized in that: described metal module bottom surface and amorphous silicon module bottom surface in the same plane, described metal module is larger than amorphous silicon module thickness.
5. anti-fake material according to claim 1, is characterized in that: described metal module is chromium, may also be gold or titanium or copper.
6. anti-fake material according to claim 1, it is characterized in that: under visible light, metal module display metallic luster, amorphous silicon module is arranged to black, and the form content of metal module adds the anti-counterfeiting information that black amorphous silicon module substrate forms this anti-fake material.
7. anti-fake material according to claim 1, is characterized in that: between the thickness of described schistose texture is 2 to 10 microns.
8. a preparation method for anti-fake material, is characterized in that, comprises the following steps:
S110, provides substrate of glass;
S120, on the glass substrate face plating adhesion layer;
S130, plates sacrifice layer on adhesion layer;
S140, plates amorphous si-layer on sacrifice layer;
S150, at amorphous si-layer coated thereon light binding;
S160, provides ultraviolet light source, provides and floods template, light binding coating exposure S150 step be coated with;
S170, provides developer solution, development;
S180, provides pure water, cleaning;
S190, provides plasma etching to equip, etching amorphous si-layer, the neighboring area namely outside void region and each unit anti-fake material;
S200, second time is coated with light binding;
S210, provides second to flood template, light binding coating exposure S200 step be coated with;
S220, development;
S230, cleans with pure water;
S240, in void region plating module;
S250, provides cleaning fluid, cleaning;
S260, provides sacrificial layer etching liquid, etching sacrificial layer;
S270, provides cleaning and filtering to equip and pure water, cleaning, filters;
Wherein, S170 step, described development, with developer solution cured portion light binding; S180 step, cleaning, washes S170 development step uncured portion light binding with pure water; S230 step, the uncured light binding of cleaning void region; S240 step, describedly refers to Vacuum Deposition in void region plating module, or electroless plating; There is provided cleaning fluid described in S250 step, cleaning fluid is acetone.
9. the preparation method of a kind of anti-fake material according to claim 8, is characterized in that: also comprise S195 step, provide cleaning fluid, and cleaning, cleaning fluid is acetone.
10. the preparation method of a kind of anti-fake material according to claim 8, is characterized in that: described S150 step, also comprises providing being coated with equipment step, with being coated with method coating.
The preparation method of 11. a kind of anti-fake materials according to claim 8, is characterized in that: described S200 step, also comprises and provide painting equipment step, be coated with spraying method.
The preparation method of 12. a kind of anti-fake materials according to claim 8, it is characterized in that: described light binding can select positive light binding and negative light binding one wherein, the cured portion light binding that described S170 step is mentioned refers to, exposure or unexposed part light binding, particularly, the part light binding exposed for positive light binding does not solidify, unexposed part light binding solidification; Accordingly, for the part light binding solidification that negative light binding exposes, unexposed part light binding does not solidify.
The preparation method of 13. a kind of anti-fake materials according to claim 8, it is characterized in that: described S110 provides substrate of glass, also comprise and glass sheet be cut into square or rectangle, and chamfering, polishing, cleaning, drying steps, for the thickness of substrate of glass between 0.3 to 0.5 millimeter.
The preparation method of 14. a kind of anti-fake materials according to claim 8, it is characterized in that: provide developer solution described in described S170 step, developer solution is that tetramethyl adds water.
The preparation method of 15. a kind of anti-fake materials according to claim 8, is characterized in that: described S190 step etching amorphous si-layer, gases used is CF6.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105931566A (en) * | 2016-07-13 | 2016-09-07 | 中国科学院光电技术研究所 | Method for producing anti-counterfeiting structure by adopting micro machining technology |
| CN105966112A (en) * | 2016-07-20 | 2016-09-28 | 翟兴 | Anti-fake material and preparing method thereof |
| CN106183529A (en) * | 2016-07-20 | 2016-12-07 | 翟兴 | A kind of anti-fake material and preparation method thereof |
| CN106183536A (en) * | 2016-07-20 | 2016-12-07 | 翟兴 | A kind of anti-fake material and preparation method thereof |
| CN106240191A (en) * | 2016-07-20 | 2016-12-21 | 翟兴 | A kind of anti-fake material and preparation method thereof |
| CN108846470A (en) * | 2018-07-06 | 2018-11-20 | 刘腾 | Label and preparation method thereof |
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| CN105931566B (en) * | 2016-07-13 | 2019-04-23 | 中国科学院光电技术研究所 | A method of anti-counterfeit structure is prepared using micrometer-nanometer processing technology |
| CN105966112A (en) * | 2016-07-20 | 2016-09-28 | 翟兴 | Anti-fake material and preparing method thereof |
| CN106183529A (en) * | 2016-07-20 | 2016-12-07 | 翟兴 | A kind of anti-fake material and preparation method thereof |
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