CN105336881B - A kind of printed form high resolution display part and preparation method thereof - Google Patents
A kind of printed form high resolution display part and preparation method thereof Download PDFInfo
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- CN105336881B CN105336881B CN201510739686.0A CN201510739686A CN105336881B CN 105336881 B CN105336881 B CN 105336881B CN 201510739686 A CN201510739686 A CN 201510739686A CN 105336881 B CN105336881 B CN 105336881B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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Abstract
The present invention discloses a kind of printed form high resolution display part and preparation method thereof.The present invention is in the manufacturing process of pixel bank, pixel light emission region is exposed entirely, same color sub-pixel adjacent area carries out half-exposure, different colours sub-pixel connected regions do not expose, pass through etching, the processing such as development patterns pixel bank, the pixel bank of wherein same color sub-pixel connected regions is relatively thin, define sub-pixel for emitting light region, different colours sub-pixel connected regions bank is thicker, define the ink deposition region in typography, so as to the deposition region of increase ink at double, the area of each sub-pixel can be effectively reduced, with reference to the processing of pixel bank surface hydrophobicities, realize the making of printed form high-resolution display.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of printed form high resolution display part and its making side
Method.
Background technology
Using the method for solution processing and fabricating OLED and QLED display, due to its inexpensive, high production capacity, it is easily achieved
The advantages that large scale, be the important directions of following Display Technique development.Wherein, printing technology be considered as realize OLED and
QLED low costs and the most effective approach of the full-color display of large area.
In typography, due to being influenced by equipment precision and drop size, for traditional RGB Stripe
（RGB stripe shape）The dot structure of arrangement, is difficult to realize the preparation of high resolution display part.When the resolution ratio of display device reaches
During 200 ppi, the width of each sub-pixel can be reduced to 42 μm, simultaneously because the presence of pixel defining layer, the true width of sub-pixel
Degree can be further reduced to 35 μm or so, and for the ink of 10 pL volumes, its diameter is just up to 27 μm.If further carry
High-resolution, sub-pixel size can further reduce, so being difficult to control ink in each sub-pixel not spill over independently of each other
Pixel.
Chinese patent（CN 104009066A）In disclose a kind of pixel arrangement structure, as shown in Figure 1, the pixel arrangement
Structure is rearranged by pixel unit 100, by the way that the sub-pixel of unconnected pixels is shared Mask（Mask）On opening so that
Effectively improve the resolution ratio of display device.But in typography, this pixel arrangement structure of simple introducing, with point
The increase of resolution, the ink in each sub-pixel still can overflow pixel hole because Pixel Dimensions diminish, with adjacent different colours
Color cross-talk occurs for sub-pixel, causes display device display effect to decline, therefore this structure is directly applied in typography,
Or the size that can not reduce sub-pixel keeps the separate of deposited ink between different colours sub-pixel, therefore this picture at the same time
Plain structure can not realize the making of the typography of high resolution display.
Therefore, the prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of printed form high resolution display part
And preparation method thereof, it is intended to solve the problems, such as that existing typography is difficult to further improve monitor resolution.
Technical scheme is as follows：
A kind of production method of printed form high resolution display part, wherein, including step：
A1, form one layer of film layer for being used to make pixel bank in the TFT substrate with patterning hearth electrode, then
One layer of photoresist layer is formed in film layer；
A2, by exposure mask be exposed photoresist layer, and wherein sub-pixel for emitting light region carries out exposure, same color entirely
Sub-pixel connected regions carry out half-exposure, different colours sub-pixel connected regions and do not expose, and then develop with by photoresist layer
Patterning；
A3, by photo-resistive mask perform etching film layer, and full exposure area is all etched to and exposes pixel electrode, will
Half-exposure region partial etching to residual fraction film layer, unexposed area is not etched, subsequent stripping resistance layer, so as to be formed
The pixel bank that required thickness differs；
A4, clean the TFT substrate for completing above-mentioned steps, carries out surface hydrophobicity processing to it therewith, is formed hydrophobic
Pixel bank surfaces；
A5, by typography be sequentially depositing assorted sub-pixel for emitting light element, last depositing electrode, and device is sealed
Dress.
A kind of production method of printed form high resolution display part, wherein, including step：
B1, form one layer of photoresist layer for being used to make pixel bank in the TFT substrate with patterning hearth electrode；
B2, by exposure mask be exposed photoresist layer, and wherein sub-pixel for emitting light region carries out exposure, same color entirely
Sub-pixel connected regions carry out half-exposure, different colours sub-pixel connected regions do not expose；
B3, then carry out development treatment, and full exposure area photoresist layer is all removed, exposes pixel electrode, half-exposure area
Domain photoresist layer segment removes, and unexposed area photoresist layer is constant, so as to form the pixel bank that required thickness differs；
B4, clean the TFT substrate for completing above-mentioned steps, carries out surface hydrophobicity processing to it therewith, is formed hydrophobic
Pixel bank surfaces；
B5, by typography be sequentially depositing assorted sub-pixel for emitting light element, last depositing electrode, and device is sealed
Dress.
The production method, wherein, the thickness of the pixel bank of different colours sub-pixel connected regions is 1000nm-
3000nm。
The production method, wherein, the thickness of the pixel bank of same color sub-pixel connected regions is 100nm-
500nm。
The production method, wherein, in the step A4 or B4, surface fluorination hydrophobic treatment is carried out to TFT substrate.
The production method, wherein, what the sub-pixel that the dot structure in the TFT substrate includes three kinds of colors was formed
Multiple pixel units；Each pixel unit is by three sub-pixels into Chinese character pin-shaped arrangement form square structure.
The production method, wherein, the sub-pixel includes red sub-pixel, green sub-pixels and blue subpixels.
A kind of printed form high resolution display part, wherein, it is made of production method as described above.
Beneficial effect：The present invention is in pixel bank（Pixel defining layer）Manufacturing process in, to pixel light emission region carry out
Full exposure, same color sub-pixel adjacent area carry out half-exposure, and different colours sub-pixel connected regions do not expose, and pass through quarter
The processing such as erosion, development pattern pixel bank, and the pixel bank of wherein same color sub-pixel connected regions is relatively thin, definition
Pixel light emission region, different colours sub-pixel connected regions bank is thicker, defines the ink deposition region in typography, so that
The deposition region of increase ink at double, can effectively reduce the area of each sub-pixel, be handled with reference to pixel bank surface hydrophobicities,
Realize the making of printed form high-resolution display.
Brief description of the drawings
Fig. 1 is the arrangement architecture schematic diagram of dot structure of the prior art.
Fig. 2 is a kind of flow chart of printed form high resolution display part production method embodiment 1 of the present invention.
Fig. 3 is the idiographic flow schematic diagram of the embodiment of the present invention 1.
Fig. 4 is a kind of flow chart of printed form high resolution display part production method embodiment 2 of the present invention.
Fig. 5 is the idiographic flow schematic diagram of the embodiment of the present invention 2.
Fig. 6 is the design sketch that red, green, blue sub-pixel has been printed in embodiment 1 and embodiment 2.
Embodiment
The present invention provides a kind of printed form high resolution display part and preparation method thereof, to make the purpose of the present invention, skill
Art scheme and effect are clearer, clear and definite, and the present invention is described in more detail below.It should be appreciated that tool described herein
Body embodiment only to explain the present invention, is not intended to limit the present invention.
The present invention is disposably to form the different pixel bank structures of different zones thickness using half-exposure technique, is simplified
The manufacture craft of pixel bank, with reference to the hydrophobic treatment on pixel bank surfaces, so as to fulfill the printing of high resolution display part
Technique makes.
Embodiment 1：
A kind of production method of printed form high resolution display part, with reference to shown in Fig. 2 and Fig. 3, it includes step：
S1, with patterning hearth electrode 13 TFT substrate 10（There is tft array 11, passivation flatness layer 12 and figure thereon
Case hearth electrode 13）It is upper to form one layer of film layer 14 for being used to make pixel bank, one layer of light is then formed in film layer 14
Resistance layer 15；
S2, by exposure mask be exposed photoresist layer 15, and wherein sub-pixel for emitting light region carries out exposure, identical face entirely
Sub-pixels connected regions carry out half-exposure, different colours sub-pixel connected regions and do not expose, and then develop with by photoresist
Layer 15 patterns；Full exposure is all to remove photoresist layer 15, half-exposure be 15 part of photoresist layer is gone divided by retained it is one layer thin
Photoresist layer 15, do not expose, be to retain whole photoresist layers 15.
S3, by photo-resistive mask perform etching film layer 14, and full exposure area is all etched to and exposes pixel electrode,
Half-exposure region partial etching to residual fraction film layer, unexposed area is not etched, subsequent stripping resistance layer 15, so that
The pixel bank that thickness needed for being formed differs；Full exposure area therein is since the protection of no photoresist layer 15 is so by whole
Etching exposes hearth electrode, and half-exposure region is partially etched due to there is one layer thin of photoresist layer 15 to protect, one layer of final residual
Relatively thin pixel bank, unexposed area is due to having the protection of photoresist layer 15 without being etched.
S4, clean the TFT substrate 10 for completing above-mentioned steps, carries out surface hydrophobicity processing to it therewith, is formed and dredged
The pixel bank surfaces of water；The hydrophobic treatment can be surface fluorination hydrophobic treatment to obtain hydrophobic surface.
S5, by typography be sequentially depositing assorted sub-pixel for emitting light element, last depositing electrode（Top electrode）, and to device
Part is packaged.
In the patterned pixel bank of the present embodiment, the thicker pixel bank of different colours sub-pixel connected regions is thick
Spend for 1000nm-3000nm, the relatively thin pixel bank thickness of same color sub-pixel connected regions is 100nm-500nm.Through
After crossing surface fluorination hydrophobic treatment, the pixel bank of same color sub-pixel connected regions is since thickness is smaller, although hydrophobic
It will not stop that ink overflows during deposited ink, therefore in connected same color sub-pixel ink deposition region, ink can be
Whole region is sprawled, and forms uniform film；And the pixel bank of different color sub-pixels connected regions is larger and thin due to thickness
Water process rear surface contact angle is larger, can prevent ink from spilling into different colours sub-pixel deposition region, can avoid causing string
Color and reduction display quality.Fig. 6 is the thickness design sketch for having printed red, green, blue sub-pixel, wherein the 1 red sub- picture to print
Element, 2 green sub-pixels to print, 3 blue subpixels to print, the 14 pixel bank formed for film layer, by this
Process, can greatly improve the resolution ratio of typographical display device.
The present embodiment additionally provides a kind of printed form high resolution display, i.e., is made using above-mentioned production method.
Embodiment 2
A kind of production method of printed form high resolution display part, with reference to shown in Fig. 4 and Fig. 5, it includes step：
T1, with patterning hearth electrode 23（The present embodiment uses the label mode different from embodiment 1 and is distinguished with showing）
TFT substrate 20（There is tft array 21, passivation flatness layer 22 and patterning hearth electrode 23 thereon）It is upper to form one layer for making
The photoresist layer 24 of pixel bank；
T2, by exposure mask be exposed photoresist layer 24, and wherein sub-pixel for emitting light region carries out exposure, identical face entirely
Sub-pixels connected regions carry out half-exposure, different colours sub-pixel connected regions do not expose；
T3, then carry out development treatment, and full exposure area photoresist layer 24 is all removed, and exposes patterning hearth electrode 23,
Photoresist layer 24 part in half-exposure region removes, and unexposed area photoresist layer 24 is constant, so as to form the picture that required thickness differs
Plain bank；
T4, clean the TFT substrate 20 for completing above-mentioned steps, carries out surface hydrophobicity processing to it therewith, is formed and dredged
The pixel bank surfaces of water；The hydrophobic treatment can be surface fluorination hydrophobic treatment to obtain hydrophobic surface
T5, by typography be sequentially depositing assorted sub-pixel for emitting light element, last depositing electrode（Top electrode）, and to device
Part is packaged.
In the patterned pixel bank of the present embodiment, the thicker pixel bank of different colours sub-pixel connected regions is thick
Spend for 1000nm-3000nm, the relatively thin pixel bank thickness of same color sub-pixel connected regions is 100nm-500nm.Through
After crossing surface fluorination hydrophobic treatment, the pixel bank of same color sub-pixel connected regions is since thickness is smaller, although hydrophobic
It will not stop that ink overflows during deposited ink, therefore in connected same color sub-pixel ink deposition region, ink can be
Whole region is sprawled, and forms uniform film；And the pixel bank of different color sub-pixels connected regions is larger and thin due to thickness
Water process rear surface contact angle is larger, can prevent ink from spilling into different colours sub-pixel deposition region, avoid causing colour contamination
With reduction display quality, Fig. 6 is the thickness design sketch for having printed red, green, blue sub-pixel, wherein 1 red sub-pixel to print,
2 green sub-pixels to print, 3 blue subpixels to print, the 24 pixel bank formed for photoresist layer, pass through this technique
Processing, can equally greatly improve the resolution ratio of typographical display device.
The present embodiment additionally provides a kind of printed form high resolution display, i.e., is made using above-mentioned production method.
Dot structure in the TFT substrate.Multiple pixel units that sub-pixel including three kinds of colors is formed；Each picture
Plain unit is by three sub-pixels into Chinese character pin-shaped arrangement form square structure.
The sub-pixel includes red sub-pixel, green sub-pixels and blue subpixels.
As shown in Figure 1, a pixel unit 100 is by a red sub-pixel, a green sub-pixels and a blueness
The square structure that sub-pixel is formed.The size of each sub-pixel area is corresponding with the light-emitting component performance of a variety of colors.Performance is most
High area is minimum, and the minimum area of performance is maximum, so that the effectively color stability of adjusting device long-term work.
In above-mentioned dot structure, the same color sub-pixel of unconnected pixels is mutually got close to, and ultimately forms four red sons
Pixel joins together, and four green sub-pixels join together, the structure that two row blue subpixels join together.
In conclusion the same color sub-pixel of unconnected pixels is linked to be by the present invention by the optimization of pixel arrangement structure
It is a piece of, meanwhile, the different pixel bank of thickness is disposably formed by half-exposure technique, simplifies the making work of pixel bank
Skill.The present invention exposes pixel light emission region, same color sub-pixel adjacent region entirely in the manufacturing process of pixel bank
Domain carries out half-exposure, and different colours sub-pixel connected regions do not expose, by the processing such as etch, develop by pixel bank patterns
Change, the pixel bank of wherein same color sub-pixel connected regions is relatively thin, defines sub-pixel for emitting light region, different colours sub-pixel
Connected regions bank is thicker, defines the ink deposition region in typography, so that the deposition region of increase ink at double, can
To effectively reduce the area of each sub-pixel, handled with reference to pixel bank surface hydrophobicities, realize the system of printed form high-resolution display
Make.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (7)
1. a kind of production method of printed form high resolution display part, it is characterised in that including step：
A1, form one layer of film layer for being used to make pixel bank in the TFT substrate with patterning hearth electrode, then thin
One layer of photoresist layer is formed in film layer；
A2, by exposure mask be exposed photoresist layer, and wherein sub-pixel for emitting light region carries out exposure, same color picture entirely
Plain connected regions carry out half-exposure, different colours sub-pixel connected regions do not expose, and then develop with by photoresist layer pattern
Change；
A3, by photo-resistive mask perform etching film layer, and full exposure area is all etched to and exposes pixel electrode, half will expose
Light region partial etching to residual fraction film layer, unexposed area is not etched, subsequent stripping resistance layer, so that needed for being formed
The pixel bank that differs of thickness；
A4, clean the TFT substrate for completing above-mentioned steps, carries out surface hydrophobicity processing to it therewith, forms hydrophobic picture
Plain bank surfaces；
A5, by typography be sequentially depositing assorted sub-pixel for emitting light element, last depositing electrode, and device is packaged；
The thickness of the pixel bank of different colours sub-pixel connected regions is 1000nm-3000nm；
The thickness of the pixel bank of same color sub-pixel connected regions is 100nm-500nm.
2. a kind of production method of printed form high resolution display part, it is characterised in that including step：
B1, form one layer of photoresist layer for being used to make pixel bank in the TFT substrate with patterning hearth electrode；
B2, by exposure mask be exposed photoresist layer, and wherein sub-pixel for emitting light region carries out exposure, same color picture entirely
Plain connected regions carry out half-exposure, different colours sub-pixel connected regions do not expose；
B3, then carry out development treatment, and full exposure area photoresist layer is all removed, exposes pixel electrode, half-exposure area light
Resistance layer part removes, and unexposed area photoresist layer is constant, so as to form the pixel bank that required thickness differs；
B4, clean the TFT substrate for completing above-mentioned steps, carries out surface hydrophobicity processing to it therewith, forms hydrophobic picture
Plain bank surfaces；
B5, by typography be sequentially depositing assorted sub-pixel for emitting light element, last depositing electrode, and device is packaged；
The thickness of the pixel bank of different colours sub-pixel connected regions is 1000nm-3000nm；
The thickness of the pixel bank of same color sub-pixel connected regions is 100nm-500nm.
3. production method according to claim 1 or 2, it is characterised in that in the step A4 or B4, to TFT substrate into
Row surface fluorination hydrophobic treatment.
4. production method according to claim 1 or 2, it is characterised in that the dot structure in the TFT substrate includes three
Multiple pixel units that the sub-pixel of kind color is formed；Each pixel unit is square into Chinese character pin-shaped arrangement form by three sub-pixels
Shape structure.
5. production method according to claim 4, it is characterised in that the sub-pixel includes red sub-pixel, green
Pixel and blue subpixels.
6. a kind of printed form high resolution display part, it is characterised in that use production method system as claimed in claim 1
Into.
7. a kind of printed form high resolution display part, it is characterised in that use production method system as claimed in claim 2
Into.
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105428553B (en) * | 2015-11-11 | 2018-09-18 | 广东聚华印刷显示技术有限公司 | A kind of printed form display device and preparation method thereof |
| CN106449722B (en) * | 2016-11-21 | 2020-04-21 | 深圳市Tcl高新技术开发有限公司 | Printed top-emitting electroluminescent display and method for manufacturing the same |
| CN113380956A (en) * | 2017-11-02 | 2021-09-10 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN111710696B (en) * | 2020-06-04 | 2023-06-30 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN112712762B (en) * | 2020-12-30 | 2022-05-03 | 深圳市华星光电半导体显示技术有限公司 | Display panel, display mother board and display device |
| CN112786675A (en) * | 2021-02-25 | 2021-05-11 | 安徽熙泰智能科技有限公司 | Method for manufacturing high-resolution micro-display capable of improving optical crosstalk |
| CN113066848B (en) * | 2021-03-26 | 2023-01-10 | 京东方科技集团股份有限公司 | Array substrate and display panel |
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| CN102324432A (en) * | 2002-11-06 | 2012-01-18 | 乐金显示有限公司 | Have the organic electroluminescence device of inclination dividing strip and apply manufacturing technology |
| CN103500731A (en) * | 2013-10-18 | 2014-01-08 | 京东方科技集团股份有限公司 | OLED (organic light-emitting diode) backboard and manufacturing method for same |
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| CN102324432A (en) * | 2002-11-06 | 2012-01-18 | 乐金显示有限公司 | Have the organic electroluminescence device of inclination dividing strip and apply manufacturing technology |
| CN103500731A (en) * | 2013-10-18 | 2014-01-08 | 京东方科技集团股份有限公司 | OLED (organic light-emitting diode) backboard and manufacturing method for same |
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